CN209606932U - A kind of radiator and server radiating system - Google Patents
A kind of radiator and server radiating system Download PDFInfo
- Publication number
- CN209606932U CN209606932U CN201920767746.3U CN201920767746U CN209606932U CN 209606932 U CN209606932 U CN 209606932U CN 201920767746 U CN201920767746 U CN 201920767746U CN 209606932 U CN209606932 U CN 209606932U
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- heat pipe
- heat
- mounting groove
- pedestal
- bottom plate
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Abstract
The utility model relates to technical field of heat dissipation, in particular to a kind of radiator and server radiating system.A kind of radiator, including pedestal, bottom plate and multiple heat pipes.Multiple mounting grooves for being used to install heat pipe are provided on pedestal, mounting groove is arranged in a one-to-one correspondence with heat pipe;Bottom plate is arranged in the side that pedestal has mounting groove, and with the heat pipe that is located in mounting groove against.It between heat pipe and bottom plate and is face contact between heat pipe and mounting groove.The heat spreader structures are simple, easy to use, can effectively improve the heat dissipation performance of the radiator.
Description
Technical field
The utility model relates to technical field of heat dissipation, in particular to a kind of radiator and server radiating system.
Background technique
With the development of communication technology, electronic equipment computing function is increasing, and corresponding CPU heating power consumption is also increasingly
Greatly.A kind of heat conducting element of the heat pipe as high conduction, thermal coefficient can achieve 20000w/ (m.k), apply on a heat sink
It is more and more extensive.
But in the prior art, the assembly method between heat pipe and substrate is welding, and it is small that there are contact surfaces, thermal contact resistance
Big problem.
Utility model content
The purpose of this utility model includes providing a kind of radiator, can effectively improve the thermal diffusivity of the radiator
Energy.
The purpose of this utility model further includes providing a kind of server radiating system, which passes through
The heat dissipation performance of server can be effectively improved using above-mentioned radiator.
The embodiments of the present invention this can be implemented so that
The embodiments of the present invention provide a kind of radiator, including pedestal, bottom plate and multiple heat pipes;
Multiple mounting grooves for being used to install heat pipe are provided on pedestal, mounting groove is arranged in a one-to-one correspondence with heat pipe;Bottom plate is set
Set in the side that pedestal has mounting groove, and be located at mounting groove in heat pipe against;
It between heat pipe and bottom plate and is face contact between heat pipe and mounting groove.
The radiator includes multiple heat pipes for heat dissipation, and the peace that multiple heat pipes are mounted on the base correspondingly
In tankage.It is additionally provided with bottom plate in the side that pedestal has mounting groove simultaneously, it, being capable of opposite heat tube by the connection of bottom plate and pedestal
Play fixed effect.In addition, when bottom plate is fixed on the base, bottom plate and the heat pipe face contact being located in mounting groove, simultaneously
Under the fixed function of bottom plate, the outer peripheral surface of heat pipe is enabled to be bonded with the cell wall of mounting groove, so that heat pipe and bottom plate
Between and the way of contact between heat pipe and mounting groove be face contact, as a result, by increasing the heat of heat pipe and pedestal and bottom plate
Contact area can be shifted into heat pipe from bottom plate and base plate convenient for heat, and then can effectively improve the performance of heat dissipation.
Optionally, each heat pipe includes curved section and two straight type segmentations, and two straight type segmentations divide with bending respectively
The both ends connection of section;
Curved section is used to cooperate with corresponding mounting groove, and mounting groove is the arc with the shape adaptation of curved section
Slot.
Optionally, bottom plate is right against the arc being provided at the crooked position of curved section for being bonded with crooked position
Plate.
Optionally, the groove body both ends of each mounting groove are provided with the through-hole through pedestal, and through-hole is used to stretch for the segmentation of straight type
Pedestal out.
Optionally, the face of each curved section and contacts baseplate is plane.
Optionally, straight type segmentation is vertical with plane.
Optionally, pedestal is connected with multiple heat conducting pipes backwards to the side of mounting groove.
