CN108918020A - A kind of differential pressure pickup of detectable bidirectional pressure difference - Google Patents
A kind of differential pressure pickup of detectable bidirectional pressure difference Download PDFInfo
- Publication number
- CN108918020A CN108918020A CN201811167536.7A CN201811167536A CN108918020A CN 108918020 A CN108918020 A CN 108918020A CN 201811167536 A CN201811167536 A CN 201811167536A CN 108918020 A CN108918020 A CN 108918020A
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- China
- Prior art keywords
- circuit board
- outer housing
- differential pressure
- pedestal
- pressure difference
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L13/00—Devices or apparatus for measuring differences of two or more fluid pressure values
- G01L13/06—Devices or apparatus for measuring differences of two or more fluid pressure values using electric or magnetic pressure-sensitive elements
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The invention discloses a kind of differential pressure pickups of detectable bidirectional pressure difference, including sensor outer housing and sensor upper cover, circuit board assembly is installed inside sensor outer housing, one end of sensor outer housing is built-in with the plug with contact pin, the inner end of contact pin is electrically connected with circuit board assembly, and the other end of sensor outer housing is provided with fixation hole；It is provided with the chip wafer for capableing of two-way detection pressure difference on the circuit board assembly, the first air cavity connection chip wafer top end face, the first stomata to realize positive pressure differential detection are provided on sensor outer housing and chip wafer bottom face is connected to by the second air cavity, the second stomata to realize reverse differential pressure detection.The present invention can be achieved to expand the use scope of differential pressure pickup to meet the demand that user detects the pressure difference in different differential pressure directions to positive and reverse differential pressure detection, improve versatility.
Description
Technical field
The present invention relates to sensor technical field, especially a kind of differential pressure pickup for automobile.
Background technique
Differential pressure pickup is a kind of sensor for measuring difference between two pressure, is commonly used to measure a certain equipment
Or the pressure difference of component rear and front end, principle be it is former directly acted on the diaphragm of sensor by measuring pressure, make diaphragm generate with
The directly proportional micro-displacement of hydraulic pressure, makes the capacitance of sensor change, then detects this variation with electronic circuit, and converts defeated
The canonical measure signal of a corresponding pressure out.
Differential pressure pickup includes shell, and circuit board assembly etc. is provided in shell.Traditional automobile differential pressure pickup electricity
Road plate assembly is potted in encapsulation using packaged pressure difference chip, i.e. chip wafer and conditioning chip circuit, then positive
On patch to PCB circuit board, the operation such as circuit board detecting is carried out to facilitate.The differential pressure pickup of such structure is being only capable of detection just
To pressure difference, two-way pressure differential detection cannot achieve.
Summary of the invention
The technical problem to be solved by the invention is to provide a kind of differential pressure pickups, can satisfy user for different directions
Pressure difference detected, improve the versatility and reliability of sensor.
In order to solve the above technical problems, the technical solution used in the present invention is as follows.
A kind of differential pressure pickup of detectable bidirectional pressure difference, including the sensor outer housing and biography for being mutually equipped with and being tightly connected
Sensor upper cover, is equipped with circuit board assembly inside sensor outer housing, one end of sensor outer housing be built-in with band contact pin, with realize with
The plug of exterior strands electrical connection, the inner end of contact pin are electrically connected with circuit board assembly, and the other end of sensor outer housing is provided with logical
Cross the fixation hole that bolt is mounted on vehicle；The chip wafer for capableing of two-way detection pressure difference is provided on the circuit board assembly,
The first air cavity connection chip wafer top end face is provided on the sensor outer housing, with the first of the positive pressure differential detection of realization
Stomata and pass through the second air cavity be connected to chip wafer bottom face, with realize reverse differential pressure detection the second stomata.
A kind of differential pressure pickup of above-mentioned detectable bidirectional pressure difference, the circuit board assembly include the base being oppositely arranged up and down
Seat and combined type PCB circuit board are provided with several positioning columns on the pedestal, the combined type PCB being correspondingly situated above pedestal
The location hole being mutually equipped with positioning column for positioning pedestal and combined type PCB circuit board is offered on circuit board；The wafer core
Piece is bonded on the top end face of combined type PCB circuit board one end, and chip wafer is electrically connected by gold thread and combined type PCB circuit board
Connect, be bonded with jube in the combined type PCB circuit board on chip wafer periphery, be located in combined type PCB circuit board jube with
Gel filled with protection chip wafer and gold thread in groove between chip wafer；The other end top of combined type PCB circuit board
Conditioning chip is electrically connected on end face.
A kind of differential pressure pickup of above-mentioned detectable bidirectional pressure difference is also provided on the pedestal and to be connected to the second air cavity
Pedestal via hole corresponds to and coaxially offers circuit board via in the combined type PCB circuit board above pedestal aperture, chip wafer setting
In combined type PCB circuit board right above circuit board via.
A kind of differential pressure pickup of above-mentioned detectable bidirectional pressure difference, the combined type PCB circuit board include being located at same put down
The ceramic pcb board and glass of face setting tie up pcb board, and ceramic pcb board and glass are tieed up the adjacent respective side edge of pcb board and be respectively set
There are several bonding welding pads, the other side edge opposite with bonding welding pad is provided on glass dimension pcb board is electrically connected with contact pin
Via pad；It is connected between bonding welding pad on two pieces of pcb boards by aluminum steel；The glass dimension pcb board setting via pad
One end is stretched out outside pedestal.
It is set respectively on a kind of differential pressure pickup of above-mentioned detectable bidirectional pressure difference, the ceramics pcb board and glass dimension pcb board
It is equipped with cylindrical location hole, the gap between ceramic pcb board and glass dimension pcb board forms strip location hole；Corresponding pedestal
On positioning column also include the cylindricality positioning column equipped with cylindrical location hole and the strip that is mutually equipped with strip location hole
Positioning column；The strip positioning column is located at the underface of aluminum steel, and the top end face of strip positioning column and ceramic pcb board and glass
The top end face of fiber pcb board is concordant.
A kind of differential pressure pickup of above-mentioned detectable bidirectional pressure difference, the chip wafer and circuit board via are arranged at
On ceramic pcb board；Conditioning chip and peripheral devices setting are on glass dimension pcb board.
A kind of differential pressure pickup of above-mentioned detectable bidirectional pressure difference, the circuit board via side of the ceramics pcb board bottom face
Edge is connect with the pedestal via hole rim seal in Chuck top face.
A kind of differential pressure pickup of above-mentioned detectable bidirectional pressure difference, the circuit board assembly are inverted on sensor outer housing,
The bottom face outer of the sensor upper cover is provided with upper cover fence, and equipped upper cover is provided on the top end face of sensor outer housing and is enclosed
The upper cover card slot on column；It is additionally provided with upper cover jube on the inner face of the sensor upper cover, the pedestal positioned at pedestal via hole periphery
The upper cover jube card slot of assembly upper cover jube is provided on bottom face；Second air cavity from sensor outer housing through upper cover jube with
Channel between pedestal is connected to pedestal via hole.
A kind of differential pressure pickup of above-mentioned detectable bidirectional pressure difference is additionally provided with card on the top end face of the sensor outer housing
The wafer jube card slot and apical grafting positioning column for filling wafer jube are so as to form receiving conditioning chip between pedestal and sensor outer housing
And the boss of aluminum steel cavity.
Due to using above technical scheme, the invention technological progress is as follows.
The present invention makes extraneous gas both can be with the top of chip wafer by using the combined type PCB circuit board of special construction
End face connection can also be connected to realizing the detection to positive pressure difference with the bottom face of chip wafer, realize the inspection to reverse differential pressure
It surveys, to meet the demand that user detects the pressure difference in different differential pressure directions, expands the use scope of differential pressure pickup,
Improve versatility；Meanwhile by optimizing to sensor structure, sensor reliability is effectively increased.
Combined type PCB circuit board in the present invention, can using the form of ceramic pcb board and glass dimension PCB combined
Take into account glass dimension pcb board and ceramic pcb board advantage, at the same avoid two kinds of material circuit boards there are the shortcomings that, greatly reduce PCB
The cost of manufacture of plate.By strengthening the reliability of differential pressure pickup circuit board assembly to chip wafer progress specially treated, and
And from pressure difference chip wafer to conditioning chip can unrestricted choice model matched, meet the needs of different use environments,
Versatility is greatly improved.In addition, circuit board assembly structure of the invention eliminates encapsulating structure, using pressure difference wafer gold
Line bonding technique, when sensor break down when, can on the basis of guaranteeing chip integrity, it is convenient, fast, accurately into
Row accident analysis.
Detailed description of the invention
Fig. 1 is external structure of the invention；
Fig. 2 is cross-sectional view of the invention；
Fig. 3 is exploded view of the invention；
Fig. 4 is the structural schematic diagram for inventing the circuit board assembly；
Fig. 5 is the side view of Fig. 4；
Fig. 6 is the exploded view for inventing the circuit board assembly；
Fig. 7 is the structural schematic diagram of combined type PCB circuit board of the present invention.
Wherein, 1, sensor outer housing, 2, sensor upper cover, 3, circuit board assembly, 4, upper cover jube, 5, upper cover jube card
Slot, 6, upper cover card slot, 8, plug, 9, contact pin, 10, fixation hole, 11, wafer jube card slot, the 12, first stomata, the 13, first gas
Chamber, the 14, second stomata, the 15, second air cavity；
31, pedestal, 32, combined type PCB circuit board, 33, wafer jube, 34, chip wafer, 35, positioning column, 36, conditioning chip,
37, gold thread, 38, gel, 39, circuit board via, 310, pedestal via hole, 311, via pad, 312, location hole；
321, glass ties up pcb board, 322, ceramic pcb board, the 323, first bonding welding pad, 324, aluminum steel, the 325, second bonding welding pad.
Specific embodiment
Below in conjunction with the drawings and specific embodiments, the present invention will be described in further detail.
A kind of differential pressure pickup of detectable bidirectional pressure difference, external structure is as described in Figure 1, including is mutually equipped with and seals
The sensor outer housing 1 and sensor upper cover 2 of connection are equipped with circuit board assembly 3 inside sensor outer housing, such as Fig. 2 and Fig. 3 institute
Show.One end of sensor outer housing is built-in with plug 8, is equipped with contact pin 9 in plug, is electrically connected with realizing with overall wire sheaves, contact pin
Inner end is electrically connected with circuit board assembly, and the other end of sensor outer housing is provided with the fixation hole that bolt is mounted on vehicle
10。
In the present invention, it is provided with the chip wafer 34 for capableing of two-way detection pressure difference on circuit board assembly 3, on sensor outer housing
It is provided with the first stomata 12 and the second stomata 14, the first stomata 12 passes through closed first air cavity 13 connection in sensor outer housing
Chip wafer top end face, the detection to realize positive pressure difference；Second stomata 14 passes through enclosed second gas in sensor outer housing
Chamber 15 is connected to chip wafer bottom face, to realize the detection of reverse differential pressure.
The structure of circuit board assembly is as shown in Figures 4 to 6, the pedestal 31 including being oppositely arranged up and down and combined type PCB electricity
Road plate 32 is bonded together between pedestal 31 and combined type PCB circuit board 32 by sealant.Several positioning are provided on pedestal
Column 35 is correspondingly situated in the combined type PCB circuit board above pedestal and offers location hole 312, location hole 312 and positioning column phase
It is equipped with for positioning pedestal 31 and combined type PCB circuit board 32.
The structure of combined type PCB circuit board 32 is as shown in fig. 7, comprises be generally aligned in the same plane 322 He of ceramic pcb board of setting
Glass ties up pcb board 321.The advantages of the advantages of combined type PCB circuit board has taken into account ceramic pcb board and glass dimension pcb board, price
It decreases than ceramic pcb board, so that PCB circuit board design is more flexible, reliable, can satisfy severe use environment on automobile
And high performance requirement.
The side edge of ceramic pcb board 322 is provided with several first bonding welding pads 323, for electric with glass dimension pcb board
Connection；Glass ties up the side edge adjacent with the first bonding welding pad 33 on ceramic pcb board of pcb board 321 and is provided with several second keys
Pad 325 is closed, the glass dimension pcb board other side edge opposite with the second bonding welding pad 325 is provided with to be electrically connected with external devices
The via pad 311 connect, glass are tieed up pcb board 321 and are arranged outside one end stretching pedestal 31 of via pad 311, and connecting contact pin is used for
9.Pass through aluminium between the first bonding welding pad 323 on ceramic pcb board 322 and the second bonding welding pad 325 of glass dimension pcb board 321
Line 324 is correspondingly connected with.
In the present invention, cylindrical location hole, ceramic PCB are respectively arranged on ceramic pcb board 322 and glass dimension pcb board 321
Gap between plate 322 and glass dimension pcb board 321 forms strip location hole；Positioning column in corresponding pedestal also include with
The strip positioning column cylindrical location hole equipped cylindricality positioning column and be mutually equipped with strip location hole；Strip positioning column
Positioned at the underface of aluminum steel, and the top end face of strip positioning column and ceramic pcb board 322 and glass tie up the top end face of pcb board 321
Concordantly.
The chip wafer 34 uses corrosion-resistant chip wafer, is bonded on ceramic pcb board 322 by sealant, wafer
Chip 34 is electrically connected by gold thread 37 with combined type PCB circuit board.It is glued on the ceramic pcb board 322 on 34 periphery of chip wafer
It is connected to jube 33, gel 38, gel institute is filled in the groove on ceramic pcb board 322 between jube and chip wafer 34
The gel layer height of formation is higher than the height of chip wafer and gold thread, for protecting chip wafer 34 and gold thread 37.
Circuit board via 39, circuit board via are offered vertically on the ceramic pcb board 322 immediately below chip wafer 34
39 diameter is less than the minimum outer diameter of chip wafer；Pedestal via hole is offered on pedestal immediately below corresponding circuits plate via hole 39
310, pedestal via hole 310 and circuit board via 39 are coaxially disposed, and the diameter of pedestal via hole 310 is greater than the maximum of chip wafer 34
Outer diameter；310 edge of pedestal via hole in 39 edge of circuit board via of ceramic 322 bottom face of pcb board and Chuck top face passes through close
Sealing is tightly connected, and guarantees that the gas of the second air cavity can be normal through pedestal via hole, circuit board via, and lead directly to chip wafer
Bottom.
The setting of circuit board via 39 and pedestal via hole 310 on circuit board assembly of the present invention, can be installed in the present invention
After on sensor outer housing, the connection with outside is formed, facilitates the detection for carrying out reverse differential pressure；That is, the present invention is applied to pressure difference
In sensor, extraneous gas can be both connected to by the first stomata, the first air cavity with the top end face of chip wafer, to positive pressure difference into
Row detection, can also be connected to the bottom face of chip wafer by the second stomata, the second air cavity, be detected to reverse differential pressure.
Glass, which is tieed up, welds conditioning chip 6 and peripheral devices on pcb board 321, as shown in figure 4, to guarantee chip stitch and electricity
The reliability of road plate pad connection.
Circuit board assembly of the invention is inverted on sensor outer housing 1, as shown in Figure 3.First air cavity is horizontally installed on biography
In sensor shell, the outer end of the first air cavity is connected to the first stomata, and in the inner end of the first air cavity and gel layer the top of chip wafer
End face connection, so as to realize the detection of positive pressure difference.
The bottom face outer of sensor upper cover 2 is provided with upper cover fence, is provided on the top end face of sensor outer housing equipped
The upper cover card slot 6 of upper cover fence, as shown in Figures 2 and 3.It is additionally provided with upper cover jube 4 on the inner face of sensor upper cover, is located at
Upper cover jube card slot 5 is provided on the base bottom face on 310 periphery of pedestal via hole, for assembling upper cover jube 4, as shown in Figure 3；
Second air cavity 15 from sensor housing vertical upwards, behind the channel between upper cover jube and pedestal with pedestal via hole 310
Connection, so as to realize the detection of reverse differential pressure.
Wafer jube card slot 11 and boss are additionally provided on the top end face of sensor outer housing, wafer jube card slot 1 is used for
Wafer jube 33, boss and strip positioning column phase apical grafting are clamped, makes to form receiving conditioning chip between pedestal and sensor outer housing
36 and aluminum steel 324 cavity, protect gold thread and conditioning chip to be not under compression damage, improve the reliability of sensor.
Assembling process of the invention is：Silica gel is applied in wafer jube card slot in sensor outer housing, by circuit board assembly 3
It is placed in sensor outer housing, allows the wafer jube of circuit board assembly and wafer jube card slot to be tightly connected, so that the top of wafer
End face is connected with the first stomata, the first air cavity and forms sealing；It is by the via pad on circuit board assembly that circuit board is total
At on the contact pin for being welded on sensor outer housing, it is electrically connected so that sensor outer housing is established with circuit board assembly；Then, in circuit
Silica gel is applied in upper cover jube card slot on plate assembly and in the upper cover card slot of sensor outer housing, and sensor upper cover is placed on sensing
On device shell, upper cover jube card slot and upper cover jube is allowed to be tightly connected, so that the bottom face of wafer is through circuit board via, pedestal mistake
Hole is connected with the second air cavity and the second stomata and forms sealing, and keeps upper cover fixed on the shell.
In use, connecing the harness connector plug of vehicle on sensor outer housing plug, enable the sensor to be powered and can be defeated
Electric signal out；Two-way gas source is separately connected the first stomata, the second stomata, when working properly, two-way gas source shape on wafer
It at pressure difference, is converted by circuit board, transmits out by plug as electronic signals.
Claims (9)
1. a kind of differential pressure pickup of detectable bidirectional pressure difference, including the sensor outer housing for being mutually equipped with and being tightly connected（1）And biography
Sensor upper cover（2）, circuit board assembly is installed inside sensor outer housing（3）, one end of sensor outer housing is built-in with band contact pin
（9）, to realize the plug that is electrically connected with exterior strands（8）, the inner end of contact pin is electrically connected with circuit board assembly, sensor outer housing
The other end is provided with the fixation hole that bolt is mounted on vehicle（10）；It is characterized in that：The circuit board assembly（3）On set
It is equipped with the chip wafer for capableing of two-way detection pressure difference（34）, the first air cavity is provided on the sensor outer housing（13）Connection
Chip wafer top end face, the first stomata to realize positive pressure differential detection（12）And pass through the second air cavity（15）It is connected to wafer core
Piece bottom face, the second stomata to realize reverse differential pressure detection（14）.
2. a kind of differential pressure pickup of detectable bidirectional pressure difference according to claim 1, it is characterised in that：The circuit board
Assembly（3）Including the pedestal being oppositely arranged up and down（31）With combined type PCB circuit board（32）, it is several fixed to be provided on the pedestal
Position column（35）, it is correspondingly situated to offer in the combined type PCB circuit board above pedestal and is mutually equipped with positioning column for positioning base
Seat（31）With combined type PCB circuit board（32）Location hole（312）；The chip wafer（34）It is bonded in combined type PCB circuit
On the top end face of plate one end, chip wafer（34）Pass through gold thread（37）It is electrically connected with combined type PCB circuit board, is located at chip wafer
（34）Jube is bonded in the combined type PCB circuit board on periphery（33）, jube and chip wafer are located in combined type PCB circuit board
（34）Between groove in filled with protection chip wafer and gold thread gel（38）；The other end top of combined type PCB circuit board
Conditioning chip is electrically connected on end face（36）.
3. a kind of differential pressure pickup of detectable bidirectional pressure difference according to claim 2, it is characterised in that：On the pedestal
It is also provided with and the second air cavity（15）The pedestal via hole of connection（310）, correspond in the combined type PCB circuit board above pedestal aperture
Coaxially offer circuit board via（39）, chip wafer（34）It is arranged in circuit board via（39）The combined type PCB electricity of surface
On the plate of road.
4. a kind of differential pressure pickup of detectable bidirectional pressure difference according to claim 2, it is characterised in that：The combined type
PCB circuit board（32）Ceramic pcb board including being generally aligned in the same plane setting（322）Pcb board is tieed up with glass（321）, ceramic pcb board
（322）Pcb board is tieed up with glass（321）Pcb board is tieed up along several bonding welding pads, glass is respectively arranged in adjacent respective side
（321）The upper other side edge opposite with bonding welding pad is provided with and contact pin（9）The via pad of electrical connection（311）；Two pieces
Pass through aluminum steel between bonding welding pad on pcb board（324）Connection；The glass ties up pcb board（21）Via pad is set（311）'s
One end is stretched out outside pedestal.
5. a kind of differential pressure pickup of detectable bidirectional pressure difference according to claim 4, it is characterised in that：The ceramics
Pcb board（322）Pcb board is tieed up with glass（321）On be respectively arranged with cylindrical location hole, ceramic pcb board（322）It is tieed up with glass
Pcb board（321）Between gap formed strip location hole；Accordingly the positioning column in pedestal also includes and cylindrical location hole
Equipped cylindricality positioning column and the strip positioning column being mutually equipped with strip location hole；The strip positioning column is located at aluminum steel
Underface, and the top end face of strip positioning column and ceramic pcb board（322）Pcb board is tieed up with glass（321）Top end face it is flat
Together.
6. a kind of differential pressure pickup of detectable bidirectional pressure difference according to claim 4, it is characterised in that：The wafer core
Piece（34）And circuit board via（39）It is arranged at ceramic pcb board（322）On；Conditioning chip and peripheral devices are arranged in glass
Tie up pcb board（321）On.
7. a kind of differential pressure pickup of detectable bidirectional pressure difference according to claim 4, it is characterised in that：The ceramics
Pcb board（322）The circuit board via of bottom face（39）Edge is connect with the pedestal via hole rim seal in Chuck top face.
8. a kind of differential pressure pickup of detectable bidirectional pressure difference according to claim 3, it is characterised in that：The circuit board
Assembly is inverted on sensor outer housing, and the bottom face outer of the sensor upper cover is provided with upper cover fence, sensor outer housing
The upper cover card slot of equipped upper cover fence is provided on top end face（6）；Upper cover is additionally provided on the inner face of the sensor upper cover
Jube（4）, it is located at pedestal via hole（310）Assembly upper cover jube is provided on the base bottom face on periphery（4）Upper cover jube card
Slot（5）；Second air cavity（15）From sensor outer housing through between upper cover jube and pedestal channel and pedestal via hole（310）Even
It is logical.
9. a kind of differential pressure pickup of detectable bidirectional pressure difference according to claim 3, it is characterised in that：The sensor
It is additionally provided on the top end face of shell and clamps wafer jube（33）Wafer jube card slot（11）And apical grafting positioning column is so that base
It is formed between seat and sensor outer housing and accommodates conditioning chip（36）And aluminum steel（324）The boss of cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811167536.7A CN108918020A (en) | 2018-10-08 | 2018-10-08 | A kind of differential pressure pickup of detectable bidirectional pressure difference |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811167536.7A CN108918020A (en) | 2018-10-08 | 2018-10-08 | A kind of differential pressure pickup of detectable bidirectional pressure difference |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108918020A true CN108918020A (en) | 2018-11-30 |
Family
ID=64409202
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811167536.7A Pending CN108918020A (en) | 2018-10-08 | 2018-10-08 | A kind of differential pressure pickup of detectable bidirectional pressure difference |
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| Country | Link |
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| CN (1) | CN108918020A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113174307A (en) * | 2021-01-15 | 2021-07-27 | 北京中科生仪科技有限公司 | Upper cover based on nucleic acid detection chip installation bin |
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|---|---|---|---|---|
| CN203310564U (en) * | 2013-06-08 | 2013-11-27 | 无锡隆盛科技股份有限公司 | Differential pressure sensor |
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| CN113174307A (en) * | 2021-01-15 | 2021-07-27 | 北京中科生仪科技有限公司 | Upper cover based on nucleic acid detection chip installation bin |
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