CN109326730A - Manufacturing equipment for organic light emitting diode display - Google Patents
Manufacturing equipment for organic light emitting diode display Download PDFInfo
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- CN109326730A CN109326730A CN201810605898.3A CN201810605898A CN109326730A CN 109326730 A CN109326730 A CN 109326730A CN 201810605898 A CN201810605898 A CN 201810605898A CN 109326730 A CN109326730 A CN 109326730A
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- emitting diode
- vapor deposition
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 53
- 238000007740 vapor deposition Methods 0.000 claims abstract description 99
- 239000011248 coating agent Substances 0.000 claims abstract description 70
- 238000000576 coating method Methods 0.000 claims abstract description 70
- 238000001704 evaporation Methods 0.000 claims abstract description 50
- 230000008020 evaporation Effects 0.000 claims abstract description 50
- 238000000034 method Methods 0.000 claims abstract description 37
- 238000004140 cleaning Methods 0.000 claims abstract description 31
- 230000005540 biological transmission Effects 0.000 claims description 21
- 229920002120 photoresistant polymer Polymers 0.000 claims description 9
- 238000007747 plating Methods 0.000 claims description 3
- 238000010025 steaming Methods 0.000 claims description 2
- 238000001459 lithography Methods 0.000 claims 4
- 230000010354 integration Effects 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 106
- 238000010586 diagram Methods 0.000 description 27
- 239000011265 semifinished product Substances 0.000 description 9
- 230000027756 respiratory electron transport chain Effects 0.000 description 7
- 239000011521 glass Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- 230000007306 turnover Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229920002472 Starch Polymers 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/04—Coating on selected surface areas, e.g. using masks
- C23C16/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C23C18/1641—Organic substrates, e.g. resin, plastic
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/14—Carrier transporting layers
- H10K50/15—Hole transporting layers
- H10K50/156—Hole transporting layers comprising a multilayered structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/14—Carrier transporting layers
- H10K50/16—Electron transporting layers
- H10K50/166—Electron transporting layers comprising a multilayered structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
The invention discloses a kind of manufacturing equipments for organic light emitting diode display, organic light emitting diode display is formed by vapor deposition processing procedure and yellow light micro-photographing process, it includes vapor deposition assembly line and yellow light lithographic assembly line, vapor deposition assembly line includes multiple first transmitting devices, multiple linear evaporation coating devices, multiple first dotted evaporation coating devices, at least one first plasma-based cleaning device, and multiple threadiness evaporation coating devices, multiple first dotted evaporation coating devices and at least one first plasma-based cleaning device are separately connected corresponding first transmitting device；Yellow light lithographic assembly line includes at least multiple second transmitting devices, light blockage coating device, exposure device, developing apparatus and wet type film-removing device, and light blockage coating device, exposure device, developing apparatus and wet type film-removing device are separately connected corresponding second transmitting device.Equipment integration vapor deposition assembly line of the invention and yellow light lithographic assembly line, to promote manufacture efficiency, manufacturing equipment of the invention can manufacture general organic light emitting diode display.
Description
Technical field
The present invention relates to field of display more particularly to a kind of manufacturing equipments for organic light emitting diode display.
Background technique
Organic light emitting diode display includes glass substrate, anode layer, hole transmission layer, red organic light emission at present
Layer, green organic luminous layer, blue organic luminous layer, electron transfer layer and cathode layer.Anode layer, hole transmission layer, red have
Machine luminescent layer, green organic luminous layer, blue organic luminous layer, electron transfer layer and cathode layer are formed by vapor deposition mode,
Especially the image element structure of organic light emitting diode display carries out organic matter vaporization plating mode by metal mask to reach fine
Change.
Now in order to promote image quality, resolution and the fineness of Organic Light Emitting Diode, improvement Organic Light Emitting Diode is aobvious
Show the patterned manner of the image element structure of device, therefore develop one kind and patterned by yellow light micro-photographing process, so at present
Manufacturing equipment for manufacturing organic light emitting diode display has been not suitable for.
Summary of the invention
The embodiment of the present invention provides a kind of manufacturing equipment for organic light emitting diode display, organic at present to solve
The manufacturing equipment of light emitting diode indicator is not used to manufacture the organic light emission formed by vapor deposition processing procedure and yellow light micro-photographing process
The problem of diode display.
In order to solve the above-mentioned technical problem, the present invention is implemented as follows:
A kind of manufacturing equipment for organic light emitting diode display is provided, organic light emitting diode display passes through
Vapor deposition processing procedure and yellow light micro-photographing process are formed comprising vapor deposition assembly line and yellow light lithographic assembly line, vapor deposition assembly line include more
A first transmitting device, multiple linear evaporation coating devices, multiple first dotted evaporation coating devices, at least one first plasma-based sanitizer cartridge
It sets, multiple threadiness evaporation coating devices, multiple first dotted evaporation coating devices and at least one first plasma-based cleaning device are separately connected pair
The first transmitting device answered；Yellow light lithographic assembly line includes at least multiple second transmitting devices, light blockage coating device, exposure dress
It sets, developing apparatus and wet type film-removing device, light blockage coating device, exposure device, developing apparatus and wet type film-removing device connect respectively
Connect corresponding second transmitting device.
