KR20100130830A - Chemical vapor deposition apparatus - Google Patents

Abstract

PURPOSE: A chemical vapor deposition apparatus is provided to efficiently improve the productivity of a substrate by reducing a pumping time. CONSTITUTION: A load lock chamber(100) loads and unloads a substrate. A process module chamber(310-350) includes a top transfer module chamber and a bottom transfer module chamber and deposits the substrate. A transfer module chamber(200) includes a substrate handling robot(500) which handles the substrate. The transfer module chamber connects the load lock chamber to the process module chamber.

Description

Chemical Vapor Deposition Apparatus {CHEMICAL VAPOR DEPOSITION APPARATUS}

The present invention relates to a chemical vapor deposition apparatus, and more particularly, to facilitate the transfer of the transfer module chamber by reducing the volume of the side transfer module chamber, and to reduce the installation and maintenance work time of the chemical vapor deposition apparatus in the production line In addition, the present invention relates to a chemical vapor deposition apparatus capable of reducing the volume of the space inside the transfer module chamber, thereby shortening the pumping time and efficiently improving the productivity of the substrate.

Flat panel displays are widely used in personal handheld terminals, as well as TVs and computer monitors.

Such flat displays include liquid crystal displays (LCDs), plasma display panels (PDPs), and organic light emitting diodes (OLEDs).

Among them, liquid crystal displays (LCDs) inject liquid crystals, which are solid and liquid intermediates, between two thin upper and lower glass substrates, and generate contrast by changing the arrangement of liquid crystal molecules by the electrode voltage difference between the upper and lower glass substrates. It is a device using a kind of optical switch phenomenon to display an image.

LCDs are now widely used in electronic clocks, electronic calculators, TVs, notebook PCs, electronic products, automobiles, aircraft speed displays and driving systems.

Previously, LCD TVs had a size of about 20 inches to about 30 inches, and most monitors had a size of 17 inches or less. However, in recent years, large TVs of 40 inches or more and large monitors of 20 inches or more have been released and sold, and the preference for them is increasing day by day.

Such LCD is a TFT process in which deposition, photolithography, etching, chemical vapor deposition, etc. are repeatedly performed, a cell process for bonding upper and lower glass substrates, and an apparatus It is released as a product through a module process that completes the process.

The chemical vapor deposition process, which is one of the above-described TFT processes, is performed by a chemical vapor deposition apparatus. Specifically, the chemical vapor deposition process is performed in a process module chamber provided in the chemical vapor deposition apparatus. Generally, the chemical vapor deposition apparatus includes a transfer module chamber, a load lock chamber coupled to one side of the transfer module chamber, and a process module chamber coupled to the other side of the transfer module chamber. . On the other hand, recently, a chemical vapor deposition apparatus having a plurality of process module chambers arranged at regular intervals so as to process many substrates in a short time has been widely used.

When the substrate of the work object is introduced into the load lock chamber, the substrate handling robot provided in the transfer module chamber transfers the substrate to the transfer module chamber, and then transfers the substrate to any one of the plurality of process module chambers, and the corresponding process module chamber. The deposition process is performed on the substrate within the substrate, and when the operation is completed, the substrate is taken out in the reverse order described above.

Inside the transfer module chamber, there is a substrate handling robot that transfers the substrate of the load lock chamber to the process module chamber or transfers the completed substrate from the process module chamber to the load lock chamber. When the vacuum is released and brought to atmospheric pressure, it is assembled to the bottom wall inside the transfer module chamber while matching its height and position.

1 is an exploded perspective view of a transfer module chamber of a chemical vapor deposition apparatus according to the prior art.

Referring to FIG. 1, the transfer module chamber 800 of the conventional chemical vapor deposition apparatus includes a rectangular box-shaped main chamber 810 and a pair of side chambers respectively coupled to both sides of the main chamber 810. (821, 822). For reference, the chemical vapor deposition apparatus is a so-called 8th generation chemical vapor deposition apparatus for a substrate having a length and width of approximately 2 meters or more.

The main chamber 810, a bottom wall 811 in which an opening 811a for penetrating the above-described substrate handling robot (not shown) is formed, and a load lock bent and integrally formed at both ends of the bottom wall 811. A chamber joining wall 812 and a process module chamber joining wall 813. The load lock chamber coupling wall 812 is coupled to the load lock chamber (not shown), and the process module chamber coupling wall 813 is connected to one of the five process module chambers (not shown). C) are combined. In addition, openings 812a and 813a serving as draw-out passages of the substrate are formed in the load lock chamber joining wall 812 and the process module chamber joining wall 813, respectively.

