CN205177820U - Electric connection structure between positive back of chip - Google Patents
Electric connection structure between positive back of chip Download PDFInfo
- Publication number
- CN205177820U CN205177820U CN201520827508.9U CN201520827508U CN205177820U CN 205177820 U CN205177820 U CN 205177820U CN 201520827508 U CN201520827508 U CN 201520827508U CN 205177820 U CN205177820 U CN 205177820U
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- chip
- circuit board
- back side
- connection gasket
- plane type
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Abstract
The utility model discloses an electric connection structure between positive back of chip, it contains a chip and one and is equipped with the single face formula softness circuit board of connection gasket on the surface at the one of which, is equipped with a plurality of brilliant pads and an at least service area on the front of this chip, this single face formula softness circuit board has a first surface and a second surface, nevertheless only is equipped with a plurality ofly corresponding to the brilliant first connection gasket that fills up of this chip and a plurality ofly correspond the second connection gasket of being connected with each first connection gasket respectively on this first surface, and each contact that these a plurality of second connection gaskets are used for attending the preinstalled circuit with a printed circuit board corresponds to be connected, during the manufacturing, each the first connection gasket that utilizes this single face formula softness circuit board to establish on with its first surface corresponds electric connection and stacks up at positive each crystalline substance of this chip, makes the curved winding course of this single face formula softness circuit board cross this chip one side back of edge in order to extend to this chip again to turn over again and roll over once in order to fix a position on the back of this chip.
Description
Technical field
The utility model relates to the electric connection structure between the positive back side of a kind of chip, espespecially a kind ofly utilize an one plane type flexible circuit board (FPC) being provided with connection gasket on one one side, make its by the front of a chip walk around this chip one lateral edges and again reflexed to be positioned on the back side of this chip, each crystalline substance pad (diepad) set in chip front side is made to move to the back side of chip by this one plane type FPC for can being electrically connected and being arranged on a printed circuit board (PCB), the using function of active region is reached to make active region set in this chip front side can coordinate this printed circuit board (PCB).
Background technology
Surface mount technology (SMT) is utilized to be electrically connected to cover crystalline substance (flip-chip) mode and to be arranged on a printed circuit board (PCB) (PCB) by a chip, the using state common for current chip and prior art, multiple crystalline substances pad (diepad) set on the front of now this chip are namely in the face of this printed circuit board (PCB) (PCB) and on each default contact of circuit layer set by corresponding being electrically connected in this printed circuit board surface.
But on the front of a chip except multiple crystalline substance pad (diepad), when being also provided with other active regions (activearea), namely cannot being electrically connected in existing crystalline substance (flip-chip) mode of covering and being arranged on a printed circuit board (PCB) (PCB).At this with an identification of fingerprint chip, chip 10 is as shown in Figure 1 example, the front 11 of this chip 10 is provided with multiple crystalline substance pad (diepad) 110 and active region (activearea) 111, as identification of fingerprint induction effect district (sensoractivearea), this induction effect district 111 is in order to externally to respond to a fingermark image (as pressed in active region 111 on the surface by finger) and to convert electronic signal to, again by the plurality of crystalline substance pad (diepad) 110 by electronic signal transmission to the printed circuit board (PCB) 50 that is electrically connected (as shown in Figure 2, it is positioned at the foreign side at the back side 12 of this chip 10) for carrying out discriminating function or relevant operation.Due to this active region 111 if identification of fingerprint induction effect district is external induction, therefore the surface of this active region 111 must towards the opposite side of this printed circuit board (PCB) 50 (as shown in Figure 2) (i.e. the front 11 of chip 10), otherwise can be covered by this printed circuit board (PCB) 50, multiple crystalline substance pad (diepad) 110 on the front 11 of therefore this chip 10 cannot be electrically connected to cover crystalline substance (flip-chip) mode and install on the printed circuit board 50.