In embodiments of the present invention, integration vapor deposition assembly line and the manufacture of yellow light lithographic assembly line are micro- by vapor deposition processing procedure and yellow light
The organic light emitting diode display that shadow processing procedure is formed, effectively promotion manufacture efficiency, while promoting organic light-emitting diode display
Image quality, resolution and the fineness of device.
Particular technique of the present invention attached will be further described by embodiment below and in schema.
Detailed description of the invention
The drawings described herein are used to provide a further understanding of the present invention, constitutes a part of the invention, this hair
Bright illustrative embodiments and their description are used to explain the present invention, and are not constituted improper limitations of the present invention.In the accompanying drawings:
Fig. 1 is the schematic diagram of the manufacturing equipment of first embodiment of the invention.
Fig. 2 is the schematic diagram of the organic light emitting diode display of first embodiment of the invention.
Fig. 3 is the schematic diagram of the vapor deposition assembly line of second embodiment of the invention.
Fig. 4 is the schematic diagram of the vapor deposition assembly line of third embodiment of the invention.
Fig. 5 is the schematic diagram of the yellow light lithographic assembly line of fourth embodiment of the invention.
Fig. 6 is the schematic diagram of the yellow light lithographic assembly line of fifth embodiment of the invention.
Fig. 7 is the schematic diagram of the yellow light lithographic assembly line of sixth embodiment of the invention.
Fig. 8 is the schematic diagram of the yellow light lithographic assembly line of seventh embodiment of the invention.
Fig. 9 is the schematic diagram of the yellow light lithographic assembly line of eighth embodiment of the invention.
Figure 10 is the schematic diagram of the yellow light lithographic assembly line of ninth embodiment of the invention.
Figure 11 is the schematic diagram of the yellow light lithographic assembly line of tenth embodiment of the invention.
Figure 12 is the schematic diagram of the yellow light lithographic assembly line of eleventh embodiment of the invention.
Figure 13 is the schematic diagram of the yellow light lithographic assembly line of twelveth embodiment of the invention.
Figure 14 is the vapor deposition assembly line of thriteenth embodiment of the invention and the schematic diagram of yellow light lithographic assembly line.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are some of the embodiments of the present invention, instead of all the embodiments.Based on this hair
Embodiment in bright, every other implementation obtained by those of ordinary skill in the art without making creative efforts
Example, shall fall within the protection scope of the present invention.
Fig. 1 and Fig. 2 is please referred to, is the schematic diagram and Organic Light Emitting Diode of the manufacturing equipment of first embodiment of the invention
The schematic diagram of display；As shown, the present invention provides a kind of manufacturing equipment for organic light emitting diode display, pass through
Organic light emitting diode display manufactured by manufacturing equipment of the invention is formed by vapor deposition processing procedure and yellow light micro-photographing process.
The manufacturing equipment 1 of the present embodiment includes vapor deposition assembly line 10 and yellow light lithographic assembly line 11, and vapor deposition assembly line 10 includes at least more
A first transmitting device 101, multiple linear evaporation coating devices 102, multiple first dotted evaporation coating devices 103, at least one first electricity
Cleaning device 104 is starched, multiple threadiness evaporation coating devices 102, multiple first dotted evaporation coating devices 103 and at least one first plasma-based are clear
Clean device 104 is separately connected corresponding first transmitting device 101.Yellow light lithographic assembly line 11 includes at least multiple second transmission dresses
Set 111, light blockage coating device 112, exposure device 113, developing apparatus 114 and wet type film-removing device 115, light blockage coating device
112, exposure device 113, developing apparatus 114 and wet type film-removing device 115 are separately connected corresponding second transmitting device 111.Often
There is mechanical arm in one the first transmitting device 101 or the second transmitting device 111, product to be processed are transmitted extremely by mechanical arm
Linear evaporation coating device 102, dotted evaporation coating device 103, the first plasma-based cleaning device 104, light blockage coating device 112, exposure device
113, developing apparatus 114 and wet type film-removing device 115 are processed.
