CN108962799A - 超精密芯片制造流水线 - Google Patents
超精密芯片制造流水线 Download PDFInfo
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- CN108962799A CN108962799A CN201811017585.2A CN201811017585A CN108962799A CN 108962799 A CN108962799 A CN 108962799A CN 201811017585 A CN201811017585 A CN 201811017585A CN 108962799 A CN108962799 A CN 108962799A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 49
- 230000007246 mechanism Effects 0.000 claims abstract description 67
- 238000007639 printing Methods 0.000 claims abstract description 53
- 238000010330 laser marking Methods 0.000 claims abstract description 16
- 230000033001 locomotion Effects 0.000 claims description 43
- 239000000758 substrate Substances 0.000 claims description 26
- 238000012937 correction Methods 0.000 claims description 18
- 244000135860 Capparis spinosa subsp spinosa Species 0.000 claims description 13
- 230000005540 biological transmission Effects 0.000 claims description 13
- 230000007717 exclusion Effects 0.000 claims description 13
- 239000003550 marker Substances 0.000 claims description 9
- 230000008878 coupling Effects 0.000 claims description 7
- 238000010168 coupling process Methods 0.000 claims description 7
- 238000005859 coupling reaction Methods 0.000 claims description 7
- 230000000694 effects Effects 0.000 claims description 5
- 239000007787 solid Substances 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 12
- 238000005516 engineering process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000009776 industrial production Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 208000002925 dental caries Diseases 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000008450 motivation Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67282—Marking devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811017585.2A CN108962799B (zh) | 2018-09-01 | 2018-09-01 | 超精密芯片制造流水线 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811017585.2A CN108962799B (zh) | 2018-09-01 | 2018-09-01 | 超精密芯片制造流水线 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108962799A true CN108962799A (zh) | 2018-12-07 |
CN108962799B CN108962799B (zh) | 2021-06-22 |
Family
ID=64475425
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201811017585.2A Active CN108962799B (zh) | 2018-09-01 | 2018-09-01 | 超精密芯片制造流水线 |
Country Status (1)
Country | Link |
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CN (1) | CN108962799B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023202307A1 (zh) * | 2022-04-18 | 2023-10-26 | 济南金威刻科技发展有限公司 | MiniLED芯片高端激光划片机后段激光整合设备 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5924675A (ja) * | 1982-08-02 | 1984-02-08 | Hitachi Ltd | 半導体製品の組立方法 |
JP2007173285A (ja) * | 2005-12-19 | 2007-07-05 | Nec Electronics Corp | ウェーハプローバ装置およびウェーハ検査方法 |
CN104733340A (zh) * | 2015-02-28 | 2015-06-24 | 兴化市华宇电子有限公司 | 芯片自动检测及封装生产线 |
CN106328566A (zh) * | 2016-10-15 | 2017-01-11 | 广州明森科技股份有限公司 | 一种多芯智能卡的芯片封装生产线 |
CN107546295A (zh) * | 2016-06-24 | 2018-01-05 | 昆山安谷自动化设备有限公司 | 一种全自动硅片插片机 |
-
2018
- 2018-09-01 CN CN201811017585.2A patent/CN108962799B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5924675A (ja) * | 1982-08-02 | 1984-02-08 | Hitachi Ltd | 半導体製品の組立方法 |
JP2007173285A (ja) * | 2005-12-19 | 2007-07-05 | Nec Electronics Corp | ウェーハプローバ装置およびウェーハ検査方法 |
CN104733340A (zh) * | 2015-02-28 | 2015-06-24 | 兴化市华宇电子有限公司 | 芯片自动检测及封装生产线 |
CN107546295A (zh) * | 2016-06-24 | 2018-01-05 | 昆山安谷自动化设备有限公司 | 一种全自动硅片插片机 |
CN106328566A (zh) * | 2016-10-15 | 2017-01-11 | 广州明森科技股份有限公司 | 一种多芯智能卡的芯片封装生产线 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023202307A1 (zh) * | 2022-04-18 | 2023-10-26 | 济南金威刻科技发展有限公司 | MiniLED芯片高端激光划片机后段激光整合设备 |
Also Published As
Publication number | Publication date |
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CN108962799B (zh) | 2021-06-22 |
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TA01 | Transfer of patent application right |
Effective date of registration: 20210524 Address after: Room 522 and 524, Building C, Science and Technology Business Incubator, Venture Service Center, Wenzhou High-tech Industrial Development Zone, Zhejiang Province, 325000 Applicant after: Yu Xiaofei Address before: Room 522 and 524, Building C, Science and Technology Business Incubator, Venture Service Center, Wenzhou High-tech Industrial Development Zone, Zhejiang Province, 325000 Applicant before: WENZHOU KEHONG ROBOT TECHNOLOGY Co.,Ltd. |
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TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20240415 Address after: 518000, Building 3, 401, Zhangkeng Youpin Cultural and Creative Park, Zhangkeng Community, Minzhi Street, Longhua District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Lingxin Microelectronics Co.,Ltd. Country or region after: China Address before: Room 522 and 524, Building C, Science and Technology Business Incubator, Venture Service Center, Wenzhou High-tech Industrial Development Zone, Zhejiang Province, 325000 Patentee before: Yu Xiaofei Country or region before: China |
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TR01 | Transfer of patent right |