CN108987305A - 半导体制造装置以及半导体器件的制造方法 - Google Patents
半导体制造装置以及半导体器件的制造方法 Download PDFInfo
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Abstract
本发明提供一种半导体制造装置,其具有能够对多个外形尺寸的筒夹进行安装以及拆卸的筒夹更换部。半导体制造装置具备利用磁铁保持筒夹的筒夹支架、在前端具有该筒夹支架且利用筒夹吸附并拾取裸芯片的头部、更换筒夹的筒夹更换部和控制头部以及筒夹更换部的控制装置。筒夹更换部具有筒夹夹持部,该筒夹夹持部具备具有爪构造的开闭臂和控制开闭臂的开闭臂控制装置。筒夹支架具备避让开闭臂的爪的避让部。控制装置通过使开闭臂开闭并使头部上下移动,来进行将筒夹向筒夹支架的安装、以及将筒夹从筒夹支架的拆卸。
Description
技术领域
本公开涉及半导体制造装置,例如可应用于在筒夹支架内置磁铁的芯片贴装机。
背景技术
在半导体器件的制造工序的一部分中,在将半导体芯片(以下简称为裸芯片)搭载于布线基板或引线框架等(以下简称为基板)并组装封装的工序的一部分中有从半导体晶片(以下简称为晶片)分割裸芯片的工序、和将分割后的裸芯片搭载于基板上的贴装工序。贴装工序所使用的半导体制造装置为芯片贴装机等的裸芯片贴装装置。
在贴装工序中,从切割带将从晶片分割出的裸芯片一个一个地剥离,并使用被称为筒夹的吸附夹具来将剥离后的裸芯片贴装在基板上。
在这种芯片贴装机中,需要与品种(裸芯片尺寸)对应地更换筒夹、或者为了防止裸芯片的表面的裂痕或污染而需要提高与裸芯片的表面接触的筒夹的更换频度(例如,日本特开2014-56978号公报(专利文献1))。
现有技术文献
专利文献
专利文献1:日本特开2014-56978号公报
在专利文献1中,利用配合筒夹尺寸而构成的筒夹更换部的爪旋转筒夹支架,来进行磁铁固定式的筒夹的拆卸以及安装。然而,磁铁固定式筒夹有多个外形尺寸,无法以相同的构造进行拆卸以及安装。
发明内容
本公开的课题在于,提供具有能够进行多个外形尺寸的筒夹的安装以及拆卸的筒夹更换部的半导体制造装置。
其它课题和新的特征根据本说明书的叙述及附图而变得明确。
简单说明本公开中代表性的概要,则如下。
即,半导体制造装置具备:筒夹支架,其利用磁铁保持筒夹;头部,其在前端具有该筒夹支架,利用所述筒夹吸附并拾取裸芯片;筒夹更换部,其更换所述筒夹;和控制装置,其控制所述头部以及所述筒夹更换部。所述筒夹更换部具有筒夹夹持部,所述筒夹夹持部具备具有爪构造的开闭臂、和控制所述开闭臂的开闭臂控制装置。所述筒夹支架具有避让所述开闭臂的爪的避让部。所述控制装置通过使所述开闭臂开闭并使所述头部上下移动,来进行将所述筒夹向所述筒夹支架的安装、以及将所述筒夹从所述筒夹支架的拆卸。
发明效果
根据上述半导体制造装置,能够进行多个外形尺寸的筒夹的安装以及拆卸。
附图说明
图1是说明芯片贴装机的结构例的图。
图2是说明图1的芯片贴装机的结构的图。
图3是说明图1的裸芯片供给部的结构的图。
图4是说明图3的裸芯片供给部的主要部分的图。
图5是说明图1的芯片贴装机所使用的筒夹支架的构造的图。
图6是说明图5的筒夹支架的构造的图。
图7是说明图1的芯片贴装机所具备的筒夹更换部的构造的图。
图8是说明图7的筒夹更换部的构造的图。
图9是说明图1的芯片贴装机的筒夹更换方法的图。
图10是说明图1的芯片贴装机的筒夹更换方法的图。
图11是说明图1的芯片贴装机的筒夹更换方法的图。
图12是说明图1的芯片贴装机的筒夹更换方法的图。
图13是说明图1的芯片贴装机的筒夹支架更换方法的图。
图14是示出使用了图1的芯片贴装机的半导体器件的制造方法的流程图。
附图标记说明
10 芯片贴装机
1 裸芯片供给部
2 拾取部
21 拾取头
22 筒夹
25 筒夹支架
3 中间载台部
31 中间载台
4 贴装部
41 贴装头
42 筒夹
5 搬运部
51 基板搬运爪
8 控制装置
9 筒夹更换部
91 筒夹夹持部
91a 开闭臂
91b 开闭臂控制部
92 供给部
93 废除部
D 裸芯片
S 基板
P 封装区域
具体实施方式
以下,使用附图说明实施例及变形例。但是,在以下的说明中,有时对于同一构成要素标注同一附图标记并省略重复说明。此外,图中,为了使说明更清晰,与实际的方式相比,有时对各部分的宽度、厚度、形状等进行示意性表示,但终究是一例,不限定本发明的解释。
实施例
图1是示出芯片贴装机的结构例的俯视图。图2是示出在图1中从箭头A方向观察时的结构的图。
芯片贴装机10大体具有裸芯片供给部1、拾取部2、中间载台部3、贴装部4、搬运部5、基板供给部6、基板搬出部7、监视并控制各部分的动作的控制部8,裸芯片供给部1供给向印刷有一个或多个最终成为一个封装的产品区域(以下称为封装区域P)的基板S安装的裸芯片D。Y轴方向为芯片贴装机10的前后方向,X轴方向为左右方向。裸芯片供给部1配置在芯片贴装机10的近前侧,贴装部4配置在内侧(远离侧)。
首先,裸芯片供给部1供给向基板S的封装区域P安装的裸芯片D。裸芯片供给部1具有保持晶片11的晶片保持台12、和将裸芯片D从晶片11上推的以虚线表示的上推单元13。裸芯片供给部1通过未图示的驱动机构而沿着XY方向移动,使待拾取的裸芯片D移动到上推单元13的位置。
拾取部2具有拾取裸芯片D的拾取头21、使拾取头21沿Y方向移动的拾取头的Y驱动部23、使筒夹22升降、旋转及沿X方向移动的未图示的各驱动部。拾取头21具有将被上推了的裸芯片D吸附保持于前端的筒夹22(也参照图2),从裸芯片供给部1拾取裸芯片D并将其载置于中间载台31上。拾取头21具有使筒夹22升降、旋转及沿X方向移动的未图示的各驱动部。
中间载台部3具有暂时载置裸芯片D的中间载台31、和用于识别中间载台31上的裸芯片D的载台识别摄像头32。
贴装部4从中间载台31拾取裸芯片D并将其贴装于搬运来的基板S的封装区域P上,或者以层叠到已贴装于基板S的封装区域P之上的裸芯片之上的形式进行贴装。贴装部4具有与拾取头21同样地具备将裸芯片D吸附保持于前端的筒夹42(也参照图2)的贴装头41、使贴装头41沿Y方向移动的Y驱动部43、对基板S的封装区域P的位置识别标记(未图示)进行拍摄来识别贴装位置的基板识别摄像头44。
通过这样的结构,贴装头41基于载台识别摄像头32的拍摄数据来修正拾取位置、姿势,从中间载台31拾取裸芯片D,并基于基板识别摄像头44的拍摄数据将裸芯片D贴装于基板S的封装区域P。
搬运部5具有抓起并搬运基板S的基板搬运爪51、和使基板S移动的搬运通道52。基板S通过利用沿着搬运通道52设置的未图示的滚珠丝杠来驱动设于搬运通道52的基板搬运爪51的螺母而移动。通过这样的结构,基板S从基板供给部6沿着搬运通道52移动至贴装位置,在贴装之后移动至基板搬出部7,向基板搬出部7交付基板S。
控制装置8具备存储监视并控制芯片贴装机10的各部分的动作的程序(软件)的存储器、和执行存储于存储器中的程序的中央处理装置(CPU)。
接着,利用图3以及图4对裸芯片供给部1的结构进行说明。图3是示出图1的裸芯片供给部的外观立体图的图。图4是示出图3的裸芯片供给部的主要部分的概略剖视图。
裸芯片供给部1具有在水平方向(XY方向)上移动的晶片保持台12、和在上下方向上移动的上推单元13。晶片保持台12具有保持晶片环14的扩展环15、将保持于晶片环14且粘接有多个裸芯片D的切割带16在水平方向上定位的支承环17。上推单元13配置于支承环17的内侧。
裸芯片供给部1在进行裸芯片D的上推时,使保持着晶片环14的扩展环15下降。其结果为,保持于晶片环14的切割带16被拉伸,裸芯片D的间隔扩大,通过上推单元13从裸芯片D下方上推裸芯片D,提高裸芯片D的拾取性。此外,随着薄型化,将裸芯片粘接于基板上的粘接剂从液态改成膜状,将被称为裸芯片粘片膜(DAF)18的膜状的粘接材料贴附在晶片11和切割带16之间。在具有裸芯片粘片膜18的晶片11中,切割是对晶片11和裸芯片粘片膜18进行的。因此,在剥离工序中,将晶片11和裸芯片粘片膜18从切割带16剥离。
拾取头21具有:筒夹柄21b,在中心具有流过吸附气体的吸附孔21a,在前端侧与筒夹支架25连接;和筒夹固定部21c,其将筒夹支架25固定于筒夹柄21b。贴装头41与拾取头21相同。
接着,利用图5、6说明筒夹支架。图5、6是用于说明图1的芯片贴装机所使用的筒夹支架的图,图5是拾取头、筒夹支架以及筒夹的剖视图,图6是筒夹支架的俯视图。
筒夹支架25具有在中心与拾取头21的吸附孔21a连通的吸附孔25a、和固定筒夹22的磁铁25b。筒夹支架25在四边的各中央附近具有切缺口(爪避让槽)251c,筒夹更换夹具成为能够把持筒夹。筒夹支架25的开口部成为越向下方越大的锥状,以便于通过磁铁25b吸引筒夹22而能够安装筒夹22。
筒夹22以能够利用磁铁固定的方式在硅橡胶等的弹性体22a的背面溶敷有不锈钢(SUS(磁性))22b,四边被筒夹支架25保持,并且为了吸附裸芯片D而具有与吸附孔251a连通的多个吸附孔(未图示)。在弹性体22a的表面具有与裸芯片D接触来保持裸芯片D的保持部22c。保持部22c与弹性体22a一体形成,具有与裸芯片D同等程度的大小。
对拾取头21进行了说明,贴装头41也相同。
接着,利用图7、8对筒夹更换部进行说明。图7是图1的芯片贴装机所具有的筒夹更换部的俯视图。图8是图7的A1-A2线剖视图。
筒夹更换部90具有:筒夹夹持部91,其具有夹持筒夹侧面且在上部具有爪构造的开闭臂91a、和控制开闭臂91a的开闭的臂部控制部91b;供给未使用的筒夹的供给部92;和废除已使用完毕的筒夹的废除部93。开闭臂91a能够配合筒夹的最大宽度地打开。如图8所示,开闭臂91a若闭合则能够夹持固定筒夹侧面,在固定的状态下,在上部的左右两处配置有爪91aa。供给部92和废除部93在上侧具有开口部92k、93k。供给部92以及废除部93配置在不影响拾取动作和贴装动作的场所,优选配置在拾取头21以及贴装头41的可动作范围以外。筒夹夹持部91、供给部92和废除部93配置在横向的一条直线上,筒夹夹持部91在横向上移动。此外,筒夹夹持部91也可以设为能够在水平方向(X方向、Y方向)以及垂直方向上移动。
接着,使用图9~图11,对在筒夹更换部90将筒夹22安装于筒夹支架25的方法以及将筒夹22拆卸的方法进行说明。图9是示出筒夹被开闭臂把持且与筒夹支架分离的状态的图,图9的(A)是俯视图,图9的(B)是剖视图,图9的(C)是侧视图。图10是示出筒夹被开闭臂把持且固定在筒夹支架上的状态的图,图10的(A)是俯视图,图10的(B)是剖视图,图10的(C)是侧视图。图11是示出筒夹固定于筒夹支架且开闭臂离开的状态的图,图11的(A)是俯视图,图11的(B)是剖视图,图11的(C)是侧视图。
首先,对将筒夹22安装于筒夹支架25的方法进行说明。控制装置8使筒夹夹持部91移动至供给部92的上方。控制装置8使供给部92内的筒夹22上升至与开闭臂91a的爪接触为止。控制装置8通过开闭臂91a夹持上升的筒夹22。如图9所示,控制装置8将夹持有筒夹22的筒夹夹持部91向更换位置(中间载台31的上方)搬运。控制装置8通过载台识别摄像头32来对筒夹外形进行位置识别。也可以利用条形码等进行品种判定。
如图10所示,控制装置8使不具有筒夹的状态下的筒夹支架25下降来安装筒夹22。针对筒夹夹持状态的精度(姿势)不需要很严格,而通过使筒夹支架25接近并利用磁铁251b的磁力吸起筒夹支架25,来使筒夹22自身定位并安装于筒夹支架25内。如上所述,在筒夹支架25的上下左右具有爪避让槽251C。如图11所示,控制装置8将开闭臂91a开放,使筒夹夹持部91移动至规定的位置。
接着,对从筒夹支架25卸下筒夹22的方法进行说明。如图11所示,控制装置8在开放开闭臂91a的状态下使筒夹夹持部91移动至拆卸位置。如图10所示,控制装置8通过开闭臂91a夹持筒夹22。如图9所示,控制装置8在开闭臂91a夹持了筒夹22的状态下使筒夹支架25上升,而从筒夹支架25卸下筒夹22。控制装置8将由开闭臂91a夹持的(卸下的)筒夹22移送至废除部93的上方,将开闭臂91a开放使筒夹22降落,使其收纳于废除部93。
对拾取头21的筒夹的更换进行了说明,贴装头41的筒夹的更换也同样。
如图7所示,对纵向长的筒夹(纵向长的筒夹支架)进行了说明,如图11所示,也能够适用于横向长的筒夹(横向长的筒夹支架)。
接着,利用图13对筒夹支架的更换方法进行说明。图13是示出筒夹支架被开闭臂把持的状态的图,图13的(A)是俯视图,图13的(B)是剖视图,图13的(C)是侧视图。
在变更品种时还要更换筒夹支架。与筒夹22同样地,利用筒夹夹持部91的开闭臂91a夹持筒夹支架来将其卸下或安装。在筒夹柄21b的下部或筒夹支架25的上部设置磁铁,筒夹支架也基于磁铁而固定,且被设为固定力比筒夹更强。
在利用筒夹构成中间载台的情况下(筒夹式的中间载台)的筒夹也与筒夹22同样地,能够利用筒夹夹持部91的开闭臂91a进行夹持来将实现卸下或安装。
在实施例中,由于利用夹持筒夹侧面并在上部具有爪构造的开闭臂来更换筒夹,所以无需更换部件就能够适用于各种尺寸(品种(筒夹外形)变更),能够进行安装以及拆卸。由此,能够实现省人力以及运转率改善。
另外,通过将筒夹夹持部91移动至中间载台上方,能够利用一个筒夹夹持部将筒夹、筒夹支架、筒夹式的中间载台这些全部更换(拆卸以及安装)。另外,通过将筒夹夹持部91移动至中间载台上方,能够更换贴装头的筒夹和拾取头的筒夹这两者。即,针对筒夹的3个用途(贴装头、拾取头、中间载台)的每一个,能够利用一个筒夹夹持部更换各品种对应数量的筒夹。另外,能够利用中间载台的上方的载台识别摄像头来确认筒夹的安装状态。
接着,利用图14对利用了实施例的芯片贴装机的半导体器件的制造方法进行说明。图14是示出半导体器件的制造方法的流程图。
步骤S11:将保持着贴附有从晶片11分割出的裸芯片D的切割带16的晶片环14保存于晶片盒(未图示),并搬入芯片贴装机10。控制部8从填充有晶片环14的晶片盒向裸芯片供给部1供给晶片环14。另外,准备基板S,并将其搬入芯片贴装机10。控制部8利用基板供给部6将基板S载置于搬运通道52。
步骤S12:控制装置8从保持于晶片环14的切割带16拾取裸芯片D。
步骤S13:控制装置8将所拾取的裸芯片D搭载于基板S的封装区域P上或层叠于已贴装的裸芯片之上。更具体来说,控制装置8将从切割带16拾取的裸芯片D载置于中间载台31,通过贴装头41从中间载台31再次拾取裸芯片D,并将其贴装在搬运来的基板S的封装区域P上。
步骤S14:控制装置8利用基板搬运爪51将基板S移动至基板搬出部7,向基板搬出部7交付基板S并从芯片贴装机10搬出基板S(基板卸载)。
以上,基于实施例具体说明了由本发明人提出的发明,但本发明不限于上述实施例,当然能够进行各种变更。
例如,在实施例中,筒夹夹持部91、供给部92和废除部93配置在横向的一条直线上,筒夹夹持部91在横向上移动,但也可以是筒夹夹持部91、供给部92和废除部93配置在纵向的一条直线上,使筒夹夹持部91在纵向上移动。另外,供给部92和废除部93的排列可以相反。
另外,可以是具有多组包括拾取部、对准部和贴装部在内的安装部以及搬运通道的芯片贴装机,也可以是具有多组包括拾取部、对准部和贴装部在内安装部且具有一个搬运通道。
另外,在实施例中,说明了使用粘片膜的例子,但也可以在基板上设置涂布粘接剂的预成形部而不使用粘片膜。
另外,在实施例中,对从裸芯片供给部用拾取头拾取裸芯片并将其载置于中间载台上,将载置于中间载台上的裸芯片用贴装头贴装于基板上的芯片贴装机进行了说明,但不限于此,可以适用于从裸芯片供给部拾取裸芯片的半导体制造装置。
例如,还能够适用于不具有中间载台和拾取头而是通过贴装头将裸芯片供给部的裸芯片贴装于基板上的芯片贴装机。
另外,能够适用于不具有中间载台而是从裸芯片供给部拾取裸芯片并将裸芯片拾取头向上方旋转,将裸芯片交接给贴装头并用贴装头贴装于基板上的倒装片贴片机。
另外,能够适用于不具有中间载台和贴装头而是将从裸芯片供给部用拾取头拾取的裸芯片载置于托盘等的芯片分选机。
Claims (17)
1.一种半导体制造装置,其特征在于,
具备:
筒夹支架,其利用磁铁保持筒夹;
头部,其在前端具有该筒夹支架,利用所述筒夹吸附并拾取裸芯片;
筒夹更换部,其更换所述筒夹;和
控制装置,其控制所述头部以及所述筒夹更换部,
所述筒夹更换部具有筒夹夹持部,所述筒夹夹持部具备具有爪构造的开闭臂、和控制所述开闭臂的开闭臂控制装置,
所述筒夹支架具有避让所述开闭臂的爪的避让部,
所述控制装置通过使所述开闭臂开闭并使所述头部上下移动,来进行将所述筒夹向所述筒夹支架的安装、以及将所述筒夹从所述筒夹支架的拆卸。
2.根据权利要求1所述的半导体制造装置,其特征在于,
所述筒夹更换部还具备:
供给部,其供给要安装于所述筒夹支架的筒夹;和
废除部,其废除从所述筒夹支架卸下的筒夹。
3.根据权利要求2所述的半导体制造装置,其特征在于,
所述控制装置利用所述开闭臂夹持从所述供给部供给来的筒夹,
将利用所述开闭臂夹持的筒夹移动至所述筒夹支架的下方,
使所述筒夹支架下降,将由所述开闭臂夹持的筒夹安装于所述筒夹支架。
4.根据权利要求3所述的半导体制造装置,其特征在于,
所述控制装置使所述筒夹支架接近由所述开闭臂夹持的筒夹,由此,由所述开闭臂夹持的筒夹因所述磁铁的磁力被吸起并被定位且安装在所述筒夹支架内。
5.根据权利要求4所述的半导体制造装置,其特征在于,
所述控制装置利用所述开闭臂夹持固定于所述筒夹支架的筒夹,
使所述筒夹支架上升而从所述筒夹支架卸下固定于所述筒夹支架的筒夹,
将由所述开闭臂夹持的筒夹移动至所述废除部的上方,
将所述开闭臂开放,并将筒夹废除到所述废除部。
6.根据权利要求1所述的半导体制造装置,其特征在于,
所述控制装置通过使所述开闭臂开闭并使所述头部上下移动,来进行将所述筒夹支架向所述头部的安装、以及将所述筒夹支架从所述头部的拆卸。
7.根据权利要求6所述的半导体制造装置,其特征在于,
所述控制装置利用所述开闭臂夹持所述筒夹支架,
将由所述开闭臂夹持的筒夹支架移动至所述头部的下方,
使所述头部下降,将由所述开闭臂夹持的筒夹支架安装于所述头部。
8.根据权利要求7所述的半导体制造装置,其特征在于,
所述头部具有利用磁力吸引筒夹支架的磁铁。
9.根据权利要求8所述的半导体制造装置,其特征在于,
所述控制装置利用所述开闭臂来夹持固定于所述头部的筒夹支架,
使所述头部上升而从所述头部卸下固定于所述头部的筒夹支架。
10.根据权利要求1所述的半导体制造装置,其特征在于,
还具备裸芯片供给部,该裸芯片供给部具有保持着贴付有裸芯片的切割带的晶片环,
所述头部为拾取贴付于所述切割带的裸芯片的拾取头。
11.根据权利要求10所述的半导体制造装置,其特征在于,
还具备:
中间载台,其载置利用所述拾取头拾取的裸芯片;和
贴装头,其将从所述中间载台拾取的裸芯片贴装于基板或贴装在已贴装的裸芯片之上,
所述贴装头具备所述筒夹支架。
12.根据权利要求11所述的半导体制造装置,其特征在于,
所述控制装置使所述筒夹夹持部移动至所述中间载台的上方,来更换所述拾取头的筒夹以及所述贴装头的筒夹。
13.根据权利要求12所述的半导体制造装置,其特征在于,
所述中间载台为筒夹式的载台,
所述控制装置将所述开闭臂开闭,使所述中间载台上下移动,来将筒夹安装于所述中间载台、以及从所述中间载台卸下筒夹。
14.根据权利要求1所述的半导体制造装置,其特征在于,
还具备裸芯片供给部,该裸芯片供给部具有保持着贴付有裸芯片的切割带的晶片环,
所述头部为拾取贴付于所述切割带的裸芯片并将所拾取的裸芯片贴装于基板或贴装于已贴装的裸芯片之上的贴装头。
15.一种半导体器件的制造方法,其特征在于,
具有:
(a)工序,准备权利要求1~12中任一项所述的半导体制造装置;
(b)工序,搬入保持着贴付有裸芯片的切割带的晶片环;
(c)工序,准备搬入基板;
(d)工序,拾取裸芯片;和
(e)工序,将所拾取的所述裸芯片贴装于所述基板或贴装在已贴装的裸芯片之上。
16.根据权利要求15所述的半导体器件的制造方法,其特征在于,
在所述(d)工序中,利用贴装头拾取贴付于所述切割带的裸芯片,
在所述(e)工序中,将利用所述贴装头拾取的裸芯片贴装于所述基板或贴装于已贴装的裸芯片之上。
17.根据权利要求16所述的半导体器件的制造方法,其特征在于,
所述(d)工序具有:
(d1)工序,利用拾取头拾取贴付于所述切割带的裸芯片;和
(d2)工序,将利用所述拾取头拾取的裸芯片载置于中间载台,
所述(e)工序具有:
(e1)工序,利用贴装头拾取载置于所述中间载台的裸芯片;和
(e2)工序,将利用所述贴装头拾取的裸芯片载置于所述基板。
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TW201911449A (zh) | 2019-03-16 |
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