Although, the front 11 of this chip 10 can adopt other junctures to be electrically connected between multiple crystalline substance pad (diepad) 110 and printed circuit board (PCB) 50, (wirebond) mode is connected as adopted wire, but the wire used is surperficial from crystalline substance pad (diepad) 110 is the printed circuit board (PCB) 50 of arcuation drawing to the back side 12 of (as crossing a lateral edges 13 of this chip) this chip 10, therefore the peak of wire can exceed the front 11 of this chip 10 or crystalline substance pad (diepad) 110 1 segment distance on it relatively, this multiple conducting wires (wire) periphery generally can apply an insulation outer jacket again in order to cover and to protect this multiple conducting wires (wire) again, with make this multiple conducting wires (wire) or its outer jacket relative to this active region (activearea) 111 sensitive surface between drop strengthen, illustrate for Fig. 2, this drop similarly is the drop between the sensitive surface (front 11 as chip 10) of second surface 22 and this active region 111 in Fig. 2, but actual drop can be larger than 50 shown in Fig. 2 μm, cause active region 111 surface and arround drop between surface and out-of-flatness, the inducing function of this active region 111 (as identification of fingerprint induction effect district) of relative effect and service efficiency, in addition, be coated in the surface area of the peripheral insulation outer jacket of this multiple conducting wires (wire) also this chip 10 of relative outer expansion encapsulation, be unfavorable for compact requirement.Separately, electrically conduct with via as arranged between front 11 and the back side 12 in the encapsulation of chip 10, the design of this type of via is common in chip package and related art, but manufacture process bothers and complicated relatively, does not meet cost benefit.
In addition, two plane type FPC (it is all provided with connection gasket on two-sided) connected mode can be adopted between multiple crystalline substance pad (diepad) 110 on the front 11 of this chip 10 and printed circuit board (PCB) (PCB), though the trouble arranging via between the front 11 and the back side 12 of chip 10 can be avoided, but the encapsulating structure on chip 10 front still exist this active region 111 surface and arround can produce the shortcoming of larger drop and out-of-flatness phenomenon between surface, cause such as identification induction effect district, active region 111 cannot close to determinand, the sensing function of this active region 111 of relative effect and service efficiency, in addition, because two plane type FPC is two-sidedly respectively provided with connection gasket at it, and turning circuit must be set up in addition between two-sided set connection gasket, therefore the thickness of two plane type FPC is larger, gross thickness that relative effect has encapsulated (as large in 400 μm as shown in than Fig. 2), also the overall width (width outwards increased as chip is greater than 120 μm as shown in Figure 2) that encapsulated of relative effect, and the trouble also having that the loaded down with trivial details and cost of manufacture process increases.
As from the foregoing, for a front being provided with the chip of multiple crystalline substance pad (diepad) and other active regions (activearea) as identification of fingerprint chip simultaneously, the structure of the state of the art and/or processing procedure are difficult to demand during realistic use in fact, therefore still there is further room for improvement.
Utility model content
Main purpose of the present utility model is to provide the electric connection structure between the positive back side of a kind of chip, it utilizes an one plane type flexible circuit board (FPC, FlexiblePrintedCircuit), only be provided with in surface thereof and multiplely correspond to the first connection gasket of brilliant pad set by a chip front side and multiple second connection gasket of connecting corresponding to each first connection gasket respectively, each first connection gasket correspondence set on this one plane type FPC is made to be electrically connected on each crystalline substance pad set by this chip front side again, this one plane type FPC is made to be bent around this chip one lateral edges to extend to the back side of this chip again, and again reflexed once to be positioned on the back side of this chip, make each second connection gasket set on this one plane type FPC can be electrically connected and be arranged on a printed circuit board (PCB), the back side of chip is moved to for can being electrically connected and being arranged on this printed circuit board (PCB) by the circuit communication of this one plane type FPC to make each crystalline substance pad set in chip front side, the using function of active region is reached to make active region set in this chip front side can coordinate this printed circuit board (PCB), and reduce the cost of manufacture of this one plane type FPC, and the encapsulation in relative this chip front side of thinning is to promote the service efficiency of set active region on its front.
In order to achieve the above object, electric connection structure between the positive back side of the chip that the utility model provides comprises a chip and an one plane type flexible circuit board, the front of this chip is provided with multiple crystalline substance pad (diepad) and at least one active region (activearea), as identification of fingerprint induction effect district (sensoractivearea); This one plane type flexible circuit board has a first surface and a second surface, but be only provided with multiple the first connection gasket corresponding to this chip crystalline substance pad and multiple second connection gasket of connecting corresponding to each first connection gasket respectively on the first surface, the plurality of second connection gasket, in order to be connected respectively with the contact that respectively exposes of default circuit on a printed circuit board (PCB) be used in combination, to be arranged on by the plurality of second connection gasket set by this one plane type flexible circuit board on this printed circuit board (PCB) to make this chip and to realize being electrically connected.
Wherein, this one plane type flexible circuit board by this chip front and walk around this chip one lateral edges to extend to the back side of this chip and to stick together and be covered on this back side, and again reflexed once to be positioned on the back side of this chip, set each second connection gasket is made on this first surface to be electrically connected and to install on a printed circuit, to make setly in chip front side each brilliantly to pad the back side that moves to chip by this one plane type flexible circuit board and facing to outward for being electrically connected and being arranged on this printed circuit board (PCB).
In the utility model one embodiment; active region (activearea) set on the front of wherein this chip is an identification of fingerprint induction effect district (sensoractivearea); and this induction effect district above a high-transmittance dielectric layer is set further, in order to protect this induction effect district.
In the utility model one embodiment, wherein the height each crystalline substance that be electrically connected at this chip front side corresponding to each first connection gasket on this one plane type FPC of the high-transmittance dielectric layer that this induction effect district (sensoractivearea) is upper set pad after height flush, namely form sustained height with the end face (second surface) of this one plane type FPC.
Accompanying drawing explanation
Fig. 1 is the upper schematic diagram of chip one embodiment in the utility model;
The cross-sectional schematic of electric connection structure one embodiment between the positive back side of chip that Fig. 2 provides for the utility model;
The schematic flow sheet of the manufacture method of electric connection structure between the positive back side of chip that Fig. 3 A ~ Fig. 3 E provides for the utility model;
Fig. 4 is the cross-sectional schematic arranging the dielectric layer of a high-transmittance above in set induction effect district in the chip front side in Fig. 1 in the utility model;
Fig. 5 is the cross-sectional schematic that in Fig. 4, the height of this high-transmittance dielectric layer flushes with the height of this flexible circuit board.
Description of reference numerals: 10-chip; 11-front; The 12-back side; 13-lateral edges; 110-crystalline substance pad; 111-active region; 20-one plane type flexible circuit board; 21-first surface; 210-first connection gasket; 211-second connection gasket; 22-second surface; 30-chemical nickel layer gold (ENIG); 40-mucigel; 50-printed circuit board (PCB); 60-high-transmittance dielectric layer.
Embodiment
For making the utility model definitely full and accurate, hereby enumerating preferred embodiment and coordinating following schemes, structure of the present utility model and technical characteristic thereof being described in detail as rear (illustrate at this, Fig. 1 ~ 5 are schematic diagram but not the size of reality or ratio):
As shown in Figure 2, the electric connection structure between the positive back side of chip that provides of the utility model comprises chip 10 and an one plane type flexible circuit board (FPC) 20.This chip 10 can be an identification of fingerprint chip, and this active region (activearea) can be an identification of fingerprint induction effect district (sensoractivearea) but do not limit.The front 11 of this chip 10 is provided with multiple crystalline substance pad (diepad) 110 and at least one active region (sensoractivearea) 111 (as identification of fingerprint induction effect district), as shown in Figure 1.In FIG, the front 11 of this chip 10 is provided with the crystalline substance pad (diepad) 110 of a lateral edges 13 of four these chips 10 close and is arranged in a row, but does not limit, and therefore only display one is brilliant in fig. 2 pads (diepad) 110.Again for chip 10 explanation in Fig. 1, this chip 10 is an identification of fingerprint chip, this active region 111 is an identification of fingerprint induction effect district (sensoractivearea), larger area on its front 11 occupying this chip 10, in order to externally to respond to a fingermark image, fingermark image finger presses produced on the surface of this active region 111 as responded to also converts electronic signal to, (diepad) 110 are padded with the printed circuit board (PCB) 50 electronic signal transmission extremely connected, for carrying out identification again by those crystalline substances.
