CN109401724A - 一种太阳能封装用单组份导电硅胶及其制备方法 - Google Patents
一种太阳能封装用单组份导电硅胶及其制备方法 Download PDFInfo
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- CN109401724A CN109401724A CN201811268950.7A CN201811268950A CN109401724A CN 109401724 A CN109401724 A CN 109401724A CN 201811268950 A CN201811268950 A CN 201811268950A CN 109401724 A CN109401724 A CN 109401724A
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- silver powder
- silica gel
- coupling agent
- electric silica
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 30
- 239000000741 silica gel Substances 0.000 title claims abstract description 22
- 229910002027 silica gel Inorganic materials 0.000 title claims abstract description 22
- 238000005538 encapsulation Methods 0.000 title claims abstract description 13
- 238000002360 preparation method Methods 0.000 title claims abstract description 12
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 58
- 229920002545 silicone oil Polymers 0.000 claims abstract description 49
- 239000007822 coupling agent Substances 0.000 claims abstract description 47
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 30
- 239000002904 solvent Substances 0.000 claims abstract description 27
- 239000007788 liquid Substances 0.000 claims abstract description 16
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 15
- 239000003054 catalyst Substances 0.000 claims abstract description 14
- 239000003085 diluting agent Substances 0.000 claims abstract description 9
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 7
- 239000012744 reinforcing agent Substances 0.000 claims abstract description 7
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 30
- 239000010703 silicon Substances 0.000 claims description 30
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Natural products CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 29
- 239000001257 hydrogen Substances 0.000 claims description 21
- 229910052739 hydrogen Inorganic materials 0.000 claims description 21
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 15
- 229920002554 vinyl polymer Polymers 0.000 claims description 15
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 14
- 239000006228 supernatant Substances 0.000 claims description 14
- 239000003921 oil Substances 0.000 claims description 13
- 125000003700 epoxy group Chemical group 0.000 claims description 10
- 239000007789 gas Substances 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 10
- 238000002156 mixing Methods 0.000 claims description 9
- 238000012986 modification Methods 0.000 claims description 9
- 230000004048 modification Effects 0.000 claims description 9
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 8
- 239000005977 Ethylene Substances 0.000 claims description 8
- 150000002431 hydrogen Chemical class 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 6
- 239000002994 raw material Substances 0.000 claims description 6
- 238000003756 stirring Methods 0.000 claims description 6
- 239000013008 thixotropic agent Substances 0.000 claims description 6
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 claims description 4
- 229910052681 coesite Inorganic materials 0.000 claims description 3
- 229910052906 cristobalite Inorganic materials 0.000 claims description 3
- NCWQJOGVLLNWEO-UHFFFAOYSA-N methylsilicon Chemical compound [Si]C NCWQJOGVLLNWEO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052682 stishovite Inorganic materials 0.000 claims description 3
- 229910052905 tridymite Inorganic materials 0.000 claims description 3
- 125000004185 ester group Chemical group 0.000 claims description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 2
- 230000001788 irregular Effects 0.000 claims description 2
- -1 silicon Alkane Chemical class 0.000 claims 1
- 125000003944 tolyl group Chemical group 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 abstract description 6
- 239000004332 silver Substances 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 5
- 238000003475 lamination Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 4
- 239000000654 additive Substances 0.000 abstract description 3
- 230000000996 additive effect Effects 0.000 abstract description 3
- 238000004500 asepsis Methods 0.000 abstract description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 2
- 239000000499 gel Substances 0.000 abstract 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 29
- 238000012360 testing method Methods 0.000 description 21
- 238000010438 heat treatment Methods 0.000 description 10
- HIHIPCDUFKZOSL-UHFFFAOYSA-N ethenyl(methyl)silicon Chemical compound C[Si]C=C HIHIPCDUFKZOSL-UHFFFAOYSA-N 0.000 description 8
- 230000001404 mediated effect Effects 0.000 description 7
- 238000009835 boiling Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 238000000227 grinding Methods 0.000 description 6
- 238000001723 curing Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 239000003292 glue Substances 0.000 description 5
- 230000008901 benefit Effects 0.000 description 4
- 238000004898 kneading Methods 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000003679 aging effect Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000001351 cycling effect Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- LFVGISIMTYGQHF-UHFFFAOYSA-N ammonium dihydrogen phosphate Chemical compound [NH4+].OP(O)([O-])=O LFVGISIMTYGQHF-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000010946 fine silver Substances 0.000 description 1
- 238000002189 fluorescence spectrum Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 150000007524 organic acids Chemical group 0.000 description 1
- 125000001820 oxy group Chemical group [*:1]O[*:2] 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 231100000572 poisoning Toxicity 0.000 description 1
- 230000000607 poisoning effect Effects 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
Description
原料 | 实施例1 | 实施例2 | 实施例3 | 对比例1 |
甲基乙烯基硅油(粘度50000cps,市售) | 12 | 13 | 11 | 9 |
偶联剂KH-560 | 0.2 | 0.2 | 0.2 | |
偶联剂Z-6040 | 0.2 | 0.1 | 0.2 | 0.3 |
低含氢硅油CJ-1100 | 2 | 1.5 | 2.0 | 3 |
端含氢硅油CJ-1200 | 2 | 1 | 2.0 | |
环氧基硅油YD-830 | 1 | 2.2 | 2.0 | |
乙烯基硅油RH-Vi305B | 1 | 1 | 1 | 2 |
凯斯特铂金催化剂3000ppm | 0.004 | 0.003 | 0.003 | 0.003 |
气相硅德山化工R974 | 4 | 7 | 7 | 3 |
气相硅赢创R8200 | 0.5 | 0.5 | 0.5 | 0.5 |
道康宁OS-10 | 8 | |||
诺而曼环保G-120 | 10 | 6 | ||
处理银粉AC-0295 | 30 | 40 | 80 | |
处理银粉SF-30 | 40 | 45 | 8 | |
处理银粉P777-1 | 20 | 20 | ||
甲苯 | 2.6 |
原料 | 实施例4 | 实施例5 | 实施例6 |
甲基乙烯基硅油(粘度10000cps,市售) | 10 | 16 | 20 |
偶联剂KH-560 | 0.02 | 0.5 | 0.6 |
偶联剂Z-6040 | 0 | 0.3 | 0.4 |
低含氢硅油CJ-1100 | 1.5 | 0.3 | 2.0 |
端含氢硅油CJ-1200 | 1.5 | 0.2 | 2.0 |
环氧基硅油YD-830 | 2 | 2 | 2.5 |
乙烯基硅油RH-Vi305B | 2 | 2 | 2.5 |
凯斯特铂金催化剂3000ppm | 0.0002 | 0.01 | 0.02 |
气相硅德山化工R974 | 10 | 8 | 2 |
气相硅赢创R8200 | 2 | 3 | |
道康宁OS-10 | 5 | ||
诺而曼环保G-120 | 20 | 15 | |
处理银粉AC-0295 | 25 | 40 | |
处理银粉SF-30 | 30 | 45 | 5 |
处理银粉P777-1 | 35 | 20 | |
甲苯 |
Claims (10)
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CN201811268950.7A CN109401724B (zh) | 2018-10-29 | 2018-10-29 | 一种太阳能封装用单组份导电硅胶及其制备方法 |
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CN201811268950.7A CN109401724B (zh) | 2018-10-29 | 2018-10-29 | 一种太阳能封装用单组份导电硅胶及其制备方法 |
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Publication Number | Publication Date |
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CN109401724A true CN109401724A (zh) | 2019-03-01 |
CN109401724B CN109401724B (zh) | 2021-07-13 |
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CN201811268950.7A Active CN109401724B (zh) | 2018-10-29 | 2018-10-29 | 一种太阳能封装用单组份导电硅胶及其制备方法 |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110229648A (zh) * | 2019-06-05 | 2019-09-13 | 苏州晶银新材料股份有限公司 | 一种单组分有机硅导电胶及其制备方法和应用 |
CN111117538A (zh) * | 2019-07-15 | 2020-05-08 | 杭州正银电子材料有限公司 | 一种光伏叠瓦组件用有机硅改性的环氧导电胶及其制备方法 |
CN111548765A (zh) * | 2020-05-09 | 2020-08-18 | 浙江祥隆科技有限公司 | 有机硅体系导电胶及其制备方法 |
CN112266742A (zh) * | 2020-10-19 | 2021-01-26 | 烟台德邦科技有限公司 | 一种性能优异的导电胶的制备方法 |
CN115386332A (zh) * | 2022-06-29 | 2022-11-25 | 上海回天新材料有限公司 | 一种超耐候纯银导电硅胶及其制备方法 |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110229648A (zh) * | 2019-06-05 | 2019-09-13 | 苏州晶银新材料股份有限公司 | 一种单组分有机硅导电胶及其制备方法和应用 |
CN110229648B (zh) * | 2019-06-05 | 2021-12-24 | 苏州晶银新材料股份有限公司 | 一种单组分有机硅导电胶及其制备方法和应用 |
CN111117538A (zh) * | 2019-07-15 | 2020-05-08 | 杭州正银电子材料有限公司 | 一种光伏叠瓦组件用有机硅改性的环氧导电胶及其制备方法 |
CN111548765A (zh) * | 2020-05-09 | 2020-08-18 | 浙江祥隆科技有限公司 | 有机硅体系导电胶及其制备方法 |
CN112266742A (zh) * | 2020-10-19 | 2021-01-26 | 烟台德邦科技有限公司 | 一种性能优异的导电胶的制备方法 |
CN112266742B (zh) * | 2020-10-19 | 2022-05-17 | 烟台德邦科技股份有限公司 | 一种性能优异的导电胶的制备方法 |
CN115386332A (zh) * | 2022-06-29 | 2022-11-25 | 上海回天新材料有限公司 | 一种超耐候纯银导电硅胶及其制备方法 |
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