Organic light emitting diode display 2 manufactured by the manufacturing equipment of the present embodiment includes glass substrate 20, anode layer
21, hole transmission layer 22, red organic luminous layer 24a, green organic luminous layer 24b, blue organic luminous layer 24c, electronics pass
Defeated layer 26 and cathode layer 27.Anode layer 21 is vaporized on glass substrate 20, and hole transmission layer 22 is vaporized on anode layer 21, red
Organic luminous layer 24a, green organic luminous layer 24b and blue organic luminous layer 24c are sequentially vaporized on hole transmission layer 22, electronics
Transport layer 26 is vaporized on red organic luminous layer 24a, green organic luminous layer 24b and blue organic luminous layer 24c, cathode layer
27 are vaporized on electron transfer layer 26.The production of the organic light emitting diode display 2 of the present embodiment is different from general organic light emission
Diode display, formed red organic luminous layer 24a, green organic luminous layer 24b or blue organic luminous layer 24c it
Before, it first is coated with photoresist on hole transmission layer 22, ultraviolet light is carried out to photoresist and is exposed, then by being carried out to photoresist
Develop and formed the vapor deposition hole of red organic luminous layer 24a, green organic luminous layer 24b or blue organic luminous layer 24c, so
Red organic luminous layer 24a, green organic luminous layer 24b or blue organic luminous layer 24c are vaporized on corresponding vapor deposition hole afterwards
It is interior, corresponding vapor deposition hole is formed in red organic luminous layer 24a, green organic luminous layer 24b or blue organic luminous layer 24c
Behind hole, then remove photoresist.Above-mentioned coating photoresist, ultraviolet light, development and removing and etc. be yellow light micro-photographing process.
Every time after removing photoresist, the surface of hole transmission layer 22 is cleaned by plasma-based, photoresist is avoided to remain in hole transport
On layer 22.It prevents plasma-based from cleaning and damages the surface of hole transmission layer 22, the first conductive guarantor can be deposited on hole transmission layer 22
Sheath 23, the first conductive protecting layer 23 protection hole transmission layer 22 will not be damaged because plasma-based cleans, while hole being maintained to pass
The conducting of defeated layer 22 and red organic luminous layer 24a, green organic luminous layer 24b and blue organic luminous layer 24c.Similarly, red
Also vapor deposition second is conductive respectively on the surface of colour organic luminous layer 24a, green organic luminous layer 24b and blue organic luminous layer 24c
Protective layer 25 reaches effect similar to the above, and details are not described herein.Manufacturing equipment of the invention is used in particular for above-mentioned organic hair
The production of optical diode display 2 is also applicable in the production of general organic light emitting diode display 2 certainly.
The device arrangement mode of assembly line 10 and yellow light lithographic assembly line 11 is deposited in following the description；
There are five the first transmitting device 101, nine linear evaporation coating devices 102, five for the tool of vapor deposition assembly line 10 of the present embodiment
A first dotted evaporation coating device 103 and four the first plasma-based cleaning devices 104.The vapor deposition assembly line 10 of the present embodiment is divided into five
Group, five groups include that group 10c, this implementation is deposited in the first vapor deposition group 10a, three the second vapor deposition group 10b and third
In example, the first vapor deposition group 10a, three the second vapor deposition group 10b and third vapor deposition group 10c are sequentially arranged from left to right.The
One vapor deposition group 10a includes the two linear evaporation coating devices 102 and the first plasma-based cleaning device for connecting the first transmitting device 101
104.Second vapor deposition group 10b includes two linear evaporation coating devices 102, the first dotted vapor deposition for connecting the first transmitting device 101
Device 103 and the first plasma-based cleaning device 104.Third vapor deposition group 10c includes the linear vapor deposition for connecting the first transmitting device 101
Device 102 and two the first dotted evaporation coating devices 103.The first transmitting device 101 of first vapor deposition group 10a passes through the first connection
The first transmitting device 101 of second vapor deposition of the connection of chamber 100 group 10b, two first of two second adjacent vapor deposition group 10b
Transmitting device 101 is connected by the first connecting cavity 100, and the first transmitting device 101 of the second vapor deposition group 10b passes through the first connection
Chamber 100 connects the first transmitting device 101 of third vapor deposition group 10c.
Second vapor deposition group 10b further includes the first switching chamber 105, and the first switching chamber 105 connects the first transmitting device 101.
The dotted evaporation coating device 103 of linear evaporation coating device 102 and first in each group is for being deposited organic light emitting diode display 2
Anode layer 21, hole transmission layer 22, the first conductive protecting layer 23, red organic luminous layer 24a, green organic luminous layer 24b,
Blue organic luminous layer 24c, the second conductive protecting layer 25, electron transfer layer 26 and cathode layer 27.
For example, two linear evaporation coating devices 102 of the first vapor deposition group 10a are to be respectively used to vapor deposition hole injection layer
And hole transmission layer 22, it is red for being deposited for being arranged in two linear evaporation coating devices 102 of first the second vapor deposition group 10b
Colour organic luminous layer 24a and the second conductive protecting layer 25 are arranged in two linear vapor depositions of second the second vapor deposition group 10b
Device 102 is to be arranged in the second vapor deposition group of third for green organic luminous layer 24b and the second conductive protecting layer 25 to be deposited
The linear evaporation coating device 102 of two of group 10b is for blue organic luminous layer 24c and the second conductive protecting layer 25 to be deposited.Second
The first dotted evaporation coating device 103 of group 10b is deposited for the first conductive protecting layer 23 and/or the second conductive protecting layer to be deposited
25, two the first dotted evaporation coating devices 103 of third vapor deposition group 10c are for being deposited electron transfer layer 26 and cathode layer 27.On
Only one embodiment of the invention is stated, it should not be as limit.
