CN209310154U - Semiconductor dehumidifying device - Google Patents
Semiconductor dehumidifying device Download PDFInfo
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- CN209310154U CN209310154U CN201822122954.6U CN201822122954U CN209310154U CN 209310154 U CN209310154 U CN 209310154U CN 201822122954 U CN201822122954 U CN 201822122954U CN 209310154 U CN209310154 U CN 209310154U
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- semiconductor
- condensation
- dehumidifying device
- radiator
- chilling plate
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Abstract
The utility model discloses a kind of semiconductor dehumidifying devices, comprising: the inlet end of fluid communication and outlet side；Dehumidification by condensation unit, including condensation end, semiconductor chilling plate, radiator and the cooling fan stacked gradually, the condensation end and the inlet end are in fluid communication, the cold end of the semiconductor chilling plate is connected to the condensation end, hot end is connected to the radiator, the radiator and/or the cooling fan and the outlet side is in fluid communication；Water collecting unit is set to the lower section of the semiconductor chilling plate, for gathering condensed water.The semiconductor dehumidifying device small volume and less weight is easy to the advantages of taking electricity, adapting to the needs of Portable movable application, have both excellent dehumidification efficiency, mute energy-saving.
Description
Technical field
The utility model belongs to dehumidification device technical field, is a kind of semiconductor dehumidifying device specifically.
Background technique
Dehumidifier is also known as dehumidifier, drying machine, dehumidifier, is widely used in covering work to the occasion of humidity sensitive
Industry field and civil field, the former include all kinds of workshops, process manufacture and laboratory applications, the latter include plantation cultivation,
Domestic dehumidifying etc..
Current dehumidifier realizes that there are many deficiencies by using compressor refrigeration mode.For example, compressor arrangement is multiple
Miscellaneous, bulky, limited space is more and cannot achieve Portable movable application；For another example, energy consumption of compressor is very big, for power supply
Network requirement is high, takes the electric inconvenient and feature of environmental protection low；For another example, refrigerant is easy leakage, damages to atmospheric environment；In addition, pressure
Contracting machine transmission parts are numerous, and the accuracy of manufacture requires height, and easily send out mechanical oscillation and generate noise.With coming for movable living epoch
Face, existing dehumidifier has been difficult to meet using needs.
Utility model content
A kind of in order to overcome the deficiencies of the prior art, the utility model provides semiconductor dehumidifying device, small volume and less weight, easily
In taking electricity, the advantages of adapting to the needs that Portable movable is applied, have both excellent dehumidification efficiency, mute energy-saving.
The purpose of this utility model is achieved through the following technical solutions:
A kind of semiconductor dehumidifying device, comprising:
The inlet end of fluid communication and outlet side；
Dehumidification by condensation unit, it is described including condensation end, semiconductor chilling plate, radiator and the cooling fan stacked gradually
Condensation end and the inlet end are in fluid communication, and the cold end of the semiconductor chilling plate is connected to the condensation end, and hot end is connected to
The radiator, the radiator and/or the cooling fan and the outlet side are in fluid communication；
Water collecting unit is set to the lower section of the semiconductor chilling plate, for gathering condensed water.
As an improvement of the above technical solution, the condensation end has a plurality of condensate films of spacing setting, the plural number
A condensate film is connected to the cold end of the semiconductor chilling plate.
As a further improvement of the above technical scheme, the radiator has a plurality of radiating fins of spacing distribution,
There is through-flow turnpike, the through-flow turnpike and the condensation end are in fluid communication between adjacent radiating fin.
As a further improvement of the above technical scheme, the water collecting unit includes that the catch basin being in fluid communication and drainage are defeated
Outlet, the catch basin are set to the lower section of the semiconductor chilling plate, and the drainage output end exports the collection for draining
Condensed water in sink.
As a further improvement of the above technical scheme, the water collecting unit is connected with water storage container, the water storage container
For storing the condensed water.
It as a further improvement of the above technical scheme, further include liquid level float and limit switch, the liquid level float drift
Float on the condensation water surface of the water storage container, the limit switch is set to the upper limit of the stroke that floats up and down of the liquid level float
Position.
As a further improvement of the above technical scheme, the semiconductor dehumidifying device further includes device housing, the dress
Shell is set with accommodating chamber, the accommodating chamber is fluidly connected to the inlet end and the outlet side, the dehumidification by condensation respectively
Unit and the water collecting unit are respectively arranged in the accommodating chamber.
As a further improvement of the above technical scheme, described device shell has a plurality of outlet sides, described a plurality of
Outlet side is lived apart the side of the inlet end.
As a further improvement of the above technical scheme, the semiconductor dehumidifying device further includes that ambient temperature and humidity sensing is single
Member, for detecting ambient temperature and humidity；And/or the semiconductor dehumidifying device further includes condensation end temperature sensor, for detecting
The real time temperature of the condensation end.
A kind of control method of semiconductor dehumidifying device, for controlling semiconductor dehumidifying device described in any of the above item,
Include:
Obtain the real time temperature of the condensation end；
Judge whether the real time temperature is more than zero centigrade, otherwise closes the semiconductor chilling plate；
Current environment temperature and humidity value is obtained, determines the dew-point temperature of current working under dew-point temperature master pattern according to it,
Ideal dehumidifying temperature range is determined according to the dew-point temperature of the current working；
The temperature regulated quantity of the condensation end is determined according to the real time temperature and the ideal dehumidifying temperature range；
The input power of the semiconductor chilling plate is controlled according to the temperature regulated quantity of the condensation end, until described real-time
Temperature is in the ideal dehumidifying temperature range.
The beneficial effects of the utility model are:
Dehumidification by condensation unit is set between inlet end and outlet side, and dehumidification by condensation unit is only by condensation end, semiconductor system
Cold, radiator and cooling fan stack gradually composition, and gather condensed water in its lower setting water collecting unit, compact structure and it is easy
In carrying；
Condensation end is set to keep low temperature by the cold end of semiconductor chilling plate, condensation end continuingly acts on air and makes water therein
Vapour condenses and realizes dehumidifying, and the hot end of semiconductor chilling plate is cooled down by radiator, saves complicated machine driving and motion structure,
Realize mute refrigeration purpose；
The cold dry air formed after condensation end cooling and dehumidifying flows through radiator under the drainage of cooling fan and realizes
Cooling to radiator guarantees that condensation end stablizes low temperature and has excellent dehumidification by condensation efficiency, reuses to thermal energy multistage
And there is ideal Energy Efficiency Ratio, it realizes energy-saving and environment-friendly purpose, is easy to that electricity is taken to power and promote environmental suitability and cruising ability.
To enable the above objects, features, and advantages of the utility model to be clearer and more comprehensible, preferred embodiment is cited below particularly, and
Cooperate appended attached drawing, is described in detail below.
Detailed description of the invention
It, below will be to use required in embodiment in order to illustrate more clearly of the technical solution of the utility model embodiment
Attached drawing be briefly described, it should be understood that the following drawings illustrates only some embodiments of the utility model, therefore should not be by
Regard the restriction to range as, for those of ordinary skill in the art, without creative efforts, may be used also
To obtain other relevant attached drawings according to these attached drawings.
Fig. 1 is the axonometric schematic diagram for the semiconductor dehumidifying device that the utility model embodiment 1 provides；
Fig. 2 is the partial schematic sectional view for the semiconductor dehumidifying device that the utility model embodiment 1 provides；
Fig. 3 is that the first axle after the semiconductor dehumidifying device removal device shell that the utility model embodiment 1 provides measures
It is intended to；
Fig. 4 is the schematic cross-sectional view after the semiconductor dehumidifying device removal device shell that the utility model embodiment 1 provides；
Fig. 5 is that the second axis after the semiconductor dehumidifying device removal device shell that the utility model embodiment 1 provides measures
It is intended to；
Fig. 6 is the perspective diagram of the water storage container for the semiconductor dehumidifying device that the utility model embodiment 1 provides；
Fig. 7 is the axonometric schematic diagram of the control unit for the semiconductor dehumidifying device that the utility model embodiment 1 provides.
Main element symbol description:
1000- semiconductor dehumidifying device, 1100- device housing, 1110- inlet end, the outlet side 1120-, 1130- first shell
Body, 1140- second shell, 1150- hasp, 1200- dehumidification by condensation unit, 1210- condensation end, 1211- condensate film, 1212- are passed through
Passage flow duct, 1220- semiconductor chilling plate, 1221- cold end, the hot end 1222-, 1230- radiator, 1231- radiating fin, 1232-
Through-flow turnpike, 1240- cooling fan, the air duct 1250- shell, 1300- water collecting unit, 1310- catch basin, 1320- drainage output
End, 1400- water storage container, 1410- liquid level float, 1420- limit switch, 1500- ambient temperature and humidity sensing unit, 1600- are cold
Solidifying end temperature sensor, 1700- control unit, 1800- harness.
Specific embodiment
Semiconductor dehumidifying device is carried out more fully below with reference to relevant drawings for the ease of understanding the utility model,
Description.The preferred embodiment of semiconductor dehumidifying device is given in attached drawing.But semiconductor dehumidifying device can be by many not
With form realize, however it is not limited to embodiment described herein.On the contrary, purpose of providing these embodiments is makes half-and-half
The disclosure of conductor dehumidification device is more thorough and comprehensive.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.On the contrary, when element is referred to as " directly existing " another element "upper",
There is no intermediary elements.Term as used herein "vertical", "horizontal", "left" and "right" and similar statement are
For illustrative purposes.
Unless otherwise defined, all technical and scientific terms used herein are led with the technology for belonging to the utility model
The normally understood meaning of the technical staff in domain is identical.Herein in the term used in the description of semiconductor dehumidifying device
It is the purpose in order to describe specific embodiment, it is not intended that limitation the utility model.Term " and or " used herein packet
Include any and all combinations of one or more related listed items.
Embodiment 1
Fig. 1~3 are please referred to, the present embodiment discloses a kind of semiconductor dehumidifying device 1000, the semiconductor dehumidifying device
1000 include inlet end 1110, outlet side 1120, dehumidification by condensation unit 1200 and water collecting unit 1300, a kind of removable for providing
Dynamic application, energy-saving and environment-friendly dehumidification mode.
Wherein, inlet end 1110 is used to input the air for needing to dehumidify, and outlet side 1120 is for after exporting removal moisture drying
Do clean air.It is in fluid communication between inlet end 1110 and outlet side 1120, guarantees that the flow path of air is unimpeded.Exemplarily, air inlet
End 1110 is respectively provided with porous array construction with outlet side 1120.Exemplarily, extraction fan, outlet side is arranged in inlet end 1110
1120 setting scavenger fans, promote the flowing velocity of air.
Exemplarily, semiconductor dehumidifying device 1000 includes device housing 1100.Device housing 1100 has accommodating chamber, receives
Cavity is fluidly connected to inlet end 1110 and outlet side 1120 respectively.Meanwhile dehumidification by condensation unit 1200 and water collecting unit 1300
It is respectively arranged in accommodating chamber, realizes monoblock type encapsulation.Exemplarily, water collecting unit 1300 and the inner wall sealing of accommodating chamber are good
It is good.
Exemplarily, device housing 1100 includes first shell 1130 and second shell 1140, and the two splicing is surrounded and shape
At accommodating chamber.Different connection types can be used between first shell 1130 and second shell 1140 and realize splicing, such as screw thread
Connection, pin joint, snapping etc..
Fig. 3~5 are please referred to, dehumidification by condensation unit 1200 includes condensation end 1210, the semiconductor refrigerating stacked gradually
Piece 1220, radiator 1230 and cooling fan 1240 save complicated mechanical structure in a manner of semiconductor refrigerating condensation, simplify knot
Structure, compression volume promote portable performance.
It is pointed out initially that, semiconductor chilling plate 1220 has cold end 1221 and hot end 1222.Semiconductor chilling plate 1220
It is made using peltier effect, so-called peltier effect refers to when DC current passes through the galvanic couple that two kinds of semiconductor materials form
When, galvanic couple one end heat absorption, one end heat release the phenomenon that.In other words, semiconductor chilling plate 1220 is made of two kinds of semiconductor materials, shape
At cold end 1221 and hot end 1222.Cold end 1221 is persistently absorbed heat, and realizes refrigeration；Hot end 1222 continues heat release, by cold end 1221
Caloric receptivity issues together with Joule heat.
Condensation end 1210 and inlet end 1110 are in fluid communication, and are connected to the cold end 1221 of semiconductor chilling plate 1220.It changes
Yan Zhi, the heat of 1221 constant absorption condensation end 1210 of cold end make condensation end 1210 keep low temperature.Inlet end 1110 inputs outer
When boundary's air passes through condensation end 1210, makes moisture condensation liquid pearl therein from air separation because of sub-cooled, realize condensation
Dehumidify purpose.Condensation end 1210 and inlet end 1110 can be by pipeline connections, alternatively, the two keeps face and shortens stream therein
Road length is avoided extending and be lost.
Exemplarily, condensation end 1210 has a plurality of condensate films 1211 of spacing setting, and a plurality of condensate films 1211 divide
It is not connected to the cold end 1221 of semiconductor chilling plate 1220.There is gap between adjacent condensate film 1211, form perforation runner
1212 and diversion air.The setting structure of a plurality of condensate films 1211 can effectively increase contact of the condensation end 1210 with air
Area promotes dehumidification by condensation ability.Condensate film 1211 can be used each metalloid material and be made, exemplarily, condensate film 1211 by
Cold aluminium is made.
The hot end 1222 of semiconductor chilling plate 1220 is connected to radiator 1230, is carried out by radiator 1230 to hot end 1222
It is cooling.Radiator 1230 should have ideal thermal coefficient, guarantee sufficient heat-exchange capacity.Exemplarily, radiator 1230
It is made of metal material, metal material includes the types such as aluminium alloy, copper, silver.
It is appreciated that radiator 1230 realized by cooling fan 1240 it is air-cooled.Under the drainage of cooling fan 1240,
Cold dry air after 1210 cooling and dehumidifying of condensation end will flow through radiator 1230 and realize the cooling to the latter.
Wherein, radiator 1230 and/or cooling fan 1240 and outlet side 1120 are in fluid communication, and realize that flow path is unimpeded.Its
In, air can be in fluid communication along the axial direction flowing of cooling fan 1240, cooling fan 1240 and outlet side 1120；Alternatively, air
It can be flowed out along the radial direction of cooling fan 1240 from the side of radiator 1230, radiator 1230 and the circulation of outlet side 1120 connect
It is logical.
Exemplarily, device housing 1100 has a plurality of outlet sides 1120, a plurality of separation of outlet sides 1120 air inlets
The side at end 1110 makes the gas output end of radiator 1230 keep phase along the vertical and outlet side 1120 of air-flow direction
It is right, to be directly vented.
Hollow structure can be used for radiator 1230 or solid construction is realized or other different structure types.It is exemplary
Ground, radiator 1230 have a plurality of radiating fins 1231 of spacing distribution, have between adjacent radiating fin 1231 through-flow
Turnpike 1232.Through-flow turnpike 1232 is in fluid communication with condensation end 1210 (can be specially perforation runner 1212 therein), so as to sky
Air-flow is logical, to increase the contact area of cold dry air Yu radiator 1230, promotes air cooling effect.
