CN109002141A - A kind of computer host box high efficiency and heat radiation equipment - Google Patents
A kind of computer host box high efficiency and heat radiation equipment Download PDFInfo
- Publication number
- CN109002141A CN109002141A CN201810877762.8A CN201810877762A CN109002141A CN 109002141 A CN109002141 A CN 109002141A CN 201810877762 A CN201810877762 A CN 201810877762A CN 109002141 A CN109002141 A CN 109002141A
- Authority
- CN
- China
- Prior art keywords
- scrollwork
- pole piece
- shell body
- chassis shell
- high efficiency
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
Abstract
The invention discloses a kind of computer host box high efficiency and heat radiation equipment, including chassis shell body, and it is mounted on the intracorporal computer main board of chassis shell and power supply, semicircle girth sheets is provided between chassis shell body and computer main board, the bottom of semicircle girth sheets is provided with air inlet orifice plate, semiconductor device is provided on the chassis shell body inner wall inside semicircle girth sheets, semiconductor device includes the silica gel thin slice for being fitted in computer main board back side, it is fitted with scrollwork pole piece A scrollwork pole piece A on silica gel thin slice and is connected with scrollwork pole piece B by heat-conductive bridges, scrollwork pole piece B opposite chassis shell body surface is embedded with the first mini fan, metal net layer is provided between first mini fan and scrollwork pole piece B, scrollwork pole piece A and scrollwork pole piece B are electrically connected on computer main board by USB interface, to effectively raise the radiating efficiency of computer host box.
Description
Technical field
The present invention relates to computer field of radiating, specially a kind of computer host box high efficiency and heat radiation equipment.
Background technique
Currently, the intelligent electronic devices such as computer, television set are as a kind of information media, in daily work life by
It is widely used, with the fast development of information technology, electronic equipment is continued to introduce new, and is just being occupied in daily work life more
Come more important position, since electronic equipment largely uses integrated circuit, it is well known that high temperature is the formidable enemy of integrated circuit, high
Temperature not only will lead to system operation shakiness, and reduced service life it could even be possible to burning certain components, and leads to the heat of high temperature
Amount comes from electronic equipment internal, or perhaps IC interior, so the service life in order to guarantee electronic equipment
And using effect, electronic equipment generally can all be attached with heat sinking function, the heat absorption that electronic equipment internal is generated, then
Exterior of terminal is diffused to, in the related technology, electronic equipment is provided with a certain number of thermal window, and above-mentioned thermal window setting exists
It on the shell of electronic equipment, is kept open, the heat that electronic equipment internal generates diffuses to electricity by above-mentioned thermal window
Sub- device external.
Multiple components are arranged in cabinet inside, wherein main heat generating components includes being not limited to: CPU, video card, power supply etc.,
Various cooling measures, such as fan etc. are respectively set in this 3 components, be all when fan is general it is uncontrollable, then right
The combination requirement of fan is very high, once a certain portion temperature is excessively high, it will it influences to use function, then urgently to be solved be
Effectively to CPU, video card, power supply radiates, and carrying out real time monitoring to the integral heat sink temperature of each computer host box is also
It is highly important.
Summary of the invention
In order to overcome the shortcomings of that prior art, the present invention provide a kind of computer host box high efficiency and heat radiation equipment, mention
The high radiating efficiency of computer host box, can effectively solve the problem of background technique proposes.
The technical solution adopted by the present invention to solve the technical problems is:
A kind of computer host box high efficiency and heat radiation equipment, including chassis shell body, and it is mounted on the intracorporal computer of chassis shell
Mainboard and power supply, are provided with semicircle girth sheets between the chassis shell body and computer main board, the bottom of the semicircle girth sheets is provided with
Orifice plate is entered the wind, is provided with semiconductor device, the semiconductor device on the chassis shell body inner wall inside the semicircle girth sheets
It is logical to be fitted with scrollwork pole piece A described in scrollwork pole piece A on the silica gel thin slice for silica gel thin slice including being fitted in computer main board back side
It crosses heat-conductive bridges and is connected with scrollwork pole piece B, the scrollwork pole piece B opposite chassis shell body surface is embedded with the first mini fan, institute
It states and is provided with metal net layer between the first mini fan and scrollwork pole piece B, the scrollwork pole piece A and scrollwork pole piece B are connect by USB
Mouth is electrically connected on computer main board.