The first switching chamber 105 of second vapor deposition group 10b can will be deposited the first conductive protecting layer 23 or red has been deposited
Green organic luminous layer 24b and/or the second conductive protection has been deposited in organic luminous layer 24a and/or the second conductive protecting layer 25
Blue organic luminous layer 24c has been deposited and/or the semi-finished product of the second conductive protecting layer 25 are forwarded to yellow light lithographic flowing water in layer 25
Line 11 carries out yellow light micro-photographing process, transfers back to after above-mentioned semi-finished product complete yellow light micro-photographing process, then through the first switching chamber 105
Corresponding first transmitting device 101 in assembly line 10 is deposited, and enters the first electricity connected with corresponding first transmitting device 101
It starches cleaning device 104 and carries out surface cleaning.
Referring to Fig. 3, it is the schematic diagram of the vapor deposition assembly line of second embodiment of the invention；As shown, the present embodiment
Vapor deposition assembly line 10 and the vapor deposition assembly line difference of first embodiment be that in the present embodiment, the second vapor deposition group 10b includes
Two the first dotted evaporation coating devices 103 are connect with the first transmitting device 101, i.e., by the first plasma-based cleaning device of first embodiment
Change the first dotted evaporation coating device 103 into.21 hole transmission layer of anode layer, the first conductive protecting layer, red organic luminous layer, green
Organic luminous layer, blue organic luminous layer, the second conductive protecting layer, electron transfer layer and cathode layer vapor deposition can distribute to first
Multiple linear evaporation coating devices 102 of group 10a, the second vapor deposition group 10b and third vapor deposition group 10c and multiple are deposited at first point
Shape evaporation coating device 103 carries out.
Referring to Fig. 4, it is the schematic diagram of the vapor deposition assembly line of third embodiment of the invention；As shown, the present embodiment
Vapor deposition assembly line 10 and the vapor deposition assembly line difference of second embodiment be, in the present embodiment, only retain the first group 10a and
Three the second group 10b, anode layer, hole transmission layer, the first conductive protecting layer, red organic luminous layer, green organic light emission
Layer, blue organic luminous layer, the second conductive protecting layer, electron transfer layer and cathode layer vapor deposition can distribute to the first vapor deposition group
The multiple linear evaporation coating devices 102 and multiple first dotted evaporation coating devices 103 of the vapor deposition of 10a and second group 10b carry out.
Multiple first embodiment provides a kind of yellow light lithographic assembly line 11 refering to fig. 1, and yellow light lithographic assembly line 11 includes two
Second transmitting device 111, light blockage coating device 112, exposure device 113, developing apparatus 114 and wet type film-removing device 115, yellow light
Lithographic assembly line 11 includes the first lithographic group 11a and the second lithographic group 11b, the first lithographic group 11a include the second transmission
Device 111 and the light blockage coating device 112, exposure device 113 and developing apparatus 114 for connecting the second transmitting device 111, second is micro-
Shadow group 11b includes the second transmitting device 111 and the wet type film-removing device 115 that connect the second transmitting device 111.The present embodiment
First lithographic group 11a and the second lithographic group 11b is to be independently arranged, in other words, the second transmission of the first lithographic group 11a
Device 111 is not connect with the second transmitting device 111 of the second lithographic group 11b.First lithographic group 11a and the second lithographic group
11b respectively further comprises the second switching chamber 111, and the second switching chamber 111 connects the second transmitting device 111.Pass through the second switching chamber 116
It is connect with the first switching chamber of above-mentioned vapor deposition assembly line, the semi-finished product that light blockage coating, exposure and imaging is completed is converted to steaming
Plating assembly line carries out vapor deposition processing procedure, then flows the semi-finished product that vapor deposition processing procedure is completed by the second switching chamber 116 and vapor deposition
First switching chamber of waterline, which is converted to yellow light lithographic assembly line 11, carries out stripping processing procedure, and the semi-finished product of stripping processing procedure are then completed
It is converted by the first switching chamber of the second switching chamber 116 and vapor deposition assembly line to vapor deposition assembly line and carries out vapor deposition processing procedure.