The pair of side chambers 821 and 822 are coupled to both sides of the main chamber 810, respectively, and are manufactured to have a substantially triangular cross section as shown in FIG. 1. Outer surfaces of the side chambers 821 and 822 are respectively coupled to the remaining four process module chambers (not shown) of the plurality of process module chambers (not shown), and the main chambers 810 to the side chambers 821 and 822, respectively. Similarly to the process module chamber joining wall 813, the openings 821a, 821b, 822a, and 822b serving as drawout passages of the substrate are formed.

The transfer module chamber 800 is generally transported through a road in a state of being mounted on a frame (not shown) in consideration of the installation and maintenance work time of the chemical vapor deposition apparatus in the production line.

However, as the size of the substrate to be deposited increases, the size of the transfer module chamber 800 also increases. When the size of the transfer module chamber 800 increases, the frame according to the width, height, and weight limitation of road transport (not shown) In the state of assembling the transfer module chamber 200, there is a problem that can not be transported through the general road.

In addition, when the size of the transfer module chamber 800 is increased, the time required to make the interior of the transfer module chamber 800 from the atmospheric state to the vacuum state, that is, the pumping time is increased, thereby increasing the process time for producing the substrate. There is a problem.

Therefore, even if the size of the transfer module chamber 800 is increased, such as a chemical vapor deposition apparatus applied to the so-called 11th generation, in which the size of the substrate to be deposited is approximately 3 m or more in width and length, the transfer convenience can be achieved. By reducing the volume of the interior space of the transfer module chamber 800, a research and development of the transfer module chamber 800 that can shorten the pumping time and efficiently improve the productivity of the substrate is required.

An object of the present invention is to facilitate the transfer of the transfer module chamber by reducing the volume of the side transfer module chamber, to reduce the installation and maintenance time of the chemical vapor deposition apparatus in the production line, as well as the space inside the transfer module chamber It is to provide a chemical vapor deposition apparatus that can reduce the volume of the pumping time to improve the productivity of the substrate efficiently.

The object is, according to the present invention, a transfer module chamber provided with a substrate handling robot for handling the substrate therein; At least one load lock chamber connected to one side of the transfer module chamber to allow a substrate to enter and exit the substrate; And a plurality of process module chambers connected to the other side of the transfer module chamber to perform a substantial deposition process on the substrate, wherein the transfer module chamber comprises: an upper transfer module chamber; A lower transfer module chamber coupled to the lower side of the upper transfer module chamber; And a pair of side transfer module chambers coupled to both sides of at least one of the upper transfer module chamber and the lower transfer module chamber, respectively.

The upper transfer module chamber may include an upper flange portion protruding inwardly from a lower inner wall of the upper transfer module chamber, and the lower transfer module chamber may include a lower portion protruding inwardly from an upper inner wall of the lower transfer module chamber. Including a flange portion, the upper flange portion and the lower flange portion may be coupled to each other by a fastening member.

The pair of side transfer module chambers may be coupled to left and right sides of the lower transfer module chamber, respectively, and sealing members may be interposed between the lower transfer module chamber and the pair of side transfer module chambers.

Sealing grooves may be formed on both outer walls of the lower transfer module chamber to which the pair of side transfer module chambers are coupled, and the sealing member may be inserted into the sealing groove.

A sealing member may be interposed between the upper transfer module chamber and the lower transfer module chamber.

A sealing groove may be formed along a lower circumference of the upper transfer module chamber or an upper circumference of the lower transfer module chamber, and the sealing member may be inserted into the sealing groove.

The chemical vapor deposition apparatus may further include a cover provided to cover an upper side of the upper transfer module chamber, and a sealing member may be interposed between the cover and the upper transfer module chamber.

A sealing groove may be formed along an upper circumference of the upper transfer module chamber or a lower circumference of the cover, and the sealing member may be inserted into the sealing groove.

Openings are formed at left and right sides of the lower transfer module chamber, respectively, the openings comprising: a first opening having a rectangular cross section; And a second opening extending downward from the lower center portion of the first opening and having a width smaller than that of the first opening.

