CN101514833A - Full electrical compressor-free civil air conditioner and manufacturing method thereof - Google Patents
Full electrical compressor-free civil air conditioner and manufacturing method thereof Download PDFInfo
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- CN101514833A CN101514833A CNA2008103003595A CN200810300359A CN101514833A CN 101514833 A CN101514833 A CN 101514833A CN A2008103003595 A CNA2008103003595 A CN A2008103003595A CN 200810300359 A CN200810300359 A CN 200810300359A CN 101514833 A CN101514833 A CN 101514833A
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- Devices For Blowing Cold Air, Devices For Blowing Warm Air, And Means For Preventing Water Condensation In Air Conditioning Units (AREA)
Abstract
The invention discloses a full electrical compressor-free civil air conditioner and a manufacturing method thereof. The air conditioner comprises two semiconductor chips and a water cycle device; the semiconductors are oppositely arranged; the semiconductors, a medium for transferring temperature and a medium for storing temperature are manufactured into a refrigeration and heating chip board; a cooling water tank is arranged close to the refrigeration and heating chip board; the cooling water tank and a fan are arranged inside an indoor set of the air conditioner; and the cooling water tank is connected with a cooling device inside an outdoor unit of the air conditioner through the water cycle device with a water pump. By utilizing full electrical semiconductor technology, the air conditioner cannot do harm to a human body during refrigeration, is safe and environment-friendly, can save electric energy consumption by 30 percent, reduces the use cost, and is noiseless during operation; in addition, the air conditioner has excellent refrigeration and heating effects; the minimum temperature for refrigeration can reach 9 DEG C to 16 DEG C below zero; and the air conditioner can heat between 16 DEG C and 38 DEG C. The air conditioner meets the requirements of civil air conditioners and realizes the application of semiconductor technology to the civil air conditioners.
Description
Technical field:
The present invention relates to a kind of electrical equipment and preparation method thereof, particularly a kind of full electrical compressor-free civil air conditioner and preparation method thereof.
Background technology:
Along with the raising of development of electronic technology and people's living standard, increasing family uses air-conditioning to regulate indoor temperature.At present, civilian air-conditioning generally adopts Technology of Compressor Refrigeration and heat-generating pipe to heat technology.Because need use freon or other cold-producing medium during compressor cooling, these cold-producing mediums are not only harmful, also can damage the ozone layer.In addition, the electric energy consumption of compressor air-conditioning is higher, has caused the raising of use cost, and during compressor operating, noise is bigger.In order to overcome these defectives, people have developed the semi-conductive cooling and warming technology that adopts, but major part has only been utilized a working face chill surface of semiconductor cooling device or has been heated in the existing product, though other fraction product has utilized two working face refrigeration of semiconductor cooling device and has heated, but its effect is relatively poor, is difficult to be applied to civilian air-conditioning.In addition, the cold-storage face of conventional semiconductor refrigeration device owing to only adopt a block semiconductor chip, causes the temperature difference of cold-storage face both sides bigger when refrigeration, also is a key factor that causes its refrigeration relatively poor.
Summary of the invention:
The technical problem to be solved in the present invention is: provide a kind of and can not damage human body, environmental protection can be freezed and heat, noiselessness when the work operation, and good full electrical compressor-free civil air conditioner of effect and preparation method thereof is to overcome the deficiencies in the prior art.
Full electrical compressor-free civil air conditioner of the present invention is to make like this: it comprises adopts semiconductor chip as freezing and heating element, it is staggered relatively and connect its inboard by the medium that transmits temperature with two block semiconductor chips, the medium that holds temperature is installed on the medium that transmits temperature simultaneously, thereby be made into a cooling and warming chip board, at the two block semiconductor chip lateral surfaces of being close to the cooling and warming chip board cooling water tank is installed respectively then, again itself and blower fan are installed in indoor apparatus of air conditioner inside, make blower fan wind can be crossed the medium that holds temperature of cooling and warming chip board, produce cold wind or hot blast and blow out, cooling water tank is connected with the heat abstractor of air-conditioner outdoor unit inside by a water circle device that has water pump, make the heat radiation that circulated of water in the cooling water tank, thereby the face of heating of semiconductor chip is dispelled the heat.
