CN111503968A - Air-cooled refrigerator and dehumidification method thereof - Google Patents
Air-cooled refrigerator and dehumidification method thereof Download PDFInfo
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- CN111503968A CN111503968A CN202010354508.7A CN202010354508A CN111503968A CN 111503968 A CN111503968 A CN 111503968A CN 202010354508 A CN202010354508 A CN 202010354508A CN 111503968 A CN111503968 A CN 111503968A
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- 238000000034 method Methods 0.000 title claims abstract description 18
- 238000007791 dehumidification Methods 0.000 title claims abstract description 13
- 238000005057 refrigeration Methods 0.000 claims abstract description 96
- 238000010438 heat treatment Methods 0.000 claims abstract description 76
- 230000005494 condensation Effects 0.000 claims abstract description 16
- 238000009833 condensation Methods 0.000 claims abstract description 16
- 238000001816 cooling Methods 0.000 claims description 62
- 239000004065 semiconductor Substances 0.000 claims description 55
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 28
- 230000002093 peripheral effect Effects 0.000 claims description 12
- 230000000630 rising effect Effects 0.000 abstract description 5
- 230000000694 effects Effects 0.000 description 11
- 238000007710 freezing Methods 0.000 description 5
- 230000008014 freezing Effects 0.000 description 5
- 239000003507 refrigerant Substances 0.000 description 3
- 235000012149 noodles Nutrition 0.000 description 2
- 238000004378 air conditioning Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
- F25D11/02—Self-contained movable devices, e.g. domestic refrigerators with cooling compartments at different temperatures
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
- F25D17/04—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection
- F25D17/042—Air treating means within refrigerated spaces
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D21/00—Defrosting; Preventing frosting; Removing condensed or defrost water
- F25D21/04—Preventing the formation of frost or condensate
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D23/00—General constructional features
- F25D23/006—General constructional features for mounting refrigerating machinery components
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D29/00—Arrangement or mounting of control or safety devices
- F25D29/005—Mounting of control devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D2317/00—Details or arrangements for circulating cooling fluids; Details or arrangements for circulating gas, e.g. air, within refrigerated spaces, not provided for in other groups of this subclass
- F25D2317/04—Treating air flowing to refrigeration compartments
- F25D2317/041—Treating air flowing to refrigeration compartments by purification
- F25D2317/0411—Treating air flowing to refrigeration compartments by purification by dehumidification
- F25D2317/04111—Control means therefor
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D2600/00—Control issues
- F25D2600/06—Controlling according to a predetermined profile
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention relates to an air-cooled refrigerator and a dehumidification method thereof, wherein the air-cooled refrigerator comprises a refrigeration cavity, a return air duct and an evaporator, the return air duct is used for conveying temperature-rising gas in the refrigeration cavity to the evaporator for heat exchange and temperature reduction, a heating piece and a refrigerating piece are arranged in the return air duct, and the heating piece and the refrigerating piece are sequentially arranged in the air circulation direction of the return air duct. When the temperature rising gas in the refrigeration cavity flows to the evaporator from the return air duct, the temperature rising gas can pass through the heating piece to be heated, so that the dew point temperature is increased, and then condensation instead of frosting can be formed when the refrigeration piece is cooled. The formed condensation can flow out of the return air duct, so that the humidity of the gas conveyed to the evaporator from the return air duct is reduced, and the condition that the frosting heat exchange efficiency is reduced on the evaporator is avoided.
Description
Technical Field
The invention relates to the technical field of refrigeration equipment, in particular to an air-cooled refrigerator and a dehumidification method thereof.
Background
In the process of refrigerating, the air-cooled refrigerator generates cold air through an evaporator, and then the cold air is blown into a refrigerating chamber or a freezing chamber by a fan. Meanwhile, the temperature-rising gas in the refrigerating chamber or the freezing chamber reaches the evaporator through the air return duct, and enters the refrigerating chamber or the freezing chamber as cold air after heat exchange is carried out on the evaporator, so that a refrigeration circulation loop is formed. However, the humidity of air in the refrigerating chamber is high, and the frosting phenomenon exists when the temperature of the heated air is reduced through the evaporator. And the evaporator frosts to cause the reduction of heat exchange efficiency and influence the refrigeration effect of the refrigerator.
