CN1092397C - 高性能低成本的多芯片组件封装件 - Google Patents

高性能低成本的多芯片组件封装件 Download PDF

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Publication number
CN1092397C
CN1092397C CN97118489A CN97118489A CN1092397C CN 1092397 C CN1092397 C CN 1092397C CN 97118489 A CN97118489 A CN 97118489A CN 97118489 A CN97118489 A CN 97118489A CN 1092397 C CN1092397 C CN 1092397C
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CN
China
Prior art keywords
chip
substrate
fin
integrated circuit
interconnection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN97118489A
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English (en)
Chinese (zh)
Other versions
CN1180927A (zh
Inventor
丹尼斯·F·克劳彻尔
格伦·G·戴维斯
比德·M·伊莱纽斯
约塞夫·J·里索夫斯基
约塞夫·M·萨利文
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International Business Machines Corp
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International Business Machines Corp
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Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of CN1180927A publication Critical patent/CN1180927A/zh
Application granted granted Critical
Publication of CN1092397C publication Critical patent/CN1092397C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Wire Bonding (AREA)
  • Combinations Of Printed Boards (AREA)
CN97118489A 1996-10-17 1997-09-16 高性能低成本的多芯片组件封装件 Expired - Fee Related CN1092397C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/733,154 US5838545A (en) 1996-10-17 1996-10-17 High performance, low cost multi-chip modle package
US733154 1996-10-17
US733,154 1996-10-17

Publications (2)

Publication Number Publication Date
CN1180927A CN1180927A (zh) 1998-05-06
CN1092397C true CN1092397C (zh) 2002-10-09

Family

ID=24946448

Family Applications (1)

Application Number Title Priority Date Filing Date
CN97118489A Expired - Fee Related CN1092397C (zh) 1996-10-17 1997-09-16 高性能低成本的多芯片组件封装件

Country Status (7)

Country Link
US (1) US5838545A (ko)
KR (1) KR100269528B1 (ko)
CN (1) CN1092397C (ko)
HK (1) HK1008616A1 (ko)
MY (1) MY116972A (ko)
SG (1) SG66391A1 (ko)
TW (1) TW338839B (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101065843B (zh) * 2004-11-26 2010-08-18 伊姆贝拉电子有限公司 制造电子模块的方法
CN101785102B (zh) * 2007-09-13 2012-04-11 欧姆龙株式会社 具有发热部的装置

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US6323549B1 (en) * 1996-08-29 2001-11-27 L. Pierre deRochemont Ceramic composite wiring structures for semiconductor devices and method of manufacture
JP3173410B2 (ja) * 1997-03-14 2001-06-04 松下電器産業株式会社 パッケージ基板およびその製造方法
US6105851A (en) * 1998-08-07 2000-08-22 Unisys Corp Method of casting I/O columns on an electronic component with a high yield
US6329713B1 (en) * 1998-10-21 2001-12-11 International Business Machines Corporation Integrated circuit chip carrier assembly comprising a stiffener attached to a dielectric substrate
FR2789541B1 (fr) 1999-02-05 2001-03-16 Novatec Sa Soc Procede de realisation de modules electroniques a connecteur a billes ou a preformes integre brasables sur circuit imprime et dispositif de mise en oeuvre
US6882045B2 (en) * 1999-10-28 2005-04-19 Thomas J. Massingill Multi-chip module and method for forming and method for deplating defective capacitors
US20030202306A1 (en) * 2002-02-26 2003-10-30 International Rectifier Corporation Heat sink for semiconductor die employing phase change cooling
CN100401485C (zh) * 2002-06-26 2008-07-09 威宇科技测试封装有限公司 一种能提高多芯片封装合格率的封装方法
US7070341B2 (en) * 2002-10-02 2006-07-04 Emcore Corporation High-density fiber-optic module with multi-fold flexible circuit
FI20031341A (fi) 2003-09-18 2005-03-19 Imbera Electronics Oy Menetelmä elektroniikkamoduulin valmistamiseksi
US7462942B2 (en) * 2003-10-09 2008-12-09 Advanpack Solutions Pte Ltd Die pillar structures and a method of their formation
FI117814B (fi) * 2004-06-15 2007-02-28 Imbera Electronics Oy Menetelmä elektroniikkamoduulin valmistamiseksi
US7434308B2 (en) * 2004-09-02 2008-10-14 International Business Machines Corporation Cooling of substrate using interposer channels
FI119714B (fi) * 2005-06-16 2009-02-13 Imbera Electronics Oy Piirilevyrakenne ja menetelmä piirilevyrakenteen valmistamiseksi
FI122128B (fi) * 2005-06-16 2011-08-31 Imbera Electronics Oy Menetelmä piirilevyrakenteen valmistamiseksi
US8225499B2 (en) 2005-06-16 2012-07-24 Imbera Electronics Oy Method for manufacturing a circuit board structure, and a circuit board structure
US20070290333A1 (en) * 2006-06-16 2007-12-20 Intel Corporation Chip stack with a higher power chip on the outside of the stack
KR200447795Y1 (ko) * 2008-10-31 2010-02-19 노상섭 차량용 보조발판
JP5672305B2 (ja) * 2010-08-27 2015-02-18 株式会社村田製作所 半導体装置
TWI446495B (zh) * 2011-01-19 2014-07-21 Subtron Technology Co Ltd 封裝載板及其製作方法
JP5747737B2 (ja) * 2011-08-26 2015-07-15 三菱電機株式会社 半導体装置とその製造方法
US9136236B2 (en) 2012-09-28 2015-09-15 Intel Corporation Localized high density substrate routing
US9190380B2 (en) 2012-12-06 2015-11-17 Intel Corporation High density substrate routing in BBUL package
US9159690B2 (en) 2013-09-25 2015-10-13 Intel Corporation Tall solders for through-mold interconnect
US9349703B2 (en) * 2013-09-25 2016-05-24 Intel Corporation Method for making high density substrate interconnect using inkjet printing
US10896861B2 (en) * 2019-04-22 2021-01-19 Raytheon Company Heterogeneous multi-layer MMIC assembly
CN110386586A (zh) * 2019-08-16 2019-10-29 中电科技集团重庆声光电有限公司 一种光电隔离通用片式can总线微系统封装结构

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US4796077A (en) * 1986-08-13 1989-01-03 Hitachi, Ltd. Electrical insulating, sintered aluminum nitride body having a high thermal conductivity and process for preparing the same
US4989117A (en) * 1990-02-12 1991-01-29 Rogers Corporation Molded integrated circuit package incorporating thin decoupling capacitor
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101065843B (zh) * 2004-11-26 2010-08-18 伊姆贝拉电子有限公司 制造电子模块的方法
CN101785102B (zh) * 2007-09-13 2012-04-11 欧姆龙株式会社 具有发热部的装置

Also Published As

Publication number Publication date
KR19980032206A (ko) 1998-07-25
MY116972A (en) 2004-04-30
KR100269528B1 (ko) 2000-10-16
US5838545A (en) 1998-11-17
CN1180927A (zh) 1998-05-06
HK1008616A1 (en) 1999-05-14
SG66391A1 (en) 1999-07-20
TW338839B (en) 1998-08-21

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Granted publication date: 20021009

Termination date: 20091016