CN103487198B - The manufacture method of pressure transducer and pressure transducer - Google Patents
The manufacture method of pressure transducer and pressure transducer Download PDFInfo
- Publication number
- CN103487198B CN103487198B CN201310231557.1A CN201310231557A CN103487198B CN 103487198 B CN103487198 B CN 103487198B CN 201310231557 A CN201310231557 A CN 201310231557A CN 103487198 B CN103487198 B CN 103487198B
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- pressure transducer
- detecting element
- pressure
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 238000000034 method Methods 0.000 title claims abstract description 14
- 239000011347 resin Substances 0.000 claims abstract description 67
- 229920005989 resin Polymers 0.000 claims abstract description 67
- 239000007767 bonding agent Substances 0.000 claims abstract description 31
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 17
- 238000003780 insertion Methods 0.000 claims 1
- 230000037431 insertion Effects 0.000 claims 1
- 238000001514 detection method Methods 0.000 abstract description 11
- 230000002950 deficient Effects 0.000 abstract description 10
- 238000009413 insulation Methods 0.000 abstract description 10
- 230000007797 corrosion Effects 0.000 abstract description 9
- 238000005260 corrosion Methods 0.000 abstract description 9
- 238000003466 welding Methods 0.000 description 6
- 230000007423 decrease Effects 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 230000000630 rising effect Effects 0.000 description 5
- 239000000203 mixture Substances 0.000 description 4
- ORQBXQOJMQIAOY-UHFFFAOYSA-N nobelium Chemical compound [No] ORQBXQOJMQIAOY-UHFFFAOYSA-N 0.000 description 4
- 238000007711 solidification Methods 0.000 description 4
- 230000008023 solidification Effects 0.000 description 4
- 239000011148 porous material Substances 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The invention provides the manufacture method of a kind of pressure transducer and pressure transducer.When being applied with power to outside lead, outside lead is fixed, can not crack on the inclosure resin of the formation bonding agent of softness, can not defective insulation be produced because moisture enters from outside or bring the impacts such as corrosion to pressure detecting element, can pressure detection accurately be carried out.Pressure transducer possesses: the joint component (14) being formed with stream (12); The pressure detecting element (16) configured in the mode opposed with the stream of joint component; Form the inclosure resin portion (68) of bonding agent in the gap that the inside being filled in cap assembly (66) is formed; And the down-lead card bonding part (60) of the fixing outside lead (62) be connected with pressure detecting element, the upper end (68a) enclosing resin portion is configured to below the plane that the upper surface (60d) with down-lead card bonding part is identical.
Description
Technical field
The present invention relates to the pressure transducer of liquid-seal type and the manufacture method of pressure transducer.
Background technology
All the time, as the pressure transducer that hydrodynamic pressure detects, at patent documentation 1(Japanese Unexamined Patent Publication 2012-68105 publication) in disclose to not allow moisture enter from outside and make the pressure transducer 100 of the liquid-seal type of structure very close to each other.
As shown in Figure 7, this pressure transducer 100 is made up of the combination of pressure detecting element 102, joint component 104 and cap assembly 106.
Further, the edge, periphery of metal diaphragm 108 utilizes welding etc. to be hermetic fastened on a square end face (bottom surface) of pressure detecting element 102.Terminal pin 114 is connected with the sensor chip 110 of the lower surface being arranged on pressure detecting element 102 by wire-bonded 112.
Further, as shown in Figure 7, this terminal pin 114 is connected with substrate 116, and is connected with outside lead 118.Further, the space in cap assembly 106 is sealed with the inclosure resin 122 be made up of bonding agent, and the space between cap assembly 106 and joint component 104 is also sealed with the inclosure resin 124 be made up of bonding agent.Thus, eliminate gap, stop the liquid of moisture etc. to enter inside.