Disclosure of Invention
Accordingly, it is necessary to provide an air-cooled refrigerator and a dehumidifying method thereof to solve the problem of the heat exchange efficiency reduction due to the frost formation on the evaporator.
The utility model provides an air-cooled refrigerator, includes refrigeration cavity, return air wind channel and evaporimeter, the return air wind channel be used for with temperature rising gas in the refrigeration cavity carries to the evaporimeter carries out the heat transfer cooling, be equipped with heating and refrigeration piece in the return air wind channel, heating with refrigeration piece is in set gradually on the gas flow direction in return air wind channel.
According to the scheme, the air-cooled refrigerator is provided, when the temperature rising gas in the refrigerating cavity flows from the return air duct to the evaporator, the temperature rising gas can pass through the heating piece to be heated and raised, so that the dew point temperature is increased, and then condensation instead of frosting can be formed when the refrigerating piece is cooled. The formed condensation can flow out of the return air duct, so that the humidity of the gas conveyed to the evaporator from the return air duct is reduced, and the condition that the frosting heat exchange efficiency is reduced on the evaporator is avoided.
In one embodiment, the air-cooled refrigerator further comprises a semiconductor refrigeration assembly, the heating piece is a heating end of the semiconductor refrigeration assembly, and the refrigeration piece is a refrigeration end of the semiconductor refrigeration assembly.
In one embodiment, the semiconductor refrigeration assembly includes a semiconductor refrigeration sheet, a hot end heat conduction block, a hot end fin, a cold end heat conduction block and a cold end fin, which are all located in the return air duct, the hot end heat conduction block is located between a heating surface of the semiconductor refrigeration sheet and the hot end fin and is used for transferring heat of the heating surface to the hot end fin, the hot end heat conduction block and the hot end fin form the heating end, the cold end heat conduction block is located between the cooling surface of the semiconductor refrigeration sheet and the refrigeration fin and is used for transferring cold of the cooling surface to the cold end fin, and the cold end heat conduction block and the cold end fin form the cooling end.
In one embodiment, the cross sections of the semiconductor refrigeration sheet, the hot end heat conduction block and the cold end heat conduction block are smaller than the cross section of the return air duct, the hot end fins and the cold end fins are multiple, the hot end fins are arranged at intervals to form a heat exchange frame, the outer peripheral surface of the heat exchange frame is tightly attached to the air duct wall of the return air duct, the cold end fins are arranged at intervals to form a cold exchange frame, and the outer peripheral surface of the cold exchange frame is tightly attached to the air duct wall of the return air duct.
In one embodiment, the semiconductor refrigeration assembly includes a semiconductor refrigeration sheet, a hot end heat conduction block, a hot end fin, a cold end heat conduction block and a cold end fin, the hot end heat conduction block is located between a heating surface of the semiconductor refrigeration sheet and the hot end fin and used for transferring heat of the heating surface to the hot end fin, the heating end is the hot end fin, the cold end heat conduction block is located between the cooling surface of the semiconductor refrigeration sheet and the refrigeration fin and used for transferring cold of the cooling surface to the cold end fin, the cooling end is the cold end fin, and the semiconductor refrigeration sheet, the hot end heat conduction block and the cold end heat conduction block are located outside the return air duct.
In one embodiment, the heat end fins and the cold end fins are multiple, the heat end fins are arranged at intervals to form a heat exchange frame, the outer peripheral surface of the heat exchange frame is tightly attached to the air duct wall of the return air duct, the cold end fins are arranged at intervals to form a cold exchange frame, and the outer peripheral surface of the cold exchange frame is tightly attached to the air duct wall of the return air duct.
In one embodiment, a first heat pipe is arranged between the hot end heat conduction block and the hot end fin and used for transferring heat of the hot end heat conduction block to the hot end fin, and/or a second heat pipe is arranged between the cold end heat conduction block and the cold end fin and used for transferring cold of the cold end heat conduction block to the cold end fin.
In one embodiment, the part of the return air duct close to the refrigeration cavity is a return air inlet section, the heating part and the refrigeration part are both positioned in the return air inlet section, and the return air inlet section is arranged obliquely relative to the horizontal plane, so that condensation in the return air inlet section can flow towards the direction close to the inlet of the return air inlet section.
In one embodiment, the air-cooled refrigerator further comprises a water receiving box, a water guide pipe and a water receiving tray, wherein the water receiving box is located at an inlet of the return air inlet section and used for receiving the condensed dew, the water guide pipe is communicated between the water receiving box and the water receiving tray, and the water receiving tray is located outside the refrigeration cavity.
In one embodiment, the refrigeration chamber is a cold room of the air-cooled refrigerator.
In one embodiment, a humidity sensor is disposed in the refrigeration chamber and used for detecting humidity in the refrigeration chamber, and the humidity sensor is electrically connected with the heating element and the refrigeration element.
A dehumidification method of an air-cooled refrigerator is used for dehumidifying the air-cooled refrigerator and comprises the following steps:
acquiring the air humidity S in the refrigeration cavity;
and comparing the air humidity S with a preset highest air humidity S1, and if S is greater than S1, operating the heating element and the cooling element to perform dehumidification.
According to the scheme, after the air humidity S in the refrigerating chamber is obtained, whether the heating piece and the refrigerating piece work or not is controlled according to the size relation between the air humidity S and the preset highest air humidity S1, and therefore the dehumidifying effect is achieved. Further avoid frosting on the evaporimeter, influence heat exchange efficiency's condition takes place.
In one embodiment, the dehumidification method of the air-cooled refrigerator further comprises the following steps:
comparing the magnitude between the air humidity S and a minimum air humidity S2;
if S < S2, stopping the operation of the heating piece and the cooling piece;
and if S2 is not less than S1, keeping the current working states of the heating element and the cooling element.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the invention and, together with the description, serve to explain the invention and not to limit the invention.
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic structural view of an air-cooled refrigerator according to the present embodiment;
FIG. 2 is a schematic view of the air-cooled refrigerator shown from another perspective;
FIG. 3 is an enlarged view of a portion of FIG. 2 at A;
FIG. 4 is a schematic view of the semiconductor refrigeration assembly in a return air duct according to another embodiment;
FIG. 5 is a schematic view of a semiconductor refrigeration assembly in a return air duct according to yet another embodiment;
FIG. 6 is a flowchart illustrating a dehumidifying method of an air-cooled refrigerator according to the present embodiment;
FIG. 7 is a flow chart of a dehumidifying method of an air-cooled refrigerator according to another embodiment.
Description of reference numerals:
10. air-cooling a refrigerator; 11. a refrigeration chamber; 111. a refrigerating chamber; 112. a freezing chamber; 12. an air return duct; 121. a heating element; 122. a refrigeration member; 123. an air return inlet section; 1231. an inlet; 13. an evaporator; 14. a fan; 15. an air outlet duct; 16. a semiconductor refrigeration assembly; 161. a semiconductor refrigeration sheet; 1611. heating the noodles; 1612. refrigerating noodles; 162. a hot end heat conduction block; 163. a hot end fin; 164. a cold end heat conduction block; 165. cold end fins; 166. a first heat pipe; 167. a second heat pipe; 17. a water receiving box; 18. a water conduit; 19. a water pan.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
As shown in fig. 1 and 2, in one embodiment, an air-cooled refrigerator 10 is provided, which includes a refrigeration compartment 11, a return air duct 12 and an evaporator 13, wherein the return air duct 12 is used for conveying temperature-rising gas in the refrigeration compartment 11 to the evaporator 13 for heat exchange and temperature reduction. The gas after heat exchange and temperature reduction by the evaporator 13 is conveyed to the refrigeration cavity 11 through the air outlet duct 15 of the air-cooled refrigerator 10, so that a refrigeration rotation process is formed. As shown in fig. 1 and fig. 2, a fan 14 may be disposed in the air outlet duct 15 to provide power for the cooled air so as to blow into the refrigeration cavity 11.