Referring to Fig. 5, it is the schematic diagram of the yellow light lithographic assembly line of fourth embodiment of the invention；As shown, this reality
The yellow light lithographic assembly line 11 for applying example and the yellow light lithographic assembly line difference of first embodiment be, second lithographic of the present embodiment
Group 11b further includes another second switching chamber 116, third transmitting device 117 and the second plasma-based cleaning device 118, the second switching
Chamber 116 connects the second transmitting device 111, the connection of third transmitting device 117 second switching chamber 116, the second plasma-based cleaning device 118
Connect third transmitting device 117.It is transmitted when the semi-finished product for finishing stripping processing procedure directly can enter third by the second switching chamber 116
Device 117, then by the second transmitting device 111 will finish stripping processing procedure semi-finished product be sent into the second plasma-based cleaning device 118, second
Plasma-based cleaning device 118 can clean the photoresist remained on semi-finished product, in other words, can directly yellow light lithographic assembly line 11 into
The cleaning of row plasma-based carries out plasma-based cleaning without being back to vapor deposition assembly line again.Wherein there is in third transmitting device 117 manipulator
Arm.
Referring to Fig. 6, it is the schematic diagram of the yellow light lithographic assembly line of fifth embodiment of the invention；As shown, this reality
The yellow light lithographic assembly line 11 for applying example and the yellow light lithographic assembly line difference of fourth embodiment be, second lithographic of the present embodiment
Group 11b further includes another second switching chamber 116, another third transmitting device 117 and the second dotted evaporation coating device 119, third
Transmitting device 117 connects the second transmitting device 111, the second dotted connection of evaporation coating device 119 and third by the second switching chamber 116
Transmitting device 117, yellow light lithographic assembly line 11 can also be directly deposited.
Referring to Fig. 7, it is the schematic diagram of the yellow light lithographic assembly line of sixth embodiment of the invention；As shown, this reality
The yellow light lithographic assembly line 11 for applying example and the yellow light lithographic assembly line difference of fourth embodiment be, the yellow light lithographic of the present embodiment
Assembly line 11 further includes third lithographic group 11c, and third lithographic group 11c includes that third transmitting device 117 is passed with third is connect
The the second plasma-based cleaning device 118 and the second switching chamber 116 of defeated device 117, mainly pass the connection second of the 5th embodiment
Second switching chamber 116 of defeated device, the third transmitting device 117 and connection third transmitting device 117 for connecting the second switching chamber 116
The second plasma-based cleaning device 118 branch away independent use.
Referring to Fig. 8, it is the schematic diagram of the yellow light lithographic assembly line of seventh embodiment of the invention；As shown, this reality
The yellow light lithographic assembly line 11 for applying example and the yellow light lithographic assembly line difference of sixth embodiment be, the yellow light lithographic of the present embodiment
Assembly line 11 further includes the second dotted evaporation coating device 119, and the second dotted evaporation coating device 119 connects third transmitting device 117, yellow light
Lithographic assembly line 11 can also be directly deposited.
Referring to Fig. 9, it is the schematic diagram of the yellow light lithographic assembly line of eighth embodiment of the invention；As shown, first
The yellow light lithographic assembly line of embodiment and the 4th to the 7th embodiment is group's discontinuous, the yellow light lithographic flowing water of the present embodiment
Line 11 is group's continous way, and yellow light lithographic assembly line 11 includes the first lithographic group 11a and the second lithographic group 11b, and first is micro-
Shadow group 11a includes the second transmitting device 111 and the light blockage coating device 112, the exposure device that connect the second transmitting device 111
113 and the second switching chamber 116, the second lithographic group 11b include the second transmitting device 111 and connect the second transmitting device 111
Developing apparatus 114, wet type film-removing device 115 and the second switching chamber 116.Wherein the second transmitting device of the first lithographic group 11a
111 connect the second transmitting device 111 of the second lithographic group 11b by the second connecting cavity 110.
Referring to Fig. 10, it is the schematic diagram of the yellow light lithographic assembly line of ninth embodiment of the invention；As shown, this reality
The yellow light lithographic assembly line 11 for applying example and the yellow light lithographic assembly line difference of the 8th embodiment be, first lithographic of the present embodiment
Group 11a and the second lithographic group 11b respectively further comprises another the second switching chamber 116, and the second switching chamber 116 connection second passes
Defeated device 111, so includes two second switching chambers 116 in each lithographic group, and semi-finished product can be from multiple second switchings chambers
The corresponding lithographic group of 116 disengaging.
Figure 11 is please referred to, is the schematic diagram of the yellow light lithographic assembly line of tenth embodiment of the invention；As shown, this reality
The yellow light lithographic assembly line 11 8 for applying example and the yellow light lithographic assembly line difference of the 1st embodiment are that the first of the present embodiment is micro-
Shadow group 11a and the second lithographic group 11b also can be separately positioned, that is, save two the second transmitting devices 111 of connection second connects
Connect chamber.
Figure 12 is please referred to, is the schematic diagram of the yellow light lithographic assembly line of eleventh embodiment of the invention；As shown, this
The yellow light lithographic assembly line 11 of embodiment further includes third lithographic group 11c, and third lithographic group 11c includes the second transmitting device
111 with the second plasma-based cleaning device 118 and universe formula Etaching device 120 that connect the second transmitting device 111.Third lithographic group
11c further includes at least one second switching chamber 116, at least one second switching chamber 116 connects the second transmitting device 111.This reality
It is separately positioned with the first lithographic group 11a and the second lithographic group 11b for applying the third lithographic group 11c of example.Certain third is micro-
The second transmitting device 111 of shadow group 11c can pass through the second transmitting device 111 of the second connecting cavity and the second lithographic group 11b
Connection forms continous way.