Optionally, multiple heat pipes are arranged side by side along the installation direction of heat pipe;
Along the installation direction of heat pipe, between the length of heat conducting pipe is greater than or equal between the heat pipe at installation direction both ends
Every.
Optionally, bottom plate and heat conducting pipe are made of copper.
The embodiments of the present invention additionally provide a kind of server radiating system, which includes above-mentioned
Radiator.
The radiator of the utility model embodiment and the beneficial effect of server radiating system include that can effectively improve scattered
Hot property.
Detailed description of the invention
It, below will be to use required in embodiment in order to illustrate more clearly of the technical solution of the utility model embodiment
Attached drawing be briefly described, it should be understood that the following drawings illustrates only some embodiments of the utility model, therefore should not be by
Regard the restriction to range as, for those of ordinary skill in the art, without creative efforts, may be used also
To obtain other relevant attached drawings according to these attached drawings.
Fig. 1 is the structural schematic diagram of radiator in the utility model embodiment;
Fig. 2 is the decomposition diagram of radiator in the utility model embodiment;
Fig. 3 is the schematic diagram of pedestal in the utility model embodiment;
Fig. 4 is the schematic diagram of pedestal in the utility model embodiment;
Fig. 5 is the structural schematic diagram of heat pipe in the utility model embodiment;
Fig. 6 is the structural schematic diagram of the utility model embodiment insole board;
Fig. 7 is the scheme of installation of heat conducting pipe in the utility model embodiment.
Icon: 200- radiator;210- pedestal;220- bottom plate;230- heat pipe;240- heat conducting pipe;250- fin;211- peace
Tankage;212- through-hole;213- groove;221- arc panel;231- curved section;The straight type segmentation of 232-;233- plane.
Specific embodiment
It is practical new below in conjunction with this to keep the objectives, technical solutions, and advantages of the embodiments of the present invention clearer
Attached drawing in type embodiment, the technical scheme in the utility model embodiment is clearly and completely described, it is clear that is retouched
The embodiment stated is the utility model a part of the embodiment, instead of all the embodiments.Usually here in attached drawing description and
The component of the utility model embodiment shown can be arranged and be designed with a variety of different configurations.
Therefore, requirement is not intended to limit to the detailed description of the embodiments of the present invention provided in the accompanying drawings below
The scope of the utility model of protection, but it is merely representative of the selected embodiment of the utility model.Based in the utility model
Embodiment, every other embodiment obtained by those of ordinary skill in the art without making creative efforts, all
Belong to the range of the utility model protection.
It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, does not then need that it is further defined and explained in subsequent attached drawing.
In the description of the present invention, it should be noted that if there is the instruction such as term " on ", "lower", "inner", "outside"
Orientation or positional relationship be based on the orientation or positional relationship shown in the drawings or the utility model product use when it is usual
The orientation or positional relationship put, is merely for convenience of describing the present invention and simplifying the description, rather than indication or suggestion institute
The device or element of finger must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as to this reality
With novel limitation.
In addition, being only used for distinguishing description if there is term " first ", " second " etc., it is not understood to indicate or imply phase
To importance.
It should be noted that in the absence of conflict, the feature in the embodiments of the present invention can be combined with each other.
With the development of communication technology, electronic equipment computing function is increasing, and corresponding CPU heating power consumption is also increasingly
Greatly.A kind of heat conducting element of the heat pipe as high conduction, thermal coefficient can achieve 20000w/ (m.k), apply on a heat sink
It is more and more extensive.
Traditional mode heat pipe is attached on substrate using the form simply inlayed or welded, the heat of heat pipe can be realized
Amount conduction.But as the heating power consumption of chip is increasing, the arrangement of heat pipe quantity and the fitting of heat pipe and substrate requirement
It is higher and higher.
230 sandwich of heat pipe is embedded in and is pacified using the aluminum substrate of die casting profiling and the copper base of extruding profiling by this programme
It fills and integrally welded, effectively reduces the thermal contact resistance of assembly building, while lateral in the other side of die casting aluminum substrate arrangement
Heat is diffused into all heat pipes 230 from the chip position of concentration, improves heat dissipation performance by heat pipe 230.
Fig. 1 and Fig. 2 is please referred to, Fig. 1 is the structural schematic diagram of radiator in the utility model embodiment, and Fig. 2 is that this is practical
The decomposition diagram of radiator in new embodiment;A kind of radiator 200 is present embodiments provided, which can use
In server radiating system comprising pedestal 210, bottom plate 220 and multiple heat pipes 230.
Referring to figure 3. and Fig. 4, Fig. 3 are the schematic diagram of pedestal in the utility model embodiment, and Fig. 4 is that the utility model is real
Apply the schematic diagram of pedestal in example;Be provided on pedestal 210 it is multiple for installing the mounting grooves 211 of heat pipe 230, mounting groove 211 with
Heat pipe 230 is arranged in a one-to-one correspondence;Bottom plate 220 is arranged in the side that pedestal 210 has mounting groove 211, and be located at mounting groove 211
Interior heat pipe 230 against;It is face contact between heat pipe 230 and bottom plate 220 and between heat pipe 230 and mounting groove 211.
The radiator 200 includes multiple heat pipes 230 for heat dissipation, and multiple heat pipes 230 are mounted on correspondingly
In mounting groove 211 on pedestal 210.It is additionally provided with bottom plate 220 in the side that pedestal 210 has mounting groove 211 simultaneously, passes through bottom
The connection of plate 220 and pedestal 210, can opposite heat tube 230 play fixed effect.In addition, being fixed on pedestal 210 in bottom plate 220
When upper, bottom plate 220 and 230 face contact of heat pipe being located in mounting groove 211, while under the fixed function of bottom plate 220, it can make
The outer peripheral surface of heat pipe 230 is bonded with the cell wall of mounting groove 211 so that between heat pipe 230 and bottom plate 220 and heat pipe 230
The way of contact between mounting groove 211 is face contact, as a result, by increasing heat pipe 230 and pedestal 210 and bottom plate 220
Thermocontact area can be shifted into heat pipe 230 from bottom plate 220 and pedestal 210 convenient for heat, and then can effectively improve heat dissipation
Performance.
Referring to figure 5., Fig. 5 is the structural schematic diagram of heat pipe in the utility model embodiment;When heat pipe 230 is arranged, In
In the present embodiment, the structure type of multiple heat pipes 230 is identical, and each heat pipe 230 includes curved section 231 and two straight types
Segmentation 232, two straight type segmentations 232 are connect with the both ends of curved section 231 respectively;And then in two straight 232 difference of type segmentation
After being connect with the both ends of curved section 231, so that heat pipe 230 forms U-shaped structure.It should be noted that heat pipe 230 is two end seals
It closes and hollow ring structure, can mechanically change the shape of heat pipe 230, such as bending, flatten etc..
- Fig. 5 referring to figure 2., corresponding with the structure of pedestal 210 and bottom plate 220 when assembling above-mentioned heat pipe 230, heat
The curved section 231 of pipe 230 is used to cooperate with corresponding mounting groove 211, and mounting groove 211 is the shape with curved section 231
In setting, the curved shape according to heat pipe 230 is arranged, in curved section 231 for the arc groove of shape adaptation, i.e. mounting groove 211
When cooperating with mounting groove 211, enable to curved section 231 towards the side of mounting groove 211 and the contact form of mounting groove 211
For face contact, and then the heat exchange area being capable of increasing between pedestal 210 and heat pipe 230, in particular so that absorbed by pedestal 210
Heat as much as possible can be transferred in heat pipe 230, thus to improve the heat dissipation performance of the radiator 200.
Further, in the present embodiment, the heat pipe 230 being mounted on pedestal 210 can be by bottom plate 220 and pedestal
The fixation relative to pedestal 210 is realized in 210 connection, therefore in heat pipe 230 fixed by bottom plate 220, it needs to support with heat pipe 230
It leans on, while needing the activity by limiting heat pipe 230 with cooperation while bottom plate 220 and mounting groove 211.
- Fig. 6, Fig. 6 are the structural schematic diagram of the utility model embodiment insole board referring to figure 2. as a result,;In setting bottom plate
When 220, the face that each curved section 231 can be made to contact with bottom plate 220 is plane 233, that is, is increasing heat pipe 230 and bottom
While the contact area of plate 220, the heat pipe 230 being mounted on pedestal 210 can be risen in such a way that plane 233 contacts
To the effect of limit.It is used for and crooked position secondly, being provided at the crooked position that bottom plate 220 is right against curved section 231
The arc panel 221 of fitting, so as to pass through, plane 233 is contacted and the setting of arc panel 221 further increases and heat pipe 230
Between heat exchange area, improve radiating efficiency.It should be noted that straight type segmentation 232 is when straight type segmentation 232 are arranged
Curved section 231 can be vertical with the plane 233 that curved section 231 is contacted with bottom plate 220 after docking.
From the foregoing it can be that in the present embodiment, heat pipe 230 includes curved section 231 and straight type segmentation 232, curved
When song segmentation 231 cooperates with mounting groove 211 and bottom plate 220, for the installation convenient for straight type segmentation 232, therefore in each mounting groove 211
Groove body both ends be provided with the through-hole 212 through pedestal 210, through-hole 212 is used to pass through for straight type segmentation 232.And straight type
Segmentation 232 is equipped with radiating fin 250 by the part after the stretching pedestal 210 of through-hole 212.
Further, referring to figure 4. and Fig. 7, Fig. 7 be the utility model embodiment in heat conducting pipe scheme of installation;For
Heat is uniformly transferred to multiple heat pipes 230, therefore in the present embodiment, in pedestal 210 backwards to the side of mounting groove 211
Multiple heat conducting pipes 240 are connected with, multiple heat conducting pipes 240 are arranged in the groove 213 of the side, and multiple heat pipes 230 are along heat pipe 230
Installation direction is arranged side by side;Along the installation direction of heat pipe 230, the length of heat conducting pipe 240 is greater than or equal at installation direction both ends
Heat pipe 230 between interval.It, can be by the heat on pedestal 210 along the arrangement of heat pipe 230 by the setting of heat conducting pipe 240
Direction is transferred in each heat pipe 230, to improve the efficiency of heat dissipation.
For the efficiency for further increasing heat dissipation, when making bottom plate 220 and heat conducting pipe 240, bottom plate 220 and heat conducting pipe 240
It can be selected and be made of copper.
In conclusion the utility model embodiment provides a kind of radiator 200, the radiator 200 include pedestal 210,
Bottom plate 220 and seven heat pipes 230.
Firstly, each heat pipe 230 includes curved section 231 and two straight types that 231 both ends of curved section are arranged in
Segmentation 232;And seven are provided on pedestal 210 for corresponding the mounting groove 211 of installation heat pipe 230, and during installation,
The curved section 231 of heat pipe 230 is mounted in mounting groove 211, and mounting groove 211 has shape compatible with curved section 231
Shape, i.e. mounting groove 211 are the arc groove being adapted with curved section 231;Secondly, being provided at each 211 both ends of mounting groove
Through-hole 212, through-hole 212, which is used to be segmented 232 both ends for the straight type at 231 both ends of curved section being mounted in mounting groove 211, to be passed through,
Straight type segmentation 232 can be used for connecting with radiating fin 250 after being stretched out by through-hole 212.
Bottom plate 220 is mounted on the side that pedestal 210 is provided with mounting groove 211, and can be used for and be located in mounting groove 211
The curved section 231 of heat pipe 230 is against and being arranged to plane for the part that contacts with bottom plate 220 in curved section 231
233, so that the contact between bottom plate 220 and heat pipe 230 is face contact.
Secondly, in pedestal 210, backwards to the connection of the side of mounting groove 211, there are two heat conducting pipes 240, and two heat pipes 230 are along warm
The installation direction of pipe 230 is arranged side by side;And along the installation direction of heat pipe 230, the length of heat conducting pipe 240, which is greater than or equal to, is pacifying
Fill the interval between the heat pipe 230 at direction both ends.It, can be by the heat on pedestal 210 along heat pipe by the setting of heat conducting pipe 240
230 arranged direction is transferred in each heat pipe 230, to improve the efficiency of heat dissipation.