As shown in Figure 2, but the size shown in Fig. 2 and ratio are also not used to limit the utility model, this one plane type flexible circuit board 20 can adopt a long rectangle flexible circuit board, and has predetermined circuit design according to using needs, and it has first surface 21 and a second surface 22; A part for this one plane type flexible circuit board 20, front section as shown in Figure 2, be cemented on the front 11 of this chip 10, be bent around this chip 10 1 lateral edges to extend to the back side 12 of this chip 10 by the front 11 of this chip 10 again, afterwards again reflexed once to be positioned on the back side 12 of this chip 10; Wherein this one plane type flexible circuit board 20 needs the whole of the back side 12 covering this chip 10, as shown in Figure 2 but do not limit, namely this one plane type flexible circuit board 20 also viewable design need and cover the part at the back side 12 of this chip 10.
This one plane type flexible circuit board 20 has first surface 21 and a second surface 22, but on this first surface 21, be only provided with multiple first connection gasket 210 and multiple second connection gasket 211 of connecting corresponding to each first connection gasket respectively.The plurality of first connection gasket 210 is in order to correspond respectively to multiple crystalline substance pad (diepad) 110 set on the front 11 of this chip 10.The plurality of second connection gasket 211 is connected with on a printed circuit board (PCB) 50, each contact of institute's preinstalled circuit is corresponding respectively by the single sided circuits of this one plane type flexible circuit board 20, to make this chip 10 be arranged on this printed circuit board (PCB) 50 by the plurality of second connection gasket 211, to realize being electrically connected.Corresponding annexation between the plurality of second connection gasket 211 with the plurality of first connection gasket 210 is based upon in the circuit design of this one plane type flexible circuit board 20, be utilize existing circuit board line designing technique to reach for the utility model, therefore do not repeat them here.
Illustrate for Fig. 2 or Fig. 3 C-3D, on the same surface that the plurality of first connection gasket 210 separates a segment distance with the plurality of second connection gasket 211 and is located at this one plane type flexible circuit board 20 and first surface 21, as shown in Fig. 3 C-3D, its lay respectively at length near this long rectangle one plane type flexible circuit board 20 to (front and back to) two opposite end places a separately segment distance, as the plurality of first connection gasket 210 and the plurality of second connection gasket 211 lay respectively at front section and the hindfoot portion of this one plane type flexible circuit board 20, but do not limit, the front section of this one plane type flexible circuit board 20 so can be made to drop on the front 11 of this chip 10, and make this one plane type flexible circuit board 20 can be bent around this chip 10 1 lateral edges 13 to extend to the back side 12 of this chip 10 by the front 11 of this chip 10, be covered on this back side 12 to make the stage casing part of its first surface 21 stick together, reflexed is once more afterwards, can stick together to make the hindfoot portion of its second surface 22 in the stage casing part being covered on the second surface 22 be covered on this back side 12, and then make the hindfoot portion of this first surface 21 can be positioned on the back side 12 of this chip 10, be located at by this and defaultly on printed circuit board (PCB) 50 that multiple second connection gaskets 211 on the hindfoot portion of this first surface 21 can be used in combination with one respectively expose that contact is corresponding to be connected, as denoted by the arrow a in figure 2, to be arranged on by the plurality of second connection gasket 211 set by this one plane type flexible circuit board 20 on this printed circuit board (PCB) 50 to make this chip 10 and to realize being electrically connected.As for design or the corresponding method of attachment that adopts of this printed circuit board (PCB), in the utility model, be considered as prior art, therefore separately do not illustrate again.
In addition, as shown in Figure 2, before multiple first connection gasket 210 set on the first surface 21 of this one plane type flexible circuit board 20 and the multiple crystalline substances set by the front 11 of this chip 10 pad that (diepad) 110 is corresponding and connect, a chemical nickel layer gold (ENIG, electrolessnickel/immersiongold) 30 first can be established in the surface of each crystalline substance pad (diepad) 110 but do not limit; This chemical nickel layer gold (ENIG) 30 for preventing each crystalline substance pad (diepad) 110 oxidation, and can be promoted this first connection gasket 210 and ties joint efficiency with the crystalline substance weldering of padding between (diepad) 110.
In addition, as shown in Fig. 2, Fig. 3 C-3D, at the predeterminable mucigel 40 in the part appropriate position, stage casing of the first surface 21 of this one plane type flexible circuit board 20, as two-sided gum, but do not limit, when extending to the back side 12 of this chip 10 to make this one plane type flexible circuit board 20 be bent around this chip 10 1 lateral edges 13 by the front 11 of this chip 10, the stage casing part of the first surface 21 of this one plane type flexible circuit board 20 can be sticked together by this mucigel 40 be covered in this chip 10 lateral edges 13 and the back side 12 on.
In addition, as Fig. 2, shown in Fig. 3 C-3D, a predeterminable mucigel 40 in the hindfoot portion appropriate position of the second surface 21 of this one plane type flexible circuit board 20, as two-sided gum, but do not limit, with make the stage casing part of the first surface 21 of this one plane type flexible circuit board 20 after sticking together on the back side 12 being covered in this chip 10 and again reflexed one time time, the hindfoot portion of this second surface 22 namely stick together by this mucigel 40 be covered on the second surface 22 be covered on this back side 12 stage casing part on, and then multiple second connection gaskets 211 of the hindfoot portion being located at this first surface 21 can be positioned on this back side 12.
In addition, compared with electric connection structure between the positive back side of the chip that the utility model provides connects (wirebond) mode with existing employing wire, the surface area that chip 10 in the utility model encapsulates, illustrate for the width shown in Fig. 2 at this, the width of this chip 10 adds that the width of mucigel 40 and the width of one plane type flexible circuit board 20 can reduce effectively; Even with adopt compared with two plane type FPC (FPC two-sided on be all provided with circuit layer and connection gasket) connected mode, width because of one plane type flexible circuit board 20 originally just at least reduces circuit layer and the connection gasket of one side compared with two plane type FPC, therefore the surface area (width) that the chip 10 in the utility model encapsulates also reduces relatively, width as outwards increased by the lateral edges 13 of this chip is equal to or less than 120 μm as shown in Figure 2, is conducive to making the utility model reach light, thin, short and small requirement in the application of the art.
The manufacture method of the electric connection structure between the positive back side of the chip that the utility model provides comprises the following step:
Step 1 a: chip 10 is provided, as shown in Figure 3A, the front 11 of this chip 10 is provided with multiple crystalline substance pad 110 and at least one active region 111; Each crystalline substance pad 110 predeterminable chemical nickel layer gold (ENIG) 30 again, as shown in Figure 3 B.
Step 2: an one plane type flexible circuit board 20 is provided, as shown in Figure 3 C, this one plane type flexible circuit board 20 has first surface 21 and a second surface 22, this first surface 21 is provided with the first connection gasket 210 of multiple crystalline substance pad 110 corresponding to this chip 10 and multiple second connection gasket 211 of connecting corresponding to each first connection gasket 210 respectively, the plurality of first connection gasket 210 corresponds respectively to the plurality of crystalline substance pad 110, the plurality of second connection gasket 211 in order to one with the use of printed circuit board (PCB) (50) on each contact of institute's preinstalled circuit is corresponding connects, be arranged on this printed circuit board (PCB) (50) to realize being electrically connected by the plurality of second connection gasket 211 to make this chip 10, wherein, appropriate position on the first surface 21 and second surface 22 of this one plane type flexible circuit board 20, as the stage casing part of the first surface 21 at this one plane type flexible circuit board 20 and the hindfoot portion appropriate position of second surface 21, a predeterminable mucigel 40, as two-sided gum, as shown in Fig. 3 C, 3D, paste operation in order to follow-up sticking together.
Step 3: each crystalline substance that each first connection gasket 210 correspondence set on the first surface 21 of this one plane type flexible circuit board 20 is electrically connected on the front 11 of this chip 10 is padded in 110 or its chemical nickel layer gold (ENIG) 30, as shown in Fig. 3 C, 3D.
Step 4: as Fig. 2, shown in Fig. 3 D-3E, this one plane type flexible circuit board 20 is bent and walks around this chip 10 1 lateral edges 13 to extend on the back side 12 of this chip 10, and the stage casing part of the first surface 21 of this one plane type flexible circuit board 20 is sticked together paste (as utilized this mucigel 40) on this back side 12, reflexed is once more afterwards, the hindfoot portion of this second surface 22 can be sticked together and paste (as utilized this mucigel 40) in the stage casing part being covered in the second surface 22 on this back side 12, and then make the hindfoot portion of this first surface 21 can be positioned on the back side 12 of this chip 10, by this, each second connection gasket 211 set by making on the first surface 21 of this one plane type flexible circuit board 20 can facing to outer (as denoted by the arrow a in figure 2), for matching on printed circuit board (PCB) 50 by subsequent job to be electrically connected and to be arranged on one, the using function of this chip 10 is reached, as the finger print identification function of identification of fingerprint chip to make active region 111 set on the front 11 of this chip 10 that this printed circuit board (PCB) 50 can be coordinated to use.
In addition, as shown in Figure 4, the surface of this active region 111 is arranged further a high-transmittance dielectric layer 60, in order to protect this active region 111 and not affect its using function; As shown in Figure 4, this high-transmittance dielectric layer 60 is arranged on the front 11 of this chip 10, in order to screen this active region 111 but expose chemical nickel layer gold (ENIG) 30 set on each crystalline substance pad (diepad) 110 and/or each crystalline substance pad (diepad) 110 comprehensively.
In addition, the height of high-transmittance dielectric layer 60 set in this induction effect district 111 in the diagram drops on height on the front 11 of this chip 10 surface of the second surface 22 of this one plane type flexible circuit board 20 (namely in Fig. 4,5) further and flushes with this one plane type flexible circuit board 20, as shown in Figure 5, to make the front 11 of this chip 10 form same plane, to meet this chip 10 as the assembling needs of identification of fingerprint chip in practical application.
The foregoing is only preferred embodiment of the present utility model, is only illustrative for the utility model, and nonrestrictive; Those of ordinary skill in the art understand, and can carry out many changes in the spirit and scope that the utility model claim limits to it, amendment, and even equivalence is changed, but all will fall in protection range of the present utility model.
Claims (7)
1. the electric connection structure between the positive back side of chip, is characterized in that, comprise:
One chip, its front is provided with multiple crystalline substance pads and at least one active region; And
One one plane type flexible circuit board, it has a first surface and a second surface, this first surface is provided with multiple first connection gasket and multiple second connection gasket, multiple first connection gasket is for each crystalline substance pad corresponded respectively to set by this chip front side, multiple second connection gasket connects for corresponding with each first connection gasket respectively, wherein the plurality of second connection gasket is in order to be connected respectively with the contact that respectively exposes of default circuit on a printed circuit board (PCB) be used in combination, to be arranged on by the plurality of second connection gasket set by this one plane type flexible circuit board on this printed circuit board (PCB) to make this chip and to realize being electrically connected,
Wherein, this one plane type flexible circuit board by this chip front and walk around this chip one lateral edges to extend to the back side of this chip and to stick together and be covered on this back side, and again reflexed once to be positioned on the back side of this chip, set each second connection gasket is made on this first surface to be electrically connected and to install on a printed circuit, to make setly in chip front side each brilliantly to pad the back side that moves to chip by this one plane type flexible circuit board and facing to outward for being electrically connected and being arranged on this printed circuit board (PCB).
2. the electric connection structure between the positive back side of chip according to claim 1, is characterized in that, this chip is an identification of fingerprint chip and its front is provided with an identification of fingerprint induction effect district.
3. the electric connection structure between the positive back side of chip according to claim 1, it is characterized in that, the plurality of first connection gasket separates a segment distance with the plurality of second connection gasket, and the plurality of first connection gasket is located on the first surface of this one plane type flexible circuit board, wherein the plurality of first connection gasket is positioned at the front section of this one plane type flexible circuit board, and the plurality of second connection gasket is positioned at the hindfoot portion of this one plane type flexible circuit board.
4. the electric connection structure between the positive back side of chip according to claim 1, it is characterized in that, a mucigel is preset with in the stage casing part of the first surface of this one plane type flexible circuit board and the hindfoot portion of second surface, with make this one plane type flexible circuit plate benging and walk around this chip one lateral edges with on the back side extending to this chip time, the stage casing part of this first surface by this mucigel with stick together be covered in this chip lateral edges and the back side on, afterwards when reflexed one time, the hindfoot portion of this second surface is covered in the stage casing part of the second surface be covered on this back side by this mucigel to stick together, and then the hindfoot portion of this first surface is positioned on the back side of this chip.
5. the electric connection structure between the positive back side of chip according to claim 1, is characterized in that, the upper surface of the active region set by this chip front side arranges a high-transmittance dielectric layer further.
6. the electric connection structure between the positive back side of chip according to claim 5, is characterized in that, on the front that this high-transmittance dielectric layer is arranged on this chip and this active region but expose each crystalline substance pad of screening completely.
7. the electric connection structure between the positive back side of chip according to claim 5, it is characterized in that, the height that the height of high-transmittance dielectric layer set on this active region drops on the front of this chip with this one plane type flexible circuit board further flushes, and forms a plane to make the front of this chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520827508.9U CN205177820U (en) | 2015-10-23 | 2015-10-23 | Electric connection structure between positive back of chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520827508.9U CN205177820U (en) | 2015-10-23 | 2015-10-23 | Electric connection structure between positive back of chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205177820U true CN205177820U (en) | 2016-04-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520827508.9U Withdrawn - After Issue CN205177820U (en) | 2015-10-23 | 2015-10-23 | Electric connection structure between positive back of chip |
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| Country | Link |
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| CN (1) | CN205177820U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017066896A1 (en) * | 2015-10-23 | 2017-04-27 | 璩泽明 | Electrical connection structure between the front and rear of a chip, and manufacturing method therefor |
| CN106611752A (en) * | 2015-10-23 | 2017-05-03 | 茂邦电子有限公司 | An electrical connection structure between the front and back surfaces of a chip and a method of manufacturing the same |
| WO2018072050A1 (en) * | 2016-10-19 | 2018-04-26 | 璩泽明 | Chip packaging structure |
-
2015
- 2015-10-23 CN CN201520827508.9U patent/CN205177820U/en not_active Withdrawn - After Issue
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017066896A1 (en) * | 2015-10-23 | 2017-04-27 | 璩泽明 | Electrical connection structure between the front and rear of a chip, and manufacturing method therefor |
| CN106611752A (en) * | 2015-10-23 | 2017-05-03 | 茂邦电子有限公司 | An electrical connection structure between the front and back surfaces of a chip and a method of manufacturing the same |
| CN106611752B (en) * | 2015-10-23 | 2019-06-18 | 茂邦电子有限公司 | Electric connection structure and its manufacturing method between the positive back side of chip |
| WO2018072050A1 (en) * | 2016-10-19 | 2018-04-26 | 璩泽明 | Chip packaging structure |
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