Prior art document
Patent documentation
Patent documentation 1: Japanese Unexamined Patent Publication 2012-68105 publication
Summary of the invention
But, this in the pressure transducer 100 of the liquid-seal type described in existing patent documentation 1, when being applied with power to outside lead 118, as shown in Figure 7, because outside lead 118 is not fixed, therefore crack in the inclosure resin 122 of the formation bonding agent of softness, moisture enters from outside and produces defective insulation or bring the impact of corrosion etc. to pressure detecting element 102, cannot carry out pressure detection accurately.
Further, when the inclosure resin 122 making to be made up of bonding agent solidifies, the inclosure resin 122 forming bonding agent spreads rising because of surface tension upward along terminal pin 114, and gives prominence to from the upper end 122a enclosing resin 122 and cause the qualities such as outward appearance to decline.
The present invention is the scheme proposed in view of this present situation, object is the manufacture method providing a kind of pressure transducer and pressure transducer, when being applied with power to outside lead, outside lead is fixed, can not crack on the inclosure resin of the formation bonding agent of softness, defective insulation can not be produced because moisture enters from outside, or the impact of corrosion etc. is brought to pressure detecting element, pressure detection accurately can be carried out, and, when making the inclosure resin solidification of formation bonding agent, the inclosure resin forming bonding agent externally can not go between because of surface tension and spread rising upward, and give prominence to from inclosure resin upper end and cause the quality of outward appearance etc. to decline.
For solving the method for problem
The present invention is problem in order to realize above-mentioned prior art and object and the invention proposed, and the feature of pressure transducer of the present invention is, possesses: the joint component being formed with stream; Be fastened on above-mentioned joint component in order to the hydrodynamic pressure detected in above-mentioned stream, and with the pressure detecting element that the mode opposed with the stream of joint component configures; In the gap that the inside being filled in cap assembly is formed, and form the inclosure resin portion of bonding agent; And the down-lead card bonding part of the fixing outside lead be connected with above-mentioned pressure detecting element, the upper end of above-mentioned inclosure resin portion is configured to below the plane identical with the upper surface of above-mentioned down-lead card bonding part.
In addition, the feature of the manufacture method of pressure transducer of the present invention is to possess: the joint component being formed with stream; Be fastened on above-mentioned joint component in order to the hydrodynamic pressure detected in above-mentioned stream, and with the pressure detecting element that the mode opposed with the stream of joint component configures; In the gap that the inside being filled in cap assembly is formed, and form the inclosure resin portion of bonding agent; And the down-lead card bonding part of the fixing outside lead be connected with above-mentioned pressure detecting element,
Fill in the gap of inside being formed at cap assembly and enclose resin, make the upper end of above-mentioned inclosure resin portion below the plane identical with the upper surface of above-mentioned down-lead card bonding part.
By such formation, possesses the down-lead card bonding part of the fixing outside lead be connected with pressure detecting element, fill in the gap of inside being formed at cap assembly and enclose resin, make the upper end enclosing resin portion below the plane identical with the upper surface of down-lead card bonding part.
Therefore, when being applied with power to outside lead, outside lead is fixed by down-lead card bonding part, therefore can not crack on the inclosure resin of the formation bonding agent of softness, defective insulation can not be produced because moisture enters from outside or bring the impact of corrosion etc. to pressure detecting element, carry out pressure detection accurately.
And, resin is enclosed owing to filling in the gap that formed in the inside of cap assembly, make the upper end enclosing resin portion below the plane identical with the upper surface of above-mentioned down-lead card bonding part, therefore when making the inclosure resin solidification of formation bonding agent, the inclosure resin forming bonding agent externally can not go between because of surface tension and spread rising upward, and gives prominence to from the upper end enclosing resin and cause the quality of appearance etc. to decline.
In addition, the invention is characterized in, above-mentioned down-lead card bonding part has the locking grooving hole of fixed outer lead-in wire.
By such formation, even if when being applied with power to outside lead, also because the locking grooving hole of outside lead by down-lead card bonding part firmly fixes, therefore can not crack on the inclosure resin of the formation bonding agent of softness, defective insulation can not be produced because moisture enters from outside or bring the impact of corrosion etc. to pressure detecting element, carry out pressure detection more accurately.