Full electrical compressor-free civil air conditioner of the present invention is to constitute like this: it comprises the indoor set shell 1 of air-conditioning and the casing of outdoor 8 of air-conditioning, top in indoor set shell 1 is provided with cooling and warming chip board 9, be close to cooling and warming chip board 9 two sides and be provided with cooling water tank 14, middle part in indoor set shell 1 is provided with blower fan 10, bottom in indoor set shell 1 is provided with control circuit board 11, be provided with the heat abstractor that has water pump in casing of outdoor 8, cooling water tank 14 is connected with heat abstractor by water circle device.
In the above-mentioned full electrical compressor-free civil air conditioner, the medium, semiconductor chip 25, the heat insulation silica gel 26 that hold temperature that the formation of described cooling and warming chip board 9 comprises the medium of the transmission temperature that is made of two substrates 22 and two conductive post 23, is made of cold-storage sheet 24; Every substrate 22 inboards are connected with conductive post 23 1 ends, connect by opening between two conductive post 23 in the coupling slot 27 of its other end, on conductive post 23, be embedded with cold-storage sheet 24, between substrate 22 outsides and cooling water tank 14, be provided with semiconductor chip 25 and heat insulation silica gel 26, and heat insulation silica gel 26 is located at the both ends of semiconductor chip 25.
In the aforesaid full electrical compressor-free civil air conditioner, the quantity of described cooling and warming chip board 9 is 1～10, and is arranged on the top in the indoor set shell 1 obliquely.
In the aforesaid full electrical compressor-free civil air conditioner, the formation of described water circle device comprises: tank 12, drainpipe 13, drainage hot channel 15, current drainage pipeline 16, water butt 17, water pump 18, outlet pipe 19; Tank 12 levels are located at the lower limb of cooling and warming chip board 9, and be connected with the water butt 17 of being located at blower fan 10 bottoms by drainpipe 13, the evaporation water of the generation when being used to collect air conditioner refrigerating, the lower end of cooling water tank 14 is connected with the delivery port of heat abstractor in being located at casing of outdoor 8 by drainage heat dissipation channel 15, its upper end is connected with water butt 17 by current drainage pipeline 16, water butt 17 also is connected with the water inlet of the water pump 18 of being located at its side, the delivery port of water pump 18 is connected with the water inlet of heat abstractor by outlet pipe 19, the face of heating carries out radiating treatment when coming air conditioner refrigerating, and water pump 18 is connected with the output of control circuit board 11.
In the aforesaid full electrical compressor-free civil air conditioner, the formation of described heat abstractor comprises: be located at sides in the casing of outdoor 8 radiator 20, be located at the electric fan 21 of radiator 20 rear sides; The lower end of cooling water tank 14 is connected with radiator 20 tops by drainage heat dissipation channel 15, and the delivery port of water pump 18 is connected with the bottom of radiator 20 by outlet pipe 19.
In the aforesaid full electrical compressor-free civil air conditioner, on electric fan 21, also be provided with temperature detect switch (TDS) 28, on cooling and warming chip board 9, be provided with temperature control chip tR1, on the air inlet of blower fan 10, be provided with temperature control chip tR2, also be provided with wind direction board 2 and the shutter 3 that is used to regulate wind direction in indoor set shell 1 upper surface, the wind direction board 2 that connects respectively and be used to drive and the wind direction motor 4 of shutter 3 and time switch motor 5, be located at the control display floater 6 that middle part, indoor set shell 1 surface is used to observe and regulate the air-conditioning work state, be located at the air intake Air Filter 7 of indoor set shell 1 surperficial bottom, time switch motor 5 all is connected with the output of control circuit board 11 with blower fan 8.