And then by above-mentioned structure, the contact form between heat pipe 230 and pedestal 210 and bottom plate 220 is enabled to
For face contact, and then it can be improved the heat exchange area between heat pipe 230 and pedestal 210 and bottom plate 220, so as to improve heat exchange
Efficiency, and then improve the heat dissipation performance of the radiator 200.
The radiator 200 is at work: chip fever transfers heat to bottom plate 220, and bottom plate 220 is fitted in heat pipe 230
Bottom, the liquid evaporation internal after absorbing heat of heat pipe 230 is at steam, steam uplink;
Cooling air passes through fin 250, while cooling down to 230 inner wall of heat pipe, and the steam in heat pipe 230 is condensed into liquid
Liquid is sucked back bottom, evaporated again in cycles by state, the capillary force that the copper powder structure being sintered by inner wall generates.
Above description is only a specific implementation of the present invention, but the protection scope of the utility model is not limited to
In this, anyone skilled in the art within the technical scope disclosed by the utility model, the change that can be readily occurred in
Change or replace, should be covered within the scope of the utility model.Therefore, the protection scope of the utility model should be with described
Subject to scope of protection of the claims.
Claims (10)
1. a kind of radiator characterized by comprising
Pedestal, bottom plate and multiple heat pipes;
It is provided on the pedestal multiple for installing the mounting groove of the heat pipe, the mounting groove and heat pipe one-to-one correspondence
Setting;The bottom plate is arranged in the side that the pedestal has the mounting groove, and with the heat that is located in the mounting groove
Pipe against;
It is face contact between the heat pipe and the bottom plate and between the heat pipe and the mounting groove.
2. radiator according to claim 1, it is characterised in that:
Each heat pipe includes curved section and two straight type segmentations, and two straight type segmentations divide with the bending respectively
The both ends connection of section;
The curved section is used to cooperate with corresponding mounting groove, and the mounting groove is suitable with the shape of the curved section
The arc groove matched.
3. radiator according to claim 2, it is characterised in that:
The bottom plate is right against the arc panel being provided at the crooked position of the curved section for being bonded with crooked position.
4. radiator according to claim 2, it is characterised in that:
The groove body both ends of each mounting groove are provided with the through-hole through the pedestal, and the through-hole is used for for the straight type point
Section stretches out the pedestal.
5. radiator according to claim 2, it is characterised in that:
The face of each curved section and the contacts baseplate is plane.
6. radiator according to claim 5, it is characterised in that:
The straight type segmentation is vertical with the plane.
7. radiator described in any one of -6 according to claim 1, it is characterised in that:
The pedestal is connected with multiple heat conducting pipes backwards to the side of the mounting groove.
8. radiator according to claim 7, it is characterised in that:
Multiple heat pipes are arranged side by side along the installation direction of the heat pipe;
Along the installation direction of the heat pipe, the length of the heat conducting pipe be greater than or equal to installation direction both ends the heat pipe it
Between interval.
9. radiator according to claim 8, it is characterised in that:
The bottom plate and the heat conducting pipe are made of copper.
10. a kind of server radiating system, it is characterised in that:
The server radiating system includes the radiator as described in any one of claim 1-9.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201920767746.3U CN209606932U (en) | 2019-05-27 | 2019-05-27 | A kind of radiator and server radiating system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201920767746.3U CN209606932U (en) | 2019-05-27 | 2019-05-27 | A kind of radiator and server radiating system |
Publications (1)
Publication Number | Publication Date |
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CN209606932U true CN209606932U (en) | 2019-11-08 |
Family
ID=68408192
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CN201920767746.3U Active CN209606932U (en) | 2019-05-27 | 2019-05-27 | A kind of radiator and server radiating system |
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CN (1) | CN209606932U (en) |
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2019
- 2019-05-27 CN CN201920767746.3U patent/CN209606932U/en active Active
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