CN110703890A - Radiator based on dragon core processor - Google Patents
Radiator based on dragon core processor Download PDFInfo
- Publication number
- CN110703890A CN110703890A CN201911230450.9A CN201911230450A CN110703890A CN 110703890 A CN110703890 A CN 110703890A CN 201911230450 A CN201911230450 A CN 201911230450A CN 110703890 A CN110703890 A CN 110703890A
- Authority
- CN
- China
- Prior art keywords
- water
- radiating
- copper pipe
- air
- condensing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/30—Monitoring
- G06F11/3058—Monitoring arrangements for monitoring environmental properties or parameters of the computing system or of the computing system component, e.g. monitoring of power, currents, temperature, humidity, position, vibrations
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Computing Systems (AREA)
- Quality & Reliability (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a radiator based on a Loongson processor, which comprises a radiating device and a condensing device, wherein the radiating device is connected with the condensing device through a connecting water pipe, the radiating device comprises a radiating fan, a radiating fin, a water-cooling copper pipe, an air-cooling copper pipe and a bottom plate, the condensing device comprises a condensing fan, a condensing shell, a condensing copper pipe and a condensing bottom plate, and the radiator adopts a radiating mode that air-cooling radiation is taken as a main part and water-cooling radiation is taken as an auxiliary part, so that the problem that heat accumulation generated when electronic elements, memory banks and a GPU (graphics processing unit) on a mainboard work is difficult to dissipate can be solved, and the problem that the performance of the processor is influenced because insufficient heat dissipation is generated when a middle.
Description
Technical Field
The invention relates to the field of processor heat dissipation devices, in particular to a radiator based on a Loongson processor.
Background
The radiator of the Loongson processor in the market at present mainly adopts an air-cooled radiating mode, because the radiator is limited by the volume, a used radiating fan is smaller, the provided air quantity is insufficient, the radiating effect is poor, the radiating effect of the water-cooled radiating fan on the Loongson processor is superior to that of the air-cooled radiator, but the water-cooled radiating fan cannot radiate the electronic elements on a mainboard, the Loongson processor not only can generate heat by itself when working, but also can generate heat by the electronic elements, memory banks, GPU and the like on the mainboard, if the generated heat is not accumulated, the computer performance can be reduced, in addition, along with the increasingly superior performance of the Loongson processor, the computing capacity of the Loongson processor is greatly improved, the corresponding Loongson processor has increasingly high radiating requirement on the radiator, and a large amount of heat is generated by the middle-high-, if the heat is not dissipated in time, the performance of the Loongson processor is affected, and how to improve the heat dissipation capacity of the radiator and ensure the normal work of the Loongson processor under the condition that the size of the radiator is limited.
Publication No.: CN106708217A, in particular to a CPU heat dissipation suit, which uses simple air cooling for heat dissipation, only can accomplish the heat dissipation of a low-end CPU, the invention is not good for the heat generated by a middle-end and high-end CPU during working, the invention can not solve the problem that the work of electronic elements, memory banks, GPUs and the like on a mainboard can also generate heat, if the generated heat is not accumulated and dissipated, the situation of computer performance reduction can occur, and the situation that the heat is not dissipated in time and the performance of a processor is influenced can also not be solved when a large amount of heat is generated by a middle-end and high-end processor during working.
Disclosure of Invention
The invention aims to provide a radiator based on a Loongson processor, which can solve the problems that electronic elements, memory banks, a GPU and the like on a mainboard can generate heat, if the generated heat is not accumulated, the performance of a computer is reduced, and the computing capacity of the Loongson processor is improved to a great extent along with the more and more excellent performance of the Loongson processor, the corresponding Loongson processor has higher and higher radiating requirements on the radiator, a large amount of heat is generated when the middle-high-end Loongson processor works, and the heat is not dissipated in time, so that the performance of the Loongson processor is influenced.
The purpose of the invention can be realized by the following technical scheme:
a radiator based on a Loongson processor comprises a radiating device and a condensing device, wherein the radiating device comprises a radiating fan, radiating fins and a bottom plate, the radiating fan is installed inside a radiating fan shell, four radiating fan supports are installed inside the radiating fan shell, the four radiating fan supports are sequentially welded to obtain a hollow square frame located below the radiating fan, the hollow square frame is welded and fixed with the radiating fan shell, a radiating fan bottom plate is installed on the outer side of the radiating fan shell, the four radiating fan bottom plates are welded and fixed at the four corners of the radiating fan shell, fixing clamps are welded on the surfaces of the four radiating fan bottom plates, and a radiating fin fixing plate is welded between every two adjacent radiating fan bottom plates;
the radiating fins are arranged below a radiating fan base plate, the radiating fins are not in direct contact with the radiating fan base plate, radiating fin fixing plates are arranged on the periphery of the top of the radiating fins and are in direct contact with the radiating fins, the four radiating fin fixing plates are fixed with the radiating fan base plate through fixing clamps, the radiating fins are composed of a plurality of radiating baffles which are uniformly distributed at equal intervals, and five radiating fin through holes which are uniformly distributed are sequentially a first radiating fin through hole, a second radiating fin through hole, a third radiating fin through hole, a fourth radiating fin through hole and a fifth radiating fin through hole on the surface of the radiating fins; the T-shaped radiating fin fixing plates are arranged at the same sides of the five radiating fin through holes, radiating fin supporting plates are welded at the four corners of the T-shaped radiating fin fixing plates, the radiating fin supporting plate and the T-shaped radiating fin fixing plate are positioned at the same horizontal height and are positioned at the bottom of the radiating fin, an air cooling copper pipe and a water cooling copper pipe which penetrate through the radiating fin through hole, one end of the water-cooling copper pipe is a heat dissipation water inlet, the other end of the water-cooling copper pipe is a heat dissipation water outlet, the heat dissipation water inlet and the heat dissipation water outlet are respectively provided with a water pipe connecting bolt, a first air-cooled copper pipe passes through a first heat dissipation sheet through hole, a second air-cooled copper pipe passes through a second heat dissipation sheet through hole, a water-cooled copper pipe passes through a third heat dissipation sheet through hole, a third air-cooled copper pipe passes through a fourth heat dissipation sheet through hole, a fourth air-cooled copper pipe passes through a fifth heat dissipation sheet through hole, and the first air-cooled copper pipe, the second air-cooled copper pipe, the water-cooled copper pipe, the third air-cooled copper pipe and the fourth air-cooled copper pipe sequentially form a heat exchange;
the central position of the bottom plate is provided with a chip groove which is of a quadrilateral hollow structure, the size of the chip groove is matched with that of the dragon core processor, the chip groove fixes the surface of the dragon core processor inside the bottom plate, one side of the chip groove at the bottom of the radiating fin is provided with a heat exchange sheet, the heat exchange sheet is in direct contact with the surface of the dragon core processor, silicone grease is coated between the heat exchange sheet and the dragon core processor, the bottom surface of the bottom plate is provided with a factory type fixing plate positioning groove, factory type fixing plate positioning holes which are uniformly distributed are arranged inside the factory type fixing plate positioning groove, a thread structure is arranged inside the factory type fixing plate positioning hole, the factory type fixing plate is provided with a plurality of uniformly distributed heat dissipation fixing holes, and a bottom plate fixing nut fixes the factory type fixing plate inside the factory type fixing plate positioning groove through the heat dissipation fixing holes and, the heat dissipation fixing nut fixes the bottom plate on the main board through the heat dissipation fixing hole;
the condensing device comprises a condensing fan, a condensing shell and a condensing bottom plate, wherein the upper end of the condensing shell is provided with a condensing fan mounting plate, the central position of the condensing fan mounting plate is provided with a round hole, two parallel condensing fan fixing plates are fixedly welded inside the round hole, two condensing fan supporting rods are welded between the two condensing fan fixing plates, and the condensing fan is fixed inside the round hole of the condensing fan mounting plate by the condensing fan supporting rods and the condensing fan fixing plates; condensation baffles, cellular boards and U-shaped pore plates are arranged on four sides between the condensation shell and the condensation bottom plate, the cellular boards and the U-shaped pore plates are fixed by welding, the cellular boards comprise a first cellular board, a second cellular board and a third cellular board, the U-shaped pore plates comprise a first U-shaped pore plate and a second U-shaped pore plate, the first cellular board, the first U-shaped pore plate, the second cellular board, the second U-shaped pore plate and the third cellular board are sequentially connected to form a U-shaped board, the first cellular board is provided with a condensation water outlet and a condensation water inlet, one ends of the condensation water inlet and the condensation water outlet are respectively provided with a water pipe connecting bolt, condensation copper pipes are respectively arranged on the cellular boards and the inner sides of the U-shaped pore plates, condensation support plates are welded on two sides of the cellular boards and the U-shaped pore plates, the condensation support plates are provided with a plurality of condensation through holes distributed at equal intervals, the, the bottom of the honeycomb plate is provided with a condensation fixing plate, the condensation fixing plate is welded and fixed with a condensation bottom plate, four condensation bolts are arranged at four corners of the condensation bottom plate, and the condensation bolts fix a condensation device on the inner side of a computer case.
Preferably, a condensation water outlet of the condensation device is connected with a heat dissipation water inlet of the heat dissipation device through a connecting water pipe, the condensation water outlet is fixed with the connecting water pipe through a water pipe connecting bolt, and the heat dissipation water inlet is fixed with the connecting water pipe through a water pipe connecting bolt; the condensation water inlet of the condensing device is connected with the heat dissipation water outlet of the heat dissipation device through a connection water pipe, the condensation water inlet is fixed with the connection water pipe through a water pipe connection bolt, and the heat dissipation water outlet is fixed with the connection water pipe through a water pipe connection bolt.
Preferably, the cooling fan shell is of a cylindrical structure, the diameter of the bottom surface of the cylinder is matched with the size of the cooling fan, four equidistant slope-shaped wind wings are fixedly welded to the top of the cooling fan shell, and a groove is formed between every two slope-shaped wind wings.
Preferably, the surfaces of the heat dissipation baffles are provided with five heat dissipation baffle through holes which are uniformly distributed at equal intervals, symmetrical heat dissipation baffle fixing holes are formed in the bottom positions of the heat dissipation baffles, and the heat dissipation baffles are sequentially fixed through the heat dissipation baffle fixing holes to obtain the heat dissipation fins.
Preferably, one end of each of the first air-cooled copper pipe, the second air-cooled copper pipe, the third air-cooled copper pipe and the fourth air-cooled copper pipe is closed and is of a flat triangular cone structure; the first air-cooled copper pipe, the second air-cooled copper pipe, the third air-cooled copper pipe, the fourth air-cooled copper pipe and the water-cooled copper pipe are all U-shaped structures.
Preferably, the condensation copper pipes are uniformly distributed inside the condensation device, and the condensation copper pipes are provided with two openings, one is a water inlet, and the other is a water outlet.
Preferably, a water inlet pump, a water outlet pump and a water storage tank are arranged in the condensing device, the water storage tank is arranged on the surface of the condensing baffle, the water outlet pump is arranged in the water storage tank, and the water inlet pump is arranged on the surface of the condensing baffle on one side below the water outlet pump; the water inlet of the water inlet pump is connected with the condensation water inlet, the water outlet of the water inlet pump is connected with the water inlet of the water storage tank, the water outlet of the water outlet pump is connected with the water outlet of the water storage tank, the water outlet of the water storage tank is connected with the water inlet of the condensation copper pipe, and the water outlet of the condensation copper pipe is connected with the.
Preferably, the honeycomb plate is formed by welding a plurality of uniformly distributed hollow regular hexagonal shapes, the gauze is arranged on the outer surface of the honeycomb plate, the U-shaped pore plate is formed by a plurality of uniformly distributed hollow rectangles, and the gauze is arranged on the outer surface of the U-shaped pore plate.
Preferably, the working method of the heat sink includes the following steps:
the method comprises the following steps: firstly, a heat dissipation device is arranged on the surface of a Loongson processor and fixed on a mainboard, the Loongson processor is positioned in a chip groove, and then a condensing device is fixed in a host case and connected with a power supply;
step two: the dragon core processor generates heat when working, the dragon core processor is connected with a temperature sensor, the temperature sensor is electrically connected with the dragon core processor through a lead and is arranged on a heat exchange sheet, the temperature sensor detects the temperature of the dragon core processor, the temperature rises, the temperature sensor senses that the temperature exceeds a preset value, the temperature sensor feeds back information to the dragon core processor, and the dragon core processor controls the heat dissipation device and the condensing device to be started;
step three: when the radiator works, the radiating fan runs, the outside air passes through the slope-shaped wind wings and the grooves on the shell of the radiating fan, the flow rate of the air passing through the slope-shaped wind wings is different from the flow rate of the air passing through the grooves to form a certain air pressure difference, the temperature of the air entering the radiating fan is lower than that of the outside air, then the radiating fan directly blows the air into the radiating fins, the radiating fins are composed of a plurality of radiating baffles which are distributed at equal intervals, the contact area between the radiating fins and the air is increased by gaps among the radiating baffles, the radiating fins can exchange heat with the air, a large amount of heat can be generated when the core processor works, the core processor and the heat exchange fins finish heat exchange, the heat exchange fins bring the heat into the radiating fins through four air-cooling copper pipes and a water-cooling copper pipe, the air-cooling copper, the air in the radiating fins expands outwards, the internal pressure of the radiating fins is reduced, the external air passes through a groove between a slope wind wing and a slope wind wing at the top of a radiating fan shell, the air is blown into the radiating fins by the radiating fan, the heat exchange between the air and the radiating fins is rapidly carried out under the action of pressure difference, the temperature of the radiating fins is reduced, water flows through a water-cooling copper pipe, a part of heat is brought into a condensing device by the water-cooling copper pipe after primary heat exchange with the radiating fins, the water carrying the heat in the condensing device firstly enters a water storage tank through a water inlet pump, primary heat exchange is completed with the water in the water storage tank, the water enters a water inlet of a condensation copper pipe through a water outlet pump in the water storage tank, the condensation copper pipe is uniformly distributed in an S shape inside a honeycomb plate and a U-shaped pore plate, and the air flow of the condensing device is increased by, and install the gauze in honeycomb panel and U type orifice plate externally, prevented impurity such as dust from entering into condensing equipment, condensing equipment's condensing fan simultaneously, send into condensing equipment with the outside air in, under condensing fan and honeycomb panel, U type orifice plate and condenser copper pipe combined action, the water in the condenser copper pipe accomplishes the second heat transfer, back gets into in the water-cooling copper pipe through the heat dissipation water inlet, carry out the heat transfer operation to the dragon core treater, the heat transfer efficiency of water-cooling copper pipe is higher than the heat transfer efficiency of air-cooled copper pipe, according to heat-conduction's principle, water-cooling copper pipe can carry out the heat transfer to air-cooled copper pipe to a certain extent, the temperature of fin has been reduced, in addition the radiator is the formula radiator that pushes down, outside air is directly blown into the fin inside to radiator fan, to diffusion all around again, dispel.