Above-mentioned first lithographic group 11a, the second lithographic group 11b and third lithographic group 11c can need again according to processing procedure
Device relevant to yellow light micro-photographing process is configured, as heating device, cooling device, hot type depressurize dry device, optical check dress
It sets or panel turnover device.
Figure 13 is please referred to, is the schematic diagram of the yellow light lithographic assembly line of twelveth embodiment of the invention；As shown, this
The yellow light lithographic assembly line 11 of embodiment and the yellow light lithographic assembly line difference of above-described embodiment are that the yellow light of the present embodiment is micro-
Shadow assembly line 11 be LINEAR CONTINUOUS formula comprising three the second transmitting devices 111, light blockage coating device 112, exposure device 113,
Developing apparatus 114, film-removing device 115 and two second switching chambers 116, three the second transmitting devices 111 are lined up linearly, adjacent
Two the second transmitting devices 111 are connected by the second connecting cavity 110, and light blockage coating device 112 and the connection of exposure device 113 come
First the second transmitting device 111, developing apparatus 114 and wet type film-removing device 115, which connect, comes second and third
Two the second transmitting devices 111, two second switching chambers 116 be connected to come first the second transmitting device 111 and
Come the second transmitting device 111 of third.
The yellow light lithographic assembly line 1 of the present embodiment is can be by adding the second switching chamber in multiple second transmitting devices 111
116, so that linear yellow light lithographic assembly line 1 there are multiple inlet and outlet, such as the 9th embodiment.
The yellow light lithographic assembly line 11 of the present embodiment can need to be reconfigured dress relevant to yellow light micro-photographing process according to processing procedure
Set, as heating device, cooling device, hot type depressurize dry device, optical detection device, panel turnover device, plasma-based cleaning device or
Universe formula Etaching device.
The yellow light lithographic assembly line 11 of first embodiment and the 4th to the 12nd embodiment can be implemented with first to third
The vapor deposition assembly line 10 of example, which is arranged in pairs or groups, to be used, and is repeated no more in this.The the first switching chamber 105 and yellow light of above-mentioned vapor deposition assembly line 10 are micro-
Transmission between second switching chamber 105 of shadow assembly line 11 is to be transmitted under vacuum or nitrogen state with Automatic Guided Vehicle.
Figure 14 is please referred to, is vapor deposition assembly line and the signal of yellow light lithographic assembly line of thriteenth embodiment of the invention
Figure；As shown, the vapor deposition assembly line 10 of the present embodiment has multiple vapor deposition group 10d, yellow light lithographic assembly line 11 has more
A lithographic group 11d, multiple vapor deposition group 10d and multiple lithographic group 11d are staggered, and vapor deposition group 10d passes through transmission dress
It sets or converts chamber and connect adjacent lithographic group 11d.Vapor deposition group 10d can select the first of above-described embodiment group, the is deposited
One group in two vapor deposition groups and third vapor deposition group, or by the first transmitting device, linear evaporation coating device, the first dotted evaporation coating device
And the first plasma-based cleaning device any combination.Lithographic group 11 can select the first lithographic group of above-described embodiment, the second lithographic
One group in group and third lithographic group, or in selection light blockage coating device, exposure device, developing apparatus and film-removing device extremely
Few one arranges linear with the second transmitting device.The vapor deposition assembly line 10 and yellow light lithographic assembly line 11 of the present embodiment can be integrated
At same assembly line.
In conclusion the present invention provides a kind of manufacturing equipment for organic light emitting diode display, major integration
Vapor deposition assembly line and the manufacture of yellow light lithographic assembly line are shown by the Organic Light Emitting Diode that vapor deposition processing procedure and yellow light micro-photographing process are formed
Show device, effectively promotion manufacture efficiency, while promoting image quality, resolution and the fineness of organic light emitting diode display.
It should be noted that, in this document, the terms "include", "comprise" or its any other variant are intended to non-row
His property includes, so that the process, method, article or the device that include a series of elements not only include those elements, and
And further include other elements that are not explicitly listed, or further include for this process, method, article or device institute it is intrinsic
Element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that including being somebody's turn to do
There is also other identical elements in the process, method of element, article or device.
The embodiment of the present invention is described with above attached drawing, but the invention is not limited to above-mentioned specific
Embodiment, the above mentioned embodiment is only schematical, rather than restrictive, those skilled in the art
Under the inspiration of the present invention, without breaking away from the scope protected by the purposes and claims of the present invention, it can also make very much
Form belongs within protection of the invention.
Claims (24)
1. a kind of manufacturing equipment for organic light emitting diode display, the organic light emitting diode display pass through vapor deposition
Processing procedure and yellow light micro-photographing process are formed, which is characterized in that the manufacturing equipment includes: vapor deposition assembly line comprising multiple first
Transmitting device, multiple linear evaporation coating devices, multiple first dotted evaporation coating devices, at least one first plasma-based cleaning device, it is multiple
The threadiness evaporation coating device, multiple first dotted evaporation coating devices and at least one described first plasma-based cleaning device connect respectively
Connect corresponding first transmitting device；And
Yellow light lithographic assembly line comprising multiple second transmitting devices, light blockage coating device, exposure device, developing apparatus and wet
Formula film-removing device, the light blockage coating device, the exposure device, the developing apparatus and the wet type film-removing device connect respectively
Connect corresponding second transmitting device.
2. being used for the manufacturing equipment of organic light emitting diode display as described in claim 1, which is characterized in that described first
Mechanical arm is respectively provided in transmitting device and second transmitting device.
3. being used for the manufacturing equipment of organic light emitting diode display as described in claim 1, which is characterized in that the vapor deposition
Assembly line is divided into the first vapor deposition group and the second vapor deposition group, and first vapor deposition group includes first transmitting device, connects
Meet the two linear evaporation coating devices and the first plasma-based cleaning device of first transmitting device, the second vapor deposition group
Group include first transmitting device, connection first transmitting device two linear evaporation coating devices and at least one the
One dotted evaporation coating device.
4. being used for the manufacturing equipment of organic light emitting diode display as claimed in claim 3, which is characterized in that described second
It further includes the first plasma-based cleaning device for connecting first transmitting device that group, which is deposited,.
5. the manufacturing equipment for organic light emitting diode display as described in claim 3 or 4, which is characterized in that described
First transmitting device of first vapor deposition group and first transmitting device of second vapor deposition group connect by first
Connect chamber connection.
6. the manufacturing equipment for organic light emitting diode display as described in claim 3 or 4, which is characterized in that described
Second vapor deposition group quantity be it is multiple, adjacent two it is described second vapor deposition group first transmitting device pass through first
Connecting cavity connection.
7. the manufacturing equipment for organic light emitting diode display as described in claim 3 or 4, which is characterized in that described
Second vapor deposition group further includes the first switching chamber, and the first switching chamber connects first transmitting device.
8. the manufacturing equipment for organic light emitting diode display as described in claim 3 or 4, which is characterized in that described
Vapor deposition assembly line further includes third vapor deposition group, and third vapor deposition group includes first transmitting device, connection described the
The linear evaporation coating device of one transmitting device and two first dotted evaporation coating devices.
9. being used for the manufacturing equipment of organic light emitting diode display as claimed in claim 8, which is characterized in that described second
First transmitting device of first transmitting device and third vapor deposition group that group is deposited passes through the first connecting cavity
Connection.
10. being used for the manufacturing equipment of organic light emitting diode display as described in claim 1, which is characterized in that the Huang
Light lithography assembly line is divided into the first lithographic group and the second lithographic group, and first lithographic group includes the second transmission dress
Set, connect the light blockage coating device, the exposure device and the developing apparatus of second transmitting device；Described second
Lithographic group includes the wet type film-removing device of second transmitting device, connection second transmitting device.
11. being used for the manufacturing equipment of organic light emitting diode display as claimed in claim 10, which is characterized in that described the
One lithographic group and second lithographic group respectively further comprise the second switching chamber, and the second switching chamber connection described second passes
Defeated device.
12. being used for the manufacturing equipment of organic light emitting diode display as claimed in claim 10, which is characterized in that described the
Two lithographic groups respectively further comprise the second switching chamber, third transmitting device and the second plasma-based cleaning device, the second switching chamber
Connect second transmitting device, third transmitting device connection the second switching chamber, the second plasma-based cleaning device
Connect the third transmitting device.
13. being used for the manufacturing equipment of organic light emitting diode display as claimed in claim 12, which is characterized in that described the
Mechanical arm is respectively provided in three transmitting devices.
14. being used for the manufacturing equipment of organic light emitting diode display as claimed in claim 12, which is characterized in that described the
Two lithographic groups respectively further comprise another second switching chamber, another third transmitting device and the second dotted evaporation coating device, and described the
Two switching chambers connect second transmitting device, and third transmitting device connection the second switching chamber, described second is dotted
Evaporation coating device connects the third transmitting device.
15. being used for the manufacturing equipment of organic light emitting diode display as claimed in claim 10, which is characterized in that the Huang
Light lithography assembly line further includes third lithographic group, and third lithographic group includes third transmitting device and connect the third
Second plasma-based cleaning device of transmitting device and the second switching chamber.
16. being used for the manufacturing equipment of organic light emitting diode display as claimed in claim 15, which is characterized in that described the
Three lithographic groups further include the second dotted evaporation coating device for connecting the third transmitting device.
17. being used for the manufacturing equipment of organic light emitting diode display as described in claim 1, which is characterized in that the Huang
Light lithography assembly line is divided into the first lithographic group and the second lithographic group, and first lithographic group includes the second transmission dress
The light blockage coating device and the exposure device set and connect second transmitting device；Second lithographic group includes
Second transmitting device and the developing apparatus and the wet type film-removing device for connecting second transmitting device.
18. being used for the manufacturing equipment of organic light emitting diode display as claimed in claim 17, which is characterized in that described the
One lithographic group and second lithographic group respectively include at least one second switching chamber, at least one second switching chamber connection
Second transmitting device.
19. the manufacturing equipment for organic light emitting diode display as described in claim 17 or 18, which is characterized in that institute
Second transmitting device of second transmitting device and second lithographic group of stating the first lithographic group passes through described
The connection of second connecting cavity.
20. being used for the manufacturing equipment of organic light emitting diode display as claimed in claim 19, which is characterized in that the Huang
Light lithography assembly line further includes third lithographic group, third lithographic group include second transmitting device with connect described in
The the second plasma-based cleaning device and universe formula Etaching device of second transmitting device.
21. being used for the manufacturing equipment of organic light emitting diode display as claimed in claim 20, which is characterized in that described the
Second transmitting device of three lithographic groups connects second transmitting device by the second connecting cavity.
22. being used for the manufacturing equipment of organic light emitting diode display as claimed in claim 21, which is characterized in that described the
Three lithographic groups include at least one second switching chamber, at least one second switching chamber connects second transmitting device.
23. being used for the manufacturing equipment of organic light emitting diode display as described in claim 1, which is characterized in that Duo Gesuo
It states the second transmitting device to line up linearly, second transmitting device of adjacent two is connected by the second connecting cavity, the photoresist
Apparatus for coating, the exposure device, the developing apparatus and the wet type film-removing device are separately connected corresponding described second and pass
Defeated device.
24. being used for the manufacturing equipment of organic light emitting diode display as described in claim 1, which is characterized in that the steaming
Plating assembly line has multiple vapor deposition groups, and the yellow light lithographic assembly line has multiple lithographic groups, multiple vapor deposition groups
It is cross-linked with multiple lithographic groups.
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|---|---|---|---|
| US201762540050P | 2017-08-01 | 2017-08-01 | |
| US62/540,050 | 2017-08-01 |
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| CN201810605898.3A Active CN109326730B (en) | 2017-08-01 | 2018-06-13 | Manufacturing apparatus for organic light emitting diode display |
| CN201820911590.7U Active CN208608230U (en) | 2017-08-01 | 2018-06-13 | Manufacturing equipment for organic light emitting diode display |
| CN201810619521.3A Pending CN109321877A (en) | 2017-08-01 | 2018-06-13 | Film formation mask and its manufacturing method |
| CN201810642272.XA Active CN109326732B (en) | 2017-08-01 | 2018-06-21 | Organic light-emitting diode structure and manufacturing method thereof |
| CN201820957593.4U Active CN208507678U (en) | 2017-08-01 | 2018-06-21 | The image element structure of organic light emitting diode display |
| CN201820957531.3U Active CN208507735U (en) | 2017-08-01 | 2018-06-21 | Organic LED structure |
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| CN201810619521.3A Pending CN109321877A (en) | 2017-08-01 | 2018-06-13 | Film formation mask and its manufacturing method |
| CN201810642272.XA Active CN109326732B (en) | 2017-08-01 | 2018-06-21 | Organic light-emitting diode structure and manufacturing method thereof |
| CN201820957593.4U Active CN208507678U (en) | 2017-08-01 | 2018-06-21 | The image element structure of organic light emitting diode display |
| CN201820957531.3U Active CN208507735U (en) | 2017-08-01 | 2018-06-21 | Organic LED structure |
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| CN110588186A (en) * | 2019-08-07 | 2019-12-20 | 华中科技大学 | Manufacturing system and method of ink-jet printing flexible display device |
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| CN109326730B (en) * | 2017-08-01 | 2024-02-13 | 拓旷(上海)光电科技有限公司 | Manufacturing apparatus for organic light emitting diode display |
| CN110634908A (en) * | 2018-06-21 | 2019-12-31 | 上海自旭光电科技有限公司 | Pixel structure of organic light emitting diode display |
| CN111763908A (en) * | 2019-04-02 | 2020-10-13 | 陕西坤同半导体科技有限公司 | Mask plate |
| CN111778475A (en) * | 2019-04-04 | 2020-10-16 | 陕西坤同半导体科技有限公司 | Mask plate |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN208608230U (en) | 2019-03-15 |
| CN109326730B (en) | 2024-02-13 |
| CN109321877A (en) | 2019-02-12 |
| CN109326732B (en) | 2024-02-13 |
| CN208507735U (en) | 2019-02-15 |
| CN208507678U (en) | 2019-02-15 |
| CN109326732A (en) | 2019-02-12 |
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