Exemplarily, dehumidification by condensation unit 1200 further includes air duct shell 1250, for installing condensation end 1210, semiconductor
Cooling piece 1220, radiator 1230 and cooling fan 1240, and there is air duct and enable air in wherein along preset direction stream
It is dynamic.
Water collecting unit 1300 is set to the lower section of semiconductor chilling plate 1220, for gathering condensed water, realizes collecting for water
Water conservancy diversion or storage.Water collecting unit 1300 can realize that exemplarily, water collecting unit 1300 includes catch basin 1310 by different modes
With drainage output end 1320.Wherein, catch basin 1310 is set to the lower section of semiconductor chilling plate 1220, for collecting condensed water；
Drainage output end 1320 is fluidly connected to catch basin 1310, for draining the condensed water in output catch basin 1310.Exemplarily,
Draining output end 1320 has one-way conduction characteristic, for example, by using structures such as check valves, avoids condensed water adverse current to catch basin
In 1310.
Exemplarily, one end of catch basin 1310 close to drainage output end 1320 is gradually received along the flow direction of condensed water
Contracting applies acceleration to condensed water, and condensed water is made quickly to flow to drainage output end 1320.Exemplarily, catch basin 1310
There is terrace with edge or frustum cone structure, the small end and drainage output end of terrace with edge or frustum cone structure close to one end of drainage output end 1320
1320 are connected.
Fig. 1 and Fig. 6 is please referred to, exemplarily, water collecting unit 1300 is connected with water storage container 1400, water storage container
1400 for storing condensed water.Water storage container 1400 and drainage output end 1320 are in fluid communication, and receive drainage 1320 row of output end
Water out.
Exemplarily, water storage container 1400 is located at the lower section of water collecting unit 1300.Exemplarily, water storage container 1400 connects
In the lower section of device housing 1100, there is therebetween detachable structure, drained convenient for removing water storage container 1400.It is exemplary
Ground, water storage container 1400 and device housing 1100 realize tool-free dismounting by hasp 1150, promote application portability.
Exemplarily, semiconductor dehumidifying device 1000 further includes liquid level float 1410 and limit switch 1420.Liquid level float
1410 float on the condensation water surface of water storage container 1400, go up and down and float up and down with the liquid level in water storage container 1400.Limit is opened
The upper limit for the stroke that floats up and down that 1420 are set to liquid level float 1410 is closed, for realizing upper limit control.In other words, work as liquid
When position float 1410 rises to upper limit, limit switch 1420 is triggered and issues prompt information, has prompted water storage container 1400
Reach full load condition.Exemplarily, when limit switch 1420 is triggered, semiconductor dehumidifying device 1000 is closed, and avoids sending out
Unboiled water stream spill-over.
Exemplarily, semiconductor dehumidifying device 1000 further includes ambient temperature and humidity sensing unit 1500, for detecting environment
Temperature and humidity, to control operation.Ambient temperature and humidity sensing unit 1500 is set in device housing 1100, so as to external environment
Contact, can be made of temperature sensor and humidity sensor.Exemplarily, semiconductor dehumidifying device 1000 further includes condensation end temperature
Sensor 1600 is spent, for detecting the real time temperature of condensation end 1210, to control operation.
Referring to Fig. 7, exemplarily, semiconductor dehumidifying device 1000 further includes control unit 1700.Control unit 1700
The driving power in semiconductor chilling plate 1220, limit switch 1420, ambient temperature and humidity sensing unit 1500 is electrically connected
With condensation end temperature sensor 1600, for realizing the control to each unit.
Exemplarily, device housing 1100 is equipped with harness 1800, so that user bears carrying.
Exemplarily, semiconductor dehumidifying device 1000 further includes purification filtering unit, for purifying the dirt of the gaseous state in air
It contaminates object and microorganism and/or crosses the particulate matter of air filtering.The implementation of purification filtering unit is numerous, including ultraviolet sterilization
The types such as lamp, filter screen.
In all examples being illustrated and described herein, any occurrence should be construed as merely illustratively, without
It is as limitation, therefore, other examples of exemplary embodiment can have different values.
It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, does not then need that it is further defined and explained in subsequent attached drawing.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed,
But it cannot be understood as the limitations to the scope of the utility model.It should be pointed out that for the ordinary skill of this field
For personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these belong to this
The protection scope of utility model.Therefore, the protection scope of the utility model should be determined by the appended claims.
Claims (10)
1. a kind of semiconductor dehumidifying device characterized by comprising
The inlet end of fluid communication and outlet side；
Dehumidification by condensation unit, including condensation end, semiconductor chilling plate, radiator and the cooling fan stacked gradually, the condensation
End is in fluid communication with the inlet end, and the cold end of the semiconductor chilling plate is connected to the condensation end, and hot end is connected to described
Radiator, the radiator and/or the cooling fan and the outlet side are in fluid communication；
Water collecting unit is set to the lower section of the semiconductor chilling plate, for gathering condensed water.
2. semiconductor dehumidifying device according to claim 1, which is characterized in that the condensation end has answering for spacing setting
Several condensate films, a plurality of condensate films are connected to the cold end of the semiconductor chilling plate.
3. semiconductor dehumidifying device according to claim 1, which is characterized in that the radiator has answering for spacing distribution
Several radiating fins, have through-flow turnpike between adjacent radiating fin, and the through-flow turnpike and the condensation end are in fluid communication.
4. semiconductor dehumidifying device according to claim 1, which is characterized in that the water collecting unit includes being in fluid communication
Catch basin and drainage output end, the catch basin are set to the lower section of the semiconductor chilling plate, and the drainage output end is used for
Drainage exports the condensed water in the catch basin.
5. semiconductor dehumidifying device according to claim 1, which is characterized in that the water collecting unit is connected with water storage appearance
Device, the water storage container is for storing the condensed water.
6. semiconductor dehumidifying device according to claim 5, which is characterized in that it further include liquid level float and limit switch,
For the liquid level buoys float in the condensation water surface of the water storage container, the limit switch is set to the upper and lower of the liquid level float
The upper limit of floating stroke.
7. semiconductor dehumidifying device according to claim 1, which is characterized in that further include device housing, described device shell
Body has accommodating chamber, and the accommodating chamber is fluidly connected to the inlet end and the outlet side, the dehumidification by condensation unit respectively
It is respectively arranged in the accommodating chamber with the water collecting unit.
8. semiconductor dehumidifying device according to claim 7, which is characterized in that described device shell has a plurality of outlets
End, a plurality of outlet sides are lived apart the side of the inlet end.
9. semiconductor dehumidifying device according to claim 1, which is characterized in that the semiconductor dehumidifying device further includes ring
Border temperature and humidity sensing unit, for detecting ambient temperature and humidity；And/or the semiconductor dehumidifying device further includes that condensation end temperature passes
Sensor, for detecting the real time temperature of the condensation end.
10. semiconductor dehumidifying device according to claim 1, which is characterized in that further include purification filtering unit, for net
Gaseous pollutant and microorganism in change air and/or the particulate matter for crossing air filtering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822122954.6U CN209310154U (en) | 2018-12-17 | 2018-12-17 | Semiconductor dehumidifying device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822122954.6U CN209310154U (en) | 2018-12-17 | 2018-12-17 | Semiconductor dehumidifying device |
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| CN209310154U true CN209310154U (en) | 2019-08-27 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109442607A (en) * | 2018-12-17 | 2019-03-08 | 广东富信科技股份有限公司 | Semiconductor dehumidifying device and its control method |
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2018
- 2018-12-17 CN CN201822122954.6U patent/CN209310154U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109442607A (en) * | 2018-12-17 | 2019-03-08 | 广东富信科技股份有限公司 | Semiconductor dehumidifying device and its control method |
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