In the aforesaid full electrical compressor-free civil air conditioner, the formation of described control circuit board 11 comprises the master switch K that connects attaching plug, choking-winding L1, L2, by four diode D and four rectifier bridge heap UR1 that capacitor C is formed, electrochemical capacitor C1, C2, C3, controllable silicon KG, induction by current coil L3, time-delay converter B, semiconductor chip 25, small-power power transformer T, the full-wave rectification unit UR2 that forms by four diode D, inductance L 4, s operation control chip U1, the relay J 2 of control time switch motor 5, the relay J 3 of control wind direction motor 4, the relay J 4 of control blower fan 10, temperature control chip tR1, tR2, the operating unit U2 and the display unit U3 that are connected with control display floater 6; Master switch K is through choking-winding L1, input with rectifier bridge heap UR1 behind the L2 is connected, the output of rectifier bridge heap UR1 is attempted by electrochemical capacitor C1 two ends, one end of rectifier bridge heap UR1 output is connected with the anode of controllable silicon KG, the other end is connected with time-delay converter B, the negative electrode of controllable silicon KG is connected with time-delay converter B behind induction by current coil L3, the output of time-delay converter B is connected with the power input of semiconductor chip 25, master switch K passes through again by small-power power transformer T, full-wave rectification unit UR2, electrochemical capacitor C2, behind the direct-flow voltage regulation unit that C3 and inductance L 4 constitutes with s operation control chip U1, operating unit U2 is connected with the power input of display unit U3, operating unit U2 is connected with the signal input part of s operation control chip U1, display unit U3 is connected with the signal output part of s operation control chip U1, master switch K also with the K switch 1 of water pump 18, the normally opened contact K2 of relay J 2, the normally opened contact K3 of relay J 3, the normally opened contact K4 of relay J 4 also fetches its power supply; Temperature control chip tR1, tR2 are connected with the signal input part of s operation control chip U1 respectively; The signal output of s operation control chip U2 is connected with the control utmost point, relay J 2, J3, the J4 of controllable silicon KG respectively.
In the aforesaid full electrical compressor-free civil air conditioner, between the top edge of indoor set shell 1 and blower fan 10 air inlets, be provided with thermal insulation board 29.
In the aforesaid full electrical compressor-free civil air conditioner, scribble one deck heat-conducting silicone grease in semiconductor chip 25 both side surface.
Owing to adopted technique scheme, compared with the prior art, refrigeration of the present invention has been utilized the all-electronin semiconductor technology, does not use cold-producing medium, and cooling working medium does not adopt chemical element, so can not damage safety and environmental protection to human body; Do not use compressor during its refrigeration, heat and do not use heat-generating pipe, so just can save 30% power consumption, reduced use cost; And the present invention is noiselessness when the work operation.In addition, cooling and warming chip board of the present invention is to adopt the convection type conduction, the temperature step temperature spread of cold-storage sheet little (promptly the both sides that constitute face by the cold-storage sheet are minimum with middle temperature difference), make that the temperature of cold-storage sheet formation face is even, the evaporation water of the present invention's generation when refrigeration can be recycled the water butt collection of cooling system in addition, and be sent to cooling water tank, be used for the face that heats heat radiation to the cooling and warming chip board, thereby promote electronics strenuous exercise, significantly strengthened the effect of chill surface, and because the cooling water tank in the cycle cooling system, the current drainage pipeline, water butt, water pump, outlet pipe, radiator and drainage hot channel can constitute a loop capable of circulation, can add cooling fluid at water butt, further improved radiating effect, the minimum temperature that makes the present invention freeze arrives subzero 9 ℃～16 ℃; When using the cooling and warming chip board to heat, can between 16 ℃～38 ℃, heat.In sum, the present invention refrigeration and the effect that heats are fine, can satisfy the requirement of civilian air-conditioning fully, real realization the application of semiconductor technology in civilian air-conditioning.
Description of drawings:
Fig. 1 is an indoor machine structure schematic diagram of the present invention;
Fig. 2 is an off-premises station structural representation of the present invention;
Fig. 3 is the structural representation of cooling and warming chip board of the present invention;
Fig. 4 is the cross section structure schematic diagram of substrate of the present invention and conductive post;
Fig. 5 is the structural representation of cycle cooling system of the present invention;
Fig. 6 is the circuit theory diagrams of control circuit board of the present invention;
Being labeled as of accompanying drawing: 1-indoor set shell, 2-wind direction board, 3-shutter, 4-wind direction motor, 5-time switch motor, 6-controls display floater, 7-air intake Air Filter, 8-casing of outdoor, 9-cooling and warming chip, the 10-blower fan, 11-control circuit board, 12-tank, the 13-drainpipe, 14-cooling water tank, 15-drainage hot channel, 16-current drainage pipeline, 17-water butt, 18-water pump, the 19-outlet pipe, the 20-radiator, 21-electric fan, 22-substrate, the 23-conductive post, 24-cold-storage sheet, 25-semiconductor chip, the heat insulation silica gel of 26-, the 27-coupling slot, the 28-temperature detect switch (TDS), 29-thermal insulation board, K-master switch, L1, the L2-choking-winding, C1, C2, the C3-electrochemical capacitor, KG-controllable silicon, L3-induction by current coil, the B-converter of delaying time, the L4-inductance, tR1, tR2-temperature control chip, UR1-rectifier bridge heap, UR2-full-wave rectification unit, the T-small-power power transformer, U1-s operation control chip, the relay of J2-control time switch motor, the relay of J3-control wind direction motor, the relay of J4-control blower fan, U2-operating unit, U3-display unit.
The specific embodiment:
Embodiments of the invention: the preparation method of this full electrical compressor-free civil air conditioner, it comprises adopts semiconductor chip as freezing and heating element, its two block semiconductor chips are staggered relatively and medium by transmitting temperature (medium that transmits temperature can adopt existing commercially available guide temp preferably material make) connect its inboard, the medium (medium that holds temperature can adopt the material making preferably of existing commercially available savings temperature performance) that holds temperature is installed on the medium of transmission temperature simultaneously, thereby be made into a cooling and warming chip board, at the two block semiconductor chip lateral surfaces of being close to the cooling and warming chip board cooling water tank is installed respectively then, again itself and blower fan are installed in indoor apparatus of air conditioner inside, make blower fan wind can be crossed the medium that holds temperature of cooling and warming chip board, produce cold wind or hot blast and blow out, cooling water tank is connected with the heat abstractor of air-conditioner outdoor unit inside by a water circle device that has water pump, make the heat radiation that circulated of water in the cooling water tank, thereby the face of heating of semiconductor chip is dispelled the heat.
Adopt the structure of the full electrical compressor-free civil air conditioner that above-mentioned preparation method makes such as Fig. 1～shown in Figure 6, it comprises the indoor set shell 1 of existing commercially available air-conditioning and the casing of outdoor 8 of air-conditioning, cooling and warming chip board 9 is installed on top in indoor set shell 1, be close to cooling and warming chip board 9 two sides a cooling water tank 14 respectively is installed, a typhoon machine 10 is installed at middle part in indoor set shell 1, a control circuit board 11 is installed in bottom in indoor set shell 1, control circuit board 11 can be controlled cooling and warming chip board 9 refrigeration or heat, heat abstractor is installed in casing of outdoor 8, cooling water tank 14 is connected with heat abstractor by the water circle device that has water pump.The formation of described cooling and warming chip board 9 comprises that (it is used for cold temperature or heat temperature that conductive semiconductor chip 25 produces for the medium of the transmission temperature that is made of two substrates 22 and two conductive post 23, substrate 22 and conductive post 23 all can adopt leads temp effect material making preferably, is preferably and adopts aluminium alloy to make), the medium that holds temperature (it is used to save cold temperature or heat temperature that semiconductor chip 25 produces) that constitutes by cold-storage sheet 24, semiconductor chip 25 (it can adopt the finished product that has commercially available semiconductor chip cooling and warming chip now), heat insulation silica gel 26 (it can adopt existing commercially available finished product); Every substrate 22 inboards are connected with conductive post 23 1 ends, substrate 22 and conductive post 23 can be cast to press and be formed, connect by opening between two conductive post 23 in the coupling slot 27 of its other end, (coupling slot 27 is a tongue and groove, promptly open a groove at conductive post 23 1 ends, one end of another conductive post 23 is made into a projection, again projection is stuck in the groove, projection and groove general designation coupling slot 27), on conductive post 23, be embedded with cold-storage sheet 24 (cold-storage sheet 24 can adopt existing commercially available film aluminium flake finished product punching press to make), between the cooling water tank 12 of substrate 22 outsides and heat dissipation circulating system, install semiconductor chip 25 and heat insulation silica gel 26, and heat insulation silica gel 26 is installed in the both ends of semiconductor chip 25, and cooling water tank 14 heats the face thermo-neutrality with semiconductor chip 25 when making air conditioner refrigerating.Strengthen the efficient of cooling and warming for the surface area of the cold-storage sheet 24 that increases wind, can quantity be installed on the top in the indoor set shell 1 is 1～10 described cooling and warming chip board 9, normally install 3, and it is mounted obliquely within top in the indoor set shell 1.The formation of described water circle device comprises: tank 12, drainpipe 13, drainage hot channel 15, current drainage pipeline 16, water butt 17, water pump 18, outlet pipe 19; Tank 12 levels can be installed in the lower limb of cooling and warming chip board 9, and be connected with the water butt 17 that is installed in blower fan 10 bottoms by drainpipe 13, the evaporation water of the generation when being used to collect air conditioner refrigerating, the lower end of cooling water tank 14 is connected with the delivery port of heat abstractor in being installed in casing of outdoor 8 by drainage heat dissipation channel 15, the upper end of cooling water tank 14 is connected with water butt 17 by current drainage pipeline 16, water just flows into from the lower end of cooling water tank 14 like this, flow out the upper end, strengthened the radiating effect of cooling and warming chip board 9, again the water inlet of water butt 17 with the water pump 18 that is installed in its side is connected, the delivery port of water pump 18 is connected with the water inlet of heat abstractor by outlet pipe 19, the face of heating carries out radiating treatment when coming air conditioner refrigerating, the output of water pump 18 with control circuit board 11 is connected, makes control circuit board 11 can control the operation of water pump 18.The formation of described heat abstractor comprises: be installed in sides in the casing of outdoor 8 radiator 20, be installed in the electric fan 21 of radiator 20 rear sides; The lower end of cooling water tank 14 can be connected with radiator 20 tops by drainage heat dissipation channel 15, the delivery port of water pump 18 is connected with the bottom of radiator 20 by outlet pipe 19, water enters from radiator 20 lower ends, and discharges the radiating efficiency that can improve water from its upper end.For feedback temperature information and convenient control electric fan 21, a temperature detect switch (TDS) 28 can be installed on electric fan 21, temperature detect switch (TDS) 28 can adopt commercially available finished product, make temperature detect switch (TDS) 28 can control the switch of electric fan 21 according to the temperature of radiator 20, a temperature control chip tR1 is installed on cooling and warming chip board 9, a temperature control chip tR2 is installed on the air inlet of blower fan 10.For the direction that makes the indoor apparatus of air conditioner air-out can be controlled, wind direction board 2 and the shutter 3 that is used to regulate wind direction can be installed in indoor set shell 1 upper surface, the wind direction board 2 that connects respectively and be used to drive and the wind direction motor 4 of shutter 3 and time switch motor 5, be installed in the control display floater 6 that middle part, indoor set shell 1 surface is used to observe and regulate the air-conditioning work state, be installed in the air intake Air Filter 7 of indoor set shell 1 surperficial bottom, air intake Air Filter 7 has the effect that stops the dust in the room air, its wind direction board 2, shutter 3, wind direction motor 4, time switch motor 5 and air intake Air Filter 7 all can adopt existing commercially available finished product, time switch motor 5 all is connected with the output of control circuit board 11 with blower fan 8, makes control circuit board 11 can control the operation of time switch motor 5 and blower fan 8.The formation of described control circuit board 11 comprises the master switch K that connects attaching plug, choking-winding L1, L2, by four diode D and four rectifier bridge heap UR1 that capacitor C is formed, electrochemical capacitor C1, C2, C3, controllable silicon KG, induction by current coil L3, time-delay converter B, semiconductor chip 25, small-power power transformer T, the full-wave rectification unit UR2 that forms by four diode D, inductance L 4, s operation control chip U1, the relay J 2 of control time switch motor 5, the relay J 3 of control wind direction motor 4, the relay J 4 of control blower fan 10, temperature control chip tR1, tR2, the operating unit U2 and the display unit U3 that are connected with control display floater 6; With master switch K process choking-winding L1, input with rectifier bridge heap UR1 behind the L2 is connected, the output of rectifier bridge heap UR1 is attempted by electrochemical capacitor C1 two ends, one end of rectifier bridge heap UR1 output is connected with the negative electrode of controllable silicon KG, the other end is connected with time-delay converter B, the anode utmost point of controllable silicon KG is connected with time-delay converter B behind induction by current coil L3, the output of time-delay converter B is connected with system semiconductor chip 25 power inputs, the delay time of time-delay converter B can be set between 30～60 minutes, can prevent semiconductor chip from when cooling and warming is changed, producing temperature jump and damage, master switch K passes through again by small-power power transformer T, full-wave rectification unit UR2, electrochemical capacitor C2, behind the direct-flow voltage regulation unit that C3 and inductance L 4 constitutes with s operation control chip U1, operating unit U2 is connected with the power input of display unit U3, operating unit U2 is connected with the signal input part of s operation control chip U1, display unit U3 is connected with the signal output part of s operation control chip U1, the K switch 1 of master switch K and water pump 18, the normally opened contact K2 of relay J 2, the normally opened contact K3 of relay J 3, the normally opened contact K4 of relay J 4 also fetches its power supply; Temperature control chip tR1, tR2 have the sensing control function, can adopt the DS1620 integrated chip, and it is connected with the signal input part of s operation control chip U1 respectively; The signal output of s operation control chip U2 is connected with the control utmost point, relay J 2, J3, the J4 of controllable silicon KG respectively.For the cold wind refluence back and blower fan inhaled air generation thermo-neutrality that prevents to make, thermal insulation board 29 can be installed between indoor set shell 1 and blower fan 10, thermal insulation board 29 can adopt existing heat-barrier material to make.For the side that makes semiconductor chip 25 and substrate 22 and cooling water tank 14 paste closelyr, can scribble one deck heat-conducting silicone grease (heat-conducting silicone grease can adopt existing commercially available finished product, is preferably its granular size is made nanoscale) in semiconductor chip 25 both side surface.
During this full electrical compressor-free civil air conditioner refrigeration, the electronics of semiconductor chip 25 inside is towards a direction strenuous exercise, temperature near substrate 22 1 sides is descended rapidly, and the temperature of cold-storage sheet 24 is descended rapidly by the conductive post 23 that is connected on the substrate 22, the wind that is blown out by blower fan 10 blows out indoor set shell 1 after cold-storage sheet 24 becomes cold air again, evaporation water on the cold-storage sheet 24 flows into tank 12, and finally drains into water butt 17; Semiconductor chip 25 rises rapidly away from the temperature of substrate 22 1 sides simultaneously, but by the cold water thermo-neutrality in the cooling water tank 14 that is in contact with it, the water in the continuous recirculated cooling water case 14 of cycle cooling system makes it keep low-temperature condition.When this full electrical compressor-free civil air conditioner heats, the electronics of semiconductor chip 25 inside is to another direction strenuous exercise, temperature near substrate 22 1 sides rises rapidly, and the temperature of cold-storage sheet 24 rising rapidly by the conductive post 23 that is connected on the substrate 22, the wind that is blown out by blower fan 10 blows out indoor set shell 1 after cold-storage sheet 24 becomes hot blast again; Semiconductor chip 25 descends rapidly away from the temperature of substrate 22 1 sides simultaneously, produce evaporation water and behind tank 12, drain into water butt 17 equally, in the tank 12 after a spot of water natural evaporation, can enter indoor, indoor comparatively dry situation when having changed existing air-conditioning and heating.
Claims (10)
1. the preparation method of a full electrical compressor-free civil air conditioner, it comprises adopts semiconductor chip as freezing and heating element, it is characterized in that: it is staggered relatively and connect its inboard by the medium that transmits temperature with two block semiconductor chips, the medium that holds temperature is installed on the medium that transmits temperature simultaneously, thereby be made into a cooling and warming chip board, at the two block semiconductor chip lateral surfaces of being close to the cooling and warming chip board cooling water tank is installed respectively then, again itself and blower fan are installed in indoor apparatus of air conditioner inside, make blower fan wind can be crossed the medium that holds temperature of cooling and warming chip board, produce cold wind or hot blast and blow out, cooling water tank is connected with the heat abstractor of air-conditioner outdoor unit inside by a water circle device that has water pump, make the heat radiation that circulated of water in the cooling water tank, thereby the face of heating of semiconductor chip is dispelled the heat.
2. full electrical compressor-free civil air conditioner, it comprises the indoor set shell (1) of air-conditioning and the casing of outdoor (8) of air-conditioning, it is characterized in that: the top in indoor set shell (1) is provided with cooling and warming chip board (9), be close to cooling and warming chip board (9) two sides and be provided with cooling water tank (14), middle part in indoor set shell (1) is provided with blower fan (10), bottom in indoor set shell (1) is provided with control circuit board (11), be provided with heat abstractor in casing of outdoor (8), cooling water tank (14) is connected with heat abstractor by the water circle device that has water pump.
3. full electrical compressor-free civil air conditioner according to claim 2 is characterized in that: the medium, semiconductor chip (25), the heat insulation silica gel (26) that hold temperature that the formation of described cooling and warming chip board (9) comprises the medium of the transmission temperature that is made of two substrates (22) and two conductive post (23), is made of cold-storage sheet (24); Every substrate (22) is inboard to be connected with a conductive post (23) one ends, connect by the coupling slot of opening in its other end (27) between two conductive post (23), on conductive post (23), be embedded with cold-storage sheet (24), between substrate (22) outside and cooling water tank (14), be provided with semiconductor chip (25) and heat insulation silica gel (26), and heat insulation silica gel (26) is located at the both ends of semiconductor chip (25).
4. full electrical compressor-free civil air conditioner according to claim 3 is characterized in that: the quantity of described cooling and warming chip board (9) is 1～10, and is arranged on the top in the indoor set shell (1) obliquely.
5. full electrical compressor-free civil air conditioner according to claim 2 is characterized in that: the formation of described water circle device comprises: tank (12), drainpipe (13), drainage hot channel (15), current drainage pipeline (16), water butt (17), water pump (18), outlet pipe (19); Tank (12) level is located at the lower limb of cooling and warming chip board (9), and be connected with the water butt (17) of being located at blower fan (10) bottom by drainpipe (13), the evaporation water of the generation when being used to collect air conditioner refrigerating, the lower end of cooling water tank (14) is connected by the delivery port of drainage heat dissipation channel (15) heat abstractor interior with being located at casing of outdoor (8), its upper end is connected with water butt (17) by current drainage pipeline (16), water butt (17) also is connected with the water inlet of the water pump of being located at its side (18), the delivery port of water pump (18) is connected with the water inlet of heat abstractor by outlet pipe (19), the face of heating carries out radiating treatment when coming air conditioner refrigerating, and water pump (18) is connected with the output of control circuit board (11).
6. full electrical compressor-free civil air conditioner according to claim 5 is characterized in that: the formation of described heat abstractor comprises: be located at a side in the casing of outdoor (8) radiator (20), be located at the electric fan (21) of radiator (20) rear side; The lower end of cooling water tank (14) is connected with radiator (20) top by drainage heat dissipation channel (15), and the delivery port of water pump (18) is connected with the bottom of radiator (20) by outlet pipe (19).
7. full electrical compressor-free civil air conditioner according to claim 6, it is characterized in that: on electric fan (21), also be provided with temperature detect switch (TDS) (28), on cooling and warming chip board (9), be provided with temperature control chip (tR1), on the air inlet of blower fan (10), be provided with temperature control chip (tR2), also be provided with wind direction board (2) and the shutter (3) of regulating wind direction in indoor set shell (1) upper surface, connect and be used to drive the wind direction motor (4) and the time switch motor (5) of wind direction board (2) and shutter (3) respectively, be located at the control display floater (6) that middle part, indoor set shell (1) surface is used to observe and regulate the air-conditioning work state, be located at the air intake Air Filter (7) of the surperficial bottom of indoor set shell (1), time switch motor (5) all is connected with the output of control circuit board (11) with blower fan (8).
8. full electrical compressor-free civil air conditioner according to claim 7, it is characterized in that: the formation of described control circuit board (11) comprises the master switch (K) that connects attaching plug, choking-winding (L1), (L2), pile (UR1) by the rectifier bridge that four diodes (D) and four electric capacity (C) are formed, electrochemical capacitor (C1), (C2), (C3), controllable silicon (KG), induction by current coil (L3), time-delay converter (B), semiconductor chip (25), small-power power transformer (T), the full-wave rectification unit of forming by four diodes (D) (UR2), inductance (L4), s operation control chip (U1), the relay (J2) of control time switch motor (5), the relay (J3) of control wind direction motor (4), the relay (J4) of control blower fan (10), temperature control chip (tR1), (tR2), the operating unit (U2) and the display unit (U3) that are connected with control display floater (6); Master switch (K) is through choking-winding (L1), (L2) back is connected with the input of rectifier bridge heap (UR1), the output of rectifier bridge heap (UR1) is attempted by electrochemical capacitor (C1) two ends, one end of rectifier bridge heap (UR1) output is connected with the anode of controllable silicon (KG), the other end is connected with time-delay converter (B), the negative electrode of controllable silicon (KG) is connected with time-delay converter (B) behind induction by current coil (L3), the output of time-delay converter (B) is connected with the power input of semiconductor chip (25), master switch (K) passes through again by small-power power transformer (T), full-wave rectification unit (UR2), electrochemical capacitor (C2), (C3) and behind the direct-flow voltage regulation unit that constitutes of inductance (L4) with s operation control chip (U1), operating unit (U2) is connected with the power input of display unit (U3), operating unit (U2) is connected with the signal input part of s operation control chip (U1), display unit (U3) is connected with the signal output part of s operation control chip (U1), master switch (K) also with the switch (K1) of water pump (18), the normally opened contact (K2) of relay (J2), the normally opened contact (K3) of relay (J3), the normally opened contact (K4) of relay (J4) also fetches its power supply; Temperature control chip (tR1), (tR2) are connected with the signal input part of s operation control chip (U1) respectively; The signal output of s operation control chip (U2) is connected with the control utmost point, relay (J2), (J3), (J4) of controllable silicon (KG) respectively.