At least one slot port may be formed in each of the upper transfer module chamber and the lower transfer module chamber so that a substrate to be deposited is introduced or a substrate on which deposition is completed is taken out.

The at least one slot port of the upper transfer module chamber is one slot port, the at least one slot port of the lower transfer module chamber is two slot ports, and among the two slot ports of the lower transfer module chamber The upper slot ports may be formed at substantially the same height as the slot ports respectively formed in the pair of side transfer module chambers.

The transfer module chamber has a hexagonal structure in planar projection, and the at least one load lock chamber and the plurality of process module chambers are disposed adjacent to each side of the transfer module chamber of the hexagonal structure, Can be connected.

The pair of side transfer module chambers may each include a reinforcement to reinforce the strength of the pair of side transfer module chambers.

According to the present invention, it is possible to reduce the volume of the side transfer module chamber by dividing the transfer module chamber into an upper transfer module chamber, a lower transfer module chamber, and a pair of side transfer module chambers. For convenience, it is possible to reduce the time required to install and repair the chemical vapor deposition apparatus on the production line, as well as to reduce the volume of the space inside the transfer module chamber, thereby reducing the pumping time and efficiently improving the productivity of the substrate. It becomes possible.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, in describing the present invention, descriptions of already known functions or configurations will be omitted to clarify the gist of the present invention.

For reference, the substrate to be described below refers to a flat panel display (FPD) including a liquid crystal display (LCD) substrate, a plasma display panel (PDP) substrate, an organic light emitting diodes (OLED) substrate, and the like. For the convenience of description, these will be referred to as substrates without being divided.

2 is a schematic plan view of a chemical vapor deposition apparatus according to an embodiment of the present invention, FIG. 3 is an exploded perspective view of the transfer module chamber of FIG. 2, and FIG. 4 is an upper transfer module chamber and a lower transfer module chamber of FIG. 3. 5 is a combined perspective view of the transfer module chamber of FIG. 3.

Referring to these drawings, the chemical vapor deposition apparatus 10 according to an embodiment of the present invention, the load lock chamber 100 to perform the loading and unloading of the substrate, and the five deposition processes for the substrate A process module chamber 310, 320, 330, 340, 350, and a transfer module chamber 200 interconnecting the load lock chamber 100 and the process module chambers 310, 320, 330, 340, 350. .

Here, the process module chambers 310, 320, 330, 340, and 350 perform a deposition process on the substrate in an environment of high temperature and low pressure. Although not shown, the process module chambers 310, 320, 330, 340, 350 are places where predetermined reactive gas ions emitted from an electrode are deposited to a predetermined thickness on the surface of a substrate placed on a susceptor (not shown). As such, this is where the actual deposition process for the substrate proceeds.

In the present exemplary embodiment, since five process module chambers 310, 320, 330, 340, and 350 are provided based on one load lock chamber 100, the productivity may be improved. However, since the scope of the present invention is not limited thereto, there may be more or at least five process module chambers 310, 320, 330, 340, and 350.

In order to proceed with the deposition process of the substrate through the process module chambers 310, 320, 330, 340, and 350, the substrate handling robot 500 provided in the transfer module chamber 200 transfers the substrate to be processed. (310, 320, 330, 340, 350) is transferred to the process, because it is difficult to enter the substrate in the atmospheric state directly into the process module chamber (310, 320, 330, 340, 350) of high temperature and low pressure Before the substrate is transferred to the corresponding process module chambers 310, 320, 330, 340, and 350, it is necessary to create the same environment as the process module chambers 310, 320, 330, 340, and 350. To this end, the load lock chamber 100 is provided.

When the load lock chamber 100 receives a substrate to be subjected to a chemical vapor deposition process from the outside by a transfer robot (not shown), the internal environment is substantially connected to the process module chambers 310, 320, 330, 340, and 350. It acts as a composition to the same temperature and pressure.

As such, the substrate in the load lock chamber 100 having substantially the same environment as the process module chambers 310, 320, 330, 340, and 350 is formed by the substrate handling robot 500 provided in the transfer module chamber 200. After being withdrawn and transferred to the corresponding process module chambers 310, 320, 330, 340, and 350, a corresponding deposition process is performed. On the contrary, the substrate in which the deposition process is completed in the process module chambers 310, 320, 330, 340, and 350 is drawn out by the substrate handling robot 500 to maintain the same temperature and pressure as the outside. After being transported to the robot, the robot is finally taken out by a transport robot (not shown).