Further, semicircle girth sheets two sides are provided with bridge joint panel assembly, and the bridge joint panel assembly includes attachment base, institute
It states and is provided with copper contact pin on attachment base, screw thread pore, the screwed pipe bottom hole are provided on the attachment base of the copper contact pin bottom
The connection seating face in portion is provided with embedding slot, and water-circulating cooling device, the water-circulating cooling device packet are equipped in the embedding slot
The water inlet pipe and return pipe connected in planar vortex pipeline section and straight pipe and horizontal vortex tube section is included, the straight pipe insertion is embedded in
In slot, the planar vortex pipeline section is mounted on chassis shell body inner wall by bracket, the chassis shell body of the planar vortex pipeline section face
The second mini fan is embedded on inner wall.
Further, back-shaped frame, the top dorsal surface of the back-shaped frame are provided in the chassis shell body at the top of the power supply
It is horizontally installed with software frame of plastic, silica gel plate, four edges setting of software frame of plastic are provided in the software frame of plastic
Have screw hole, heat dissipation metal fin be installed on the software frame of plastic, the bottom plate of the heat dissipation metal fin bottom portion setting and
Silica gel plate fits together.
Further, back-shaped frame back side positioned at bottom is horizontally disposed a rectangular metal frame, the planar vortex pipeline section into
Back-shaped frame of the water pipe from the back-shaped frame at top around to bottom, and several continuous U-tube sections, institute are formed in rectangular metal frame
The return pipe of one end access planar vortex pipeline section of U-tube section is stated, is provided on the pipeline between the U-tube section and return pipe micro-
Type turbulence pump, the rectangular metal frame are fitted in the top surface of power supply just.
Further, top loading board is provided at the top of the chassis shell body, the two sides of the top loading board are pacified by gib block
Mounted in the top of chassis shell body, the gib block is mounted at the top of the inner surface of chassis shell body, the top loading board bottom setting
There is an air inlet interlayer, the rear and front end surface of the air inlet interlayer side is provided with sliding slot, inserted with fixed installation in the sliding slot
The rear and front end of fixed link in gib block one end, the side that the air inlet interlayer is located at semicircle girth sheets is provided with minitype piston
Bar.
Further, the both ends of the back-shaped frame are mounted in chassis shell body by buckle, and the back-shaped frame back side at top is set
It is equipped with and bridges identical screw thread pore on seat, the section of the back-shaped frame is in " Ω " shape, and the pipeline of planar vortex pipeline section is along long
The circular portion that direction passes through back-shaped frame is spent, the surface that planar vortex pipeline section and back-shaped bridge joint touch is coated with heat-conducting glue.
Further, the heat conducting pipe of S-shaped is provided between the heat dissipation metal fin and bottom plate, the heat conducting pipe is laterally worn
Heat dissipation metal fin is crossed, the both ends of the heat conducting pipe are connected on back-shaped frame, and heat dissipation metal fin surface is in ripple dentation.
Further, the semiconductor device, the first mini fan, the second mini fan, miniature turbulence pump and miniature work
The independent STM single-chip microcontroller control of stopper rod, the STM single-chip microcontroller are powered by computer main board.
Compared with prior art, the beneficial effects of the present invention are:
Semiconductor device is arranged in the chassis shell body of computer main board back side in the present invention, carries out computer by semiconductor device
The high efficiency and heat radiation of pyrotoxin on mainboard, wherein semiconductor device carries out the thermal contact conductance of computer main board, whirlpool by silica gel thin slice
It rolls up pole piece A and scrollwork pole piece B and heat-conductive bridges forms semiconductor cooling device entirety, while heat-conductive bridges, metal net layer and silica gel
Thin slice forms the inner cavity of a spiral type, carries out quick heat by the heat-conductive bridges between scrollwork pole piece A and scrollwork pole piece B and turns
Metal net layer is moved to, and rapid cooling is carried out by the first mini fan, the first mini fan at work, also will be in spiral type
Inner cavity in form negative pressure so that the rapid air movement in the inner cavity of spiral type, accelerate the heat transfer of heat-conductive bridges, mention
Its high heat transfer efficiency.
Detailed description of the invention
Fig. 1 is semiconductor device structure schematic diagram of the invention；
Fig. 2 is water-circulating cooling device mounting structure schematic diagram of the invention；
Fig. 3 is side view angle schematic perspective view of the invention；
Fig. 4 is planar vortex pipe segment structure schematic diagram of the invention；
Fig. 5 is top loading board structural schematic diagram of the invention；
Fig. 6 is heat-conductive bridges vertical section structure schematic diagram of the invention；
Fig. 7 is heat-conductive bridges overlooking structure diagram of the invention.
Figure label:
1- chassis shell body；2- computer main board；3- power supply；4- semicircle girth sheets；5- enters the wind orifice plate；6- semiconductor device；7- bridge
Plate receiving device；8- water-circulating cooling device；The second mini fan of 9-；The back-shaped frame of 10-；11- software frame of plastic；12- silica gel plate；13-
Heat dissipation metal fin；14- bottom plate；15- rectangular metal frame；16-U shape pipe；The miniature turbulence pump of 17-；18- pushes up loading board；19- guiding
Item；20- enters the wind interlayer；21- sliding slot；22- fixed link；23- minitype piston bar；24- heat conducting pipe；
601- silica gel thin slice；602- scrollwork pole piece A；603- scrollwork pole piece B；604- heat-conductive bridges；The first mini fan of 605-；
606- metal net layer；
701- attachment base；702- copper contact pin；703- screw thread pore；704- embedding slot；
801- planar vortex pipeline section；802- straight pipe；803- water inlet pipe；804- return pipe.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
As shown in Figures 1 to 7, the present invention provides a kind of computer host box high efficiency and heat radiation equipment, including chassis shell body
1, and the computer main board 2 and power supply 3 that are mounted in chassis shell body 1, semicircle is provided between chassis shell body 1 and computer main board 2
Girth sheets 4, the bottom of semicircle girth sheets 4 are provided with air inlet orifice plate 5, are provided on 1 inner wall of chassis shell body inside semicircle girth sheets 4
Semiconductor device 6, semiconductor device 6 include the silica gel thin slice 601 for being fitted in 2 back side of computer main board, are bonded on silica gel thin slice 601
There is scrollwork pole piece A602 scrollwork pole piece A602 to be connected with scrollwork pole piece B603 by heat-conductive bridges 604, scrollwork pole piece B603 is opposite
1 surface of chassis shell body is embedded with the first mini fan 605, is provided with gold between the first mini fan 605 and scrollwork pole piece B603
Belong to stratum reticulare 606, scrollwork pole piece A602 and scrollwork pole piece B603 are electrically connected on computer main board 2 by USB interface.
Semiconductor device 6 is arranged in the present invention in the chassis shell body 1 of 2 back side of computer main board, is carried out by semiconductor device 6
The high efficiency and heat radiation of pyrotoxin on computer main board 2, wherein semiconductor device 6 carries out connecing for computer main board 2 by silica gel thin slice 601
Touch thermally conductive, it is whole while thermally conductive that scrollwork pole piece A602 and scrollwork pole piece B603 and heat-conductive bridges 604 form semiconductor cooling device
Bridge 604, metal net layer 606 and silica gel thin slice 601 form the inner cavity of a spiral type, pass through scrollwork pole piece A602 and scrollwork pole piece
Heat-conductive bridges 604 between B603 carry out quick heat and are transferred to metal net layer 606, and are carried out by the first mini fan 605
Rapid cooling, the first mini fan 605 at work, also will form negative pressure in the inner cavity of spiral type, so that spiral type
Inner cavity in rapid air movement, accelerate heat-conductive bridges 604 heat transfer, improve its heat transfer efficiency.
4 two sides of semicircle girth sheets are provided with bridge joint panel assembly 7, and bridge joint panel assembly 7 includes attachment base 701, set on attachment base 701
It is equipped with copper contact pin 702, screw thread pore 703, the company of 703 bottom of screw thread pore are provided on the attachment base 701 of 702 bottom of copper contact pin
701 surface of joint chair is provided with embedding slot 704, and water-circulating cooling device 8 is equipped in embedding slot 704, and water-circulating cooling device 8 includes flat
The water inlet pipe 803 and return pipe 804 connected on face scroll section 801 and straight pipe 802 and horizontal vortex tube section 801, straight pipe
In 802 insertion embedding slots 704, planar vortex pipeline section 801 is mounted on 1 inner wall of chassis shell body by bracket, and planar vortex pipeline section 801 is just
Pair 1 inner wall of chassis shell body on be embedded with the second mini fan 9.
It is provided with back-shaped frame 10 in the chassis shell body 1 at 3 top of power supply, the top dorsal surface of back-shaped frame 10 is horizontally installed with soft
Body frame of plastic 11 is provided with silica gel plate 12 in software frame of plastic 11, and four edges of software frame of plastic 11 are provided with screw hole,
Heat dissipation metal fin 13 is installed, the bottom plate 14 and silica gel plate 12 of 13 bottom of heat dissipation metal fin setting paste on software frame of plastic 11
It is combined.
10 back side of back-shaped frame positioned at bottom, which is horizontally disposed with, rectangular metal frame 15, the water inlet pipe 803 of planar vortex pipeline section 801
From the back-shaped frame 10 at top around to the back-shaped frame 10 of bottom, and several continuous U-tube sections are formed in rectangular metal frame 15
16, the return pipe 804 of one end access planar vortex pipeline section 801 of U-tube section 16, the pipeline between U-tube section 16 and return pipe 804
On be provided with miniature turbulence pump 17, rectangular metal frame 15 is fitted in the top surface of power supply 3 just.
The top of chassis shell body 1 is provided with top loading board 18, and the two sides of top loading board 18 are mounted on chassis shell by gib block 19
The top of body 1, gib block 19 are mounted at the top of the inner surface of chassis shell body 1, and top 18 bottom of loading board is provided with air inlet interlayer 20,
The rear and front end surface of air inlet 20 side of interlayer is provided with sliding slot 21, inserted with being fixedly mounted on 19 one end of gib block in sliding slot 21
Fixed link 22, the rear and front end of air inlet interlayer 20 side that is located at semicircle girth sheets 4 is provided with minitype piston bar 23.
The both ends of back-shaped frame 10 are mounted in chassis shell body 1 by buckle, and 10 back side of back-shaped frame at top is provided with and bridge
The section of identical screw thread pore 703 on joint chair 701, back-shaped frame 10 is in " Ω " shape, and the pipeline of planar vortex pipeline section 801 is along length
Direction passes through the circular portion of back-shaped frame, and the surface that planar vortex pipeline section 801 and back-shaped bridge joint touch is coated with heat-conducting glue.
The heat conducting pipe 24 of S-shaped is provided between heat dissipation metal fin 13 and bottom plate 14, heat conducting pipe 24 is horizontally through metal and dissipates
Hot fin 13, the both ends of heat conducting pipe 24 are connected on back-shaped frame 10, and 13 surface of heat dissipation metal fin is in ripple dentation.
Semiconductor device 6, the first mini fan 605, the second mini fan 9, miniature turbulence pump 17 and minitype piston bar 23
Independent STM single-chip microcontroller control, STM single-chip microcontroller are powered by computer main board 2.
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, and not
In the case where spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter from
From the point of view of which point, the embodiments should be taken as exemplary, and is non-limiting, and the scope of the present invention is wanted by appended right
Ask rather than above description limit, it is intended that by all changes that come within the meaning and range of equivalency of the claims
It is included within the present invention.Any reference signs in the claims should not be construed as limiting the involved claims.
Claims (8)
1. a kind of computer host box high efficiency and heat radiation equipment, including chassis shell body (1), and be mounted in chassis shell body (1)
Computer main board (2) and power supply (3), it is characterised in that: be provided with half circle between the chassis shell body (1) and computer main board (2)
Plate (4), the bottom of the semicircle girth sheets (4) are provided with air inlet orifice plate (5), are located at the internal chassis shell of the semicircle girth sheets (4)
It is provided with semiconductor device (6) on body (1) inner wall, the semiconductor device (6) includes the silicon for being fitted in computer main board (2) back side
Glue thin slice (601), be fitted on the silica gel thin slice (601) scrollwork pole piece A (602) the scrollwork pole piece A (602) pass through it is thermally conductive
Bridge (604) is connected with scrollwork pole piece B (603), and opposite chassis shell body (1) surface of the scrollwork pole piece B (603) is embedded with first
Mini fan (605) is provided with metal net layer (606), institute between first mini fan (605) and scrollwork pole piece B (603)
It states scrollwork pole piece A (602) and scrollwork pole piece B (603) is electrically connected on computer main board (2) by USB interface.
2. a kind of computer host box high efficiency and heat radiation equipment according to claim 1, it is characterised in that: the semicircle girth sheets
(4) two sides are provided with bridge joint panel assembly (7), and the bridge joint panel assembly (7) includes attachment base (701), on the attachment base (701)
It is provided with copper contact pin (702), is provided with screw thread pore (703) on the attachment base (701) of copper contact pin (702) bottom, it is described
Attachment base (701) surface of screw thread pore (703) bottom is provided with embedding slot (704), is equipped with and is followed in the embedding slot (704)
Ring water cooling plant (8), the water-circulating cooling device (8) include planar vortex pipeline section (801) and straight pipe (802) and horizontal whirlpool
The water inlet pipe (803) and return pipe (804) connected on pipeline section (801), the straight pipe (802) are embedded in embedding slot (704), institute
It states planar vortex pipeline section (801) to be mounted on chassis shell body (1) inner wall by bracket, the machine of planar vortex pipeline section (801) face
The second mini fan (9) are embedded on tank shell (1) inner wall.
3. a kind of computer host box high efficiency and heat radiation equipment according to claim 1, it is characterised in that: the power supply (3)
It is provided with back-shaped frame (10) in the chassis shell body (1) at top, the top dorsal surface of the back-shaped frame (10) is horizontally installed with software
Frame of plastic (11) is provided with silica gel plate (12) in the software frame of plastic (11), and four edges of software frame of plastic (11) are set
It is equipped with screw hole, is equipped with heat dissipation metal fin (13) on the software frame of plastic (11), heat dissipation metal fin (13) bottom
The bottom plate (14) and silica gel plate (12) of portion's setting fit together.
4. a kind of computer host box high efficiency and heat radiation equipment according to claim 3, it is characterised in that: positioned at returning for bottom
Shape frame (10) back side is horizontally disposed to be had rectangular metal frame (15), and the water inlet pipe (803) of the planar vortex pipeline section (801) is from top
Back-shaped frame (10) and forms several continuous U-tube sections in the rectangular metal frame (15) around to the back-shaped frame (10) of bottom
(16), the U-tube section (16) one end access planar vortex pipeline section (801) return pipe (804), the U-tube section (16) and
It is provided on pipeline between return pipe (804) miniature turbulence pump (17), the rectangular metal frame (15) is fitted in power supply just
(3) top surface.
5. a kind of computer host box high efficiency and heat radiation equipment according to claim 1, it is characterised in that: the chassis shell body
(1) top loading board (18) is provided at the top of, the two sides of top loading board (18) are mounted on chassis shell body (1) by gib block (19)
Top, the gib block (19) is mounted at the top of the inner surface of chassis shell body (1), and top loading board (18) bottom is provided with
It enters the wind interlayer (20), the rear and front end surface of described air inlet interlayer (20) side is provided with sliding slot (21), in the sliding slot (21)
Inserted with the fixed link (22) for being fixedly mounted on gib block (19) one end, air inlet interlayer (20) is located at semicircle girth sheets (4)
The rear and front end of side is provided with minitype piston bar (23).
6. a kind of computer host box high efficiency and heat radiation equipment according to claim 3, it is characterised in that: the back-shaped frame
(10) both ends are mounted on chassis shell body (1) by buckle, and back-shaped frame (10) back side at top is provided with and bridge joint seat (701)
Upper identical screw thread pore (703), the section of the back-shaped frame (10) are in " Ω " shape, the pipeline edge of planar vortex pipeline section (801)
Length direction passes through the circular portion of back-shaped frame, and the surface that planar vortex pipeline section (801) and back-shaped bridge joint touch is coated with heat-conducting glue.
7. a kind of computer host box high efficiency and heat radiation equipment according to claim 3, it is characterised in that: the heat dissipation metal
The heat conducting pipe (24) of S-shaped is provided between fin (13) and bottom plate (14), the heat conducting pipe (24) is horizontally through heat dissipation metal wing
The both ends of piece (13), the heat conducting pipe (24) are connected on back-shaped frame (10), and heat dissipation metal fin (13) surface is in ripple dentation.
8. a kind of computer host box high efficiency and heat radiation equipment according to claim 1, it is characterised in that: the semiconductor dress
It is independent to set (6), the first mini fan (605), the second mini fan (9), miniature turbulence pump (17) and minitype piston bar (23)
The control of STM single-chip microcontroller, the STM single-chip microcontroller is powered by computer main board (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810877762.8A CN109002141B (en) | 2018-08-03 | 2018-08-03 | Computer mainframe heat dissipation equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810877762.8A CN109002141B (en) | 2018-08-03 | 2018-08-03 | Computer mainframe heat dissipation equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109002141A true CN109002141A (en) | 2018-12-14 |
| CN109002141B CN109002141B (en) | 2021-06-25 |
Family
ID=64595747
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810877762.8A Active CN109002141B (en) | 2018-08-03 | 2018-08-03 | Computer mainframe heat dissipation equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109002141B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110703890A (en) * | 2019-12-05 | 2020-01-17 | 北京中航科电测控技术股份有限公司 | Radiator based on dragon core processor |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203941491U (en) * | 2014-07-15 | 2014-11-12 | 铁岭师范高等专科学校 | A kind of movable computer cabinet of high heat dispersion |
| CN107145203A (en) * | 2016-03-01 | 2017-09-08 | 天津可可马网络技术有限公司 | A kind of computer heat dissipation equipment |
| CN206639159U (en) * | 2017-04-05 | 2017-11-14 | 广西南宁超网网络科技有限责任公司 | It is a kind of can double-radiation function high-efficiency computer radiator |
| CN206805392U (en) * | 2017-04-14 | 2017-12-26 | 无锡城市职业技术学院 | A kind of computer host box with high efficient shock-proof heat dispersion |
| CN206833331U (en) * | 2017-06-02 | 2018-01-02 | 东华理工大学 | Liquid-cooled main frame |
| WO2018032314A1 (en) * | 2016-08-16 | 2018-02-22 | 陈玮彤 | Computer chassis |
| CN207367141U (en) * | 2017-10-10 | 2018-05-15 | 华北理工大学 | A kind of efficient computer cabinet heat dissipation equipment |
| CN108196633A (en) * | 2017-12-27 | 2018-06-22 | 重庆欣璇网络科技有限公司 | A kind of heat-radiating chassis for computer |
| CN207529329U (en) * | 2017-11-29 | 2018-06-22 | 深圳市久盟电子科技有限公司 | A kind of computer power with radiating structure |
| CN108334182A (en) * | 2018-04-26 | 2018-07-27 | 苏州洋紫瑞信息科技有限公司 | A kind of computer intelligence cooling cabinet |
-
2018
- 2018-08-03 CN CN201810877762.8A patent/CN109002141B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203941491U (en) * | 2014-07-15 | 2014-11-12 | 铁岭师范高等专科学校 | A kind of movable computer cabinet of high heat dispersion |
| CN107145203A (en) * | 2016-03-01 | 2017-09-08 | 天津可可马网络技术有限公司 | A kind of computer heat dissipation equipment |
