CN109321879B - 蒸镀掩模 - Google Patents

蒸镀掩模 Download PDF

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Publication number
CN109321879B
CN109321879B CN201810834458.5A CN201810834458A CN109321879B CN 109321879 B CN109321879 B CN 109321879B CN 201810834458 A CN201810834458 A CN 201810834458A CN 109321879 B CN109321879 B CN 109321879B
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CN
China
Prior art keywords
frame
vapor deposition
mask
layer
frame body
Prior art date
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CN201810834458.5A
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English (en)
Chinese (zh)
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CN109321879A (zh
Inventor
石川树一郎
田丸裕仁
小林良弘
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Maxell Ltd
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Maxell Ltd
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Publication of CN109321879A publication Critical patent/CN109321879A/zh
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
  • Outer Garments And Coats (AREA)
CN201810834458.5A 2017-07-31 2018-07-26 蒸镀掩模 Active CN109321879B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2017-148250 2017-07-31
JP2017148250 2017-07-31
JP2017191494A JP7067889B2 (ja) 2017-07-31 2017-09-29 蒸着マスク
JP2017-191494 2017-09-29

Publications (2)

Publication Number Publication Date
CN109321879A CN109321879A (zh) 2019-02-12
CN109321879B true CN109321879B (zh) 2022-06-10

Family

ID=65264087

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810834458.5A Active CN109321879B (zh) 2017-07-31 2018-07-26 蒸镀掩模

Country Status (4)

Country Link
JP (5) JP7067889B2 (https=)
KR (1) KR102702151B1 (https=)
CN (1) CN109321879B (https=)
TW (1) TWI791549B (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7233954B2 (ja) * 2019-02-19 2023-03-07 株式会社ジャパンディスプレイ 蒸着マスク
JP7122278B2 (ja) * 2019-03-15 2022-08-19 マクセル株式会社 蒸着マスクおよびその製造方法
JP7449485B2 (ja) * 2019-03-28 2024-03-14 大日本印刷株式会社 蒸着マスク及び蒸着マスクの製造方法
JP7473298B2 (ja) * 2019-03-29 2024-04-23 マクセル株式会社 蒸着マスク
JP7249863B2 (ja) * 2019-04-26 2023-03-31 キヤノントッキ株式会社 マスク、マスクの製造方法および電子デバイスの製造方法
KR102187007B1 (ko) * 2020-02-26 2020-12-04 주식회사 핌스 평탄도가 개선된 박막 증착용 마스크 조립체 및 그 제조 방법
WO2025225401A1 (ja) * 2024-04-23 2025-10-30 大日本印刷株式会社 メタルマスク及びその製造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002371349A (ja) * 2001-06-19 2002-12-26 Optonix Seimitsu:Kk 蒸着用マスク
JP2004349086A (ja) * 2003-05-21 2004-12-09 Kyushu Hitachi Maxell Ltd 有機ｅｌ素子用の蒸着マスクとその製造方法
JP2006244746A (ja) * 2005-03-01 2006-09-14 Kyocera Corp マスク構造体およびそれを用いた蒸着方法、並びに有機発光素子の製造方法
JP2010222687A (ja) * 2009-03-25 2010-10-07 Seiko Epson Corp 成膜用マスク
CN102174688A (zh) * 2003-04-10 2011-09-07 株式会社半导体能源研究所 掩模、容器和制造装置
CN103154300A (zh) * 2010-09-29 2013-06-12 夏普株式会社 蒸镀装置
CN105385990A (zh) * 2012-01-12 2016-03-09 大日本印刷株式会社 拼版蒸镀掩模的制造方法及有机半导体元件的制造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4046269B2 (ja) * 2001-05-24 2008-02-13 九州日立マクセル株式会社 有機ｅｌ素子用蒸着マスクと有機ｅｌ素子用蒸着マスクの製造方法
JP2003231964A (ja) * 2001-12-05 2003-08-19 Toray Ind Inc 蒸着マスクおよびその製造方法並びに有機電界発光装置およびその製造方法
KR100534580B1 (ko) * 2003-03-27 2005-12-07 삼성에스디아이 주식회사 표시장치용 증착 마스크 및 그의 제조방법
JP4369199B2 (ja) 2003-06-05 2009-11-18 九州日立マクセル株式会社 蒸着マスクとその製造方法
JP2005105406A (ja) * 2003-09-10 2005-04-21 Nippon Seiki Co Ltd 蒸着用マスク
JP2005232474A (ja) * 2004-02-17 2005-09-02 Dainippon Screen Mfg Co Ltd 蒸着用マスク
JP2007270289A (ja) * 2006-03-31 2007-10-18 Canon Inc 成膜用マスク
JP4677363B2 (ja) * 2006-04-07 2011-04-27 九州日立マクセル株式会社 蒸着マスクおよびその製造方法
JP2008196002A (ja) * 2007-02-13 2008-08-28 Seiko Epson Corp 蒸着マスクおよび蒸着マスクの製造方法
JP5751810B2 (ja) * 2010-11-26 2015-07-22 日立マクセル株式会社 メタルマスクの製造方法、枠部材及びその製造方法
JP5382259B1 (ja) * 2013-01-10 2014-01-08 大日本印刷株式会社 金属板、金属板の製造方法、および金属板を用いて蒸着マスクを製造する方法
CN114774854B (zh) * 2015-02-10 2024-09-06 大日本印刷株式会社 金属板以及蒸镀掩模的制造方法
KR20170059526A (ko) * 2015-11-20 2017-05-31 삼성디스플레이 주식회사 마스크 프레임 조립체, 마스크 프레임 조립체 제조 방법 및 표시 장치 제조 방법
JP6624504B2 (ja) * 2015-12-03 2019-12-25 大日本印刷株式会社 蒸着マスク及び蒸着マスクの製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002371349A (ja) * 2001-06-19 2002-12-26 Optonix Seimitsu:Kk 蒸着用マスク
CN102174688A (zh) * 2003-04-10 2011-09-07 株式会社半导体能源研究所 掩模、容器和制造装置
JP2004349086A (ja) * 2003-05-21 2004-12-09 Kyushu Hitachi Maxell Ltd 有機ｅｌ素子用の蒸着マスクとその製造方法
JP2006244746A (ja) * 2005-03-01 2006-09-14 Kyocera Corp マスク構造体およびそれを用いた蒸着方法、並びに有機発光素子の製造方法
JP2010222687A (ja) * 2009-03-25 2010-10-07 Seiko Epson Corp 成膜用マスク
CN103154300A (zh) * 2010-09-29 2013-06-12 夏普株式会社 蒸镀装置
CN105385990A (zh) * 2012-01-12 2016-03-09 大日本印刷株式会社 拼版蒸镀掩模的制造方法及有机半导体元件的制造方法

Also Published As

Publication number Publication date
JP7067889B2 (ja) 2022-05-16
TW201911622A (zh) 2019-03-16
JP2023126306A (ja) 2023-09-07
JP7470734B2 (ja) 2024-04-18
CN109321879A (zh) 2019-02-12
KR20190013534A (ko) 2019-02-11
JP2024097027A (ja) 2024-07-17
JP7846721B2 (ja) 2026-04-15
KR102702151B1 (ko) 2024-09-04
JP2019026926A (ja) 2019-02-21
JP2022103212A (ja) 2022-07-07
TWI791549B (zh) 2023-02-11
JP2025023270A (ja) 2025-02-14

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