Compared with the prior art, the invention has the beneficial effects that:
the invention uses the heat radiation mode that air-cooled heat radiation is taken as the main and water-cooled heat radiation is taken as the auxiliary, the slope-shaped wind wing and the groove arranged on the shell of the heat radiation fan can increase the air flow, and simultaneously, because of the existence of the groove, the air flow rate in the groove is different from the air flow rate at the top end of the slope-shaped wind wing and the groove, so that the temperature of the air blown into the heat radiation fins by the heat radiation fan is lower than the external temperature, and the heat radiation effect of the heat radiator is improved to a certain extent; in addition, the Loongson processor regulates the rotating speeds of the cooling fan and the condensing fan according to the temperature monitored by the temperature control element in the host case, and controls the input currents of the cooling fan and the condensing fan according to the temperature monitored by the temperature control element, so that the rotating speeds of the cooling fan and the condensing fan are controlled;
in the heat dissipation device, the water cooling copper pipe and the air cooling copper pipe are combined to obtain the heat exchange fin with a flat structure, the heat exchange fin is directly contacted with the dragon core processor through silicone grease, the heat exchange efficiency is improved, the four air cooling copper pipes and the water cooling copper pipe firstly bring heat exchanged between the heat exchange fin and the dragon core processor into the heat dissipation fin, the heat dissipation fin exchanges heat with the outside under the help of the heat dissipation fan, the water cooling copper pipe brings part of heat into the condensation device for heat exchange work, the heat exchange work is completed in the re-condensation device, the water cooling copper pipe can exchange heat for the dragon core processor and also can exchange heat for the air cooling copper pipe to a certain degree, so that when air blown into the heat dissipation fin by the heat dissipation fan is diffused to the periphery, the temperature of the air is reduced, and the;
the condensing device used by the invention cools water in a heat conduction mode, the condensing device comprises a honeycomb plate and a U-shaped pore plate, a through hole type baffle plate increases the flow of air and improves the condensing effect of the condensing device, condensing copper pipes which are arranged in an S shape and are equidistant and uniform are arranged on the inner sides of the honeycomb plate and the U-shaped pore plate, the condensing copper pipes are a copper pipe, a water inlet and a water outlet are reserved at the two ends of the copper pipe, water coming from the heat dissipation device firstly enters a water storage tank, a water pump is arranged in the water storage tank, water enters the condensing copper pipes from the water storage tank under the action of the water pump to perform first heat dissipation, then enters the condensing copper pipes to perform second heat dissipation under the combined action of the honeycomb plate, the U-shaped pore plate, the condensing copper pipes and a condensing fan, finally, the heat exchange operation is continuously performed on a dragon processor by returning to a water cooling copper pipe, and the condensing fan in the, the ventilation of host computer machine case has been increased, heat dissipation and condensation effect are improved to the cooling method of using forced air cooling as the water-cooling of giving first place to assist, not only can dispel the heat to the godson treater, also can dispel the heat to the electronic component on the mainboard.
Drawings
In order to facilitate understanding for those skilled in the art, the present invention will be further described with reference to the accompanying drawings.
FIG. 1 is a schematic diagram of a main body structure of a radiator based on a Loongson processor;
FIG. 2 is a schematic view of a fan assembly of a radiator based on a Loongson processor;
FIG. 3 is a schematic view of a heat sink structure of a godson processor-based heat sink;
FIG. 4 is a schematic diagram of a bottom plate of a godson processor-based heat sink;
FIG. 5 is a schematic diagram of an air-cooled copper pipe and a water-cooled copper pipe of a radiator based on a Loongson processor;
FIG. 6 is a schematic diagram of a main structure of a condenser based on a radiator of a Loongson processor;
FIG. 7 is a schematic view of a condenser plate of a Loongson processor-based heat sink;
FIG. 8 is a schematic view of a condenser fan of a fan-based heat sink;
FIG. 9 is a schematic view of a condenser copper tube of a fan core processor based heat sink;
FIG. 10 is an enlarged schematic view at A of FIG. 9 of a godson processor-based heat sink;
FIG. 11 is a schematic view of a faucet based radiator water connection;
in the figure: 1. a radiator fan support; 2. a heat radiation fan; 3. a heat dissipation fan housing; 4. a fixing clip; 5. a heat dissipation fan base plate; 6. a heat sink fixing plate; 7. a base plate; 71. a factory-type fixing plate; 711. a heat dissipation fixing hole; 72. a chip slot; 73. a positioning groove of the factory-type fixing plate; 8. a heat sink; 81. a first fin through hole; 82. a second heat sink through hole; 83. a third fin through hole; 84. a fourth heat sink through hole; 85. a fifth fin through hole; 9. water-cooling the copper pipe; 10. air-cooling the copper pipe; 101. a first air-cooled copper tube; 102. a second air-cooled copper pipe; 103. a third air-cooled copper tube; 104. a fourth air-cooled copper tube; 11. a heat sink supporting plate; 12. a heat dissipation water inlet; 13. a heat dissipation water outlet; 14. a condensation water outlet; 15. a condensation water inlet; 16. a condensation baffle; 17. a condensing shell; 18. a condensing fan; 181. a condensing fan fixing plate; 19. a condensing fan mounting plate; 20. a U-shaped orifice plate; 201. a first U-shaped orifice plate; 202. a second U-shaped orifice plate; 21. a honeycomb panel; 211. a first honeycomb panel; 212. a second cellular board; 213. a third cellular board; 22. a T-shaped radiating fin fixing plate; 23. a base plate fixing nut; 24. a heat dissipation fixing nut; 25. a condensing floor; 26. a condensing bolt; 27. a condensation fixing plate; 28. a condensing support plate; 29. condensing the copper pipe; 30. connecting a water pipe; 31. the water pipe is connected with the bolt.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the following embodiments, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-11, a radiator based on a core processor comprises a heat dissipation device and a condensation device, the heat dissipation device comprises a heat dissipation fan 2, a heat dissipation fin 8 and a bottom plate 7, the heat dissipation fan 2 is installed inside a heat dissipation fan housing 3, the heat dissipation fan housing 3 is a cylindrical structure, the diameter of the bottom surface of the cylinder is matched with the size of the heat dissipation fan 2, four equidistant slope-shaped wind wings are welded and fixed on the top of the heat dissipation fan housing 3, a groove is arranged between every two slope-shaped wind wings, four heat dissipation fan brackets 1 are installed inside the heat dissipation fan housing 3, the four heat dissipation fan brackets 1 are sequentially welded to obtain a hollow square frame below the heat dissipation fan 2, the hollow square frame is welded and fixed with the heat dissipation fan housing 3, a heat dissipation fan bottom plate 5 is installed outside the heat dissipation fan housing 3, the four heat dissipation fan bottom plates 5, the surface of each of the four radiating fan bottom plates 5 is welded with a fixing clamp 4, and a radiating fin fixing plate 6 is welded between every two adjacent radiating fan bottom plates 5;
the radiating fins 8 are arranged below a radiating fan bottom plate 5, the radiating fins 8 are not in direct contact with the radiating fan bottom plate 5, radiating fin fixing plates 6 are arranged at the periphery of the top of the radiating fins 8, the radiating fin fixing plates 6 are in direct contact with the radiating fins 8, four radiating fin fixing plates 6 are fixed with the radiating fan bottom plate 5 through fixing clamps 4, the radiating fins 8 are composed of a plurality of radiating baffles which are uniformly distributed at equal intervals, five radiating baffle through holes which are uniformly distributed at equal intervals are arranged on the surfaces of the plurality of radiating baffles, symmetrical radiating baffle fixing holes are arranged at the bottom of the radiating baffles, and the radiating fins 8 are obtained by sequentially fixing the plurality of radiating baffles through the, the radiating fin baffle through holes are sequentially formed to obtain a first radiating fin through hole 81, a second radiating fin through hole 82, a third radiating fin through hole 83, a fourth radiating fin through hole 84 and a fifth radiating fin through hole 85 of the radiating fin 8; the T-shaped heat sink fixing plate 22 is mounted on the same side of the five heat sink through holes, heat sink supporting plates 11 are welded at four corners of the T-shaped heat sink fixing plate 22, the heat sink supporting plates 11 and the T-shaped heat sink fixing plate 22 are located at the same horizontal height and located at the bottom of the heat sink 8, air-cooled copper pipes 10 and water-cooled copper pipes 9 penetrate through the heat sink through holes, one end of each water-cooled copper pipe 9 is a heat sink water inlet 12, the other end of each water-cooled copper pipe 9 is a heat sink water outlet 13, water pipe connecting bolts 31 are mounted on the heat sink water inlets 12 and the heat sink water outlets 13, a first air-cooled copper pipe 101 penetrates through a first heat sink through hole 81, a second air-cooled copper pipe 102 penetrates through a second heat sink through hole 82, the water-cooled copper pipe 9 penetrates through a third heat sink through hole 83, a, One end of the second air-cooled copper pipe 102, one end of the third air-cooled copper pipe 103 and one end of the fourth air-cooled copper pipe 104 are sealed and are in flat triangular cone structures; the first air-cooled copper pipe 101, the second air-cooled copper pipe 102, the third air-cooled copper pipe 103, the fourth air-cooled copper pipe 104 and the water-cooled copper pipe 9 are all U-shaped structures, and the first air-cooled copper pipe 101, the second air-cooled copper pipe 102, the water-cooled copper pipe 9, the third air-cooled copper pipe 103 and the fourth air-cooled copper pipe 104 sequentially form heat exchange fins with flat structures;
a chip groove 72 is arranged at the central position of the bottom plate 7, the chip groove 72 is of a quadrilateral hollow structure, the size of the chip groove 72 is matched with that of the Loongson processor, the surface of the Loongson processor is fixed inside the bottom plate 7 by the chip groove 72, one side of the chip groove 72 at the bottom of the radiating fin 8 is provided with a heat exchange sheet, the heat exchange sheet is directly contacted with the surface of the Loongson processor, silicone grease is coated between the heat exchange sheet and the Loongson processor, one side of the bottom plate 7 is provided with a factory type fixing plate positioning groove 73, factory type fixing plate positioning holes which are uniformly distributed are arranged inside the factory type fixing plate positioning groove 73, a thread structure is arranged inside the factory type fixing plate positioning holes, the factory type fixing plate 71 is provided with a plurality of uniformly distributed heat dissipation fixing holes 711, the bottom plate fixing nut 23 fixes the factory type fixing plate 71 inside, the heat dissipation fixing nut 24 fixes the bottom plate 7 on the main plate through the heat dissipation fixing hole 711;
the condensing device comprises a condensing fan 18, a condensing shell 17 and a condensing bottom plate 25, wherein a condensing fan mounting plate 19 is mounted at the upper end of the condensing shell 17, a round hole is formed in the center of the condensing fan mounting plate 19, two parallel condensing fan fixing plates 181 are fixedly welded inside the round hole, two condensing fan supporting rods are welded between the two condensing fan fixing plates 181, and the condensing fan 18 is fixed inside the round hole of the condensing fan mounting plate 19 by the condensing fan supporting rods and the condensing fan fixing plates 181; condensation baffles 16, a honeycomb plate 21 and a U-shaped pore plate 20 are arranged on four side surfaces between a condensation shell 17 and a condensation bottom plate 25, the honeycomb plate 21 is formed by welding a plurality of uniformly distributed regular hexagonal shapes, a gauze is arranged on the outer surface of the honeycomb plate 21, the U-shaped pore plate 20 is formed by a plurality of uniformly distributed rectangles, the gauze is arranged on the outer surface of the U-shaped pore plate 20, the honeycomb plate 21 and the U-shaped pore plate 20 are fixed by welding, the honeycomb plate 21 comprises a first honeycomb plate 211, a second honeycomb plate 212 and a third honeycomb plate 213, the U-shaped pore plate 20 comprises a first U-shaped pore plate 201 and a second U-shaped pore plate 202, the first honeycomb plate 211, the first U-shaped pore plate 201, the second honeycomb plate 212, the second U-shaped pore plate 202 and the third honeycomb plate 213 are sequentially connected to form a U-shaped plate, the first honeycomb plate 211 is provided with a condensation water outlet 14 and a condensation water inlet 15, and water pipe connecting bolts 31 are arranged at one ends of the, a condensation water outlet 14 of the condensation device is connected with a heat dissipation water inlet 12 of the heat dissipation device through a connecting water pipe 30, the condensation water outlet 14 and the connecting water pipe 30 are fixed through a water pipe connecting bolt 31, and the heat dissipation water inlet 12 and the connecting water pipe 30 are fixed through a water pipe connecting bolt 31; the condensation water inlet 15 of the condensing device is connected with the heat radiation water outlet 13 of the heat radiation device through a connecting water pipe 30, the condensation water inlet 15 is fixed with the connecting water pipe 30 through a water pipe connecting bolt 31, the heat radiation water outlet 13 is fixed with the connecting water pipe 30 through a water pipe connecting bolt 31, the inner sides of the honeycomb plate 21 and the U-shaped pore plate 20 are both provided with condensation copper pipes 29, both sides of the inner parts of the honeycomb plate 21 and the U-shaped pore plate 20 are welded with condensation support plates 28, the condensation support plates 28 are provided with a plurality of condensation through holes which are uniformly and equidistantly distributed, the condensation through holes are penetrated with the condensation copper pipes 29, the condensation copper pipes 29 are uniformly distributed in the condensing device, the condensation copper pipes 29 are provided with two openings, one is a water inlet, the other is a water outlet, the condensing device is internally provided with a water, the water inlet pump is arranged on the surface of the condensation baffle positioned on one side below the water outlet pump; the water inlet of the water inlet pump is connected with the condensation water inlet 15, the water outlet of the water inlet pump is connected with the water inlet of the water storage tank, the water outlet of the water outlet pump is connected with the water outlet of the water storage tank, the water inlet of the condensation copper pipe 29 is connected with the water outlet of the water storage tank, the condensation water outlet 14 is connected with the water outlet of the condensation copper pipe 29, the bottom of the honeycomb panel 21 is provided with a condensation fixing plate 27, the condensation fixing plate 27 is welded and fixed with a condensation bottom plate 25, four condensation bolts 26 are arranged at four corners of the.
The working method of the radiator comprises the following specific steps:
the method comprises the following steps: firstly, a heat dissipation device is arranged on the surface of a Loongson processor and fixed on a mainboard, the Loongson processor is positioned in a chip groove 72, and then a condensing device is fixed in a host case and connected with a power supply;
step two: the dragon core processor generates heat when working, the dragon core processor is connected with a temperature sensor, the temperature sensor is electrically connected with the dragon core processor through a lead and is arranged on a heat exchange sheet, the temperature sensor detects the temperature of the dragon core processor, the temperature rises, the temperature sensor senses that the temperature exceeds a preset value, the temperature sensor feeds back information to the dragon core processor, and the dragon core processor controls the heat dissipation device and the condensing device to be started; the model of the temperature sensor is DS18B 20;
step three: when the radiator works, the heat radiation fan 2 operates, the outside air firstly causes the difference between the flow speed of the air passing through the slope type wind wings and the flow speed of the air passing through the grooves on the heat radiation fan shell 3 under the action of the slope type wind wings and the grooves to form a certain air pressure difference, the temperature of the air entering the heat radiation fan 2 is lower than that of the outside air, then the heat radiation fan 2 directly blows the air into the heat radiation fins 8, the heat radiation fins 8 are composed of a plurality of heat radiation baffles distributed at equal intervals, the contact area between the heat radiation fins 8 and the air can be increased through gaps among the heat radiation baffles, the heat radiation fins 8 can carry out high-efficiency heat exchange with the air, a large amount of heat can be generated when the core processor works, the core processor and the heat exchange fins complete heat exchange, the heat is brought into the heat radiation fins 8 through four air cooling copper pipes, the air-cooled copper pipe 10 and the water-cooled copper pipe 9 complete heat exchange with the radiating fins 8, in addition, water flows through the water-cooled copper pipe 9, so that the water-cooled copper pipe 9 brings part of heat into the condensing device through water, the water in the condensing device carries the heat water, firstly enters the water storage tank through the water inlet pump to complete the first heat exchange with the water in the water storage tank, and then enters the water inlet of the condensing copper pipe 29 through the water outlet pump, the condensing copper pipe 29 is uniformly distributed inside the honeycomb plate 21 and the U-shaped pore plate 20 in an S shape, the air flow of the condensing device is increased by the honeycomb plate 21 and the U-shaped pore plate 20 in the pore structure, the heat exchange efficiency of the water in the condensing copper pipe 29 is improved, and gauze is arranged outside the honeycomb plate 21 and the U-shaped pore plate 20, impurities such as dust and the like are effectively prevented from entering the condensing device, thereby the influence, the external air is sent into the condensing device, under the combined action of the condensing fan 18, the honeycomb plate 21, the U-shaped pore plate 20 and the condensing copper pipe 29, the water in the condensing copper pipe 29 completes the second heat exchange, then enters the water-cooling copper pipe 9 through the heat-radiating water inlet 12, and carries out the heat exchange operation on the dragon core processor, the heat exchange efficiency of the water-cooling copper pipe 9 is higher than that of the air-cooling copper pipe 10, according to the heat conduction principle, the water-cooling copper pipe 9 can exchange heat to the air-cooling copper pipe 10 to a certain extent, the temperature of the radiating fins 8 is reduced, in addition, the radiator is a downward-pressing radiator, the external air is directly blown into the radiating fins 8 by the radiating fan 2 and then diffuses all around, and the existence of the water-cooling copper.
When the invention is used:
example 1
The heat dissipation method which mainly uses air cooling heat dissipation and uses water cooling heat dissipation as assistance is used, the heat dissipation device is arranged on the surface of the godson processor and is fixed on a mainboard, the godson processor is positioned in the chip groove 72, then the condensing device is fixed in the host case and is connected with a power supply, when the heat dissipation device works, the heat dissipation fan 2 runs, outside air firstly has a difference between the flow velocity of the air passing through the slope-shaped wind wing and the flow velocity of the air passing through the groove under the action of the slope-shaped wind wing and the groove on the heat dissipation fan shell 3 to form a certain air pressure difference, so that the temperature of the air entering the heat dissipation fan 2 is lower than the temperature of the outside air, then the heat dissipation fan 2 directly blows the air into the heat dissipation fins 8, the heat dissipation fins 8 are composed of a plurality of heat dissipation baffles which are distributed at equal intervals, and, so that the radiating fin 8 can perform high-efficiency heat exchange with air, the godson processor can generate a large amount of heat when working, the godson processor and the heat exchange fin finish the heat exchange, the heat exchange fin brings the heat into the radiating fin 8 through four air-cooled copper pipes 10 and a water-cooled copper pipe 9, a first air-cooled copper pipe 101 passes through a first radiating fin through hole 81 in the radiating fin 8, a second air-cooled copper pipe 102 passes through a second radiating fin through hole 82 in the radiating fin 8, the water-cooled copper pipe 9 passes through a third radiating fin through hole 83 in the radiating fin 8, a third air-cooled copper pipe 103 passes through a fourth radiating fin through hole 84 in the radiating fin 8, a fourth air-cooled copper pipe 104 passes through a fifth radiating fin through hole 85 in the radiating fin 8, the air-cooled copper pipe 10 and the water-cooled copper pipe 9 pass through the inside the radiating fin 8, the air-cooled copper pipe, the expansion of the air inside the radiating fin 8 is directly caused, so that the pressure inside the radiating fin 8 is reduced, at the moment, the external air is blown into the radiating fin 8 by the radiating fan 2, and the heat exchange operation between the radiating fin 8 and the air is rapidly completed with the help of the air pressure difference; the water-cooled copper pipe 9 is provided with water flowing, the water-cooled copper pipe 9 after primary heat exchange with the radiating fins 8 leads the water-cooled copper pipe 9 to bring a part of heat into the condensing device through the water, the condensing device carries the water of the heat, firstly, the water enters the water storage tank through the water inlet pump to finish the first heat exchange with the water in the water storage tank, the water enters the inside of the condensing copper pipe 29 through the water inlet of the condensing copper pipe 29 under the action of the water outlet pump in the water storage tank, the condensing copper pipe 29 is uniformly distributed inside the honeycomb plate 21 and the U-shaped pore plate 20 in an S shape, the honeycomb plate 21 and the U-shaped pore plate 20 with the pore structure increase the air flow of the condensing device, the heat exchange efficiency of the water in the condensing copper pipe 29 is improved, and the gauze is arranged outside the honeycomb plate 21 and the U-shaped pore plate 20, thereby effectively preventing impurities such as dust from, meanwhile, the condensing fan 18 of the condensing device sends outside air into the condensing device, under the combined action of the condensing fan 18, the honeycomb plate 21, the U-shaped pore plate 20 and the condensing copper pipe 29, water in the condensing copper pipe 29 completes second heat exchange, then enters the water-cooling copper pipe 9 through the heat dissipation water inlet 12, and carries out heat exchange operation on the Loongson processor, the heat exchange efficiency of the water-cooling copper pipe 9 is higher than that of the air-cooling copper pipe 10, according to the heat conduction principle, the water-cooling copper pipe 9 can exchange heat to the air-cooling copper pipe 10 to a certain extent, the temperature of the radiating fins 8 is reduced, in addition, the radiator is a pressing type radiator, the external air is directly blown into the radiating fins 8 by the radiating fan 2 and then is diffused to the periphery, the air flow in the host case is increased by the condensing fan 18 in the condensing device, and.
Example 2
The condensation device provided by the invention can be omitted, only the heat dissipation device is used for carrying out heat dissipation operation on the Loongson processor, at the moment, all water in the water-cooled copper pipe 9 is poured out, the interior of the water-cooled copper pipe 9 is ensured to be dry, and in addition, the heat dissipation water inlet 12 and the heat dissipation water outlet 13 are sealed by using a copper cap matched with the heat dissipation water inlet 12 and the heat dissipation water outlet 13; the radiator is arranged on the surface of the Loongson processor and fixed on the mainboard, the Loongson processor is positioned inside the chip groove 72, the Loongson processor is directly contacted with the heat exchange sheet to improve the heat exchange efficiency, when the radiator works, the radiator fan 2 runs, the outside air firstly causes the difference between the flow speed of the air passing through the slope-shaped air wing and the flow speed of the air passing through the groove under the action of the slope-shaped air wing and the groove on the radiator fan shell 3 to form a certain air pressure difference, so that the temperature of the air entering the radiator fan 2 is lower than the temperature of the outside air, then the radiator fan 2 directly blows the air into the radiator fin 8, the radiator fin 8 is composed of a plurality of radiating baffles which are distributed at equal intervals, the contact area between the radiator fin 8 and the air can be increased by gaps among the radiating baffles, and the radiator fin 8 can perform high-efficiency, the operating process of the godson processor can produce a large amount of heat, godson processor and heat exchanger fin accomplish the heat exchange, the heat of heat exchanger fin brings fin 8 into through air-cooled copper pipe 10 and dry airtight water-cooled copper pipe 9 of handling, make the temperature of fin 8 itself improve, directly lead to 8 inside air of fin to take place the inflation, make 8 internal pressure of fin diminish, radiator fan 2 blows in the fin 8 inside with the outside air this moment, under the help of atmospheric pressure difference, accomplish the heat transfer operation of fin 8 with the air fast, the temperature of fin 8 has been reduced, the radiator is the formula radiator that pushes down in addition, radiator fan 2 is direct blows in 8 insides of fin with the outside air, again to diffusion all around, in addition water-cooled copper pipe 9's existence, electronic component's radiating efficiency on the mainboard has been improved.
The preferred embodiments of the invention disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention. The invention is limited only by the claims and their full scope and equivalents.
Claims (9)
1. A radiator based on a Loongson processor is characterized by comprising a radiating device and a condensing device, the heat dissipation device comprises a heat dissipation fan (2), a heat dissipation fin (8) and a bottom plate (7), the heat dissipation fan (2) is arranged in a heat dissipation fan shell (3), four radiating fan brackets (1) are arranged in the radiating fan shell (3), the four radiating fan brackets (1) are sequentially welded to obtain a hollow square frame positioned below the radiating fan (2), the hollow square frame is fixedly welded with the radiating fan shell (3), a radiating fan bottom plate (5) is installed on the outer side of the radiating fan shell (3), four radiating fan bottom plates (5) are fixedly welded at four corners of the radiating fan shell (3), fixing clamps (4) are welded on the surfaces of the four radiating fan bottom plates (5), and radiating fin fixing plates (6) are welded between every two adjacent radiating fan bottom plates (5);
the radiating fin (8) is arranged below a radiating fan base plate (5), the radiating fin (8) is not in direct contact with the radiating fan base plate (5), radiating fin fixing plates (6) are arranged on the periphery of the top of the radiating fin (8), the radiating fin fixing plates (6) are in direct contact with the radiating fin (8), the four radiating fin fixing plates (6) are fixed with the radiating fan base plate (5) through fixing clamps (4), the radiating fin (8) is composed of a plurality of radiating baffles which are uniformly distributed at equal intervals, and five radiating fin through holes which are uniformly distributed are sequentially arranged on the surface of the radiating fin (8), namely a first radiating fin through hole (81), a second radiating fin through hole (82), a third radiating fin through hole (83), a fourth radiating fin through hole (84) and a fifth radiating fin through hole (85); t type fin fixed plate (22) is all installed to five fin through-hole homonymies, and the four corners position welding of T type fin fixed plate (22) has fin backup pad (11), fin backup pad (11) and T type fin fixed plate (22) are in same level and lie in fin (8) bottom, have air-cooled copper pipe (10) and water-cooled copper pipe (9) that run through in the fin through-hole, the one end of water-cooled copper pipe (9) is heat dissipation water inlet (12), and the other end of water-cooled copper pipe (9) is heat dissipation delivery port (13), water piping connection bolt (31) are all installed to heat dissipation water inlet (12) and heat dissipation delivery port (13), and first air-cooled copper pipe (101) passes first fin through-hole (81), and second air-cooled copper pipe (102) passes second fin through-hole (82), and water-cooled copper pipe (9) pass third, a third air-cooled copper pipe (103) penetrates through a fourth heat radiating fin through hole (84), a fourth air-cooled copper pipe (104) penetrates through a fifth heat radiating fin through hole (85), and a heat exchange fin with a flat structure is sequentially formed by the first air-cooled copper pipe (101), the second air-cooled copper pipe (102), the water-cooled copper pipe (9), the third air-cooled copper pipe (103) and the fourth air-cooled copper pipe (104);
a chip groove (72) is formed in the center of the bottom plate (7), the chip groove (72) is of a quadrilateral hollow structure, the surface of the Loongson processor is fixed inside the bottom plate (7) through the chip groove (72), a heat exchange plate is arranged on one surface of the chip groove (72) at the bottom of the radiating fin (8), and the heat exchange plate is in direct contact with the surface of the Loongson processor;
the condensing device comprises a condensing fan (18), a condensing shell (17) and a condensing bottom plate (25), wherein the upper end of the condensing shell (17) is provided with a condensing fan mounting plate (19), a round hole is formed in the center of the condensing fan mounting plate (19), two parallel condensing fan fixing plates (181) are fixedly welded in the round hole, two condensing fan supporting rods are welded between the two condensing fan fixing plates (181), and the condensing fan (18) is fixed in the round hole of the condensing fan mounting plate (19) by the condensing fan supporting rods and the condensing fan fixing plates (181); condensation baffles (16), cellular boards (21) and U-shaped pore plates (20) are arranged on four sides between a condensation shell (17) and a condensation bottom plate (25), the cellular boards (21) and the U-shaped pore plates (20) are fixed by welding, the cellular boards (21) comprise first cellular boards (211), second cellular boards (212) and third cellular boards (213), the U-shaped pore plates (20) comprise first U-shaped pore plates (201) and second U-shaped pore plates (202), the first cellular boards (211), the first U-shaped pore plates (201), the second cellular boards (212), the second U-shaped pore plates (202) and the third cellular boards (213) are sequentially connected to form U-shaped boards, a condensation water outlet (14) and a condensation water inlet (15) are arranged on the first cellular boards (211), and water pipe connecting bolts (31) are arranged at one ends of the condensation water inlet (15) and the condensation water outlet (14), condensation copper pipe (29) are all installed with U type orifice plate (20) inboard in honeycomb panel (21), condensation backup pad (28) have all been welded with U type orifice plate (20) inside both sides in honeycomb panel (21), and condensation backup pad (28) are provided with the condensation through-hole that a plurality of even equidistance distribute, condensation through-hole inside runs through has condensation copper pipe (29), honeycomb panel (21) bottom is provided with condensation fixed plate (27), condensation fixed plate (27) and condensation bottom plate (25) welded fastening, and condensation bottom plate (25) four corners is provided with four condensation bolt (26), four condensation bolt (26) are fixed condensing equipment in computer mainframe inboard.
2. The radiator based on the Loongson processor is characterized in that a condensation water outlet (14) of a condensation device is connected with a heat radiation water inlet (12) of the heat radiation device through a connecting water pipe (30), the condensation water outlet (14) is fixed with the connecting water pipe (30) through a water pipe connecting bolt (31), and the heat radiation water inlet (12) is fixed with the connecting water pipe (30) through the water pipe connecting bolt (31); a condensation water inlet (15) of the condensing device is connected with a heat dissipation water outlet (13) of the heat dissipation device through a connecting water pipe (30), the condensation water inlet (15) is fixed with the connecting water pipe (30) through a water pipe connecting bolt (31), and the heat dissipation water outlet (13) is fixed with the connecting water pipe (30) through a water pipe connecting bolt (31).
3. The radiator based on the Loongson processor as claimed in claim 1, wherein the radiator fan housing (3) is a cylindrical structure, the diameter of the bottom surface of the cylinder is matched with the size of the radiator fan, four equidistant slope-shaped wind wings are welded and fixed on the top of the radiator fan housing (3), and a groove is formed between every two slope-shaped wind wings.
4. The radiator based on the Loongson processor as claimed in claim 1, wherein five radiating baffle through holes are uniformly distributed at equal intervals on the surface of a plurality of radiating baffles, symmetrical radiating baffle fixing holes are arranged at the bottom positions of the radiating baffles, and a plurality of radiating baffles are sequentially fixed through the radiating baffle fixing holes to obtain the radiating fins (8).
5. The radiator based on the Loongson processor is characterized in that one end of each of the first air-cooled copper pipe (101), the second air-cooled copper pipe (102), the third air-cooled copper pipe (103) and the fourth air-cooled copper pipe (104) is closed and is of a flat triangular cone structure; the first air-cooled copper pipe (101), the second air-cooled copper pipe (102), the third air-cooled copper pipe (103), the fourth air-cooled copper pipe (104) and the water-cooled copper pipe (9) are all U-shaped structures.
6. The core processor-based radiator according to claim 1, wherein the condensation copper pipes (29) are uniformly arranged inside the condensation device, and the condensation copper pipes (29) are provided with two openings, one is a water inlet and the other is a water outlet.
7. The radiator based on the dragon core processor as claimed in claim 1, wherein the condensing device is internally provided with a water inlet pump, a water outlet pump and a water storage tank, the water storage tank is arranged on the surface of the condensing baffle (16), the water storage tank is internally provided with the water outlet pump, and the water inlet pump is arranged on the surface of the condensing baffle (16) on one side below the water outlet pump; the water inlet of the water inlet pump is connected with the condensation water inlet (15), the water outlet of the water inlet pump is connected with the water inlet of the water storage tank, the water outlet of the water outlet pump is connected with the water outlet of the water storage tank, the water outlet of the water storage tank is connected with the water inlet of the condensation copper pipe (29), and the water outlet of the condensation copper pipe (29) is connected with the condensation water outlet.
8. The radiator based on the Loongson processor as claimed in claim 1, wherein the honeycomb plate (21) is composed of a plurality of hollow regular hexagonal welds which are evenly distributed, a gauze is installed on the outer surface of the honeycomb plate (21), the U-shaped pore plate (20) is composed of a plurality of hollow rectangles which are evenly distributed, and a gauze is installed on the outer surface of the U-shaped pore plate (20).
9. The radiator based on the Loongson processor as claimed in claim 1, wherein the working method of the radiator comprises the following specific steps:
the method comprises the following steps: firstly, a heat dissipation device is arranged on the surface of a Loongson processor and fixed on a mainboard, the Loongson processor is positioned in a chip groove (72), and then a condensing device is fixed in a host case and connected with a power supply;
step two: the dragon core processor generates heat when working, the dragon core processor is connected with a temperature sensor, the temperature sensor is electrically connected with the dragon core processor through a lead and is arranged on a heat exchange sheet, the temperature sensor detects the temperature of the dragon core processor, the temperature rises, the temperature sensor senses that the temperature exceeds a preset value, the temperature sensor feeds back information to the dragon core processor, and the dragon core processor controls the heat dissipation device and the condensing device to be started;
step three: when the radiator works, the radiating fan (2) runs, outside air passes through the slope-shaped wind wings and the grooves on the radiating fan shell (3), the flow rate of the air passing through the slope-shaped wind wings is different from the flow rate of the air passing through the grooves to form air pressure difference, the radiating fan (2) blows the air into the radiating fins (8), the radiating fins (8) are composed of a plurality of radiating baffles distributed at equal intervals, the contact area of the radiating fins (8) and the air is increased by gaps among the radiating baffles, the radiating fins (8) exchange heat with the air, the processor can generate heat when working, the core processor exchanges heat with the heat exchange fins, the heat exchange fins bring the heat into the radiating fins (8) through four air-cooling copper pipes (10) and one water-cooling copper pipe (9), the air-cooling copper pipes (10) and the water-cooling copper pipes (9) exchange heat with the radiating fins (8), and the temperature of the radiating fins (, the air in the radiating fin (8) expands outwards, the internal pressure of the radiating fin (8) is reduced, the external air passes through a groove between a slope wind wing and a slope wind wing at the top of the radiating fan shell (3), the air is blown into the radiating fin (8) by the radiating fan (2), the heat exchange between the air and the radiating fin (8) is rapidly carried out under the existence of air pressure difference, the temperature of the radiating fin (8) is reduced, water flows through a water-cooling copper pipe (9) in the water-cooling copper pipe (9), the water-cooling copper pipe (9) carries the heat into a condensing device through the water after the initial heat exchange with the radiating fin (8), the water-cooling copper pipe (9) carries the heat into the condensing device, the water carrying the heat enters the water storage tank through