| WO2018032314A1 (en) * | 2016-08-16 | 2018-02-22 | 陈玮彤 | Computer chassis |
| CN206639159U (en) * | 2017-04-05 | 2017-11-14 | 广西南宁超网网络科技有限责任公司 | It is a kind of can double-radiation function high-efficiency computer radiator |
| CN206805392U (en) * | 2017-04-14 | 2017-12-26 | 无锡城市职业技术学院 | A kind of computer host box with high efficient shock-proof heat dispersion |
| CN206833331U (en) * | 2017-06-02 | 2018-01-02 | 东华理工大学 | Liquid-cooled main frame |
| CN207367141U (en) * | 2017-10-10 | 2018-05-15 | 华北理工大学 | A kind of efficient computer cabinet heat dissipation equipment |
| CN207529329U (en) * | 2017-11-29 | 2018-06-22 | 深圳市久盟电子科技有限公司 | A kind of computer power with radiating structure |
| CN108196633A (en) * | 2017-12-27 | 2018-06-22 | 重庆欣璇网络科技有限公司 | A kind of heat-radiating chassis for computer |
| CN108334182A (en) * | 2018-04-26 | 2018-07-27 | 苏州洋紫瑞信息科技有限公司 | A kind of computer intelligence cooling cabinet |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110703890A (en) * | 2019-12-05 | 2020-01-17 | 北京中航科电测控技术股份有限公司 | Radiator based on dragon core processor |
| CN110703890B (en) * | 2019-12-05 | 2020-04-14 | 北京中航科电测控技术股份有限公司 | Radiator based on dragon core processor |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109002141B (en) | 2021-06-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN206097019U (en) | Mainframe box | |
| WO2017202250A1 (en) | Cooling structure for discrete computer graphics card and mounting structure therefor | |
| CN205880794U (en) | Installation fixing device and dedicated CPU radiator of computer CPU radiator | |
| CN205880769U (en) | Baffle among computer | |
| CN104065767B (en) | A kind of mobile phone cooling system, radiator for mobile phone and mobile phone | |
| WO2017202247A1 (en) | Computer system unit power supply unit | |
| CN205788069U (en) | The water-cooling fan that the heat radiation of a kind of computer is special | |
| CN109002141A (en) | A kind of computer host box high efficiency and heat radiation equipment | |
| CN107193338A (en) | Space accounting small host computer and desktop computer | |
| CN209551788U (en) | A kind of robot cooling system and robot | |
| CN204965311U (en) | High -efficient heat dissipation notebook panel | |
| CN208846530U (en) | Novel graphene electric heater | |
| CN202455710U (en) | Hot-fluid channel heat conduction device and electronic product | |
| CN205384564U (en) | Device based on heat dissipation of computer electrical components | |
| CN205812609U (en) | Heat spreader structures | |
| CN206162348U (en) | Notebook computer's radiating fan | |
| CN201159867Y (en) | Extension type internal memory guard sheet | |
| CN206115368U (en) | Industrial control main board | |
| CN213987392U (en) | Computer machine case with built-in high-efficient heat dissipation | |
| CN208188779U (en) | A kind of double nip radiator of video card | |
| CN207573824U (en) | A kind of free-splicing almag cooling fin | |
| CN209606932U (en) | A kind of radiator and server radiating system | |
| CN201905000U (en) | Radiating fin | |
| CN220798873U (en) | Heat radiation structure of power adapter | |
| CN208985094U (en) | Shared miniature heat radiation module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB03 | Change of inventor or designer information | ||
| CB03 | Change of inventor or designer information |
Inventor after: Sheng Ruilian Inventor after: Xie Zhixiong Inventor before: Sheng Ruilian |
|
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20210608 Address after: 100089 701-h7-1, 7 / F, building 2, 6 Shangdi West Road, Haidian District, Beijing Applicant after: LENOVO CHANGFENG TECHNOLOGY (BEIJING) Co.,Ltd. Address before: 241000 no.3-302, No.6 Jinshan West Road, Yijiang District, Wuhu City, Anhui Province Applicant before: WUHU YINGTEJIE INTELLIGENT TECHNOLOGY Co.,Ltd. |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant |