CN109119521A - 一种用于led管芯备胶作业的自动化机器 - Google Patents
一种用于led管芯备胶作业的自动化机器 Download PDFInfo
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- CN109119521A CN109119521A CN201810966034.4A CN201810966034A CN109119521A CN 109119521 A CN109119521 A CN 109119521A CN 201810966034 A CN201810966034 A CN 201810966034A CN 109119521 A CN109119521 A CN 109119521A
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- 239000003292 glue Substances 0.000 title claims abstract description 32
- 239000000463 material Substances 0.000 claims abstract description 94
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- 238000000034 method Methods 0.000 claims abstract description 36
- 238000007599 discharging Methods 0.000 claims description 26
- 238000009434 installation Methods 0.000 claims description 16
- 230000001105 regulatory effect Effects 0.000 claims description 16
- 230000001681 protective effect Effects 0.000 claims description 13
- 230000007246 mechanism Effects 0.000 claims description 12
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- 238000010168 coupling process Methods 0.000 claims description 9
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- 230000000903 blocking effect Effects 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims description 3
- 241000233855 Orchidaceae Species 0.000 claims 1
- 230000008569 process Effects 0.000 abstract description 34
- 241001133184 Colletotrichum agaves Species 0.000 abstract description 10
- 230000000694 effects Effects 0.000 abstract description 10
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- 230000008859 change Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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Abstract
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Priority Applications (1)
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CN201810966034.4A CN109119521B (zh) | 2018-08-23 | 2018-08-23 | 一种用于led管芯备胶作业的自动化机器 |
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CN201810966034.4A CN109119521B (zh) | 2018-08-23 | 2018-08-23 | 一种用于led管芯备胶作业的自动化机器 |
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CN109119521A true CN109119521A (zh) | 2019-01-01 |
CN109119521B CN109119521B (zh) | 2020-01-07 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111097651A (zh) * | 2020-01-16 | 2020-05-05 | 鲍合祥 | 一种电镀锡处理用涂油装置 |
CN113013069A (zh) * | 2021-03-03 | 2021-06-22 | 万博汇电子实业(定南)有限公司 | 一种玻封二极管加工用端子自动装载设备 |
CN115020282A (zh) * | 2022-05-26 | 2022-09-06 | 先之科半导体科技(东莞)有限公司 | 一种具有高效上料功能的二极管封装设备 |
Citations (10)
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JPH08264092A (ja) * | 1995-01-27 | 1996-10-11 | Fuji Electric Co Ltd | リレーターミナル |
US6179031B1 (en) * | 1997-10-08 | 2001-01-30 | Leybold Systems Gmbh | Process for the adhesion of a flat plastic substrate in the form of a circular disk to a like second substrate for a digital video disc and apparatus for implementation of the process |
US20010045811A1 (en) * | 2000-05-26 | 2001-11-29 | Agency Of Industrial Science & Technology, Ministry Of International Trade & Industry | Slider mechanism and method of driving the same |
CN104009134A (zh) * | 2014-05-29 | 2014-08-27 | 华南理工大学 | 一种led基板和透镜键合、热压和注胶一体化设备 |
CN203941942U (zh) * | 2014-05-29 | 2014-11-12 | 华南理工大学 | 一种led基板和透镜键合、热压和注胶一体化设备 |
CN106252487A (zh) * | 2016-09-08 | 2016-12-21 | 东莞市凯昶德电子科技股份有限公司 | Led支架全自动喷墨机 |
CN207271545U (zh) * | 2017-08-31 | 2018-04-27 | 苏州汉基视测控设备有限公司 | 一种点胶机自动送料系统 |
CN108231975A (zh) * | 2017-12-27 | 2018-06-29 | 杭州大晨显示技术有限公司 | 一种led高效封装系统 |
CN108328315A (zh) * | 2018-03-27 | 2018-07-27 | 杭州爵沸网络科技有限公司 | 一种工业夹持输送设备 |
CN108328377A (zh) * | 2018-03-27 | 2018-07-27 | 杭州爵沸网络科技有限公司 | 一种机械化夹持输送环保设备 |
-
2018
- 2018-08-23 CN CN201810966034.4A patent/CN109119521B/zh active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08264092A (ja) * | 1995-01-27 | 1996-10-11 | Fuji Electric Co Ltd | リレーターミナル |
US6179031B1 (en) * | 1997-10-08 | 2001-01-30 | Leybold Systems Gmbh | Process for the adhesion of a flat plastic substrate in the form of a circular disk to a like second substrate for a digital video disc and apparatus for implementation of the process |
US20010045811A1 (en) * | 2000-05-26 | 2001-11-29 | Agency Of Industrial Science & Technology, Ministry Of International Trade & Industry | Slider mechanism and method of driving the same |
CN104009134A (zh) * | 2014-05-29 | 2014-08-27 | 华南理工大学 | 一种led基板和透镜键合、热压和注胶一体化设备 |
CN203941942U (zh) * | 2014-05-29 | 2014-11-12 | 华南理工大学 | 一种led基板和透镜键合、热压和注胶一体化设备 |
CN106252487A (zh) * | 2016-09-08 | 2016-12-21 | 东莞市凯昶德电子科技股份有限公司 | Led支架全自动喷墨机 |
CN207271545U (zh) * | 2017-08-31 | 2018-04-27 | 苏州汉基视测控设备有限公司 | 一种点胶机自动送料系统 |
CN108231975A (zh) * | 2017-12-27 | 2018-06-29 | 杭州大晨显示技术有限公司 | 一种led高效封装系统 |
CN108328315A (zh) * | 2018-03-27 | 2018-07-27 | 杭州爵沸网络科技有限公司 | 一种工业夹持输送设备 |
CN108328377A (zh) * | 2018-03-27 | 2018-07-27 | 杭州爵沸网络科技有限公司 | 一种机械化夹持输送环保设备 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111097651A (zh) * | 2020-01-16 | 2020-05-05 | 鲍合祥 | 一种电镀锡处理用涂油装置 |
CN113013069A (zh) * | 2021-03-03 | 2021-06-22 | 万博汇电子实业(定南)有限公司 | 一种玻封二极管加工用端子自动装载设备 |
CN113013069B (zh) * | 2021-03-03 | 2022-12-23 | 日照鲁光电子科技有限公司 | 一种玻封二极管加工用端子自动装载设备 |
CN115020282A (zh) * | 2022-05-26 | 2022-09-06 | 先之科半导体科技(东莞)有限公司 | 一种具有高效上料功能的二极管封装设备 |
CN115020282B (zh) * | 2022-05-26 | 2023-02-14 | 先之科半导体科技(东莞)有限公司 | 一种具有高效上料功能的二极管封装设备 |
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Effective date of registration: 20210209 Address after: 102200 423, 4 / F, block a, Xinhua future city building, 175 Litang Road, Changping District, Beijing Patentee after: Li Qiannan Address before: 325041 No.6, Shanghui village new street, Louqiao street, Ouhai District, Wenzhou City, Zhejiang Province Patentee before: Guo Jiachuan |
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Effective date of registration: 20220113 Address after: 102200 423, 4 / F, block a, Xinhua future city building, 175 Litang Road, Changping District, Beijing Patentee after: Li Gang Address before: No. 46, Meixi new village, Meicheng Town, Minqing County, Fuzhou City, Fujian Province 350800 Patentee before: Fuzhou Jingyi Agricultural Comprehensive Development Co.,Ltd. |
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