a water inlet pump, the first heat exchange is completed with the water in the water storage tank, the heat enters a water inlet of a condensing copper pipe (29) through a water outlet pump in the water storage tank, and the condensing copper pipe, the honeycomb plate (21) and the U-shaped pore plate (20) of the pore structure increase the air flow of the condensing device, gauze is arranged outside the honeycomb plate (21) and the U-shaped pore plate (20) to prevent impurities such as dust and the like from entering the condensing device, a condensing fan (18) in the condensing device sends outside air into the condensing device, water in a condensing copper pipe (29) completes secondary heat exchange under the combined action of the condensing fan (18), the honeycomb plate (21), the U-shaped pore plate (20) and the condensing copper pipe (29), enters a water-cooling copper pipe (9) through a heat dissipation water inlet (12) to carry out heat exchange operation on a dragon core processor, the heat exchange efficiency of the water-cooling copper pipe (9) is higher than that of an air-cooling copper pipe (10), the water-cooling copper pipe (9) can carry out heat exchange on the air-cooling copper pipe (10) according to the heat conduction principle to reduce the temperature of a radiating fin (8), and the, the heat radiation fan (2) directly blows the outside air into the heat radiation fins (8) and then diffuses all around to radiate the electronic elements on the mainboard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911230450.9A CN110703890B (en) | 2019-12-05 | 2019-12-05 | Radiator based on dragon core processor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911230450.9A CN110703890B (en) | 2019-12-05 | 2019-12-05 | Radiator based on dragon core processor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110703890A true CN110703890A (en) | 2020-01-17 |
| CN110703890B CN110703890B (en) | 2020-04-14 |
Family
ID=69207104
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911230450.9A Active CN110703890B (en) | 2019-12-05 | 2019-12-05 | Radiator based on dragon core processor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110703890B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111007934A (en) * | 2020-03-11 | 2020-04-14 | 北京中航科电测控技术股份有限公司 | Rack-mounted server mainboard based on Loongson 3A4000 |
| CN111457382A (en) * | 2020-04-09 | 2020-07-28 | 张仁清 | Garbage pyrolysis gasification furnace |
| CN111629569A (en) * | 2020-06-23 | 2020-09-04 | 镇江元普电子科技有限公司 | Electronic radiator with air cooling and water cooling combined |
| CN113380283A (en) * | 2021-06-09 | 2021-09-10 | 西安交通大学 | M2 solid state disk heat dissipation subsides |
| CN114623422A (en) * | 2022-03-25 | 2022-06-14 | 桂林智神信息技术股份有限公司 | Water-cooling heat dissipation device and photographic lamp |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100073875A1 (en) * | 2008-09-22 | 2010-03-25 | Fujitsu Limited | Cooling unit and electronic device |
| CN107562150A (en) * | 2017-08-29 | 2018-01-09 | 昆山苏熙莱卡电子科技有限公司 | A kind of computer radiator |
| CN107957768A (en) * | 2018-01-25 | 2018-04-24 | 李嘉顺 | A kind of computer radiating apparatus |
| CN109002141A (en) * | 2018-08-03 | 2018-12-14 | 芜湖英特杰智能科技有限公司 | A kind of computer host box high efficiency and heat radiation equipment |
-
2019
- 2019-12-05 CN CN201911230450.9A patent/CN110703890B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100073875A1 (en) * | 2008-09-22 | 2010-03-25 | Fujitsu Limited | Cooling unit and electronic device |
| CN107562150A (en) * | 2017-08-29 | 2018-01-09 | 昆山苏熙莱卡电子科技有限公司 | A kind of computer radiator |
| CN107957768A (en) * | 2018-01-25 | 2018-04-24 | 李嘉顺 | A kind of computer radiating apparatus |
| CN109002141A (en) * | 2018-08-03 | 2018-12-14 | 芜湖英特杰智能科技有限公司 | A kind of computer host box high efficiency and heat radiation equipment |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111007934A (en) * | 2020-03-11 | 2020-04-14 | 北京中航科电测控技术股份有限公司 | Rack-mounted server mainboard based on Loongson 3A4000 |
| CN111007934B (en) * | 2020-03-11 | 2020-05-22 | 北京中航科电测控技术股份有限公司 | Rack-mounted server mainboard based on Loongson 3A4000 |
| CN111457382A (en) * | 2020-04-09 | 2020-07-28 | 张仁清 | Garbage pyrolysis gasification furnace |
| CN111457382B (en) * | 2020-04-09 | 2022-04-26 | 中开水生态治理有限公司 | Garbage pyrolysis gasification furnace |
| CN111629569A (en) * | 2020-06-23 | 2020-09-04 | 镇江元普电子科技有限公司 | Electronic radiator with air cooling and water cooling combined |
| CN111629569B (en) * | 2020-06-23 | 2022-06-21 | 镇江元普电子科技有限公司 | Electronic radiator with air cooling and water cooling combined |
| CN113380283A (en) * | 2021-06-09 | 2021-09-10 | 西安交通大学 | M2 solid state disk heat dissipation subsides |
| CN113380283B (en) * | 2021-06-09 | 2022-08-02 | 西安交通大学 | M2 solid state disk heat dissipation subsides |
| CN114623422A (en) * | 2022-03-25 | 2022-06-14 | 桂林智神信息技术股份有限公司 | Water-cooling heat dissipation device and photographic lamp |
| CN114623422B (en) * | 2022-03-25 | 2024-05-07 | 桂林智神信息技术股份有限公司 | Water-cooling heat abstractor and photographic lamp |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110703890B (en) | 2020-04-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110703890B (en) | Radiator based on dragon core processor | |
| CN102221189A (en) | Vertical convector radiator and vertical convector radiating down lamp | |
| CN112885798A (en) | Integrated phase change heat transfer element liquid cooling heat radiation module for server | |
| CN216775385U (en) | Optical module liquid cooling radiator | |
| CN106411110A (en) | Heat radiation controllable frequency converter | |
| CN210610179U (en) | Liquid-cooled heat pipe radiator | |
| CN205648307U (en) | Water cooling device used for cooling electronic device | |
| CN209946807U (en) | Auxiliary heat dissipation device for computer case | |
| CN217279471U (en) | Computer mainframe capable of circularly radiating | |
| CN215600194U (en) | Grid type radiator for transformer or reactor | |
| CN205946472U (en) | Liquid cooling heat exchanger | |
| CN211860427U (en) | Industry thing networking switch based on M2M terminal | |
| CN209982983U (en) | Heat exchange heat dissipation device of outdoor LCD | |
| CN209946787U (en) | Sheet-metal case with efficient heat dissipation function | |
| CN206774522U (en) | A kind of chip heat radiator | |
| CN107027273B (en) | Overhead heat transfer device of rack | |
| CN111124091A (en) | CPU radiator | |
| CN211297216U (en) | 5G system installation equipment that radiating effect is good | |
| CN212936539U (en) | Miniature electronic component radiator | |
| CN216451723U (en) | Computer network safety case with heat dissipation function | |
| CN219843549U (en) | Inverter for photovoltaic power generation | |
| CN217898002U (en) | High-efficient auto radiator | |
| CN217011559U (en) | Air-cooled water-cooled radiator for electronic equipment | |
| CN215956966U (en) | Photovoltaic inverter heat abstractor | |
| CN211267505U (en) | Heat radiation structure of communication terminal |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |