CN109030624B - 缺陷检测方法以及缺陷检测装置 - Google Patents

缺陷检测方法以及缺陷检测装置 Download PDF

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Publication number
CN109030624B
CN109030624B CN201810601368.1A CN201810601368A CN109030624B CN 109030624 B CN109030624 B CN 109030624B CN 201810601368 A CN201810601368 A CN 201810601368A CN 109030624 B CN109030624 B CN 109030624B
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elastic wave
defect
wave
inspected
displacement
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CN109030624A (zh
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畠堀贵秀
长田侑也
田窪健二
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Shimadzu Corp
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Shimadzu Corp
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/045—Analysing solids by imparting shocks to the workpiece and detecting the vibrations or the acoustic waves caused by the shocks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02094—Speckle interferometers, i.e. for detecting changes in speckle pattern
    • G01B9/02095—Speckle interferometers, i.e. for detecting changes in speckle pattern detecting deformation from original shape
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02097—Self-interferometers
    • G01B9/02098—Shearing interferometers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/41—Refractivity; Phase-affecting properties, e.g. optical path length
    • G01N21/45—Refractivity; Phase-affecting properties, e.g. optical path length using interferometric methods; using Schlieren methods
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/44—Processing the detected response signal, e.g. electronic circuits specially adapted therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/44—Processing the detected response signal, e.g. electronic circuits specially adapted therefor
    • G01N29/48—Processing the detected response signal, e.g. electronic circuits specially adapted therefor by amplitude comparison
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/41—Refractivity; Phase-affecting properties, e.g. optical path length
    • G01N21/45—Refractivity; Phase-affecting properties, e.g. optical path length using interferometric methods; using Schlieren methods
    • G01N2021/458—Refractivity; Phase-affecting properties, e.g. optical path length using interferometric methods; using Schlieren methods using interferential sensor, e.g. sensor fibre, possibly on optical waveguide

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Acoustics & Sound (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
CN201810601368.1A 2017-06-12 2018-06-12 缺陷检测方法以及缺陷检测装置 Active CN109030624B (zh)

Applications Claiming Priority (2)

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JP2017-115398 2017-06-12
JP2017115398A JP6791029B2 (ja) 2017-06-12 2017-06-12 欠陥検出方法及び欠陥検出装置

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CN109030624A CN109030624A (zh) 2018-12-18
CN109030624B true CN109030624B (zh) 2021-02-26

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JP6638810B2 (ja) * 2016-06-21 2020-01-29 株式会社島津製作所 欠陥検査装置及び方法
JP7315535B2 (ja) * 2018-04-05 2023-07-26 株式会社島津製作所 振動計測装置
US11391700B2 (en) * 2018-07-04 2022-07-19 Samsung Electronics Co., Ltd. Defect detection device
JP7215134B2 (ja) * 2018-12-17 2023-01-31 株式会社島津製作所 検査装置および検査方法
US11644443B2 (en) * 2018-12-17 2023-05-09 The Boeing Company Laser ultrasound imaging
WO2020157817A1 (ja) * 2019-01-29 2020-08-06 株式会社島津製作所 変位計測装置及び欠陥検出装置
CN113646627B (zh) * 2019-04-17 2024-01-05 株式会社岛津制作所 缺陷检查装置和缺陷检查方法
WO2020241092A1 (ja) * 2019-05-30 2020-12-03 株式会社島津製作所 管状体の接合部の検査方法及び装置
JP7283324B2 (ja) * 2019-09-18 2023-05-30 株式会社島津製作所 欠陥検査装置
US12360052B2 (en) * 2020-01-23 2025-07-15 Shimadzu Corporation Defect inspection apparatus and defect inspection method
CN112212124A (zh) * 2020-08-25 2021-01-12 武汉中仪物联技术股份有限公司 一种管道管壁强度检测方法及检测机器人
JP7518781B2 (ja) 2021-02-17 2024-07-18 嘉二郎 渡邊 振動可視化装置及び該装置を用いた機器診断装置、並びに振動可視化方法及び機器診断方法
JP7746861B2 (ja) * 2022-01-25 2025-10-01 株式会社島津製作所 欠陥検出装置及び欠陥検出方法
US12209960B1 (en) * 2022-03-16 2025-01-28 The United States Of America As Represented By The Secretary Of The Navy Non-invasive tension measuring system
CN114858755B (zh) * 2022-07-05 2022-10-21 中国航发四川燃气涡轮研究院 一种航空发动机涂层变频原位激光检测系统
JP7476392B1 (ja) 2023-04-27 2024-04-30 株式会社東芝 超音波検査装置および超音波検査方法

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US10429172B2 (en) 2019-10-01
JP2019002714A (ja) 2019-01-10
JP6791029B2 (ja) 2020-11-25
CN109030624A (zh) 2018-12-18
US20180356205A1 (en) 2018-12-13

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