In this way, the load lock chamber 100 may be formed by the substrate from the outside before the substrate is introduced into the process module chambers 310, 320, 330, 340, 350 or from the process module chambers 310, 320, 330, 340, 350. It serves to receive the substrate in a state substantially the same as the environment of the process module chambers 310, 320, 330, 340, 350 or an external environment before being drawn out.

The transfer module chamber 200 is a chamber connecting the process module chambers 310, 320, 330, 340, and 350 to the load lock chamber 100. In this embodiment, the transfer module chamber 200 has a hexagonal structure in planar projection. Having a huge structure. That is, the transfer module chamber 200 is provided as a huge structure because a so-called 11th generation substrate having a width / length of about 3 meters in and out of it must be transferred by the substrate handling robot 500.

The transfer module chamber 200 is provided in a state where it is mounted on a frame (not shown). Of course, the structure in which the transfer module chamber 200 is mounted on a frame (not shown) may include a load lock chamber in addition to the transfer module chamber 200. 100 and process module chambers 310, 320, 330, 340, 350.

Meanwhile, as shown in detail in FIG. 3, the transfer module chamber 200 according to the present embodiment may include an upper transfer module chamber 210 and a lower transfer module chamber coupled to a lower side of the upper transfer module chamber 210. 230, a pair of side transfer module chambers 240 and 250 coupled to both sides of the lower transfer module chamber 230, and a cover 220 covering the upper transfer module chamber 210.

The upper transfer module chamber 210 has a rectangular box shape, and includes a slot port 212 formed through one side wall of the upper transfer module chamber 210 and a top transfer module chamber 210 to draw in and out of a substrate. It includes an upper flange portion 211 protruding in the inward direction from the lower inner wall of the.

The slot port 212 is in communication with a slot port (not shown) provided in the load lock chamber 100, the substrate to be deposited is drawn from the load lock chamber 100 toward the upper transfer module chamber 210, The substrate on which the deposition is completed is a part which is drawn out from the upper transfer module chamber 210 to the load lock chamber 100 side.

The upper flange portion 211 is mutually coupled to the lower flange portion 231 of the lower transfer module chamber 230, which will be described later as protruding inward from the lower inner wall of the upper transfer module chamber 210, and thus the upper transfer module. This is to prevent relative sliding between the chamber 210 and the lower transfer module chamber 230. As shown in FIGS. 3 and 4, the upper flange portion 211 protrudes inward from the lower side of the first inner wall 213 and the lower side of the second inner wall 214 of the upper transfer module chamber 210, respectively. Prepared.

On the other hand, the lower transfer module chamber 230 is coupled to the lower side of the upper transfer module chamber 210, the slot port 232 is formed through the one side wall of the lower transfer module chamber 230 for the withdrawal of the substrate 233, openings 237 and 238 formed through the left and right walls, respectively, and a lower flange portion 231 protruding inwardly from an upper inner wall of the lower transfer module chamber 230.

The slot ports 232 and 233 communicate with slot ports (not shown) provided in the load lock chamber 100 so that the substrate to be deposited is drawn from the load lock chamber 100 toward the lower transfer module chamber 230. Alternatively, the substrate on which deposition is completed is a portion from which the lower transfer module chamber 230 is drawn out to the load lock chamber 100 side.

Unlike the upper transfer module chamber 210, the lower transfer module chamber 230 of the present embodiment includes two slot ports 232 and 233, of which the upper slot port 232 is a side transfer module chamber ( It is formed at substantially the same height as the slot port (241, 251) formed in the 240, 250, respectively.

As such, the slot ports 232 located on the upper side of the two slot ports 232 and 233 of the lower transfer module chamber 230 are formed in the side transfer module chambers 240 and 250, respectively. By forming the substrate at substantially the same height as the above, it is possible to shorten the time required for drawing out the substrate.

That is, the slot ports (not shown) formed in the process module chambers 310, 320, 330, 340, and 350 may be flush with the slot ports 241 and 251 formed in the side transfer module chambers 240 and 250, respectively. In this case, the substrate to be deposited is introduced from the load lock chamber 100 to the upper transfer module chamber 210 or the lower transfer module chamber 230, and then passes through the side transfer module chamber 240 or 250. It is drawn into one process module chamber 310 or 320 or 330 or 340 or 350. Similarly, the substrate on which deposition is completed is withdrawn from the process module chamber 310 or 320 or 330 or 340 or 350 to the side transfer module chamber 240 or 250 and then back to the upper transfer module chamber 210 or the lower transfer module chamber ( It is withdrawn to the load lock chamber 100 side via 230.