In addition, the invention is characterized in, be configured to by the grooving in above-mentioned locking grooving hole and outside lead is engaging in locking grooving hole with inserted mode.
By such formation, because outside lead is engaging in locking grooving hole with inserted mode by the grooving by locking grooving hole, therefore utilize the operation of the locking grooving hole fixed outer lead-in wire of down-lead card bonding part to become easy, can reduce costs and time and labour.
Effect of the present invention is as follows.
According to the present invention, possesses the down-lead card bonding part of the fixing outside lead be connected with pressure detecting element, by enclosing in gap that resin filling formed in the inside of cap assembly, make the upper end of inclosure resin portion below the plane identical with the upper surface of above-mentioned down-lead card bonding part.
Therefore, even if when being when having added power to outside lead, also because outside lead is fixed by down-lead card bonding part, therefore can not crack on the inclosure resin of the formation bonding agent of softness, defective insulation can not be produced because moisture enters from outside or bring the impact of corrosion etc. to pressure detecting element, carry out pressure detection accurately.
And, resin is enclosed owing to filling in the gap that formed in the inside of cap assembly, make the upper end enclosing resin portion below the plane identical with the upper surface of above-mentioned down-lead card bonding part, therefore when making the inclosure resin solidification of formation bonding agent, the inclosure resin forming bonding agent externally can not go between because of surface tension and spread rising upward, and the upper end enclosing resin is given prominence to and causes the quality of appearance etc. to decline.
Accompanying drawing explanation
Fig. 1 is the longitudinal section of pressure transducer of the present invention.
Fig. 2 is the vertical view of pressure transducer of the present invention.
Fig. 3 is the longitudinal section of the outline of the manufacturing process that pressure transducer of the present invention is described.
Fig. 4 is the longitudinal section of the outline of the manufacturing process that pressure transducer of the present invention is described.
Fig. 5 is the longitudinal section of the outline of the manufacturing process that pressure transducer of the present invention is described.
Fig. 6 is the longitudinal section of the outline of the manufacturing process that pressure transducer of the present invention is described.
Fig. 7 is the longitudinal section of the pressure transducer 100 representing existing liquid-seal type.
In figure:
10-pressure transducer, 12-stream, 14-joint component, 14a-flange part, 16-pressure detecting element, 18-element body, 20-central opening, 22-seal glass, 24-diaphragm, 26-intercommunicating pore, 28-diaphragm protective cover, 30-fluid-tight room, 32-sensor chip, 34-terminal pin, 34a-front end, 36-metal wire, 38-terminal board, 38a-surface, 40-pressure chamber, the fixing wall of 42-terminal, 42a-inserting hole, 44-lower sidewalls, 46-top sidewall, 48-terminal, 48a-outer end, 50-chimeric stage portion, 52-connecting portion, 54-cover, 56-upper plate portion, 58-sidewall, 60-down-lead card bonding part, 60a ~ 60c-locking grooving hole, 60d-upper surface, 60e-lower surface, 62-outside lead, 62a ~ 62c-outside lead, 64-connecting portion, 66-cap assembly, 66a-base end part, 66b-peristome, 68-enclose resin portion, 68a-upper end, 100-pressure transducer, 102-pressure detecting element, 104-joint component, 106-cap assembly, 108-diaphragm, 110-sensor chip, 112-wire-bonded, 114-terminal pin, 116-substrate, 118-outside lead, 122-enclose resin, 124-enclose resin, S1-the first space, S2-second space, S3-gap, T-gap.
Embodiment
Below, based on accompanying drawing, embodiments of the present invention (embodiment) are described in detail.
Embodiment 1
Fig. 1 is the longitudinal section of pressure transducer of the present invention, and Fig. 2 is the vertical view of pressure transducer of the present invention, and Fig. 3 ~ Fig. 6 is the longitudinal section of the outline of the manufacturing process that pressure transducer of the present invention is described.
