CN210610179U - Liquid-cooled heat pipe radiator - Google Patents

Liquid-cooled heat pipe radiator Download PDF

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Publication number
CN210610179U
CN210610179U CN201921583918.8U CN201921583918U CN210610179U CN 210610179 U CN210610179 U CN 210610179U CN 201921583918 U CN201921583918 U CN 201921583918U CN 210610179 U CN210610179 U CN 210610179U
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Prior art keywords
pipe
heat
liquid
heat pipe
cooling
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CN201921583918.8U
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Chinese (zh)
Inventor
姚勇
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SHANGHAI WTL HEAT PIPE TECHNOLOGY CO LTD
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SHANGHAI WTL HEAT PIPE TECHNOLOGY CO LTD
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Abstract

The utility model discloses a liquid-cooled heat pipe radiator, belonging to the technical field of radiators and solving the problem that the cooling efficiency of the radiating pipe of the prior device is low, which causes the damage of an electronic device; the technical characteristics are as follows: the heat dissipation base plate is fixedly connected with the radiating tube assembly, two mounting seats for fixing the heat dissipation base plate are symmetrically arranged on the heat dissipation base plate, the heat dissipation base plate is fixedly connected with the mounting seats through bolts, a fixing clamping groove is formed in each mounting seat, and the heat dissipation base plate is of a rectangular plate-shaped structure; the embodiment of the utility model provides a cooling tube subassembly has been set up, can disperse the heat that electron device work produced, has avoided the heat too concentrated and has caused the injury to electron device, and the setting of cooling plate has increased the heat radiating area of outer tube simultaneously, has improved the radiating efficiency of outer tube.

Description

Liquid-cooled heat pipe radiator
Technical Field
The utility model relates to a radiator technical field especially relates to a liquid cooling type heat pipe radiator.
Background
Along with the continuous development and innovation of science and technology, more and more electronic equipment is developed, the operation speed of modern electronic equipment is faster and faster, and the size of product becomes smaller, and electronic product heat dissipation problem is the problem of making the best in the electronic product development process, if the inside heat of electronic product can not timely discharge, can influence electronic product's normal work, causes serious electric power accident even.
Chinese patent CN204598536U discloses a liquid-cooled heat pipe radiator, which comprises a radiator substrate contacting with the surface of an electronic device, a heat pipe radiator connected with the radiator substrate, and a centralized cooling pipe connected with a plurality of heat pipe radiators; the heat pipe radiators are mutually spaced, and the condensation sections of the heat pipe radiators extend into the centralized cooling pipe and are connected with the centralized cooling pipe in a sealing manner; the concentrated cooling pipe comprises a cooling pipe body filled with cooling liquid, and a cooling liquid inlet pipe and a cooling liquid outlet pipe which are respectively communicated with the inside of the cooling pipe body, wherein the cooling liquid inlet pipe and the cooling liquid outlet pipe are connected with an external cooling liquid circulating system, but the cooling efficiency of a radiating pipe of the device is low, so that electronic devices are damaged, and therefore, a liquid-cooled heat pipe radiator is provided.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a liquid cooling type heat pipe radiator, including heat dissipation base plate and cooling tube subassembly, fixed connection between heat dissipation base plate and the cooling tube subassembly, the symmetry is equipped with two mount pads that are used for fixed heat dissipation base plate on the heat dissipation base plate, through bolt fixed connection between heat dissipation base plate and the mount pad, has seted up fixed slot on the mount pad, and the heat dissipation base plate is rectangle platelike structure to it is low to solve current device cooling tube cooling efficiency, leads to the problem that electronic device appears damaging.
In order to achieve the above object, the utility model provides a following technical scheme:
the utility model provides a liquid cooling type heat pipe radiator, includes radiating basal plate and cooling tube subassembly, fixed connection between radiating basal plate and the cooling tube subassembly, the symmetry is equipped with two mount pads that are used for fixed radiating basal plate on the radiating basal plate, through bolt fixed connection between radiating basal plate and the mount pad, has seted up fixed slot on the mount pad, and the radiating basal plate is rectangular plate structure.
As a further aspect of the present invention: a plurality of heat dissipation holes are uniformly distributed in the heat dissipation substrate, a connecting seat is fixedly mounted on one side of each heat dissipation hole, the heat dissipation holes are riveted with the connecting seat through bolts, and the heat dissipation pipe assembly is fixedly connected with the connecting seat.
As a further aspect of the present invention: the cooling tube assembly comprises a cooling plate, a cooling tube and an outer tube, the central position in the outer tube is provided with the cooling tube, cooling liquid is placed in the outer tube, one end of the cooling tube is fixedly provided with an inner connecting valve, the other end of the cooling tube is communicated with the connecting seat, and the outer wall of the outer tube is horizontally and evenly provided with a plurality of cooling plates.
As a further aspect of the present invention: one side that the connecting seat was kept away from to the cooling tube subassembly is equipped with the reposition of redundant personnel subassembly, and the reposition of redundant personnel subassembly includes heat dissipation chamber, external connection valve and shunt tubes, and the external connection valve barrel is established on the outer tube, and the outer wall of external connection valve and outer tube passes through threaded connection, and the circumference equipartition has a plurality of drainage grooves on the external connection valve, and the one end and the shunt tubes intercommunication in drainage groove, and the one end and the in-connection valve intercommunication in drainage groove are kept away from to the shunt tubes, and the degree of depth in drainage groove is the same.
As a further aspect of the present invention: the one end of outer tube is equipped with the inlet, installs the circulating pump on the inlet, and the leakage fluid dram has been seted up to the other end of outer tube, and the cross section of cooling tube is the ellipse, and the material of cooling tube adopts the aluminium material.
To sum up, the beneficial effects of the utility model are that: the embodiment of the utility model provides a cooling tube subassembly has been set up, can disperse the heat that electron device work produced, has avoided the heat too concentrated and has caused the injury to electron device, and the setting of cooling plate has increased the heat radiating area of outer tube simultaneously, has improved the radiating efficiency of outer tube.
Drawings
Fig. 1 is a schematic structural diagram of the utility model.
Fig. 2 is a schematic structural view of the heat dissipation substrate of the present invention.
Fig. 3 is a schematic structural view of the middle heat dissipating tube of the utility model.
Fig. 4 is a side sectional view of the middle tube of the utility model.
Fig. 5 is a schematic structural view of the mounting seat in the utility model.
In the figure: 1-radiating base plate, 2-radiating pipe assembly, 3-mounting seat, 4-connecting seat, 5-heat discharging cavity, 6-cooling plate, 7-radiating pipe, 8-external connecting valve, 9-radiating hole, 10-shunt pipe, 11-internal connecting valve and 12-external pipe.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Example 1
As shown in fig. 1 and 5, in the embodiment of the present invention, a liquid-cooled heat pipe radiator includes a heat dissipation substrate 1 and a heat dissipation pipe assembly 2, the heat dissipation substrate 1 and the heat dissipation pipe assembly 2 are fixedly connected, two mounting seats 3 for fixing the heat dissipation substrate 1 are symmetrically disposed on the heat dissipation substrate 1, the heat dissipation substrate 1 and the mounting seats 3 are fixedly connected by bolts, and a fixing slot is disposed on the mounting seats 3;
as shown in fig. 2, the heat dissipating substrate 1 is a rectangular plate structure, a plurality of heat dissipating holes 9 are uniformly distributed on the heat dissipating substrate 1, a connecting seat 4 is fixedly installed on one side of each heat dissipating hole 9, the heat dissipating holes 9 are riveted with the connecting seat 4 through bolts, and the heat dissipating pipe assembly 2 is fixedly connected with the connecting seat 4.
Example 2
As shown in fig. 1 and 5, in the embodiment of the present invention, a liquid-cooled heat pipe radiator includes a heat dissipation substrate 1 and a heat dissipation pipe assembly 2, the heat dissipation substrate 1 and the heat dissipation pipe assembly 2 are fixedly connected, two mounting seats 3 for fixing the heat dissipation substrate 1 are symmetrically disposed on the heat dissipation substrate 1, the heat dissipation substrate 1 and the mounting seats 3 are fixedly connected by bolts, and a fixing slot is disposed on the mounting seats 3;
as shown in fig. 2, the heat dissipation substrate 1 is a rectangular plate structure, a plurality of heat dissipation holes 9 are uniformly distributed on the heat dissipation substrate 1, a connection seat 4 is fixedly installed on one side of each heat dissipation hole 9, the heat dissipation holes 9 are riveted with the connection seat 4 through bolts, and the heat dissipation tube assembly 2 is fixedly connected with the connection seat 4;
as shown in fig. 3-4, the heat dissipation pipe assembly 2 includes a cooling plate 6, a heat dissipation pipe 7 and an outer pipe 12, the heat dissipation pipe 7 is disposed at a central position in the outer pipe 12, a cooling liquid is disposed in the outer pipe 12, an inner connection valve 11 is fixedly mounted at one end of the heat dissipation pipe 7, the other end of the heat dissipation pipe 7 is communicated with the connection seat 4, a plurality of cooling plates 6 are horizontally and uniformly distributed on an outer wall of the outer pipe 12, and the arrangement of the cooling plates 6 increases a heat dissipation area of the outer pipe 12, thereby improving a heat dissipation efficiency of the outer pipe;
a shunting assembly is arranged on one side, away from the connecting seat 4, of the radiating pipe assembly 2, and comprises a radiating cavity 5, an external connecting valve 8 and a shunting pipe 10, the external connecting valve 8 is sleeved on the outer pipe 12, the outer walls of the external connecting valve 8 and the outer pipe 12 are connected through threads, a plurality of drainage grooves are uniformly distributed in the circumferential direction on the external connecting valve 8, the depth of each drainage groove is the same as the height of the external connecting valve 8, one end of each drainage groove is communicated with the shunting pipe 10, and one end, away from the drainage grooves, of the shunting pipe 10 is communicated with the internal connecting valve 11;
a liquid inlet is formed in one end of the outer pipe 12, a circulating pump is mounted on the liquid inlet, a liquid outlet is formed in the other end of the outer pipe 12, and the arrangement of the outer pipe 12 realizes cooling of hot gas in the radiating pipe 7, so that protection of electronic devices is realized, and cooling efficiency is improved;
the cross section of the radiating pipe 7 is oval, and the radiating pipe 7 is made of aluminum.
To sum up, the utility model discloses a theory of operation is: during the use, open the circulating pump, in the circulating pump can send the coolant liquid into outer tube 12, then realize the circulation refrigeration to cooling tube 7, and the heat on the radiating base plate 1 is by louvre 9 suction cooling tube 7 in, then through cooling tube 7 reposition of redundant personnel to heat extraction chamber 5 in, realized the refrigeration to electronic device, prolonged electronic device's service life.
The embodiment of the utility model provides a cooling tube assembly 2 has been set up, can disperse the heat that electron device work produced, has avoided the heat too concentrated and has caused the injury to electron device, and the setting up of cooling plate 6 has increased the heat radiating area of outer tube 12 simultaneously, has improved the radiating efficiency of outer tube 12.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the invention and for the convenience of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims (8)

1. The utility model provides a liquid cooling type heat pipe radiator, includes radiating basal plate (1) and cooling tube subassembly (2), its characterized in that, fixed connection between radiating basal plate (1) and the cooling tube subassembly (2), the symmetry is equipped with two mount pads (3) that are used for fixed radiating basal plate (1) on radiating basal plate (1), through bolt fixed connection between radiating basal plate (1) and mount pad (3), has seted up fixed slot on mount pad (3).
2. The liquid-cooled heat pipe radiator as claimed in claim 1, wherein the heat-dissipating substrate (1) is a rectangular plate-like structure.
3. The liquid-cooled heat pipe radiator as claimed in claim 2, wherein a plurality of heat dissipating holes (9) are uniformly distributed on the heat dissipating substrate (1), a connecting seat (4) is fixedly installed at one side of each heat dissipating hole (9), the heat dissipating holes (9) and the connecting seat (4) are riveted by bolts, and the heat dissipating pipe assembly (2) and the connecting seat (4) are fixedly connected.
4. The liquid-cooled heat pipe radiator according to any one of claims 1 to 3, wherein the heat pipe assembly (2) comprises a cooling plate (6), a heat pipe (7) and an outer pipe (12), the heat pipe (7) is disposed at a central position in the outer pipe (12), the cooling liquid is disposed in the outer pipe (12), an inner connection valve (11) is fixedly mounted at one end of the heat pipe (7), the other end of the heat pipe (7) is communicated with the connection base (4), and a plurality of cooling plates (6) are horizontally and uniformly distributed on the outer wall of the outer pipe (12).
5. The liquid-cooled heat pipe radiator according to claim 4, wherein a side of the heat pipe assembly (2) away from the connecting base (4) is provided with a flow dividing assembly, the flow dividing assembly comprises a heat discharging cavity (5), an external connection valve (8) and flow dividing pipes (10), the external connection valve (8) is sleeved on the outer pipe (12), the external connection valve (8) is connected with the outer wall of the outer pipe (12) through threads, a plurality of flow guiding grooves are uniformly distributed on the external connection valve (8) in the circumferential direction, one ends of the flow guiding grooves are communicated with the flow dividing pipes (10), and one ends of the flow dividing pipes (10) away from the flow guiding grooves are communicated with the internal connection valve (11).
6. The liquid-cooled heat pipe radiator according to claim 5, characterized in that the depth of the drainage groove is the same as the height of the external connection valve (8).
7. The liquid-cooled heat pipe radiator as claimed in claim 4, wherein an inlet is provided at one end of the outer pipe (12), a circulation pump is installed on the inlet, and a liquid outlet is provided at the other end of the outer pipe (12).
8. The liquid-cooled heat pipe radiator as claimed in claim 4, wherein the cross section of the heat dissipating pipe (7) is oval, and the material of the heat dissipating pipe (7) is aluminum.
CN201921583918.8U 2019-09-23 2019-09-23 Liquid-cooled heat pipe radiator Active CN210610179U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921583918.8U CN210610179U (en) 2019-09-23 2019-09-23 Liquid-cooled heat pipe radiator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921583918.8U CN210610179U (en) 2019-09-23 2019-09-23 Liquid-cooled heat pipe radiator

Publications (1)

Publication Number Publication Date
CN210610179U true CN210610179U (en) 2020-05-22

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CN201921583918.8U Active CN210610179U (en) 2019-09-23 2019-09-23 Liquid-cooled heat pipe radiator

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112835430A (en) * 2021-02-01 2021-05-25 洛阳师范学院 Computer machine case heat abstractor with water-cooling function
CN113541050A (en) * 2021-05-21 2021-10-22 中国电子科技集团公司第十四研究所 Liquid cooling radiating wire harness clamp device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112835430A (en) * 2021-02-01 2021-05-25 洛阳师范学院 Computer machine case heat abstractor with water-cooling function
CN113541050A (en) * 2021-05-21 2021-10-22 中国电子科技集团公司第十四研究所 Liquid cooling radiating wire harness clamp device

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