Specifically, the refrigerating chamber 11 is a refrigerating chamber 111 and/or a freezing chamber 112 of the air-cooled refrigerator 10.
Further, in one embodiment, the air-cooled refrigerator 10 is a single evaporator air-cooled refrigerator.
Further, as shown in fig. 2 and 3, a heating element 121 and a cooling element 122 are disposed in the return air duct 12, and the heating element 121 and the cooling element 122 are sequentially disposed in the air circulation direction of the return air duct 12. The heating element 121 is used to heat the air in the return air duct 12 passing through the heating element 121, and may be specifically a heating element, a heat source having heat of itself, or other devices capable of raising the temperature of the air. The cooling element 122 is used to cool the air passing through the cooling element 122 in the return air duct 12, and specifically may be a cooling element, a cold source having a cooling capacity, or other devices capable of reducing the temperature of the air.
For example, in an air conditioning system, a pipeline is used for conducting a refrigerant, and a pipeline for transporting a high-temperature refrigerant can pass through the return air duct 12 to be used as the heating element 121, so that the temperature of the air can be raised in a heat conduction manner; the pipeline which transmits the low-temperature refrigerant passes through the return air duct 12 to be used as a refrigerating piece, and the gas in the return air duct 12 is cooled through a heat conduction mode.
Under the same air temperature, the higher the humidity is, the higher the dew point temperature is; the higher the air temperature, the higher the dew point temperature at the same humidity. In the air-cooled refrigerator 10 provided by the present disclosure, as shown in fig. 2 and 3, when the temperature-rising gas in the refrigeration cavity 11 flows from the return air duct 12 to the evaporator 13, the temperature-rising gas is heated by the heating element 121, so as to raise the dew point temperature, and then condensation rather than frosting can be formed when the temperature of the refrigeration element 122 is lowered. The formed condensation can flow out of the return air duct 12, and the humidity of the air delivered from the return air duct 12 to the evaporator 13 is reduced, so that the condition that the frosting heat exchange efficiency on the evaporator 13 is reduced is avoided.
Specifically, the heating element 121 and the cooling element 122 may be two independent electric devices, the heating element 121 may heat to provide heat, so as to raise the temperature of the gas, and the cooling element 122 may provide cold to lower the temperature.
Alternatively, the heating element 121 and the cooling element 122 may be two parts of one electric device. For example, as shown in fig. 1 to 3, in one embodiment, the air-cooled refrigerator 10 further includes a semiconductor cooling assembly 16, the heating element 121 is a heating end of the semiconductor cooling assembly 16, and the cooling element 122 is a cooling end of the semiconductor cooling assembly 16.
The semiconductor refrigeration component 16 heats the gas in the return air duct 12 at the heating end in the working process, the dew point of the heated gas is high, condensation is formed when the gas is cooled at the refrigeration end and is discharged out of the return air duct 12, the moisture in the gas in the return air duct 12 is reduced, and the frosting condition of the gas when the gas passes through the evaporator 13 is reduced.
The semiconductor refrigeration assembly 16 is used for simultaneously playing the roles of the heating element 121 and the refrigeration element 122, so that resources are saved. As shown in fig. 3, when the semiconductor cooling assembly 16 is located in the return air duct 12, the heating end is located closer to the inlet 1231 of the return air duct 12 than the cooling end. Here, the inlet 1231 of the return air duct 12 refers to an opening of the return air duct 12 communicating with the refrigerating compartment 11.
More specifically, in one embodiment, as shown in fig. 3 and 4, the semiconductor refrigeration assembly 16 includes semiconductor refrigeration fins 161, a hot side heat conduction block 162, hot side fins 163, a cold side heat conduction block 164, and cold side fins 165, all located in the return air duct 12. The hot-end heat conduction block 162 is located between the heating surface 1611 of the semiconductor cooling fin 161 and the hot-end fin 163, and is configured to transfer heat of the heating surface 1611 to the hot-end fin 163. Specifically, the hot-end heat-conducting block 162 and the heating surface 1611 may be attached to each other, so as to improve the conduction effect. The cold-end heat conduction block 164 is located between the refrigerating surface 1612 of the semiconductor refrigerating sheet 161 and the refrigerating fins, and is used for transmitting the cold energy of the refrigerating surface 1612 to the cold-end fins 165. Specifically, the cold end heat conduction block 164 and the refrigeration surface 1612 can be attached to each other, so that the conduction effect is improved.
The hot side heat conduction block 162 and the hot side fin 163 constitute the heating side. The cold side heat conduction block 164 and the cold side fins 165 constitute the refrigeration side. The hot end fins 163 and the cold end fins 165 enlarge the contact area between the heating end and the cooling end and the gas, and improve the heat exchange effect. The hot-side heat-conducting block 162 and the hot-side fin 163 constituting the heating side are located closer to the inlet 1231 of the return air duct 12 than the cold-side heat-conducting block 164 and the cold-side fin 165 constituting the cooling side.
Further, in one embodiment, as shown in fig. 4, the cross-sections of the semiconductor cooling fins 161, the hot side heat-conducting block 162 and the cold side heat-conducting block 164 are smaller than the cross-section of the return air duct 12. The resistance of the semiconductor cooling fins 161, the hot-side heat-conducting blocks 162 and the cold-side heat-conducting blocks 164 to the gas circulation in the return air duct 12 is reduced as much as possible.
Further, the hot side fin 163 and the cold side fin 165 are plural. The heat end fins 163 are arranged at intervals to form a heat exchange frame, and the outer peripheral surface of the heat exchange frame is tightly attached to the air duct wall of the return air duct 12. The plurality of cold-end fins 165 are arranged at intervals to form a cold exchange rack, and the outer peripheral surface of the cold exchange rack is tightly attached to the air duct wall of the return air duct 12.
The heat exchange frame and the cold exchange frame further increase the contact area of the gas in the return air duct 12 and the heat exchange frame, so that the heat exchange effect is improved. Ensures that condensation can form when the gas in the return air duct 12 passes through the semiconductor cooling fins 161. Particularly, when the cross sections of the semiconductor refrigeration fins 161, the hot-end heat conduction blocks 162 and the cold-end heat conduction blocks 164 are designed to be smaller than the cross section of the return air duct 12 in order to reduce resistance to gas circulation, the areas of the hot-end heat conduction blocks 162 and the cold-end heat conduction blocks 164 which can be directly contacted with gas are smaller, and at the moment, the heat exchange area of the heat exchange frame and the cold exchange frame with larger cross sections can be effectively increased, so that the heat exchange effect is improved. And then both reduced the resistance to the gas circulation, also ensured heat transfer effect.
Further, in another embodiment, as shown in fig. 5, the semiconductor cooling assembly 16 includes semiconductor cooling fins 161, a hot side heat-conducting block 162, hot side fins 163, a cold side heat-conducting block 164, and cold side fins 165. The hot-end heat conduction block 162 is located between the heating surface 1611 of the semiconductor cooling fin 161 and the hot-end fin 163, and is configured to transfer heat of the heating surface 1611 to the hot-end fin 163. The cold-end heat conduction block 164 is located between the refrigerating surface 1612 of the semiconductor refrigerating sheet 161 and the refrigerating fins, and is used for transmitting the cold energy of the refrigerating surface 1612 to the cold-end fins 165. The heating end is the heating end fin 163, and the cooling end is the cooling end fin 165. In other words, the hot side fins 163 and the cold side fins 165 are both located in the return air duct 12, and the hot side fins 163 are located closer to the inlet 1231 of the return air duct 12 than the cold side fins 165. The semiconductor refrigeration sheet 161, the hot-end heat-conducting block 162 and the cold-end heat-conducting block 164 are all located outside the return air duct 12.
Therefore, during the operation of the air-cooled refrigerator 10, the air in the return air duct 12 only needs to pass through the hot-end fin 163 and the cold-end fin 165, and is not blocked by the semiconductor chilling plate 161, the hot-end heat-conducting block 162 and the cold-end heat-conducting block 164. And the resistance of the fins to the gas circulation can be almost ignored, so that the influence on the gas circulation is reduced as much as possible.
Further, as shown in FIG. 5, in one embodiment, there are a plurality of hot side fins 163 and cold side fins 165. The heat end fins 163 are arranged at intervals to form a heat exchange frame, and the outer peripheral surface of the heat exchange frame is tightly attached to the air duct wall of the return air duct 12. The plurality of cold-end fins 165 are arranged at intervals to form a cold exchange rack, and the outer peripheral surface of the cold exchange rack is tightly attached to the air duct wall of the return air duct 12. Thereby increasing the contact area of the gas with the hot end fins 163 and the cold end fins 165 and improving the heat exchange effect.
Further, as shown in fig. 5, in one embodiment, a first heat pipe 166 is disposed between the hot side heat-conducting block 162 and the hot side fin 163, and is used for transferring heat of the hot side heat-conducting block 162 to the hot side fin 163. And/or a second heat pipe 167 is arranged between the cold-end heat-conducting block 164 and the cold-end fin 165 and is used for transmitting the cold energy of the cold-end heat-conducting block 164 to the cold-end fin 165.
The heating surface 1611 of the semiconductor cooling plate 161 transfers heat to the hot-side fin 163 through the hot-side heat conduction block 162 and the first heat pipe 166. The refrigerating surface 1612 of the semiconductor refrigerating sheet 161 transmits cold to the cold-side fin 165 through the cold-side heat-conducting block 164 and the second heat pipe 167.
Further, as shown in fig. 5, the first heat pipe 166 and/or the second heat pipe 167 are located outside the return air duct 12.
Further, as shown in fig. 1 to 3, in one embodiment, the portion of the return air duct 12 adjacent to the refrigerated compartment 11 is a return air inlet section 123. The heating member 121 and the cooling member 122 are both located in the return air inlet section 123. The return air inlet section 123 is disposed at an angle with respect to the horizontal plane such that the condensation in the return air inlet section 123 can flow in a direction close to the inlet 1231 of the return air inlet section 123.
After entering the return air duct 12, the temperature-rising gas in the refrigeration cavity 11 passes through the heating member 121 and the refrigeration member 122 in sequence, moisture in the gas forms condensation, and the condensation flows to the inlet 1231 of the return air inlet section 123 along the wall surface of the obliquely arranged return air inlet section 123, so that the condensation is prevented from being condensed along the wall surface flow channel evaporator 13 of the return air duct 12.
Specifically, as shown in fig. 4, when the semiconductor refrigeration unit 16 is fully disposed in the return air duct 12, the semiconductor refrigeration unit 16 is located in the return air inlet section 123. As shown in fig. 5, when only the hot side fin 163 and the cold side fin 165 of the semiconductor module are located in the return air duct 12, the hot side fin 163 and the cold side fin 165 are located in the return air inlet section 123.
More specifically, in one embodiment, as shown in fig. 1 and 2, the air-cooled refrigerator 10 further includes a water receiving box 17, a water guide pipe 18 and a water receiving tray 19. The water receiving box 17 is located at the inlet 1231 of the return air inlet section 123 and is used for receiving the condensation, the water guide pipe 18 is communicated between the water receiving box 17 and the water receiving tray 19, and the water receiving tray 19 is located outside the refrigeration chamber 11. The formed condensation finally enters the water receiving tray 19 and is discharged out of the refrigeration chamber 11, so that the moisture in the refrigeration chamber 11 is reduced, and the dehumidification effect is achieved.
Further, in an embodiment, a humidity sensor is disposed in the refrigeration chamber 11 for detecting the humidity in the refrigeration chamber 11, and the humidity sensor is electrically connected to the heating element 121 and the refrigeration element 122.
When the air humidity S detected by the humidity sensor is greater than the preset maximum air humidity S1, the heating element 121 and the cooling element 122 are started to perform dehumidification. When the air humidity S detected by the humidity sensor is less than the preset minimum air humidity S2, the heating element 121 and the cooling element 122 stop operating. When the air humidity S detected by the humidity sensor is between the preset maximum air humidity S1 and the preset minimum air humidity S2, the operation state of the heating elements 121 and the cooling elements 122 at this time is maintained. The states of the heating member 121 and the cooling member 122 are controlled in real time, and the humidity in the cooling chamber 11 is controlled.
Further, in another embodiment, as shown in fig. 6, there is provided a dehumidifying method for an air-cooled refrigerator 10, for dehumidifying the air-cooled refrigerator, the dehumidifying method for an air-cooled refrigerator comprising the following steps:
obtaining the air humidity S in the refrigeration chamber 11;
comparing the air humidity S with a preset maximum air humidity S1, if S > S1, the heating element 121 and the cooling element 122 operate to dehumidify.
According to the dehumidification method of the air-cooled refrigerator, after the air humidity S in the refrigeration cavity 11 is obtained, whether the heating element 121 and the refrigeration element 122 work or not is controlled according to the size relation between the air humidity S and the preset highest air humidity S1, so that the dehumidification effect is achieved. Further avoid frosting on the evaporimeter 13, influence heat exchange efficiency's condition emergence.
Further, in an embodiment, as shown in fig. 7, the dehumidification method of the air-cooled refrigerator further includes the following steps:
comparing the magnitude between the air humidity S and a minimum air humidity S2;
if S < S2, the heating element 121 and the cooling element 122 stop operating;
and if S2 is not less than S1, keeping the current working state of the heating element 121 and the cooling element 122.
When S < S2, it is proved that the humidity in the refrigerating chamber 11 is too low, and the operation of the heating member 121 and the refrigerating member 122 is stopped, so that the humidity in the refrigerating chamber 11 gradually increases. When S2 is not less than S1, it is proved that the humidity in the cooling chamber 11 is within the allowable range, and the current working state of the heating element 121 and the cooling element 122 is maintained.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (13)
1. The utility model provides an air-cooled refrigerator, its characterized in that, includes refrigeration cavity, return air wind channel and evaporimeter, the return air wind channel be used for with temperature rise gas in the refrigeration cavity carries to the evaporimeter carries out the heat transfer cooling, be equipped with heating piece and refrigeration piece in the return air wind channel, heating piece with the refrigeration piece is in set gradually on the gas flow direction in return air wind channel.
2. The air-cooled refrigerator according to claim 1, further comprising a semiconductor refrigeration assembly, wherein the heating member is a heating end of the semiconductor refrigeration assembly, and the refrigerating member is a refrigerating end of the semiconductor refrigeration assembly.
3. The air-cooled refrigerator according to claim 2, wherein the semiconductor refrigeration assembly includes a semiconductor refrigeration sheet, a hot end heat conduction block, a hot end fin, a cold end heat conduction block, and a cold end fin, all of which are located in the return air duct, the hot end heat conduction block is located between a heating surface of the semiconductor refrigeration sheet and the hot end fin and is used for transferring heat of the heating surface to the hot end fin, the hot end heat conduction block and the hot end fin constitute the heating end, the cold end heat conduction block is located between the cooling surface of the semiconductor refrigeration sheet and the cooling fin and is used for transferring cold of the cooling surface to the cold end fin, and the cold end heat conduction block and the cold end fin constitute the cooling end.
4. The air-cooled refrigerator of claim 3, wherein the cross sections of the semiconductor refrigeration fins, the hot end heat conduction block and the cold end heat conduction block are smaller than the cross section of the return air duct, the hot end fins and the cold end fins are multiple, the hot end fins are arranged at intervals to form a heat exchange frame, the outer peripheral surface of the heat exchange frame is tightly attached to the air duct wall of the return air duct, the cold end fins are arranged at intervals to form a cold exchange frame, and the outer peripheral surface of the cold exchange frame is tightly attached to the air duct wall of the return air duct.
5. The air-cooled refrigerator according to claim 2, wherein the semiconductor refrigeration assembly comprises a semiconductor refrigeration sheet, a hot end heat conduction block, a hot end fin, a cold end heat conduction block and a cold end fin, the hot end heat conduction block is located between a heating surface of the semiconductor refrigeration sheet and the hot end fin and used for transferring heat of the heating surface to the hot end fin, the heating end is the hot end fin, the cold end heat conduction block is located between the refrigeration surface of the semiconductor refrigeration sheet and the refrigeration fin and used for transferring cold of the refrigeration surface to the cold end fin, the refrigeration end is the cold end fin, and the semiconductor refrigeration sheet, the hot end heat conduction block and the cold end heat conduction block are located outside the return air duct.
6. The air-cooled refrigerator according to claim 5, wherein the number of the hot end fins and the number of the cold end fins are plural, the plural hot end fins are arranged at intervals to form a heat exchange frame, the outer peripheral surface of the heat exchange frame is closely attached to the air duct wall of the return air duct, the plural cold end fins are arranged at intervals to form a cold exchange frame, and the outer peripheral surface of the cold exchange frame is closely attached to the air duct wall of the return air duct.
7. The air-cooled refrigerator according to claim 5, wherein a first heat pipe is provided between the hot-end heat conduction block and the hot-end fin for transferring heat of the hot-end heat conduction block to the hot-end fin, and/or a second heat pipe is provided between the cold-end heat conduction block and the cold-end fin for transferring cold of the cold-end heat conduction block to the cold-end fin.
8. The air-cooled refrigerator of any one of claims 1 to 7, wherein the portion of the return air duct adjacent to the refrigeration compartment is a return air inlet section, the heating element and the cooling element are both located in the return air inlet section, and the return air inlet section is disposed at an angle relative to a horizontal plane such that condensation in the return air inlet section can flow in a direction adjacent to the inlet of the return air inlet section.
9. The air-cooled refrigerator according to claim 8, further comprising a water receiving box, a water conduit and a water receiving tray, wherein the water receiving box is located at an inlet of the return air inlet section and used for receiving the condensed dew, the water conduit is communicated between the water receiving box and the water receiving tray, and the water receiving tray is located outside the refrigeration cavity.
10. The air-cooled refrigerator as claimed in any one of claims 1 to 7, wherein the refrigerating chamber is a refrigerating chamber of the air-cooled refrigerator.
11. The air-cooled refrigerator according to any one of claims 1 to 7, wherein a humidity sensor is disposed in the cooling chamber for detecting humidity in the cooling chamber, and the humidity sensor is electrically connected to the heating element and the cooling element.
12. A dehumidifying method for an air-cooled refrigerator according to any one of claims 1 to 11, comprising the steps of:
acquiring the air humidity S in the refrigeration cavity;
and comparing the air humidity S with a preset highest air humidity S1, and if S is greater than S1, operating the heating element and the cooling element to perform dehumidification.
13. The method for dehumidifying an air-cooled refrigerator as claimed in claim 12, further comprising the steps of:
comparing the magnitude between the air humidity S and a minimum air humidity S2;
if S < S2, stopping the operation of the heating piece and the cooling piece;
and if S2 is not less than S1, keeping the current working states of the heating element and the cooling element.
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| CN202010354508.7A CN111503968A (en) | 2020-04-29 | 2020-04-29 | Air-cooled refrigerator and dehumidification method thereof |
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| CN202010354508.7A CN111503968A (en) | 2020-04-29 | 2020-04-29 | Air-cooled refrigerator and dehumidification method thereof |
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| CN115265038A (en) * | 2022-07-20 | 2022-11-01 | 澳柯玛股份有限公司 | Refrigerator air duct system |
| WO2023124631A1 (en) * | 2021-12-27 | 2023-07-06 | 青岛海尔电冰箱有限公司 | Refrigerator |
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Application publication date: 20200807 |