CN109413881A - A kind of production method of carbon oil wiring board and solder mask window - Google Patents
A kind of production method of carbon oil wiring board and solder mask window Download PDFInfo
- Publication number
- CN109413881A CN109413881A CN201811400393.XA CN201811400393A CN109413881A CN 109413881 A CN109413881 A CN 109413881A CN 201811400393 A CN201811400393 A CN 201811400393A CN 109413881 A CN109413881 A CN 109413881A
- Authority
- CN
- China
- Prior art keywords
- carbon oil
- wiring board
- solder mask
- mask window
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/052—Magnetographic patterning
Abstract
The present invention provides the production method of a kind of carbon oil wiring board and solder mask window.The production method of the carbon oil wiring board and solder mask window is the following steps are included: S1: production contraposition exposure area and laser windowing region, determines welding resistance contraposition exposure area and the other text of layer that needs the region for carrying out laser precision windowing and to export processing procedure different；S2: the production figure film and production positioning datum point, determining contraposition exposure area and laser windowing region carry out route dynamic in conjunction with actual Etching compensation rate and compensate, and according to printed circuit board layout structure.The production method of carbon oil wiring board and solder mask window provided by the invention, work original text solder mask window small 2mil integrally than route PAD, since copper PAD can be snapped the small about 1mil of alteration after circuit etching, solder mask window is suitable good tangent or slightly larger with the edge copper PAD, both it will not improve carbon oil press quality with copper PAD line edge at a distance of excessive without step, improve the qualification rate of the finished product, reduction is done over again chromatography, and reduction is scrapped.
Description
Technical field
The present invention relates to wiring board technology field more particularly to a kind of production methods of carbon oil wiring board and solder mask window.
Background technique
Wiring board is divided into single sided board if dividing by the number of plies, the three big classification of dual platen and multilayer circuit board are first
Single sided board, on most basic PCB, part concentrates one side wherein, and conducting wire then concentrates on another side, because conducting wire only occurs
One side wherein, so this PCB is just claimed to be called one-sided circuit board, single sided board is usually made simply, low cost, but a disadvantage is that
It can not be applied on too complicated product, dual platen is the extension of single sided board, when single layer wiring cannot meet the need of electronic product
It is necessary to use dual platen when wanting, it is two-sided have cover copper and have cabling, and the line between two layers can be connected by via hole
Road, is allowed to form required network connection, and multi-layer board refers to conductive pattern layer and insulation material therebetween with three layers or more
Material is laminated with being separated by, and the printed board that conductive pattern interconnects as required therebetween, multilayer circuit board be electronic information technology to
At high speed, the product that multi-functional, large capacity, small size, slimming, lightweight direction are developed.
Need the position of print carbon oil in the circuit board at present, solder mask window forms one on route copper face between ink and copper face
Layer step, the anti-welding edge of step position is not easy lower oil when carbon oil prints, and intensified pressure guarantees that lower oil is easy to appear permeability again, carbon oil
It does not print oil and causes dew copper or permeability, increase the amount of doing over again, scrap raising.
Therefore, it is necessary to provide the production method solution above-mentioned technical problem of a kind of carbon oil wiring board and solder mask window.
Summary of the invention
The technical problem to be solved by the present invention is to provide the systems of a kind of the carbon oil wiring board for improving printing quality and solder mask window
Make method.