9. full electrical compressor-free civil air conditioner according to claim 2 is characterized in that: be provided with thermal insulation board (29) between the top edge of indoor set shell (1) and blower fan (10) air inlet.
10. full electrical compressor-free civil air conditioner according to claim 3 is characterized in that: scribble one deck heat-conducting silicone grease in semiconductor chip (25) both side surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008103003595A CN101514833A (en) | 2008-02-20 | 2008-02-20 | Full electrical compressor-free civil air conditioner and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008103003595A CN101514833A (en) | 2008-02-20 | 2008-02-20 | Full electrical compressor-free civil air conditioner and manufacturing method thereof |
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| Publication Number | Publication Date |
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| CN101514833A true CN101514833A (en) | 2009-08-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNA2008103003595A Pending CN101514833A (en) | 2008-02-20 | 2008-02-20 | Full electrical compressor-free civil air conditioner and manufacturing method thereof |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102620363A (en) * | 2012-03-29 | 2012-08-01 | 广东美的环境电器制造有限公司 | Evaporation and electronic double-refrigeration cooling fan |
| CN103277862A (en) * | 2013-06-17 | 2013-09-04 | 周哲明 | Energy-saving water-cooling air conditioner |
| CN104733915A (en) * | 2013-12-23 | 2015-06-24 | 珠海格力电器股份有限公司 | Alternating current electric connecting wire and circuit board test system |
| CN106276288A (en) * | 2013-07-29 | 2017-01-04 | 吴红平 | A kind of smart code stamps the method for work of device |
| CN108592270A (en) * | 2018-05-22 | 2018-09-28 | 郑州云海信息技术有限公司 | A kind of air-conditioning |
| WO2019116156A1 (en) * | 2017-12-14 | 2019-06-20 | 周兆泰 | Semiconductor cooling or heating air conditioner |
| CN111486526A (en) * | 2020-05-27 | 2020-08-04 | 成都市蜀海天诚环保科技有限公司 | Air purification device capable of heating and cooling |
| CN115333285A (en) * | 2022-10-13 | 2022-11-11 | 四川富生汽车零部件有限公司 | Automobile-used air-blower motor end cover structure that can dispel heat |
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- 2008-02-20 CN CNA2008103003595A patent/CN101514833A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102620363A (en) * | 2012-03-29 | 2012-08-01 | 广东美的环境电器制造有限公司 | Evaporation and electronic double-refrigeration cooling fan |
| CN102620363B (en) * | 2012-03-29 | 2014-10-29 | 广东美的环境电器制造有限公司 | Evaporative and electronic double refrigeration cooling fan |
| CN103277862A (en) * | 2013-06-17 | 2013-09-04 | 周哲明 | Energy-saving water-cooling air conditioner |
| WO2014201973A1 (en) * | 2013-06-17 | 2014-12-24 | Zhou Zheming | Energy-saving water-cooled air-conditioner |
| CN106276288B (en) * | 2013-07-29 | 2018-06-26 | 陈铁红 | A kind of smart code stamps the method for work of device |
| CN106276288A (en) * | 2013-07-29 | 2017-01-04 | 吴红平 | A kind of smart code stamps the method for work of device |
| CN104733915A (en) * | 2013-12-23 | 2015-06-24 | 珠海格力电器股份有限公司 | Alternating current electric connecting wire and circuit board test system |
| WO2019116156A1 (en) * | 2017-12-14 | 2019-06-20 | 周兆泰 | Semiconductor cooling or heating air conditioner |
| CN110662924A (en) * | 2017-12-14 | 2020-01-07 | 周兆泰 | Semiconductor refrigerating and heating air conditioner |
| US11841166B2 (en) * | 2017-12-14 | 2023-12-12 | Siu Tai Chau | Semiconductor refrigeration and heating air conditioner |
| CN108592270A (en) * | 2018-05-22 | 2018-09-28 | 郑州云海信息技术有限公司 | A kind of air-conditioning |
| CN111486526A (en) * | 2020-05-27 | 2020-08-04 | 成都市蜀海天诚环保科技有限公司 | Air purification device capable of heating and cooling |
| CN115333285A (en) * | 2022-10-13 | 2022-11-11 | 四川富生汽车零部件有限公司 | Automobile-used air-blower motor end cover structure that can dispel heat |
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