In Fig. 1 ~ Fig. 2, symbol 10 integrally represents pressure transducer of the present invention.
As shown in Figure 1, pressure transducer 10 of the present invention is pressure transducers of liquid-seal type, possesses: the joint component 14 being formed with stream 12; And detect the pressure detecting element 16 of the hydrodynamic pressure in stream 12.
Further, configure pressure detecting element 16 in the mode that the stream 12 with this joint component 14 is opposed, and weld fastening at its circumference with joint component 14.
Pressure detecting element 16 possesses metal element body 18 such as such as stainless steel, aluminium etc., is embedded in and is fastened with seal glass 22 at the central opening 20 being formed at this element body 18.
In addition, as shown in Figure 1, the element body 18 of pressure detecting element 16, metal diaphragm 24 and the diaphragm protective cover 28 that is formed with intercommunicating pore 26 are fastened as a whole by welding in their edge, periphery.
Further, by this structure, in the part of the central opening 20 of element body 18, between seal glass 22 and diaphragm 24, the fluid-tight room 30 enclosing oil is formed.
On the other hand, as shown in Figure 1, at the face of the side, fluid-tight room 30 of seal glass 22, bonding agent is utilized to be fixed with the sensor chip 32 of single chip architecture.
This sensor chip 32 is disposed in fluid-tight room 30, the pressure transducer sheet that the integrated circuit that the pressure elements as detected pressures and the output signal to this pressure detecting element process is integrally formed and forming.
In addition, seal glass 22 utilizes encapsulation process to be fixed with multiple terminal pin 34 with breakthrough status respectively, and the plurality of terminal pin 34 is for carrying out the input and output of the signal to sensor chip 32.
In this embodiment, although not shown, terminal pin 34 is provided with eight altogether.Namely, be provided with the outside lead 62a(Vout described later as input and output terminal), 62b(Vcc), 62c(GND) three terminal pins 34 and five terminal pins 34 of terminal as the adjustment of sensor chip 32.
Terminal pin 34 is connected (wire-bonded) with sensor chip 32 conducting by the metal wire 36 of such as gold system or aluminum, forms outside lead-out terminal and the External input terminals of sensor chip 32.
Further, be delivered to hydrodynamic pressure in pressure chamber 40 by the intercommunicating pore 26 of diaphragm protective cover 28 by the surface of pressuring film plate 24 from the stream 12 of joint component 14, and utilize the sensor chip 32 in fluid-tight room 30 to detect this signature pressure.
In addition, as shown in Figure 1, on the top of pressure detecting element 16, the terminal board 38 of the first spring means of Special composition forming member is adjacent to configure with the top of the element body 18 of pressure detecting element 16, and utilizes such as bonding agent to be fixed on the element body 18 of pressure detecting element 16.
As shown in Figure 1, this terminal board 38 is substantially cylindrical shape, and be formed with the fixing wall 42 of terminal in its substantially central portion, this terminal fixes the inserting hole 42a with wall 42 being formed with for inserting for terminal pin 34.Further, this terminal board 38 is formed and fixes from this terminal the lower sidewalls 44 that extends downward with wall 42 and fix with wall 42 top sidewall 46 extended upward from terminal.
Thus, as shown in Figure 1, formed between pressure detecting element 16 and terminal board 38 and fixed first space S 1 of surrounding by wall 42 and lower sidewalls 44 by terminal.
Further, the front end 34a of the terminal pin 34 of pressure detecting element 16 inserts in inserting hole 42a, to utilize such as weld and be electrically connected with the terminal 48 arranged in the mode of the top sidewall 46 of through terminal board 38 at connecting portion 52.
In addition, in this embodiment, although not shown, as shown in Figure 2 described later, be provided with outside lead 62a(Vout), 62b(Vcc), 62c(GND) three terminals 48.