In this case, the substrate introduced into the transfer module chamber 200 may be transferred to the process module chambers 310, 320, 330, 340, and 350, or the substrate drawn out from the process module chambers 310, 320, 330, 340, and 350 may be transferred. As described above, the substrate handling robot 500 is responsible for the transfer to the transfer module chamber 200, and as shown in the present embodiment, the upper portion of the two slot ports 232 and 233 of the lower transfer module chamber 230 is disposed above. By forming the slot ports 232 positioned at substantially the same height as the slot ports 241 and 251 formed in the side transfer module chambers 240 and 250, respectively, the time required for raising and lowering the substrate handling robot 500 is increased. To reduce it.

That is, the height of the slot port 232 formed in the center of the three slot ports (212, 232, 233) provided on one side of the transfer module chamber 200, and the slot port of the side transfer module chamber (240, 250) By making the heights of the slot ports (not shown) of the 241 and 251 and the process module chambers 310, 320, 330, 340, and 350 substantially the same, the substrate handling robot 500 is centered in the transfer module chamber 200. The substrate is transferred while moving along the shortest distance in the vertical direction.

However, according to another embodiment of the present invention, two or more slot ports may be formed in the upper transfer module chamber 210 (not shown), and three or more slot ports may be formed in the lower transfer module chamber 230. (Not shown). In addition, if necessary, the heights of the slot ports 233 of the lower transfer module chamber 230 and the slot ports 241 and 251 of the side transfer module chambers 240 and 250 may not be substantially the same. The scope of the right is not limited by the formation position of the slot port (212, 232, 233, 241, 251).

On the other hand, the openings 237 and 238 are formed through the first inner wall 234 and the second inner wall 235 respectively formed on the left and right sides of the lower transfer module chamber 230, and the first openings 237a, 238a and second openings 237b and 238b extending downwards with a width smaller than the width of the first openings 237a and 238a at the lower center portions of the first openings 237a and 238a.

Correspondingly, openings 257 (not shown) having the same shape are formed in the pair of side transfer module chambers 240 and 250 described below.

The reason for forming the openings 237 and 238 of the lower transfer module chamber 230 and the openings 257 (not shown) of the pair of side transfer module chambers 240 and 250 as described above is because the substrate handling robot 500 In order to shorten the pumping time for making the inside of the transfer module chamber 200 into a vacuum while securing a sufficient radius of rotation.

As will be described later, the pair of side transfer module chambers 240 and 250 may include a process module chamber coupling part 242 and 252 to which the process module chambers 310, 320, 330, 340 and 350 are coupled along each side; And curved surface portions 244 and 254 provided integrally under the process module chamber coupling portions 242 and 252.

The process module chamber coupling portions 242, 252 each have a triangular cross-sectional shape for the convenience of coupling the side transfer module chambers 240, 250 and the process module chambers 310, 320, 330, 340, 350. It is provided as a straight surface, the curved surface portion 244, 254 is provided in a curved surface having a predetermined curvature to provide a rotation space for the substrate handling robot 500 to rotate in the transfer module chamber 200.

The elliptical portion provided below the lower transfer module chamber 230 is interconnected with the curved inner walls of the curved surface portions 244 and 254 of the pair of side transfer module chambers 240 and 250 to have an overall circular cross-sectional shape. And a portion of the openings 257 (not shown) of the pair of side transfer module chambers 240 and 250 provided in the same shape as the second openings 237b and 238b and the second openings 237b and 238b. The substrate handling robot 500 may rotate in the inner space of the transfer module chamber 200 while having a sufficient radius of rotation.

In addition, the openings 257 of the first openings 237a and 238a of the lower transfer module chamber 230 and the pair of side transfer module chambers 240 and 250 provided in the same shape as the first openings 237a and 238a. The substrate may be drawn from the lower transfer module chamber 230 to the pair of side transfer module chambers 240 and 250 in a state in which the substrate has sufficient clearance, or a pair of side transfer module chambers (not shown). 240 and 250 may be taken out to the lower transfer module chamber 230 side.

Meanwhile, the lower flange part 231 is protruded inward from the upper inner wall of the lower transfer module chamber 230 and is mutually coupled to the upper flange part 211 of the upper transfer module chamber 210.

In general, since the inside of the transfer module chamber 200 is maintained in a vacuum state and the outside is kept at atmospheric pressure, an upper pressure difference between the upper transfer module chamber 210 and the lower transfer module chamber due to an air pressure difference between the inside and the outside of the transfer module chamber 200. (230) A constant force acts on each other. This force may cause the lower transfer module chamber 230 to move relatively with respect to the upper transfer module chamber 210, and thus, it is difficult to maintain airtightness inside the transfer module chamber 200. May occur.

In consideration of these problems, the chemical vapor deposition apparatus 10 of the present embodiment is provided on the upper flange portion 211 provided on the lower inner wall of the upper transfer module chamber 210 and the upper inner wall of the lower transfer module chamber 230. The lower flanges 231 are fastened to each other through the fastening member 400 to prevent relative sliding of the lower transfer module chamber 230 with respect to the upper transfer module chamber 210.

3 and 4, the lower flange portion 231 protrudes in an inward direction from an upper side of the first inner wall 234 and an upper side of the second inner wall 235 of the lower transfer module chamber 230, respectively. Prepared.

The upper flange portion 211 and the lower flange portion 231 are mutually coupled by the fastening member 400, where the fastening member 400 refers to the bolt 410 and the nut 420. The fastening members 400 are spaced apart by a predetermined distance from each other along the length direction of the upper flange portion 211 and the lower flange portion 231 are coupled in plurality. However, as long as the upper transfer module chamber 210 and the lower transfer module chamber 230 can be firmly coupled, the fastening member 400 may be variously changed, and the scope of the present invention is defined by the fastening member 400. It is not limited by type.

In the chemical vapor deposition apparatus 10 according to the present embodiment, the upper transfer module chamber 210 and the lower transfer module chamber 230 are firmly fastened to each other by the fastening member 400, thereby transferring the transfer module chamber 200. It is possible to effectively maintain the vacuum pressure inside the transfer module chamber 200 by preventing relative movement of the lower transfer module chamber 230 with respect to the upper transfer module chamber 210 which may be caused by the difference in pressure between the inside and the outside. To help.

In addition, the chemical vapor deposition apparatus 10 according to the present embodiment, the transfer module chamber 200 to which the pair of side transfer module chambers 240 and 250 are coupled, the upper transfer module chamber 210 and the lower transfer module chamber. It is configured by dividing the 230, and by coupling the side transfer module chamber (240, 250) to both sides of the lower transfer module chamber 230, as will be described later, it is possible to reduce the volume of the side transfer module chamber (240, 250) Accordingly, even when the size of the transfer module chamber 200 increases, the transfer module chamber 200 may be easily transported.

As a result, the chemical vapor deposition apparatus 10 according to the present embodiment can facilitate the transfer of the transfer module chamber 200, and reduce the installation and maintenance work time of the chemical vapor deposition apparatus 10 in the production line. In addition, by reducing the volume of the space inside the transfer module chamber 200 it is possible to shorten the pumping time to efficiently improve the productivity of the substrate.

Meanwhile, sealing grooves 230a recessed from the surface are formed on both outer walls of the lower transfer module chamber 230 to which the pair of side transfer module chambers 240 and 250 are coupled. The sealing groove 230a is inserted between the lower transfer module chamber 230 and the side transfer module chambers 240 and 250 to insert a sealing member 510 to maintain the airtight inside the transfer module chamber 200. More details will be described later.

The pair of side transfer module chambers 240 and 250 may be formed in the lower transfer module chamber 230 to withdraw the substrate between the transfer module chamber 200 and the process module chambers 310, 320, 330, 340 and 350. It is a configuration that is coupled to both sides.

In the present embodiment, the pair of side transfer module chambers 240 and 250 are coupled to both sides of the lower transfer module chamber 230, respectively, so that the overall volume of the side transfer module chambers 240 and 250 can be reduced. do.

However, according to another embodiment of the present invention, the pair of side transfer module chambers 240 and 250 may be configured as two or more parts which are not integrated (not shown). It is not limited by the configuration method of the pair of side transfer module chambers 240 and 250.

As shown in FIGS. 3 and 5, the side transfer module chambers 240 and 250 may include a process module chamber coupling part 242 to which the process module chambers 310, 320, 330, 340 and 350 are coupled along each side. 252 and curved surface portions 244 and 254 integrally provided under the process module chamber coupling portions 242 and 252.

The process module chamber coupling parts 242 and 252 are manufactured to have a triangular cross-sectional shape, respectively, so that a total of four process module chambers 310, 320, 330, and 340 are coupled along each side, and curved surface parts 244 and 254. Is a portion that provides a rotation space for the substrate handling robot 500 to rotate in the transfer module chamber 200.

Slot ports 241 and 251 are formed at each side of the process module chamber coupling parts 242 and 252, respectively. As described above, the slot ports 241 and 251 are two slot ports of the lower transfer module chamber 230. It is formed at substantially the same height as the slot port 232 formed on the upper side of the (232, 233).

Meanwhile, the pair of side transfer module chambers 240 and 250 include reinforcement parts 260 for reinforcing the strength of the side transfer module chambers 240 and 250, respectively.

The reinforcement part 260 is provided in plurality so as to protrude from the upper surfaces of the process module chamber coupling parts 242 and 252 and the outer peripheral surfaces of the curved surface parts 244 and 254. In addition, the reinforcement parts 260 provided in the process module chamber coupling parts 242 and 252 and the curved surface parts 244 and 254, respectively, are provided substantially coaxially with each other, so that the stiffness applied to the side transfer module chambers 240 and 250 is increased. It should have rigidity that can effectively resist the pneumatic pressure.

Meanwhile, the chemical vapor deposition apparatus 10 according to the present exemplary embodiment further includes a cover 220 covering the upper transfer module chamber 210.

The cover 220 is to maintain a vacuum inside the transfer module chamber 200 by completely sealing the upper side of the upper transfer module chamber 210. Although not shown, the cover 220 may be provided with a crane lifting ring connecting portion (not shown) for coupling the lifting ring of the crane, thereby simply lifting the cover 220 from the upper transfer module chamber 210 or Allow to get off.

3 to 5, the sealing member 510 interposed between the chemical vapor deposition lower transfer module chamber 230 and the pair of side transfer module chambers 240 and 250, respectively, according to the present embodiment. More).

The sealing member 510 is inserted into the sealing grooves 230a formed on both outer walls of the lower transfer module chamber 230 to which the side transfer module chambers 240 and 250 are coupled, respectively, so that the whole of the transfer module chamber 200 is provided. It is a member that maintains the airtightness of the internal space.

In the present embodiment, the sealing member 510 is a general O-ring (O-ring) is used, where the O-ring refers to a mechanical element for sealing the plate or the moving part of the 'O' type. In particular, the sealing member 510 of the present embodiment is made of a material such as viton or silicon in consideration of the internal pressure and temperature of the transfer module chamber 200.

The sealing member 510 is inserted into the sealing grooves 230a formed on both outer walls of the lower transfer module chamber 230, and then pressed by the pair of side transfer module chambers 240 and 250 to be unfolded as a whole. The airtightness inside the transfer module chamber 200 is maintained.

However, according to another embodiment of the present invention, the sealing groove 230a may be formed at the side transfer module chambers 240 and 250 (not shown), and may be made of a material other than viton or silicon.

In the same manner, the transfer module chamber 200 of the present embodiment may include a sealing member interposed between the cover 220 and the upper transfer module chamber 210, and between the upper transfer module chamber 210 and the lower transfer module chamber 230. (Not shown), the details of the insertion method and function of the sealing member (not shown) are the same as described above, and a detailed description thereof will be omitted.

The chemical vapor deposition apparatus 10 according to the present embodiment includes a cover 220 and an upper transfer module chamber 210, an upper transfer module chamber 210 and a lower transfer module chamber 230, and a lower transfer module chamber ( By interposing the sealing members 510 between the 230 and the pair of side transfer module chambers 240 and 250, the vacuum pressure inside the transfer module chamber 200 can be efficiently maintained.

In addition, in the chemical vapor deposition apparatus 10 of the present invention, the transfer module chamber 200 includes an upper transfer module chamber 210, a lower transfer module chamber 230, and a pair of side transfer module chambers 240 and 250. By dividing the structure into two, transfer of the transfer module chamber 200 is facilitated, and the installation and maintenance work time of the chemical vapor deposition apparatus 10 in the production line can be reduced, and the interior space of the transfer module chamber 200 can be reduced. By reducing the volume of the pump it is possible to shorten the pumping time to efficiently improve the productivity of the substrate.

While specific embodiments of the invention have been described and illustrated above, it is to be understood that the invention is not limited to the described embodiments, and that various modifications and changes can be made without departing from the spirit and scope of the invention. It is self-evident to those who have. Therefore, such modifications or variations are not to be understood individually from the technical spirit or point of view of the present invention, the modified embodiments will belong to the claims of the present invention.

1 is an exploded perspective view of a transfer module chamber of a chemical vapor deposition apparatus according to the prior art.

2 is a schematic plan view of a chemical vapor deposition apparatus according to an embodiment of the present invention.

3 is an exploded perspective view of the transfer module chamber of FIG. 2.

4 is a perspective view illustrating a coupling of the upper transfer module chamber and the lower transfer module chamber of FIG. 3.

FIG. 5 is a perspective view of the transfer module chamber of FIG. 3.

* Description of the symbols for the main parts of the drawings *

10: chemical vapor deposition apparatus 100: load lock chamber

200: transfer module chamber 210: upper transfer module chamber

220: cover 230: lower transfer module chamber

240, 250: side transfer module chamber 211: upper flange

231: lower flange 400: fastening member

Process module chamber: 310, 320, 330, 340, 350

Claims (13)

A transfer module chamber in which a substrate handling robot for handling a substrate is provided; At least one load lock chamber connected to one side of the transfer module chamber to allow a substrate to enter and exit the substrate; And A plurality of process module chambers connected to the other side of the transfer module chamber to perform a substantial deposition process on the substrate, The transfer module chamber, An upper transfer module chamber; A lower transfer module chamber coupled to the lower side of the upper transfer module chamber; And And a pair of side transfer module chambers coupled to both sides of at least one of the upper transfer module chamber and the lower transfer module chamber. The method of claim 1, The upper transfer module chamber, An upper flange portion protruding inward from a lower inner wall of the upper transfer module chamber, The lower transfer module chamber, A lower flange part protruding in an inward direction from an upper inner wall of the lower transfer module chamber, And the upper flange portion and the lower flange portion are coupled to each other by a fastening member. The method of claim 1, The pair of side transfer module chambers are respectively coupled to the left and right sides of the lower transfer module chamber, And a sealing member is interposed between the lower transfer module chamber and the pair of side transfer module chambers. The method of claim 3, Sealing grooves are formed on both outer walls of the lower transfer module chamber to which the pair of side transfer module chambers are coupled. And the sealing member is inserted into the sealing groove. The method of claim 1, And a sealing member interposed between the upper transfer module chamber and the lower transfer module chamber. The method of claim 5, A sealing groove is formed along a lower circumference of the upper transfer module chamber or an upper circumference of the lower transfer module chamber. And the sealing member is inserted into the sealing groove. The method of claim 1, Further comprising a cover provided to cover the upper side of the upper transfer module chamber, And a sealing member is interposed between the cover and the upper transfer module chamber. The method of claim 7, wherein A sealing groove is formed along an upper circumference of the upper transfer module chamber or a lower circumference of the cover. And the sealing member is inserted into the sealing groove. The method of claim 3, Openings are formed in left and right sides of the lower transfer module chamber, The opening is A first opening formed in a rectangular cross section; And And a second opening extending downwardly at a lower end central portion of the first opening and having a width smaller than the width of the first opening. The method of claim 1, The upper transfer module chamber and the lower transfer module chamber, respectively, And at least one slot port is formed to allow the substrate to be deposited to be introduced or to remove the substrate from which deposition is completed. The method of claim 10, The at least one slot port of the upper transfer module chamber is one slot port, The at least one slot port of the lower transfer module chamber is two slot ports, And a slot port located at an upper side of the two slot ports of the lower transfer module chamber is formed at substantially the same height as slot ports respectively formed in the pair of side transfer module chambers. The method of claim 1, The transfer module chamber has a hexagonal structure in planar projection, And the at least one load lock chamber and the plurality of process module chambers are disposed adjacent to each side of the transfer module chamber having a hexagonal structure and connected to the transfer module chamber. The method of claim 1, The pair of side transfer module chambers, respectively, And a reinforcement for reinforcing the strength of the pair of side transfer module chambers.

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