In order to solve the above technical problems, the production method of carbon oil wiring board provided by the invention and solder mask window includes following
Step:
S1: production contraposition exposure area and laser windowing region determine welding resistance contraposition exposure area and need to carry out laser
The region of precision windowing simultaneously exports the other text of the different layer of processing procedure；
S2: the production figure film and production positioning datum point, determining contraposition exposure area and laser windowing region, in conjunction with
Actual Etching compensation rate carries out route dynamic and compensates, and according to printed circuit board layout structure, it is luxuriant and rich with fragrance to design PNL figure
Woods, the PNL figure film and actual graphical harmomegathus data make positioning datum point in the figure film；
S3: production contraposition exposure film and contraposition exposure area are exposed, develop, solidify, the PNL figure film and reality
Figure harmomegathus data, the production positioning datum point in the figure film, welding resistance contraposition exposure area and laser windowing region
The other text of different layers makes conventional welding resistance contraposition exposure film；
S4: laser windowing carries out windowing processing using solder mask of the carbon dioxide laser drilling machine to windowed regions, prints carbon
Oil by key mapping do it is anti-welding do swinging-out casement window, guarantee carbon oil spacing >=16mil, carbon oil is more unilateral than the edge copper PAD >=6mil, carbon oil key
Copper PAD spacing under position must assure that >=28mil, and work original text solder mask window small 2mil integrally than route PAD；
S5: cleaning wiring board, in the circuit board production technique carbon oil figure and vertical carbon oil figure；
S6: respectively for horizontal carbon oil figure and the horizontal carbon oil film of vertical carbon oil graphic making and the vertical carbon oil film；
S7: horizontal carbon oil silk screen is first installed on screen printer, after horizontal carbon oil silk screen and wiring board to be printed align, to be printed
The horizontal carbon oil figure of silk-screen, horizontal carbon oil figure direction are consistent with frictioning direction on wiring board, are first installed on screen printer
After horizontal carbon oil silk screen, horizontal carbon oil silk screen and wiring board to be printed contraposition, the horizontal carbon oil figure of silk-screen, water on wiring board to be printed
Flat carbon oil figure direction is consistent with frictioning direction；
S8: exposure；
S9: development；
S10: carrying out baking for the first time to wiring board makes horizontal carbon oil figure semi-solid preparation, then installs on screen printer vertical
After carbon oil silk screen, vertical carbon oil silk screen and wiring board to be printed contraposition, the vertical carbon oil figure of silk-screen on wiring board to be printed；Vertical carbon
Oily figure direction is consistent with frictioning direction；
S11: carrying out second of baking to wiring board solidifies horizontal carbon oil figure and vertical carbon oil figure.
Preferably, the positioning datum spot diameter is 1mm.
Preferably, the conditions of exposure is to be carried out using the Exposing Lamp of 3KW, and the time for exposure controls in 200s-300s.
Preferably, the wiring board cleaning, is cleaned using low concentration akaline liquid, makes what is generated when laser windowing to have
Machine carbide is removed, and subsequent pad surface processing is conducive to.
Preferably, the temperature control of first time baking is at 150-160 DEG C, time 15min.
Preferably, the temperature control of second baking is at 150-160 DEG C, time 45min.
Preferably, the horizontal carbon oil figure of the silk-screen and vertical carbon oil figure use viscosity for the carbon of 300-400dpas
Oil.
Compared with the relevant technologies, the production method of carbon oil wiring board and solder mask window provided by the invention has following beneficial
Effect:
The present invention provides the production method of a kind of carbon oil wiring board and solder mask window, does anti-welding do by key mapping by print carbon oil
Swinging-out casement window guarantees carbon oil spacing >=16mil, and carbon oil is more unilateral than the edge copper PAD >=6mil, and carbon oil presses the copper PAD spacing under key mapping
It must assure that >=28mil, route cut copper sheet processing, work original text solder mask window small 2mil integrally than route PAD, after circuit etching
Since copper PAD can be snapped the small about 1mil of alteration, solder mask window is suitable good tangent or slightly larger with the edge copper PAD, both will not without step
With copper PAD line edge at a distance of excessive, improve carbon oil press quality, improve the qualification rate of the finished product, reduction is done over again chromatography, and reduction is scrapped.
Specific embodiment
Below with reference to embodiment, the invention will be further described.A kind of production side of carbon oil wiring board and solder mask window
Method the following steps are included:
S1: production contraposition exposure area and laser windowing region determine welding resistance contraposition exposure area and need to carry out laser
The region of precision windowing simultaneously exports the other text of the different layer of processing procedure；
S2: the production figure film and production positioning datum point, determining contraposition exposure area and laser windowing region, in conjunction with
Actual Etching compensation rate carries out route dynamic and compensates, and according to printed circuit board layout structure, it is luxuriant and rich with fragrance to design PNL figure
Woods, the PNL figure film and actual graphical harmomegathus data make positioning datum point in the figure film；
S3: production contraposition exposure film and contraposition exposure area are exposed, develop, solidify, the PNL figure film and reality
Figure harmomegathus data, the production positioning datum point in the figure film, welding resistance contraposition exposure area and laser windowing region
The other text of different layers makes conventional welding resistance contraposition exposure film；
S4: laser windowing carries out windowing processing using solder mask of the carbon dioxide laser drilling machine to windowed regions, prints carbon
Oil by key mapping do it is anti-welding do swinging-out casement window, guarantee carbon oil spacing >=16mil, carbon oil is more unilateral than the edge copper PAD >=6mil, carbon oil key
Copper PAD spacing under position must assure that >=28mil, and integrally than route PAD small 2mil, laser windowing are complete for work original text solder mask window
At with +/- 10 μm of aligning accuracy；
S5: cleaning wiring board, in the circuit board production technique carbon oil figure and vertical carbon oil figure；
S6: respectively for horizontal carbon oil figure and the horizontal carbon oil film of vertical carbon oil graphic making and the vertical carbon oil film；
S7: horizontal carbon oil silk screen is first installed on screen printer, after horizontal carbon oil silk screen and wiring board to be printed align, to be printed
The horizontal carbon oil figure of silk-screen, horizontal carbon oil figure direction are consistent with frictioning direction on wiring board, are first installed on screen printer
After horizontal carbon oil silk screen, horizontal carbon oil silk screen and wiring board to be printed contraposition, the horizontal carbon oil figure of silk-screen, water on wiring board to be printed
Flat carbon oil figure direction is consistent with frictioning direction；
S8: exposure；
S9: development, the web plate exposed develop after standing 3-5min, and web plate is then soaked dissolution with clear water；Again with height
Hydraulic giant is pressed to rinse, until unexposed part is all rinsed well, hydraulic giant off-network plate distance about 0.8-1.0m；
S10: carrying out baking for the first time to wiring board makes horizontal carbon oil figure semi-solid preparation, then installs on screen printer vertical
After carbon oil silk screen, vertical carbon oil silk screen and wiring board to be printed contraposition, the vertical carbon oil figure of silk-screen on wiring board to be printed；Vertical carbon
Oily figure direction is consistent with frictioning direction；
S11: carrying out second of baking to wiring board solidifies horizontal carbon oil figure and vertical carbon oil figure.
