CN207529329U - A kind of computer power with radiating structure - Google Patents
A kind of computer power with radiating structure Download PDFInfo
- Publication number
- CN207529329U CN207529329U CN201721632759.7U CN201721632759U CN207529329U CN 207529329 U CN207529329 U CN 207529329U CN 201721632759 U CN201721632759 U CN 201721632759U CN 207529329 U CN207529329 U CN 207529329U
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- CN
- China
- Prior art keywords
- power supply
- supply body
- side wall
- chilling plate
- power
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model is related to computer power technical field, especially a kind of computer power with radiating structure.It includes power supply body, power outlet group and exhaust vent, semiconductor chilling plate is provided on one madial wall of power supply body, water cooling component is provided on the lateral wall of power supply body, water cooling component includes heat dissipation pipe and the water pump of the side wall distribution of half embedment power supply body, heat dissipation pipe includes inlet and outlet, and inlet and outlet are connect respectively by aqueduct with water pump.The utility model is conducted using the heat that the medial surface of semiconductor chilling plate freezes and generates the lateral surface of semiconductor chilling plate to the side wall being in contact with power supply body, water cooling component is recycled by heat transfer and is dissipated outward, so as to reduce the temperature in power supply body；The setting for being embedded to structure using half simultaneously can effectively increase the contact area of cooling water and the side wall of computer body, so as to improve the heat dissipation performance of water cooling group, so as to effectively radiate to computer power.
Description
Technical field
The utility model is related to computer power technical field, especially a kind of computer power with radiating structure.
Background technology
It is well known that computer power is one of important composition component of computer, it is exclusively for computer fittings such as CPU, master
The equipment of the power supplies such as plate, hard disk, memory bar, video card, CD drive.At present, computer power heating problem is that computer power is deposited
One of main problem, for the transfer efficiency of computer power usually between 70-80%, this means that the energy of 20-30%
Heat is translated into, existing computer power is usually all radiated with fan, wind-force or draft by fan, is driven
Air flowing in power supply, so as to take away the heat in power supply；However the heat dissipation effect for depending merely on fan is limited；These heats gather
It cannot be distributed in time in power supply, power supply local temperature can be made excessively high, so as to cause unnecessary injury to power supply.
Utility model content
In view of the deficiency of the prior art, the purpose of this utility model is to provide one kind to have heat sinking knot
The computer power of structure.
To achieve these goals, the utility model adopts the following technical solution：
A kind of computer power with radiating structure, it includes power supply body and is set to power supply body front side wall
On power outlet group and exhaust vent, be provided with semiconductor chilling plate, the power supply sheet on a madial wall of the power supply body
Body and with being provided with water cooling component on the corresponding lateral wall of semiconductor chilling plate, the water cooling component includes half embedment power supply sheet
The side wall distribution of body and the heat dissipation pipe in hollow structure and external water pump, the heat dissipation pipe include a water inlet and one
Water outlet, the inlet and outlet are connect respectively by aqueduct with water pump.
Preferably, the semiconductor chilling plate and heat dissipation pipe are set on the left side wall or right side wall of power supply body, institute
Inlet and outlet are stated through being distributed on the front side wall of power supply body.
Preferably, the heat dissipation pipe is continuously connected by multiple bending sections in U-typed structure, the water inlet and
Water outlet is extended outwardly molding respectively by the one end for the bending section for being distributed in both ends.
Preferably, first annular groove is provided on the peripheral wall of the water inlet, the second ring is provided on the water outlet
Connected in star.
Preferably, be additionally provided in the power supply body temperature sensor and one for control semiconductor chilling plate and
The controller of pump working, the temperature sensor are electrically connected with the controller, the semiconductor chilling plate and water pump respectively with control
Device electrical connection processed.
Preferably, be additionally provided with a switch on the power supply body front side wall, the switch control semiconductor chilling plate and
Conducting and disconnection between water pump and controller.
As a result of said program, the utility model utilizes semiconductor chilling plate on the basis of existing fan cooling
Medial surface refrigeration and the heat that generates the lateral surface of semiconductor chilling plate conduct to the side wall being in contact with power supply body,
Water cooling component is recycled by heat transfer and is dissipated outward, so as to reduce the temperature in power supply body；Half embedment knot is utilized simultaneously
The setting of structure can effectively increase the contact area of cooling water and the side wall of computer body, so as to improve the thermal diffusivity of water cooling group
Can, so as to effectively radiate to computer power, there is very strong practical value and market popularization value.
Description of the drawings
Fig. 1 is the overall structure diagram of the utility model embodiment；
Fig. 2 is the right view of the utility model embodiment；
Fig. 3 is the schematic cross-section of the part-structure of the utility model embodiment.
Specific embodiment
The embodiment of the utility model is described in detail below in conjunction with attached drawing, but the utility model can be by right
It is required that the multitude of different ways for limiting and covering is implemented.
As shown in Figure 1 to Figure 3, a kind of computer power with radiating structure that the utility model embodiment provides,
It includes power supply body 1 and the power outlet group 2 and exhaust vent 3 that are set on 1 front side wall of power supply body, in power supply body 1
The one of air inlet hole (not shown), wherein power supply body 1 for being provided with fan (not shown) and being set at fan
Semiconductor chilling plate 4 is provided on madial wall, in power supply body 1 and with being set on 4 corresponding lateral wall of semiconductor chilling plate
Have a water cooling component, water cooling component include the side wall distribution of half embedment power supply body 1 and in hollow structure heat dissipation pipe 51 and
External water pump (not shown), heat dissipation pipe 51 include a water inlet 52 and a water outlet 53, water inlet 52 and water outlet
53 are connect respectively by aqueduct (not shown) with water pump.As a result, using the medial surface of semiconductor chilling plate 4 refrigeration simultaneously
The heat that the lateral surface of semiconductor chilling plate 4 generates is conducted to the side wall being in contact with power supply body 1, recycles water cooling group
Part is by heat transfer and dissipates outward, so as to reduce the temperature in power supply body 1；The setting for being embedded to structure using half simultaneously, can
Effectively increase the contact area of cooling water and the side wall of computer body 1, so as to improve the heat dissipation performance of water cooling component, so as to have
It radiates to computer power on effect ground.
In order to optimize the structure of computer power, the distribution for making each building block is more reasonable, the semiconductor of the present embodiment
Cooling piece 4 and heat dissipation pipe 51 are set on the left side wall or right side wall of power supply body 1, water inlet 52 and water outlet 53 through point
It is distributed on the front side wall of power supply body 1.It can connect, while can incite somebody to action with water inlet 52 and water outlet 53 convenient for aqueduct as a result,
Water pump is fixedly installed on the outside of power supply body or computer housing.
In order to improve the heat dissipation performance of heat dissipation pipe 51, the heat dissipation pipe 51 of the present embodiment is by multiple in U-typed structure
Bending section 511 is continuously connected, and one end of water inlet 52 and water outlet 53 bending section 51 by being distributed in both ends respectively is outside
Elongation moulding.More than structure is based on, heat dissipation pipe 51 can be made uniformly to be distributed in the outside of semiconductor chilling plate 4, so as to make half
The heat generated on the lateral surface of conductor cooling piece 4 can be shifted uniformly and be distributed outward, so as to effectively ensure computer
The heat dissipation performance of power supply.
The joining place leak of water inlet 52 and water outlet 53 and aqueduct in order to prevent, the week of the water inlet 52 of the present embodiment
First annular groove 521 is provided on wall, second annular groove 531 is provided on water outlet 53.Can effectively it ensure as a result,
The stable operation of computer power.
In order to which the temperature control in power supply body 1 in a certain range, is additionally provided in the power supply body 1 of the present embodiment
One temperature sensor (not shown) and one is used to control the controller of semiconductor chilling plate 4 and pump working (in figure not
Show), wherein temperature sensor is electrically connected with the controller, and semiconductor chilling plate 4 and water pump are electrically connected with the controller respectively.By
The temperature value detected, using the temperature in temperature sensor detection power supply body 1 and is sent in controller, controls by this
One normal temperature can be set in device, and when the temperature value detected is higher than normal temperature, controller then controls semiconductor chilling plate 4
And water pump starts to work and carries out cooling and heat dissipation to 1 inside of power supply body；When the temperature value detected is less than normal temperature, control
Device processed then controls semiconductor chilling plate 4 and water pump to be stopped, so as to which effectively the temperature control in power supply body 1 exists
In a certain range, while also can effectively energy saving waste.
For the ease of the opening and closing of user's control semiconductor chilling plate, water pump and controller, preferably,
A switch 6,6 control semiconductor chilling plate 4 of switch and water pump and control are additionally provided on 1 front side wall of power supply body of the present embodiment
Conducting and disconnection between device.User can voluntarily choose whether to open semiconductor chilling plate, water pump according to extraneous temperature as a result,
And controller work, cool down to computer power.
The above is only the preferred embodiment of the present invention, and it does not limit the scope of the patent of the present invention,
Every equivalent structure or equivalent flow shift made based on the specification and figures of the utility model, is directly or indirectly transported
Used in other related technical areas, it is equally included in the patent within the scope of the utility model.
Claims (6)
1. a kind of computer power with radiating structure, it includes power supply body and is set on power supply body front side wall
Power outlet group and exhaust vent, it is characterised in that：Semiconductor chilling plate is provided on one madial wall of the power supply body, institute
State power supply body and with being provided with water cooling component on the corresponding lateral wall of semiconductor chilling plate, the water cooling component includes partly burying
Enter power supply body side wall distribution and in hollow structure heat dissipation pipe and external water pump, the heat dissipation pipe include one into
The mouth of a river and a water outlet, the inlet and outlet are connect respectively by aqueduct with water pump.
2. a kind of computer power with radiating structure as described in claim 1, it is characterised in that：The semiconductor system
Cold is set to heat dissipation pipe on the left side wall or right side wall of power supply body, and the inlet and outlet, which run through, is distributed in electricity
On the front side wall of source ontology.
3. a kind of computer power with radiating structure as claimed in claim 2, it is characterised in that：The heat dissipation pipe
Continuously it is connected by multiple bending sections in U-typed structure, the inlet and outlet are respectively by being distributed in the curved of both ends
One end of pars convoluta extends outwardly molding.
4. a kind of computer power with radiating structure as claimed in claim 3, it is characterised in that：The water inlet
First annular groove is provided on peripheral wall, second annular groove is provided on the water outlet.
5. a kind of computer power with radiating structure as described in any one of claim 1-4, it is characterised in that：Institute
It states and a temperature sensor and one is additionally provided in power supply body for controlling the controller of semiconductor chilling plate and pump working,
The temperature sensor is electrically connected with the controller, and the semiconductor chilling plate and water pump are electrically connected with the controller respectively.
6. a kind of computer power with radiating structure as claimed in claim 5, it is characterised in that：The power supply body
A switch is additionally provided on front side wall, on and off is led between the switch control semiconductor chilling plate and water pump and controller
It opens.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721632759.7U CN207529329U (en) | 2017-11-29 | 2017-11-29 | A kind of computer power with radiating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721632759.7U CN207529329U (en) | 2017-11-29 | 2017-11-29 | A kind of computer power with radiating structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207529329U true CN207529329U (en) | 2018-06-22 |
Family
ID=62579539
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721632759.7U Expired - Fee Related CN207529329U (en) | 2017-11-29 | 2017-11-29 | A kind of computer power with radiating structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207529329U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109002141A (en) * | 2018-08-03 | 2018-12-14 | 芜湖英特杰智能科技有限公司 | A kind of computer host box high efficiency and heat radiation equipment |
| CN111221401A (en) * | 2020-01-17 | 2020-06-02 | 深圳市久盟电子科技有限公司 | PC power supply |
-
2017
- 2017-11-29 CN CN201721632759.7U patent/CN207529329U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109002141A (en) * | 2018-08-03 | 2018-12-14 | 芜湖英特杰智能科技有限公司 | A kind of computer host box high efficiency and heat radiation equipment |
| CN109002141B (en) * | 2018-08-03 | 2021-06-25 | 联想长风科技(北京)有限公司 | Computer mainframe heat dissipation equipment |
| CN111221401A (en) * | 2020-01-17 | 2020-06-02 | 深圳市久盟电子科技有限公司 | PC power supply |
| CN111221401B (en) * | 2020-01-17 | 2021-03-02 | 深圳市久盟电子科技有限公司 | PC power supply |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180622 Termination date: 20211129 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |