CN112856615B - Anti-icing control method for dehumidifier and dehumidifier - Google Patents
Anti-icing control method for dehumidifier and dehumidifier Download PDFInfo
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- CN112856615B CN112856615B CN202110016783.2A CN202110016783A CN112856615B CN 112856615 B CN112856615 B CN 112856615B CN 202110016783 A CN202110016783 A CN 202110016783A CN 112856615 B CN112856615 B CN 112856615B
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- dehumidifier
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F3/00—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems
- F24F3/12—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling
- F24F3/14—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by humidification; by dehumidification
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F11/00—Control or safety arrangements
- F24F11/30—Control or safety arrangements for purposes related to the operation of the system, e.g. for safety or monitoring
- F24F11/41—Defrosting; Preventing freezing
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F11/00—Control or safety arrangements
- F24F11/50—Control or safety arrangements characterised by user interfaces or communication
- F24F11/61—Control or safety arrangements characterised by user interfaces or communication using timers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F11/00—Control or safety arrangements
- F24F11/62—Control or safety arrangements characterised by the type of control or by internal processing, e.g. using fuzzy logic, adaptive control or estimation of values
- F24F11/63—Electronic processing
- F24F11/64—Electronic processing using pre-stored data
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F11/00—Control or safety arrangements
- F24F11/70—Control systems characterised by their outputs; Constructional details thereof
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F3/00—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems
- F24F3/12—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling
- F24F3/14—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by humidification; by dehumidification
- F24F2003/144—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by humidification; by dehumidification by dehumidification only
- F24F2003/1446—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by humidification; by dehumidification by dehumidification only by condensing
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F2110/00—Control inputs relating to air properties
- F24F2110/10—Temperature
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F2110/00—Control inputs relating to air properties
- F24F2110/20—Humidity
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
Abstract
The invention discloses a dehumidifier anti-icing control method and a dehumidifier, wherein the dehumidifier anti-icing control method comprises the following steps: acquiring the ambient temperature of the environment where the dehumidifier is located through a first temperature sensor; acquiring the environmental humidity of the environment where the dehumidifier is located through a humidity sensor; when the ambient temperature is lower than a first preset value or the ambient humidity is higher than a second preset value, controlling a control circuit to enable a semiconductor refrigeration sheet to be connected with current to start a dehumidification function; acquiring the real-time temperature of a cold dissipation assembly through a second temperature sensor, wherein the cold dissipation assembly is arranged at the cold end of the semiconductor refrigeration piece; and when the temperature of the cold dissipation assembly is continuously lower than a third preset value within a preset time period, controlling a temperature control unit to increase the temperature of the cold dissipation assembly so as to enable the temperature of the cold dissipation assembly to be higher than zero degrees centigrade. Therefore, frost formation on the cooling component can be avoided.
Description
Technical Field
The invention relates to the technical field of dehumidifiers, in particular to an anti-icing control method for a dehumidifier and the dehumidifier.
Background
In a traditional dehumidifier applying a semiconductor refrigerating sheet, the cold end of the semiconductor refrigerating sheet is cooled by an aluminum profile heat exchanger. In the dehumidification process of the dehumidifier, condensed water is easy to condense on the aluminum profile heat exchanger; and in order to obtain better dehumidification effect, the hot junction and the cold junction of semiconductor refrigeration piece can design great difference in temperature, consequently, the cold junction of semiconductor refrigeration piece can have the condition that is less than 0, and the comdenstion water on the aluminium alloy heat exchanger freezes easily, and dehumidification effect is poor.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides an anti-icing control method for a dehumidifier, which is used for solving the problem of poor dehumidification effect of the traditional dehumidifier caused by easy icing of condensed water on an aluminum profile heat exchanger.
The invention also provides a dehumidifier.
According to the embodiment of the first aspect of the invention, the anti-icing control method for the dehumidifier comprises the following steps:
acquiring the ambient temperature of the environment where the dehumidifier is located through a first temperature sensor;
acquiring the environmental humidity of the environment where the dehumidifier is located through a humidity sensor;
when the ambient temperature is lower than a first preset value or the ambient humidity is higher than a second preset value, controlling a control circuit to enable a semiconductor refrigeration sheet to be connected with current to start a dehumidification function;
acquiring the real-time temperature of a cold dissipation assembly through a second temperature sensor, wherein the cold dissipation assembly is arranged at the cold end of the semiconductor refrigeration sheet;
and when the temperature of the cold dissipation assembly is continuously lower than a third preset value within a preset time period, controlling a temperature control unit to increase the temperature of the cold dissipation assembly so as to enable the temperature of the cold dissipation assembly to be higher than zero degrees centigrade.
The anti-icing control method of the dehumidifier according to the embodiment of the invention at least has the following technical effects:
the first temperature sensor is used for detecting the ambient temperature of the environment where the dehumidifier is located in real time; the humidity sensor is used for detecting the environmental humidity of the environment where the dehumidifier is located in real time, and when the environmental temperature is lower than a first preset value or the environmental humidity is higher than a second preset value, the control circuit is controlled to enable the semiconductor refrigeration piece to be connected with current, so that the dehumidifier starts the dehumidification function. The second temperature sensor is used for detecting the real-time temperature of the cold dissipation assembly in real time, and when the temperature of the cold dissipation assembly is detected to be continuously lower than a third preset value in a preset time period, the temperature control unit is controlled to increase the temperature of the cold dissipation assembly, so that the temperature of the cold dissipation assembly is higher than zero centigrade. Therefore, frost formation on the cooling component can be avoided.
According to some embodiments of the invention, the temperature control unit is a fan, and controlling the temperature control unit to increase the temperature of the cooling element such that the temperature of the cooling element is above zero degrees centigrade comprises:
and controlling the fan to rotate in a first direction so as to enable the airflow generated by the fan to sequentially pass through the heat dissipation assembly and the cold dissipation assembly, wherein the heat dissipation assembly is arranged at the hot end of the semiconductor refrigerating sheet.
According to some embodiments of the invention, the temperature control unit is a fan, and the controlling the temperature control unit to increase the temperature of the cooling module such that the temperature of the cooling module is above zero degrees centigrade comprises:
reducing the rotation speed of the fan in the second direction; when the fan rotates in the second direction, the airflow generated by the fan sequentially passes through the cooling dissipation assembly and the heat dissipation assembly, wherein the heat dissipation assembly is arranged at the hot end of the semiconductor refrigerating sheet.
According to some embodiments of the invention, the temperature control unit is the control circuit, and the controlling the temperature control unit to increase the temperature of the cooling element such that the temperature of the cooling element is above zero degrees celsius comprises:
and controlling the control circuit to reduce the voltages of the hot end and the cold end of the semiconductor refrigerating sheet.
According to some embodiments of the present invention, before the controlling the control circuit to enable the semiconductor chilling plate to switch in current to start the dehumidification function when the ambient temperature is lower than the first preset value, the method further includes:
acquiring a dew point temperature according to the environment temperature and the environment humidity;
and acquiring the first preset value according to the dew point temperature.
According to the embodiment of the second aspect of the invention, the dehumidifier comprises: the first temperature sensor is used for detecting the ambient temperature of the environment where the dehumidifier is located; the humidity sensor is used for detecting the environmental humidity of the environment where the dehumidifier is located; the semiconductor refrigeration piece is electrically connected with the control circuit, the semiconductor refrigeration piece is provided with a cold end, and when the ambient temperature is lower than a first preset value or when the ambient humidity is higher than a second preset value, the control circuit is used for enabling the semiconductor refrigeration piece to be connected with current to start a dehumidification function; the cold dispersing component is arranged at the cold end; the second temperature sensor is used for detecting the real-time temperature of the cold dissipation assembly; the temperature control unit is used for increasing the temperature of the cooling component when the temperature of the cooling component is continuously lower than a first preset value in a preset time period so as to enable the temperature of the cooling component to be higher than zero centigrade; the processing module, first temperature sensor, humidity transducer, control circuit, the semiconductor refrigeration piece, second temperature sensor and the temperature control unit all with processing module electric connection.
The dehumidifier according to the embodiment of the invention at least has the following technical effects:
the first temperature sensor is used for detecting the ambient temperature of the environment where the dehumidifier is located in real time; the humidity sensor is used for detecting the environmental humidity of the environment where the dehumidifier is located in real time; the processing module is used for acquiring the environmental temperature of the environment where the dehumidifier is located through the first temperature sensor and acquiring the environmental humidity of the environment where the dehumidifier is located through the humidity sensor; when the ambient temperature is lower than a first preset value or the ambient humidity is higher than a second preset value, the processing module controls the control circuit to enable the semiconductor refrigeration piece to be connected with current, and the dehumidifier starts the dehumidification function. The second temperature sensor is used for detecting the real-time temperature of the cooling dissipation assembly in real time, and the processing module is used for acquiring the real-time temperature of the cooling dissipation assembly through the second temperature sensor; when the processing module detects that the temperature of the cooling dissipation assembly is continuously lower than a third preset value in a preset time period, the temperature control unit is controlled to increase the temperature of the cooling dissipation assembly so that the temperature of the cooling dissipation assembly is higher than zero degrees centigrade. Therefore, frost formation on the cooling component can be avoided.
According to some embodiments of the present invention, the cold dissipation assembly includes a first connecting member, a first heat pipe, and a cold dissipation sheet, the first connecting member is sleeved outside the first heat pipe and fixed to the cold end, the first connecting member is a heat conducting member, and the first heat pipe and the cold end can transfer heat through the first connecting member.
According to some embodiments of the present invention, the dehumidifier further includes a heat dissipation assembly, the semiconductor refrigeration sheet further includes a hot end, the heat dissipation assembly is disposed at the hot end, the temperature control unit is a fan, the fan is disposed between the heat dissipation assembly and the heat dissipation assembly, and the fan has a first working state rotating in a first direction and a second working state rotating in a second direction opposite to the first direction;
the fan can generate airflow in the first working state to sequentially pass through the heat dissipation assembly and the cold dissipation assembly; the fan is in the air current that the second operating condition produced can pass through in proper order the cooling subassembly with radiator unit.
According to some embodiments of the present invention, the heat dissipation assembly includes a second connecting member, a second heat pipe, and a heat dissipation plate, the second connecting member is sleeved outside the second heat pipe and fixed to the hot end, the second connecting member is a heat conduction member, the second heat pipe and the hot end can transfer heat through the second connecting member, and the heat dissipation plate is disposed on the second heat pipe.
According to some embodiments of the present invention, the processing module is configured to obtain a dew point temperature according to the ambient temperature and the ambient humidity, and obtain the first preset value according to the dew point temperature.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic view of a partial structure of a dehumidifier according to an embodiment of the present invention;
FIG. 2 is a schematic top view of a partial structure of a dehumidifier according to an embodiment of the present invention;
fig. 3 is a schematic view of an assembly structure of a cooling module and a semiconductor cooling plate according to an embodiment of the present invention;
fig. 4 is a schematic view illustrating an assembly structure of a heat dissipation assembly and a semiconductor cooling plate according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of an anti-icing control method for a dehumidifier according to an embodiment of the present invention.
Reference numerals:
100. a dehumidifier; 110. a semiconductor refrigerating sheet; 111. a cold end; 112. a hot end; 120. a cold dissipation assembly; 121. a first connecting member; 1211. a first energy transfer plane; 122. a first heat pipe; 123. cooling tablets; 130. a heat dissipating component; 131. a second connecting member; 1311. a second energy transfer plane; 132. a second heat pipe; 133. a heat sink; 140. a fan.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", and the like, indicate orientations and positional relationships based on the orientations and positional relationships shown in the drawings, and are used merely for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention. Furthermore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 1 and fig. 2, in a dehumidifier 100 according to an embodiment, the dehumidifier 100 includes a semiconductor cooling plate 110, a cooling component 120, and a heat dissipation component 130.
As shown in fig. 1, the semiconductor chilling plate 110 has a cold end 111 and a hot end 112.
The semiconductor refrigerating plate 110 is an application of the peltier effect in the aspect of refrigeration technology. The cold end 111 of semiconductor refrigeration piece 110 is used for refrigerating, and hot junction 112 is used for outwards giving off heat, and the main parameter of semiconductor refrigeration piece 110 is the cold end 111 and the difference in temperature of hot junction 112, and it is good if the hot junction 112 heat dissipation, the temperature reduces, and corresponding can make cold end 111 temperature reduce, realizes better refrigeration effect.
As shown in fig. 1 and 3, the cooling dissipation assembly 120 includes a first connecting member 121, a first heat pipe 122 and a cooling dissipation sheet 123, the first connecting member 121 is sleeved outside the first heat pipe 122 and fixed to the cold end 111, the first connecting member 121 is a heat conducting member, the first heat pipe 122 and the cold end 111 of the semiconductor cooling sheet 110 can perform heat transfer through the first connecting member 121, and the cooling dissipation sheet 123 is disposed on the first heat pipe 122.
The first connecting member 121 is made of a metal material or a composite material with good thermal conductivity, and optionally, the first connecting member 121 is made of a copper, aluminum or graphite composite material. The first connecting member 121 may be fixed to the cold end 111 of the semiconductor chilling plate 110 by fastening bolts or snaps, etc.
The heat dissipation plate 123 is perpendicular to the first heat pipe 122, and within an allowable error range, an angle deviation between the heat dissipation plate 123 and the first heat pipe 122 may be within 5 °.
In the dehumidifier 100, the cold dissipation assembly 120 is arranged at the cold end 111 of the semiconductor refrigeration sheet 110, so that the cold dissipation assembly 120 can increase the heat exchange area between the cold end 111 of the semiconductor refrigeration sheet 110 and air, and improve the refrigeration efficiency. In addition, the first connecting member 121 is sleeved outside the first heat pipe 122, and the first connecting member 121 is fixed to the cold end 111 of the semiconductor chilling plate 110, so that the connection firmness between the first heat pipe 122 and the semiconductor chilling plate 110 can be increased, the first heat pipe 122 is prevented from falling off in the using process, and the reliability is high.
As shown in fig. 3, in one embodiment, the first connecting member 121 has a first energy transmission plane 1211, the first energy transmission plane 1211 is attached to the cold end 111 of the semiconductor refrigeration sheet 110, and the first connecting member 121 is configured with a first energy channel for enabling the cold end 111 of the semiconductor refrigeration sheet 110 to perform cold energy transmission with the first heat pipe 122.
The first energy transmission plane 1211 of the first connecting member 121 is attached to the cold end 111 of the semiconductor refrigeration sheet 110, and the first connecting member 121 is sleeved outside the first heat pipe 122, so that the first connecting member 121 constructs a first energy channel for transmitting the cold energy between the cold end 111 of the semiconductor refrigeration sheet 110 and the first heat pipe 122, and the first energy channel can transmit the cold energy a of the cold end 111 of the semiconductor refrigeration sheet 110 to the first heat pipe 122. Compared with the energy transfer in the way that the first heat pipe 122 is in line contact with the cold end 111 of the semiconductor chilling plate 110, the first energy transmission plane 1211 of the first connecting member 121 in the dehumidifier 100 is in surface contact with the cold end 111 of the semiconductor chilling plate 110, so that the contact area is increased, the efficiency of energy transfer is higher, and the heat exchange efficiency is higher.
Further, there are a plurality of first heat pipes 122, and the first connecting member 121 is sleeved outside all the first heat pipes 122. In this way, the plurality of first heat pipes 122 can absorb the cooling energy of the cold end 111 of the semiconductor cooling plate 110 at the same time, thereby further increasing the heat transfer efficiency.
Further, all the first heat pipes 122 are arranged in parallel at intervals along a first preset direction, wherein the first preset direction is parallel to a plane where the cold end 111 of the semiconductor chilling plate 110 is located.
Specifically, the cold ends 111 of the semiconductor refrigeration pieces 110 are planes, the contact portions of all the first heat pipes 122 and the first connecting pieces 121 are arranged in parallel at intervals along a first preset direction, and the first preset direction is parallel to the plane where the cold ends 111 of the semiconductor refrigeration pieces 110 are located, so that the cold energy at each position of the cold ends 111 of the semiconductor refrigeration pieces 110 can be transmitted to the first heat pipes 122.
Furthermore, the first connecting member 121 is provided with a plurality of first mounting holes (or first mounting grooves), the plurality of first mounting holes (or first mounting grooves) are arranged in parallel at intervals along a first preset direction, the plurality of first heat pipes 122 are arranged in the plurality of first mounting holes (or first mounting grooves) in a one-to-one correspondence manner, and a first energy channel is established between every two adjacent first mounting holes (or first mounting grooves). In other words, in the first connecting member 121, a solid body is formed between two adjacent first installation holes (or first installation grooves), and the solid body constitutes a first energy channel for enabling the cold end 111 of the semiconductor chilling plate 110 to perform cooling energy transfer with the first heat pipe 122.
Optionally, a first heat conducting medium is filled between the first heat pipe 122 and the hole wall of the first mounting hole of the first connecting member 121 (or the groove wall of the first mounting groove), and the first heat conducting medium may be heat conducting silica gel or the like, metal powder, oxide powder, graphite powder, diamond powder or the like, so as to improve energy transfer efficiency.
As shown in fig. 1 and 2, the heat dissipation assembly 130 is disposed on the hot end 112 of the semiconductor chilling plate 110, the heat dissipation assembly 130 includes a second connector 131, a second heat pipe 132 and a heat dissipation sheet 133, the second connector 131 is disposed outside the second heat pipe 132 and fixed to the hot end 112, the second connector 131 is a heat conduction member, the second heat pipe 132 and the hot end 112 of the semiconductor chilling plate 110 can perform heat transfer through the second connector 131, and the heat dissipation sheet 133 is disposed on the second heat pipe 132.
Specifically, the second connecting member 131 is made of a metal material or a composite material with good thermal conductivity, and optionally, the second connecting member 131 is made of a copper, aluminum or graphite composite material. The second connector 131 may be fixed to the semiconductor chilling plate 110 by fastening bolts or snaps. By fixedly connecting the second connecting member 131 to the hot end 112 of the semiconductor chilling plate 110 and sleeving the second connecting member 131 outside the second heat pipe 132, the firmness of connection between the second heat pipe 132 and the semiconductor chilling plate 110 can be increased, the second heat pipe 132 is prevented from falling off in the using process, and the reliability is high.
The heat sink 133 is perpendicular to the second heat pipe 132, and the angular deviation between the heat sink 133 and the second heat pipe 132 may be within 5 ° within an allowable error range.
Through setting up radiator unit 130 at the hot junction 112 of semiconductor refrigeration piece 110, radiator unit 130 can distribute the heat of the hot junction 112 of semiconductor refrigeration piece 110 as early as possible to reduce the temperature of the hot junction 112 of semiconductor refrigeration piece 110, so, can make the cold junction 111 temperature of semiconductor refrigeration piece 110 reduce correspondingly, realize better refrigeration effect.
As shown in fig. 4, further, the second connecting member 131 has a second energy transmission plane 1311, the second energy transmission plane 1311 is attached to the hot end 112 of the semiconductor chilling plate 110, and the second connecting member 131 is configured with a second energy channel for transferring heat between the hot end 112 of the semiconductor chilling plate 110 and the second heat pipe 132.
By attaching the second energy transmission plane 1311 of the second connecting member 131 to the hot end 112 of the semiconductor chilling plate 110 and sleeving the second connecting member 131 outside the second heat pipe 132, the second connecting member 131 constructs a second energy channel for transferring the cooling energy between the hot end 112 of the semiconductor chilling plate 110 and the second heat pipe 132, and the second energy channel can transmit the heat B of the hot end 112 of the semiconductor chilling plate 110 to the second heat pipe 132. Compared with the energy transfer by the way that the second heat pipe 132 is in line contact with the hot end 112 of the semiconductor chilling plate 110, the second energy transmission plane 1311 of the second connecting piece 131 in the dehumidifier 100 is in surface contact with the hot end 112 of the semiconductor chilling plate 110, so that the contact area is increased, the efficiency of energy transfer is higher, and the heat exchange efficiency is higher.
In one embodiment, the number of the second heat pipes 132 is multiple, and the second connecting members 131 are sleeved outside all the second heat pipes 132. In this way, the plurality of second heat pipes 132 can absorb heat from the hot end 112 of the semiconductor chilling plate 110 at the same time, thereby further increasing the heat transfer efficiency.
Further, all the parts of the second heat pipes 132 contacting the second connecting member 131 are arranged in parallel and at intervals along a second predetermined direction, wherein the second predetermined direction is parallel to the plane where the hot end 112 of the semiconductor chilling plate 110 is located.
Specifically, the second connecting member 131 is provided with a plurality of second mounting holes (or second mounting grooves), the plurality of second mounting holes (or second mounting grooves) are arranged in parallel at intervals along a second preset direction, the plurality of second heat pipes 132 are arranged in the plurality of second mounting holes (or second mounting grooves) in a one-to-one correspondence manner, and a second energy channel is established between every two adjacent second mounting holes (or second mounting grooves). In other words, in the second connector 131, there is a solid body between two adjacent second mounting holes (or second mounting grooves), and the solid body constitutes a second energy channel for transferring the heat B between the hot end 112 of the semiconductor chilling plate 110 and the second heat pipe 132.
Optionally, a second heat conducting medium is filled between the second heat pipe 132 and the hole wall of the second mounting hole (or the groove wall of the second mounting groove) of the second connecting member 131, and the second heat conducting medium may be heat conducting silica gel, metal powder, oxide powder, graphite powder, diamond powder, or the like, so as to improve energy transfer efficiency.
In one embodiment, the surface of the heat sink 133 is coated with an anti-sticking layer, optionally, the anti-sticking layer may be made of teflon, and the anti-sticking layer can prevent dust and other impurities from being accumulated on the cooling fins 123, thereby reducing the heat dissipation effect.
As shown in fig. 1, in one embodiment, the dehumidifier 100 further includes a control circuit, a first temperature sensor, a second temperature sensor, a humidity sensor, a temperature control unit, and a processing module, wherein the semiconductor cooling plate 110 is electrically connected to the control circuit, and the first temperature sensor, the control circuit, the semiconductor cooling plate 110, the second temperature sensor, and the temperature control unit are electrically connected to the processing module.
The first temperature sensor is used for detecting the ambient temperature of the environment where the dehumidifier 100 is located; the humidity sensor is used for detecting the environmental humidity of the environment where the dehumidifier 100 is located; the processing module is used for acquiring a dew point temperature according to the environment temperature and the environment humidity of the environment where the dehumidifier 100 is located, and acquiring a first preset value according to the dew point temperature; when the ambient temperature is lower than a first preset value, the processing module is used for controlling the control circuit to enable the semiconductor refrigeration piece 110 to be connected with current so as to start the dehumidification function; the second temperature sensor is used for detecting the real-time temperature of the cooling dissipation assembly 120; when the temperature of the cooling module 120 is continuously lower than the preset value within the preset time period, the processing module is configured to control the temperature control unit to increase the temperature of the cooling module 120, so that the temperature of the cooling module 120 is higher than zero degrees centigrade.
Specifically, the first temperature sensor is used for detecting the ambient temperature of the environment where the dehumidifier 100 is located in real time; the humidity sensor is used for detecting the environmental humidity of the environment where the dehumidifier 100 is located in real time, and the processing module is used for acquiring the environmental temperature of the environment where the dehumidifier 100 is located through the first temperature sensor and acquiring the environmental humidity of the environment where the dehumidifier 100 is located through the humidity sensor; when the ambient temperature is lower than the first preset value, the processing module controls the control circuit to enable the semiconductor refrigeration sheet 110 to be connected with current, so that the dehumidifier 100 starts the dehumidification function. The second temperature sensor is used for detecting the real-time temperature of the cooling component 120 in real time, and the processing module is used for acquiring the real-time temperature of the cooling component 120 through the second temperature sensor; when the processing module detects that the temperature of the cooling module 120 is continuously lower than the third preset value within the preset time period, the temperature control unit is controlled to increase the temperature of the cooling module 120 so that the temperature of the cooling module 120 is higher than zero degrees centigrade. The preset time period can be any value between 5 minutes and 20 minutes, and the third preset value can be any value between-5 ℃ and 0 ℃. In this way, frost formation on the cold dissipation assembly 120 can be avoided.
More specifically, the processing module is configured to obtain a dew point temperature according to the ambient temperature and the ambient humidity of the dehumidifier 100, and obtain the first preset value according to the dew point temperature.
The dew point temperature may be calculated according to Magnus-tentens (Magnus) approximation method after obtaining the ambient temperature and the ambient humidity of the environment where the dehumidifier 100 is located, where the first preset value is a sum of the dew point temperature and a preset value, and the preset value is generally between 0 and 10 ℃.
In another embodiment, the humidity sensor may obtain an ambient humidity of an environment where the dehumidifier is located, and the dehumidification function may be started when the ambient temperature is higher than a second preset value by comparing the ambient humidity with the second preset value.
The second preset value can be any value greater than 70% RH (relative humidity).
It should be noted that, the processing module controls the control circuit to enable the semiconductor refrigeration chip 110 to access current, so that the semiconductor refrigeration chip 110 only works as one of the necessary conditions when the dehumidifier 100 starts the dehumidification function, and other conditions required for starting the dehumidification function are the prior art, and are not described herein again.
As shown in fig. 1, in one embodiment, the temperature control unit is a fan 140, and the fan 140 generates an air flow when operating, and the air flow can pass through at least one of the heat dissipation assembly 130 and the cold dissipation assembly 120.
Specifically, the fan 140 is disposed between the heat dissipation assembly 130 and the cooling dissipation assembly 120, and the fan 140 has a first working state rotating in a first direction and a second working state rotating in a second direction opposite to the first direction; the air flow generated by the fan 140 in the first working state can sequentially pass through the heat dissipation assembly 130 and the cold dissipation assembly 120; the air flow generated by the fan 140 in the second operating state can sequentially pass through the cooling module 120 and the heat sink assembly 130.
The first direction is counterclockwise, the second direction is clockwise, when the fan 140 rotates counterclockwise, the air is heated by the heat dissipation assembly 130 and then blown to the cold dissipation assembly 120, so as to increase the temperature of the cold dissipation assembly 120 and prevent the cold dissipation assembly 120 from freezing. When the fan 140 rotates clockwise, the air cooled by the cooling module 120 can be heated by the cooling module 130, and the cold air is prevented from blowing to other components.
More specifically, the step of controlling the temperature control unit by the processing module to increase the temperature of the cooling module 120 so that the temperature of the cooling module 120 is higher than zero degrees centigrade includes: the processing module controls the fan 140 to rotate in the first direction, so that the airflow generated by the fan 140 sequentially passes through the heat dissipation assembly 130 and the cold dissipation assembly 120, when the fan 140 rotates in the first direction, the air can be heated by the heat dissipation assembly 130 and then blown to the cold dissipation assembly 120, the temperature of the cold dissipation assembly 120 can be increased, and the cold dissipation assembly 120 is prevented from being frozen.
In another embodiment, the temperature control unit is the fan 140 in the above embodiment, and the processing module controls the temperature control unit to increase the temperature of the cooling element 120, so that the temperature of the cooling element 120 is higher than zero degrees centigrade specifically: the processing module controls the fan 140 to rotate in the second direction, but the rotation speed of the fan 140 is reduced to reduce the heat dissipation effect of the heat dissipation assembly 130, so that the temperature of the hot end 112 of the semiconductor chilling plate 110 is increased, and the temperature of the cold end 111 of the semiconductor chilling plate 110 is increased, thereby preventing the cooling dissipation assembly 120 from freezing.
In another embodiment, the temperature control unit is a control circuit, and the processing module controls the temperature control unit to increase the temperature of the cooling module 120, so that the temperature of the cooling module 120 is higher than zero degrees centigrade, specifically: the processing module reduces the voltages of the hot end 112 and the cold end 111 of the semiconductor refrigeration piece 110 through the control circuit, so that the temperature of the cold end 111 of the semiconductor refrigeration piece 110 is increased, and the cold dissipation assembly 120 is prevented from freezing.
An embodiment also relates to an anti-icing control method of the dehumidifier, which is applied to the dehumidifier 100.
As shown in fig. 1 and 5, the anti-icing control method for the dehumidifier includes:
s100, acquiring the ambient temperature of the environment where the dehumidifier 100 is located through a first temperature sensor; acquiring the environmental humidity of the environment where the dehumidifier 100 is located through a humidity sensor;
specifically, the first temperature sensor is used for detecting the ambient temperature of the environment where the dehumidifier 100 is located in real time, and the processing module is used for acquiring the ambient temperature of the environment where the dehumidifier is located through the first temperature sensor; the humidity sensor is used for detecting the environmental humidity of the environment where the dehumidifier 100 is located in real time, and the processing module is used for acquiring the environmental humidity of the environment where the dehumidifier is located through the humidity sensor.
S200, when the ambient temperature is lower than a first preset value or the ambient humidity is higher than a second preset value, the control circuit is controlled to enable the semiconductor refrigeration sheet to be connected with current so as to start the dehumidification function.
Specifically, when the ambient temperature is lower than the first preset value, the processing module controls the control circuit to enable the semiconductor refrigeration sheet 110 to be connected with current, so that the dehumidifier 100 starts the dehumidification function.
It should be noted that the processing module controls the control circuit to enable the semiconductor refrigeration chip 110 to access current, so that the semiconductor refrigeration chip 110 only works as one of the necessary conditions when the dehumidifier 100 starts the dehumidification function, and other conditions required for starting the dehumidification function are the prior art, and are not described herein again.
Further, when the ambient temperature is lower than the first preset value, before controlling the control circuit to make the semiconductor chilling plate 110 access current to start the dehumidification function, the method further includes:
acquiring the environmental humidity of the environment where the dehumidifier is located through a humidity sensor; acquiring dew point temperature according to the environment temperature and the environment humidity; and acquiring the first preset value according to the dew point temperature.
Specifically, the humidity sensor is used for detecting the environmental humidity of the environment where the dehumidifier is located in real time, the processing module is used for acquiring the environmental humidity of the environment where the dehumidifier is located through the humidity sensor, and the processing module is further used for acquiring the dew point temperature according to the environmental temperature and the environmental humidity of the dehumidifier and acquiring the first preset value according to the dew point temperature.
More specifically, the dew point temperature may be calculated according to Magnus-tens (Magnus) approximation after obtaining the ambient temperature and the ambient humidity of the environment where the dehumidifier 100 is located, where the first preset value is a sum of the dew point temperature and a preset value, and the first preset value is generally between 0 and 10 ℃.
Or the humidity sensor can be used for acquiring the environmental humidity of the environment where the dehumidifier is located, and the dehumidification function is started when the environmental temperature is higher than a second preset value by comparing the environmental humidity with the second preset value.
The second preset value can be any value greater than 70% RH (relative humidity).
And S300, acquiring the real-time temperature of the cold dissipation assembly through a second temperature sensor.
Specifically, the second temperature sensor is configured to detect a real-time temperature of the cooling module 120 in real time, and the processing module is configured to obtain the real-time temperature of the cooling module 120 through the second temperature sensor.
S400, when the temperature of the cooling module 120 is continuously lower than the third preset value within the preset time period, controlling the temperature control unit to increase the temperature of the cooling module 120, so that the temperature of the cooling module 120 is higher than zero degrees centigrade.
Specifically, when the processing module obtains that the temperature of the cooling dissipation assembly 120 is continuously lower than the third preset value within the preset time period, the temperature control unit is controlled to increase the temperature of the cooling dissipation assembly 120, so that the temperature of the cooling dissipation assembly 120 is higher than zero degrees centigrade. In this way, frost formation on the cold dissipation assembly 120 can be avoided.
Wherein the preset time period can be any value between 5 minutes and 20 minutes; the third preset value can be any value between-5 ℃ and 0 ℃.
In one embodiment, the temperature control unit is a fan 140, and controlling the temperature control unit to increase the temperature of the cooling module 120 so that the temperature of the cooling module 120 is higher than zero degrees centigrade comprises:
the fan 140 is controlled to rotate in a first direction, so that the air flow generated by the fan 140 passes through the heat dissipation assembly 130 and the cold dissipation assembly 120 in sequence.
Specifically, the processing module controls the fan 140 to rotate in the first direction, so that the airflow generated by the fan 140 sequentially passes through the heat dissipation assembly 130 and the cold dissipation assembly 120, and when the fan 140 rotates in the first direction, the air is heated by the heat dissipation assembly 130 and then blown to the cold dissipation assembly 120, so that the temperature of the cold dissipation assembly 120 can be increased, and the cold dissipation assembly 120 is prevented from being frozen.
In another embodiment, the temperature control unit is a fan 140, and controlling the temperature control unit to increase the temperature of the cooling element 120 so that the temperature of the cooling element 120 is higher than zero degrees centigrade comprises:
reducing the rotational speed of the fan 140 when rotating in the second direction; thereby reducing the airflow velocity around the heat sink assembly 130.
Specifically, after the dehumidifier 100 starts dehumidification, the fan 140 operates in a second direction rotation mode, and when the temperature of the cooling module 120 is detected to be continuously lower than a third preset value within a preset time period, the processing module controls the fan 140 to rotate in the second direction, but reduces the rotation speed of the fan 140 and reduces the heat dissipation effect of the cooling module 130, so that the temperature of the hot end 112 of the semiconductor chilling plate 110 rises, the temperature of the cold end 111 of the semiconductor chilling plate 110 rises, and the cooling module 120 is prevented from freezing.
In yet another embodiment, the temperature control unit is a control circuit, and controlling the temperature control unit to increase the temperature of the cooling module 120 so that the temperature of the cooling module 120 is higher than zero degrees centigrade comprises:
the control circuit is controlled to reduce the voltage of the hot end 112 and the cold end 111 of the semiconductor chilling plate 110.
Specifically, the processing module reduces the voltages of the hot end 112 and the cold end 111 of the semiconductor refrigeration sheet 110 through the control circuit, so as to increase the temperature of the cold end 111 of the semiconductor refrigeration sheet 110 and avoid the cold dissipation assembly 120 from freezing.
According to the anti-icing control method of the dehumidifier 100 and the dehumidifier 100, the temperature of the cold dissipation assembly 120 can be increased through the temperature control unit, so that icing is avoided.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (6)
1. An anti-icing control method for a dehumidifier is characterized by comprising the following steps:
acquiring the ambient temperature of the environment where the dehumidifier is located through a first temperature sensor;
acquiring the environmental humidity of the environment where the dehumidifier is located through a humidity sensor;
when the ambient temperature is lower than a first preset value or the ambient humidity is higher than a second preset value, controlling a control circuit to enable a semiconductor refrigeration sheet to be connected with current to start a dehumidification function;
acquiring the real-time temperature of a cold dissipation assembly through a second temperature sensor, wherein the cold dissipation assembly is arranged at the cold end of the semiconductor refrigeration sheet;
when the temperature of the cooling component is continuously lower than a third preset value within a preset time period, controlling a temperature control unit to increase the temperature of the cooling component so as to enable the temperature of the cooling component to be higher than zero degrees centigrade;
wherein, the temperature control unit is the fan, control temperature control unit improves the temperature of cooling subassembly looses to make the temperature of cooling subassembly be higher than zero degree centigrade and include:
reducing the rotation speed of the fan in the second direction; when the fan rotates in the second direction, the airflow generated by the fan sequentially passes through the cold dissipation assembly and the heat dissipation assembly, wherein the heat dissipation assembly is arranged at the hot end of the semiconductor refrigerating sheet.
2. The anti-icing control method for the dehumidifier according to claim 1, wherein when the ambient temperature is lower than a first preset value or when the ambient humidity is higher than a second preset value, before controlling the control circuit to switch the semiconductor chilling plate on the current to start the dehumidification function, the method further comprises:
acquiring a dew point temperature according to the environment temperature and the environment humidity;
and acquiring the first preset value according to the dew point temperature.
3. A dehumidifier to which the method for controlling anti-icing of the dehumidifier according to any one of claims 1 to 2 is applied, the dehumidifier comprising:
the first temperature sensor is used for detecting the ambient temperature of the environment where the dehumidifier is located;
the humidity sensor is used for detecting the environmental humidity of the environment where the dehumidifier is located;
the semiconductor refrigeration piece is electrically connected with the control circuit, the semiconductor refrigeration piece is provided with a cold end, and when the ambient temperature is lower than a first preset value or the ambient humidity is higher than a second preset value, the control circuit is used for enabling the semiconductor refrigeration piece to be connected with current to start a dehumidification function;
the cold dispersing component is arranged at the cold end;
the second temperature sensor is used for detecting the real-time temperature of the cold dissipation assembly;
the temperature control unit is used for increasing the temperature of the cooling component when the temperature of the cooling component is continuously lower than a first preset value in a preset time period so as to enable the temperature of the cooling component to be higher than zero centigrade;
the first temperature sensor, the humidity sensor, the control circuit, the semiconductor refrigeration piece, the second temperature sensor and the temperature control unit are all electrically connected with the processing module;
the dehumidifier further comprises a heat dissipation assembly, the semiconductor refrigeration sheet is further provided with a hot end, the heat dissipation assembly is arranged on the hot end, the temperature control unit is a fan, the fan is arranged between the heat dissipation assembly and the heat dissipation assembly, and the fan is provided with a first working state rotating towards a first direction and a second working state rotating towards a second direction opposite to the first direction;
the fan can generate airflow in the first working state to sequentially pass through the heat dissipation assembly and the cold dissipation assembly; the fan is in the air current that the second operating condition produced can pass through in proper order the cooling subassembly with radiator unit.
4. The dehumidifier of claim 3, wherein the cooling dissipating assembly comprises a first connecting member, a first heat pipe and a cooling dissipating sheet, the first connecting member is sleeved outside the first heat pipe and fixed on the cold end, the first connecting member is a heat conducting member, and the first heat pipe and the cold end can transfer heat through the first connecting member.
5. The dehumidifier of claim 3, wherein the heat sink assembly includes a second connector, a second heat pipe, and a heat sink, the second connector is sleeved outside the second heat pipe and fixed to the hot end, the second connector is a heat conducting member, the second heat pipe and the hot end can transfer heat through the second connector, and the heat sink is disposed on the second heat pipe.
6. The dehumidifier of claim 3, wherein the processing module is further configured to obtain a dew point temperature according to the ambient temperature and the ambient humidity, and obtain the first preset value according to the dew point temperature.
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| CN113587509B (en) * | 2021-06-24 | 2022-10-11 | 纽爱新能源(广州)有限公司 | Anti-frost heat exchanger fin for air source heat pump |
| CN114087728B (en) * | 2021-11-15 | 2022-11-18 | 珠海格力电器股份有限公司 | Dehumidifier control method and device and dehumidifier |
| CN114440396B (en) * | 2022-03-18 | 2023-04-11 | 珠海格力电器股份有限公司 | Control method of semiconductor dehumidifier and semiconductor dehumidifier |
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