The positioning datum spot diameter is 1mm.
The conditions of exposure is to be carried out using the Exposing Lamp of 3KW, and the time for exposure controls in 200s-300s.
The wiring board cleaning, is cleaned using low concentration akaline liquid, makes the organic carbon generated when laser windowing
Object is removed, and subsequent pad surface processing is conducive to.
The temperature control of first time baking is at 150-160 DEG C, time 15min.
The temperature control of second baking is at 150-160 DEG C, time 45min.
The horizontal carbon oil figure of silk-screen and vertical carbon oil figure use viscosity for the carbon oil of 300-400dpas, work
Whole than the route PAD small 2mil of original text solder mask window, since copper PAD can be snapped the small about 1mil of alteration, solder mask window after circuit etching
It is suitable good tangent or slightly larger with the edge copper PAD, it both will not be with copper PAD line edge at a distance of excessive without step.
Compared with the relevant technologies, the production method of carbon oil wiring board and solder mask window provided by the invention has and has as follows
Beneficial effect:
The present invention provides the production method of a kind of carbon oil wiring board and solder mask window, does anti-welding do by key mapping by print carbon oil
Swinging-out casement window guarantees carbon oil spacing >=16mil, and carbon oil is more unilateral than the edge copper PAD >=6mil, and carbon oil presses the copper PAD spacing under key mapping
It must assure that >=28mil, route cut copper sheet processing, work original text solder mask window small 2mil integrally than route PAD, after circuit etching
Since copper PAD can be snapped the small about 1mil of alteration, solder mask window is suitable good tangent or slightly larger with the edge copper PAD, both will not without step
With copper PAD line edge at a distance of excessive, improve carbon oil press quality, improve the qualification rate of the finished product, reduction is done over again chromatography, and reduction is scrapped.
The above description is only an embodiment of the present invention, is not intended to limit the scope of the invention, all to utilize this hair
Equivalent structure or equivalent flow shift made by bright specification is applied directly or indirectly in other relevant technical fields,
Similarly it is included within the scope of the present invention.
Claims (7)
1. a kind of production method of carbon oil wiring board and solder mask window, which comprises the following steps:
S1: production contraposition exposure area and laser windowing region determine welding resistance contraposition exposure area and need to carry out laser precision
The region of windowing simultaneously exports the other text of the different layer of processing procedure；
S2: the production figure film and production positioning datum point, determining contraposition exposure area and laser windowing region, in conjunction with reality
Etching compensation rate carry out route dynamic and compensate, and according to printed circuit board layout structure, design the PNL figure film, PNL
The figure film and actual graphical harmomegathus data make positioning datum point in the figure film；
S3: production contraposition exposure film and contraposition exposure area are exposed, develop, solidify, the PNL figure film and actual graphical
Harmomegathus data, make positioning datum point in the figure film, and welding resistance aligns the difference in exposure area and laser windowing region
The other text of layer makes conventional welding resistance contraposition exposure film；
S4: laser windowing carries out windowing processing using solder mask of the carbon dioxide laser drilling machine to windowed regions, and print carbon oil is pressed
Key mapping do it is anti-welding do swinging-out casement window, guarantee carbon oil spacing >=16mil, carbon oil is more unilateral than the edge copper PAD >=6mil, and carbon oil is pressed under key mapping
Copper PAD spacing must assure that >=28mil, whole than the route PAD small 2mil of work original text solder mask window；
S5: cleaning wiring board, in the circuit board production technique carbon oil figure and vertical carbon oil figure；
S6: respectively for horizontal carbon oil figure and the horizontal carbon oil film of vertical carbon oil graphic making and the vertical carbon oil film；
S7: horizontal carbon oil silk screen is first installed on screen printer, after horizontal carbon oil silk screen and wiring board to be printed align, in route to be printed
The horizontal carbon oil figure of silk-screen, horizontal carbon oil figure direction are consistent with frictioning direction on plate, are first installed on screen printer horizontal
After carbon oil silk screen, horizontal carbon oil silk screen and wiring board to be printed contraposition, the horizontal carbon oil figure of silk-screen, horizontal carbon on wiring board to be printed
Oily figure direction is consistent with frictioning direction；
S8: exposure；
S9: development；
S10: carrying out baking for the first time to wiring board makes horizontal carbon oil figure semi-solid preparation, and vertical carbon oil is then installed on screen printer
After silk screen, vertical carbon oil silk screen and wiring board to be printed contraposition, the vertical carbon oil figure of silk-screen on wiring board to be printed；Vertical carbon oil figure
Shape direction is consistent with frictioning direction；
S11: carrying out second of baking to wiring board solidifies horizontal carbon oil figure and vertical carbon oil figure.
2. the production method of carbon oil wiring board and solder mask window according to claim 1, which is characterized in that the positioning base
Diameter is 1mm on schedule.
3. the production method of carbon oil wiring board and solder mask window according to claim 1, which is characterized in that the exposure item
Part is to be carried out using the Exposing Lamp of 3KW, and the time for exposure controls in 200s-300s.
4. the production method of carbon oil wiring board and solder mask window according to claim 1, which is characterized in that the wiring board
Cleaning, is cleaned using low concentration akaline liquid, the organic carbon compound generated when laser windowing is enable to remove, and is conducive to subsequent
Pad surface processing.
5. the production method of carbon oil wiring board and solder mask window according to claim 1, which is characterized in that the first time
The temperature control of baking is at 150-160 DEG C, time 15min.
6. the production method of carbon oil wiring board and solder mask window according to claim 1, which is characterized in that described second
The temperature control of baking is at 150-160 DEG C, time 45min.
7. the production method of carbon oil wiring board and solder mask window according to claim 1, which is characterized in that the silk-screen water
Flat carbon oil figure and vertical carbon oil figure use viscosity for the carbon oil of 300-400dpas.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811400393.XA CN109413881B (en) | 2018-11-22 | 2018-11-22 | Manufacturing method of carbon oil circuit board and solder-mask windowing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811400393.XA CN109413881B (en) | 2018-11-22 | 2018-11-22 | Manufacturing method of carbon oil circuit board and solder-mask windowing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109413881A true CN109413881A (en) | 2019-03-01 |
| CN109413881B CN109413881B (en) | 2021-10-22 |
Family
ID=65474752
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811400393.XA Active CN109413881B (en) | 2018-11-22 | 2018-11-22 | Manufacturing method of carbon oil circuit board and solder-mask windowing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109413881B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110677985A (en) * | 2019-10-25 | 2020-01-10 | 杭州友成电子有限公司 | Carbon film printed board high-conductivity paste resistance value regulation and control method |
| CN110913572A (en) * | 2019-12-04 | 2020-03-24 | 东莞市若美电子科技有限公司 | LED lamp panel PAD ON PAD design structure and method |
| CN112654155A (en) * | 2020-11-24 | 2021-04-13 | 深圳和美精艺半导体科技股份有限公司 | Laser-fired lead windowing method and substrate preparation method |
| WO2022088607A1 (en) * | 2020-10-27 | 2022-05-05 | 惠州市特创电子科技股份有限公司 | Circuit board and method for forming opening thereon using laser |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103200784A (en) * | 2013-04-24 | 2013-07-10 | 梅州市志浩电子科技有限公司 | Solder mask windowing method for printed circuit board |
| CN103874336A (en) * | 2014-02-28 | 2014-06-18 | 奥士康精密电路（惠州）有限公司 | Carbon oil printing process for circuit board |
| CN204090284U (en) * | 2014-09-11 | 2015-01-07 | 大连崇达电路有限公司 | Electric conductive carbon printing printed wiring board |
| CN105163507A (en) * | 2015-08-11 | 2015-12-16 | 深圳崇达多层线路板有限公司 | Method for improving carbon oil yield |
| CN206674303U (en) * | 2017-05-08 | 2017-11-24 | 胜宏科技（惠州）股份有限公司 | It is a kind of to reveal copper circuit board without carbon oil |
| CN107493662A (en) * | 2017-08-11 | 2017-12-19 | 珠海精毅电路有限公司 | Low resistance, the method for thickness >=25um carbon oils are made on a printed-wiring board |
| CN108124388A (en) * | 2017-11-17 | 2018-06-05 | 江门崇达电路技术有限公司 | A kind of wiring board carbon oil printing technology |
-
2018
- 2018-11-22 CN CN201811400393.XA patent/CN109413881B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103200784A (en) * | 2013-04-24 | 2013-07-10 | 梅州市志浩电子科技有限公司 | Solder mask windowing method for printed circuit board |
| CN103874336A (en) * | 2014-02-28 | 2014-06-18 | 奥士康精密电路（惠州）有限公司 | Carbon oil printing process for circuit board |
| CN204090284U (en) * | 2014-09-11 | 2015-01-07 | 大连崇达电路有限公司 | Electric conductive carbon printing printed wiring board |
| CN105163507A (en) * | 2015-08-11 | 2015-12-16 | 深圳崇达多层线路板有限公司 | Method for improving carbon oil yield |
| CN206674303U (en) * | 2017-05-08 | 2017-11-24 | 胜宏科技（惠州）股份有限公司 | It is a kind of to reveal copper circuit board without carbon oil |
| CN107493662A (en) * | 2017-08-11 | 2017-12-19 | 珠海精毅电路有限公司 | Low resistance, the method for thickness >=25um carbon oils are made on a printed-wiring board |
| CN108124388A (en) * | 2017-11-17 | 2018-06-05 | 江门崇达电路技术有限公司 | A kind of wiring board carbon oil printing technology |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110677985A (en) * | 2019-10-25 | 2020-01-10 | 杭州友成电子有限公司 | Carbon film printed board high-conductivity paste resistance value regulation and control method |
| CN110913572A (en) * | 2019-12-04 | 2020-03-24 | 东莞市若美电子科技有限公司 | LED lamp panel PAD ON PAD design structure and method |
| WO2022088607A1 (en) * | 2020-10-27 | 2022-05-05 | 惠州市特创电子科技股份有限公司 | Circuit board and method for forming opening thereon using laser |
| CN112654155A (en) * | 2020-11-24 | 2021-04-13 | 深圳和美精艺半导体科技股份有限公司 | Laser-fired lead windowing method and substrate preparation method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109413881B (en) | 2021-10-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109413881A (en) | A kind of production method of carbon oil wiring board and solder mask window | |
| CN100574569C (en) | A kind of production method with long and short golden finger circuit board | |
| CN101668389B (en) | Method for making high alignment printed circuit board | |
| CN101378635B (en) | Method for producing circuit board with local electric thick gold | |
| CN101282617B (en) | Flexible printed circuit board of complete winding non-intermittence circuit as well as manufacturing technique | |
| CN109688712A (en) | The production method of the thick copper sheet of the thick gold of plating | |
| CN104202922B (en) | Method for manufacturing rigid-flex printed circuit board with rigid areas different in thickness | |
| CN108430159A (en) | A kind of oversize printed board method for drilling holes | |
| CN105430884B (en) | The preparation method of flexible PCB, terminal and flexible PCB | |
| CN102079162A (en) | Aligning mark and aligning method for screen printing | |
| CN103068175A (en) | Method of improving buried resistance printed wire board resistance precision | |
| CN104717839A (en) | Thick copper circuit board and manufacturing method thereof | |
| CN105430877A (en) | Flexible circuit board, terminal and preparation method of flexible circuit board | |
| CN107660069A (en) | A kind of PCB plate production method with half bore | |
| CN109714907A (en) | A kind of production method of the multi-layer PCB for 5G communication | |
| CN104812179B (en) | The hole copper preparation technology and printed circuit board (PCB) of a kind of printed circuit board (PCB) | |
| CN110708873A (en) | Manufacturing method for realizing positioning of embedded copper block | |
| CN108093569A (en) | A kind of processing method for reducing super thick copper circuit board welding resistance difficulty | |
| CN101594750B (en) | Structure and manufacturing method of high-density substrate | |
| CN101198211B (en) | Laminated substrate and manufacturing method thereof | |
| CN108012465A (en) | A kind of preparation method of the PCB equipped with step groove | |
| CN107666781A (en) | A kind of preparation method of circuit board | |
| CN206461842U (en) | Panel construction for making double-sided PCB board | |
| CN105611743A (en) | Manufacturing method for fine circuit | |
| CN202573249U (en) | Screen printing device with PCB (Printed Circuit Board) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |