CN109326704A - A kind of structure preventing the bluish-green optical chip adhesion of small spacing LED - Google Patents
A kind of structure preventing the bluish-green optical chip adhesion of small spacing LED Download PDFInfo
- Publication number
- CN109326704A CN109326704A CN201811238897.6A CN201811238897A CN109326704A CN 109326704 A CN109326704 A CN 109326704A CN 201811238897 A CN201811238897 A CN 201811238897A CN 109326704 A CN109326704 A CN 109326704A
- Authority
- CN
- China
- Prior art keywords
- chip
- pad
- green light
- bluish
- small spacing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 15
- 125000006850 spacer group Chemical group 0.000 claims abstract description 13
- 239000000853 adhesive Substances 0.000 claims abstract description 9
- 230000001070 adhesive effect Effects 0.000 claims abstract description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 239000011889 copper foil Substances 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 3
- 241001062009 Indigofera Species 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 3
- 239000003292 glue Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a kind of structures for preventing the bluish-green optical chip adhesion of small spacing LED, including LED substrate ontology；The pad of protrusion there are two being set on the LED substrate ontology front；Spacer region is reserved between two raised pads；Green light chip is fixed on one pad；Fixed blue chip on another pad；The spacer region can block green light chip connected together with blue chip by crystal-bonding adhesive, to avoid the green light chip and blue chip stick to each other.By devising the spacer region between the green light chip and blue chip, the access that green light chip uses crystal-bonding adhesive to connect together with blue chip is blocked, so as to avoid the adhesion between green light chip and blue chip.The design of bump pad can sufficiently take into account the heat dissipation problem of chip simultaneously.
Description
Technical field
The present invention relates to LED component encapsulation fields, more particularly to a kind of knot for preventing the bluish-green optical chip adhesion of small spacing LED
Structure.
Background technique
As LED display is towards the trend development of fine definition high contrast, the requirement of LED component towards miniaturization very
Develop to the direction of micromation, so that small spacing LED is packaged with higher technical requirements.
On the small spacing LED that size becomes small, encapsulate the redgreenblue chip of certain volume, need reasonably design with
And good making technology guarantees the stability and reliability of LED.In addition, on unit area LED component increase, also require
Small spacing LED needs to have good heating conduction.In the range scale of small spacing LED, between the electrode of functional areas, chip it
Between, the safe distance between chip and electrode it is minimum, the utilization rate and safe distance for how taking into account space are asking for urgent need to resolve
Topic.And a problem for being difficult to control is compared in the problem of being among these the problem of blue green light LED chip adhesion the inside.
Summary of the invention
In order to solve the above technical problems, leading to we have proposed a kind of structure for preventing the bluish-green optical chip adhesion of small spacing LED
The structure design for being separated pad is crossed, so that the die bond glue of green light chip and blue chip is not easy to connect, to reach
Prevent the purpose of green light chip and blue chip stick to each other.
In order to achieve the above objectives, technical scheme is as follows:
A kind of structure preventing the bluish-green optical chip adhesion of small spacing LED, including LED substrate ontology；The LED substrate ontology
The pad of protrusion there are two being set on front；Spacer region is reserved between two raised pads；Green light is fixed on one pad
Chip；Fixed blue chip on another pad；The spacer region can block green light chip and blue chip pass through die bond
Glue connection is connected to together, to avoid the green light chip and blue chip stick to each other.
Preferably, the LED substrate ontology substrate is BT resin plate, covers copper foil in BT resin board surface, then on copper foil
Etching forms pad.
Preferably, the pad thickness of the protrusion is 0.02mm.
Preferably, the interval sector width between described two bump pads is 0.08mm.
Through the above technical solutions, the present invention is by devising the spacer region between the green light chip and blue chip,
The access that green light chip uses crystal-bonding adhesive to connect together with blue chip is blocked, so as to avoid green light chip and blue light core
Adhesion between piece.The design of bump pad simultaneously can sufficiently take into account the heat dissipation problem of chip, thus reached novel design,
Structurally reasonable and good application effect purpose.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 is positive structure schematic in a kind of structure for preventing the bluish-green optical chip adhesion of small spacing LED of the present invention.
Fig. 2 is the side the schematic diagram of the section structure of Fig. 1.
Number and corresponding component title represented by letter in figure:
2. pad of 1.LED substrate body, 3. spacer region, 4. green light chip
5. blue chip
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Below with reference to embodiment and specific embodiment, the present invention is described in further detail.
Embodiment
As depicted in figs. 1 and 2, a kind of structure preventing the bluish-green optical chip adhesion of small spacing LED, including LED substrate ontology
1；The pad 2 of protrusion there are two being set on 1 front of LED substrate ontology；Spacer region 3 is reserved between two raised pads 2；
Green light chip 4 is fixed on one of pad 2；Fixed blue chip 5 on another pad 2；The spacer region 3 can
Block green light chip 4 is connected together with blue chip 5 by crystal-bonding adhesive, to avoid 5 phase of the green light chip 4 and blue chip
Mutual adhesion improves the reliability of product to prevent 5 short circuit of green light chip 4 and blue chip.
Meanwhile in the above-mentioned structure design for preventing the bluish-green optical chip adhesion of small spacing LED, the LED substrate ontology
Substrate is BT resin plate, covers copper foil in BT resin board surface, then etching forms pad on copper foil.The pad thickness of the protrusion
For 0.02mm.Interval sector width between described two bump pads is 0.08mm, is spaced such that area 3 just blocks green light chip
The 4 nearest accesses connected together with 5 crystal-bonding adhesive of blue chip, so as to avoid the adhesion of bluish-green optical chip.And feux rouges core
Piece and green light chip, because red light chips are first using different crystal-bonding adhesives and baking-curing, even if red light chips and green
Optical chip closely will not adhesion apart from glue on a pad.
The present invention is set between pad by separately designing green light chip 4 and blue chip 5 on corresponding pad
There is spacer region, the access that green light chip 4 is connected together with 5 crystal-bonding adhesive of blue chip can be blocked, so as to avoid bluish-green
The adhesion of optical chip prevents 5 short circuit of green light chip 4 and blue chip, improves the reliability of product.The design of pad can simultaneously
The heat dissipation problem of chip is sufficiently taken into account.And red light chips and green light chip, because of both fixed crystal-bonding adhesive ingredient difference table
Face tension is larger, so will not adhesion on a pad even if red-green glow chip.
Above-described is only a kind of structure preferred implementation side for preventing the bluish-green optical chip adhesion of small spacing LED of the invention
Formula, it is noted that for those of ordinary skill in the art, without departing from the concept of the premise of the invention, may be used also
To make several modifications and improvements, these are all within the scope of protection of the present invention.
Claims (4)
1. a kind of structure for preventing the bluish-green optical chip adhesion of small spacing LED, which is characterized in that including LED substrate ontology (1)；Institute
State the pad (2) of protrusion there are two setting on LED substrate ontology (1) front；Spacer region is reserved between two raised pads
(3)；Green light chip (4) are fixed on one pad；Fixed blue chip (5) on another pad；Spacer region (3) energy
Enough block green light chip (4) are connected together with blue chip (5) by crystal-bonding adhesive, to avoid the green light chip (4) and indigo plant
Optical chip (5) stick to each other.
2. a kind of structure for preventing the bluish-green optical chip adhesion of small spacing LED according to claim 1, which is characterized in that institute
Stating LED substrate ontology (1) substrate is BT resin plate, covers copper foil in BT resin board surface, then etching forms pad on copper foil
(2)。
3. a kind of structure for preventing the bluish-green optical chip adhesion of small spacing LED according to claim 2, which is characterized in that institute
The pad (2) of protrusion is stated with a thickness of 0.02mm.
4. a kind of structure for preventing the bluish-green optical chip adhesion of small spacing LED according to claim 3, which is characterized in that institute
Stating spacer region (3) width between two bump pads is 0.08mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811238897.6A CN109326704A (en) | 2018-10-23 | 2018-10-23 | A kind of structure preventing the bluish-green optical chip adhesion of small spacing LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811238897.6A CN109326704A (en) | 2018-10-23 | 2018-10-23 | A kind of structure preventing the bluish-green optical chip adhesion of small spacing LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109326704A true CN109326704A (en) | 2019-02-12 |
Family
ID=65263061
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811238897.6A Pending CN109326704A (en) | 2018-10-23 | 2018-10-23 | A kind of structure preventing the bluish-green optical chip adhesion of small spacing LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109326704A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050110035A1 (en) * | 2003-11-20 | 2005-05-26 | Hsing Chen | Tri-color znse white light emitting diode |
| CN106711136A (en) * | 2017-01-18 | 2017-05-24 | 苏州晶台光电有限公司 | Vertical-structure LED chip packaging structure for realizing super-high density display |
| CN208889693U (en) * | 2018-10-23 | 2019-05-21 | 苏州晶台光电有限公司 | A kind of structure preventing the bluish-green optical chip adhesion of small spacing LED |
-
2018
- 2018-10-23 CN CN201811238897.6A patent/CN109326704A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050110035A1 (en) * | 2003-11-20 | 2005-05-26 | Hsing Chen | Tri-color znse white light emitting diode |
| CN106711136A (en) * | 2017-01-18 | 2017-05-24 | 苏州晶台光电有限公司 | Vertical-structure LED chip packaging structure for realizing super-high density display |
| CN208889693U (en) * | 2018-10-23 | 2019-05-21 | 苏州晶台光电有限公司 | A kind of structure preventing the bluish-green optical chip adhesion of small spacing LED |
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