And, as shown in Figure 1 and Figure 2, above terminal board 38, sidewall 46 is formed with chimeric stage portion 50, the mode that the cover 54 of the second space forming member of Special composition forming member is fitted together to stage portion 50 chimeric with this, is adjacent to configure with terminal board 38.
Namely, cover 54 for possessing the roughly cup-shaped of upper plate portion 56 and sidewall 58, be configured to sidewall 58 chimeric with the chimeric stage portion 50 of the top sidewall 46 being formed at terminal board 38.
Thus, as shown in Figure 1, formed between cover 54 and terminal board 38 by the terminal of terminal board 38 fix with wall 42 and above the second space S2 that surrounds of sidewall 46, the upper plate portion 56 of cover 54 and sidewall 58.
Namely, by forming like this, as shown in Figure 1, the cover 54 of terminal board 38 and configuration adjacent with terminal board 38 is utilized, larger space form overburden pressure detecting element 16 together with terminal board 38, that be made up of above-mentioned space S 1 and space S 2.
Namely, at the terminal of terminal board 38 fix with wall 42, become connected state between above-mentioned space S 1, S2, thus, utilize terminal board 38 and cover 54 to form the larger space of overburden pressure detecting element 16.
Further, as shown in Figure 1 and Figure 2, down-lead card bonding part 60 projecting is laterally formed with at the sidewall 58 of cover 54.As shown in Figure 2, this down-lead card bonding part 60 is rectangular shape, with three outside leads 62, namely, outside lead 62a(Vout), 62b(Vcc), 62c(GND) be formed with locking grooving hole 60a, 60b, 60c of down-lead card bonding part 60 accordingly respectively.
Namely, outside lead 62a(Vout), 62b(Vcc), 62c(GND) shown in arrow A as shown in Figure 1, Figure 2, embed locking grooving hole 60a, 60b, 60c and fix.
On the other hand, as shown in Figure 1, outside lead 62 is electrically connected by the outer end 48a with the terminal 48 arranged in the mode of sidewall 46 above through terminal board 38 such as such as solder, welding etc. at connecting portion 64.
In addition, as shown in the arrow B of Fig. 1, the peristome 66b side of cap assembly 66 is inserted from joint component 14 side, and the base end part 66a of the flange shape projecting in the inner side of cap assembly 66 becomes the state abutted with the flange part 14a of joint component 14.
Thus, as shown in Figure 1, at formation gap, the inside S3 of cap assembly 66, in the S3 of this gap, fill from the peristome 66b side of cap assembly 66 the inclosure resin forming bonding agent, formed and enclose resin portion 68.
In addition, in this case, as shown in Figure 1, the upper end 68a enclosing resin portion 68 wishes, for the height below the plane that the height of the upper surface 60d of the down-lead card bonding part 60 with cover 54 is identical, to be preferably placed between the upper surface 60d of down-lead card bonding part 60 and lower surface 60e.
The pressure transducer of the present invention 10 of such formation is manufactured by the operation shown in Fig. 3 ~ Fig. 6.
Namely, as shown in Figure 3, the pressure detecting element 16 assembled integratedly is in advance prepared, welding joint parts 14 on this pressure detecting element 16.
Then, as shown in Figure 4, in the lower sidewalls 44 of the top of the element body 18 of pressure detecting element 16 configuration terminal board 38, such as bonding agent is utilized to be fixed.In this condition, the front end 34a of the terminal pin 34 of pressure detecting element 16 becomes the state that the terminal inserting terminal board 38 fixes the inserting hole 42a with wall 42.
In this condition, the front end 34a of the terminal pin 34 of pressure detecting element 16 inserts inserting hole 42a, and at connecting portion 52, utilization is such as welded and is electrically connected with the terminal 48 arranged in the mode of the top sidewall 46 of through terminal board 38 by the front end 34a of terminal pin 34.
In addition, in this condition, as shown in Figure 4, formed between pressure detecting element 16 and terminal board 38 and fixed first space S 1 of surrounding by wall 42 and lower sidewalls 44 by terminal.
Further, as shown in Figure 5, such as welding, solder etc. are utilized to be electrically connected by the outer end 48a of outside lead 62 with the terminal 48 arranged in the mode of sidewall 46 above through terminal board 38 at connecting portion 64.
In addition, in the mode chimeric with the chimeric stage portion 50 of the top sidewall 46 being formed at terminal board 38, be adjacent to configure cover 54 with terminal board 38.
Thus, as shown in Figure 5, become to be formed between cover 54 and terminal board 38 by the terminal of terminal board 38 fix with wall 42 and above sidewall 46, the upper plate portion 56 of cover 54 and sidewall 58 state of second space S2 of surrounding.
In addition, as shown in the arrow A of Fig. 2, Fig. 5, by outside lead 62a(Vout), 62b(Vcc), 62c(GND) embed respectively and be fixed on locking grooving hole 60a, 60b, 60c of down-lead card bonding part 60.
In this condition, as shown in Figure 6, become and the peristome 66b side of cap assembly 66 is inserted from joint component 14 side, the state that the base end part 66a of the flange shape projecting in the inner side of cap assembly 66 abuts with the flange part 14a of joint component 14.In addition, as required, such as welding is utilized to wait the flange part 14a of butt junction the parts 14 and base end part 66a of cap assembly 66 to be fixed.
Finally, as shown in Figure 1, be formed at the gap S3 of inside of cap assembly 66, filling from the peristome 66b side of cap assembly 66 the inclosure resin forming bonding agent, formed and enclose resin portion 68.
And, in this condition, as shown in Figure 1, the terminal pin 34 of pressure detecting element 16 and the connecting portion 52 of terminal 48 be connected with outside lead 62 become to be positioned at the state that following space manner configures, this space is formed by the cover 54 of the terminal board 38 of the first spring means of Special composition forming member and the second space forming member of Special composition forming member, and enclose the space S 1 of resin by not filling, S2 forms.
This state is the state that terminal pin 34 and the connecting portion 52 of the terminal 48 being connected outside lead 62 of pressure detecting element 16 is positioned at space, instead of as in the past by the state of enclosing resin and covering.Therefore, even if when pressure transducer is repeatedly heated or is cooled, also can not thermal stress be produced, become tolerance thermal shock experiment, can not produce defective insulation or short circuit, can not bring impact to pressure detecting element, can carry out pressure detection accurately.
According to the pressure transducer of the present invention 10 formed like this, on the pressure detecting element 16 only configured in the mode opposed with the stream 12 with joint component 14, be adjacent to configure terminal board 38 with pressure detecting element 16, and be adjacent to configure cover 54 with terminal board 38, space S 1, the S2 of overburden pressure detecting element 16 is just formed by cover 54 and terminal board 38.
Further, side's opening is assembled from joint component 14 side and the cap assembly 66 that abuts with joint component 14 of the base end part 66a of the opposing party side.Then, fill at the gap S3 of the inside being formed at cap assembly 66 the inclosure resin forming bonding agent, formed and enclose resin portion 68.
Thus, as shown in Figure 1, the terminal pin 34 of joint component 14, pressure detecting element 16, abutment pressure detecting element 16 and the terminal board 38 of terminal 48 be connected with outside lead 62 and cover 54 one-tenth are integrated and are sealed.
Therefore, do not need structure complicated as existing pressure transducer, component number of packages also reduces, and assembling does not need time and labor, can also reduce costs.
In addition, be integrated because the terminal pin 34 of joint component 14, pressure detecting element 16, abutment pressure detecting element 16 and the terminal board 38 of terminal 48 be connected with outside lead 62 and cover 54 utilize the inclosure resin forming bonding agent to form and sealed, therefore can not produce defective insulation because moisture enters from outside or bring the impacts such as corrosion to pressure detecting element 16, can pressure detection accurately be carried out.
And, as shown in Figure 1, due to the space S 1, the S2 that utilize cover 54 and terminal board 38 to form overburden pressure detecting element 16, therefore enclose resin can not enter inside and contact with pressure detecting element 16, pressure detecting element 16 can not breakage damages because enclosing the thermal stress of resin, carries out pressure detection accurately.
Have again, owing to assembling side's opening from joint component 14 side and the cap assembly 66 that abuts with joint component 14 of the base end part 66a of the opposing party side, even if therefore when being applied with tensile force to outside lead 62, the base end part 66a of cap assembly 66 also can abut with joint component 14 and be lived by hooking.
Thus, even if apply power to inclosure resin, enclose on resin and also can not crack, defective insulation can not be produced because moisture enters from outside or bring the impact of corrosion etc. to pressure detecting element 16, can pressure detection accurately be carried out.
Have again, shown in arrow A as shown in Figure 1, Figure 2, outside lead 62a(Vout), 62b(Vcc), 62c(GND) embed locking grooving hole 60a, 60b, 60c of projecting down-lead card bonding part 60 on the sidewall 58 of cover 54 laterally respectively and be fixed.
Therefore, even if apply power to outside lead 62, also can not crack in the inclosure resin portion 68 be made up of the inclosure resin forming bonding agent of softness because outside lead 62 is fixed, defective insulation can not be produced because moisture enters from outside or pressure detecting element 16 be brought to the impact of corrosion etc., can pressure detection accurately be carried out.
Further, outside lead 62 becomes its state be separated up and down in down-lead card bonding part 60.Thereby, it is possible to preventing when making the inclosure resin solidification of formation bonding agent, forming the inclosure resin of bonding agent and externally going between because of surface tension and 62 climb up by holding on to rising upward, and give prominence to from the upper end 68a enclosing resin portion 68 and cause the quality of outward appearance etc. to decline.
In addition, in this situation, as shown in Figure 1, wish that the upper end 68a of inclosure resin portion 68 is the height of below the plane identical with the height of the upper surface 60d of the down-lead card bonding part 60 of cover 54, be preferably placed between the upper surface 60d of down-lead card bonding part 60 and lower surface 60e.
Above the preferred embodiment of the present invention is illustrated, but the present invention is not limited thereto, such as in the above-described embodiments, terminal board 38 and cover 54 are parts separately, but terminal board 38 and cover 54 also can be made up of the component of one, can carry out various change in the scope not departing from object of the present invention.
Utilizability in industry
The present invention can be applied to the pressure transducer of liquid-seal type and the manufacture method of pressure transducer.
Claims (6)
1. a pressure transducer, it possesses:
Be formed with the joint component of stream;
Be fastened on above-mentioned joint component in order to the hydrodynamic pressure detected in above-mentioned stream, and with the pressure detecting element that the mode opposed with the stream of joint component configures; And
Be filled in the gap of the inside being formed at cap assembly, and form the inclosure resin portion of bonding agent,
The feature of above-mentioned pressure transducer is,
Above-mentioned pressure transducer also possesses the down-lead card bonding part of the fixing outside lead be connected with above-mentioned pressure detecting element,
After said external lead-in wire is fixed to above-mentioned down-lead card bonding part, fill the inclosure resin for the formation of above-mentioned inclosure resin portion,
The upper end of above-mentioned inclosure resin portion is configured to be positioned at below the plane identical with the upper surface of above-mentioned down-lead card bonding part.
2. pressure transducer according to claim 1, is characterized in that,
Above-mentioned down-lead card bonding part has the locking grooving hole of fixed outer lead-in wire.
3. pressure transducer according to claim 2, is characterized in that,
Be configured to by the grooving in above-mentioned locking grooving hole, outside lead be inserted be engaging in locking grooving hole.
4. a manufacture method for pressure transducer, this pressure transducer possesses:
Be formed with the joint component of stream;
Be fastened on above-mentioned joint component in order to the hydrodynamic pressure detected in above-mentioned stream, and with the pressure detecting element that the mode opposed with the stream of joint component configures; And
Be filled in the gap of the inside being formed at cap assembly, and form the inclosure resin portion of bonding agent,
The feature of the manufacture method of above-mentioned pressure transducer is,
Above-mentioned pressure transducer also possesses the down-lead card bonding part of the fixing outside lead be connected with above-mentioned pressure detecting element,
After said external lead-in wire is fixed to above-mentioned down-lead card bonding part, fill the inclosure resin for the formation of above-mentioned inclosure resin portion,
Fill in the gap of inside being formed at cap assembly and enclose resin, make the upper end of above-mentioned inclosure resin portion be positioned at below the plane identical with the upper surface of above-mentioned down-lead card bonding part.
5. the manufacture method of pressure transducer according to claim 4, is characterized in that,
Above-mentioned down-lead card bonding part has the locking grooving hole of fixed outer lead-in wire.
6. the manufacture method of pressure transducer according to claim 5, is characterized in that,
By the grooving in above-mentioned locking grooving hole, outside lead insertion is engaging in locking grooving hole.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-132211 | 2012-06-11 | ||
| JP2012132211 | 2012-06-11 | ||
| JP2012-229677 | 2012-10-17 | ||
| JP2012229677A JP5656318B2 (en) | 2012-06-11 | 2012-10-17 | Pressure sensor and method of manufacturing pressure sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103487198A CN103487198A (en) | 2014-01-01 |
| CN103487198B true CN103487198B (en) | 2016-03-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310231557.1A Expired - Fee Related CN103487198B (en) | 2012-06-11 | 2013-06-09 | The manufacture method of pressure transducer and pressure transducer |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR101483278B1 (en) |
| CN (1) | CN103487198B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9310267B2 (en) * | 2014-02-28 | 2016-04-12 | Measurement Specialities, Inc. | Differential pressure sensor |
| US10352796B2 (en) * | 2014-07-28 | 2019-07-16 | Ford Global Technologies, Llc | Protective cover for pressure sensor nozzle |
| JP6517709B2 (en) * | 2016-01-29 | 2019-05-22 | 株式会社鷺宮製作所 | Refrigerant circuit components |
| JP6461862B2 (en) * | 2016-06-29 | 2019-01-30 | 株式会社鷺宮製作所 | Pressure sensor and method of manufacturing pressure sensor |
| JP6480969B2 (en) * | 2017-03-17 | 2019-03-13 | 株式会社鷺宮製作所 | Pressure sensor |
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| CN1497245A (en) * | 2002-10-23 | 2004-05-19 | 株式会社电装 | Pressure sensing device with temp. sensor |
| CN1983582A (en) * | 2005-12-08 | 2007-06-20 | 雅马哈株式会社 | Semiconductor device |
| CN101620022A (en) * | 2008-07-01 | 2010-01-06 | 欣兴电子股份有限公司 | Pressure sensing element encapsulation and manufacturing method thereof |
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| JP3318804B2 (en) * | 1994-05-19 | 2002-08-26 | 日立建機株式会社 | Differential pressure sensor |
| JPH10104101A (en) * | 1996-10-02 | 1998-04-24 | Mitsubishi Electric Corp | Semiconductor pressure sensor |
| JP2002231413A (en) | 2001-01-31 | 2002-08-16 | Ngk Spark Plug Co Ltd | Plug with built-in pressure sensor |
| JP3942176B2 (en) * | 2003-03-17 | 2007-07-11 | 日本特殊陶業株式会社 | Glow plug with combustion pressure detection function and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1497245A (en) * | 2002-10-23 | 2004-05-19 | 株式会社电装 | Pressure sensing device with temp. sensor |
| CN1983582A (en) * | 2005-12-08 | 2007-06-20 | 雅马哈株式会社 | Semiconductor device |
| CN101620022A (en) * | 2008-07-01 | 2010-01-06 | 欣兴电子股份有限公司 | Pressure sensing element encapsulation and manufacturing method thereof |
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| KR101483278B1 (en) | 2015-01-14 |
| KR20130138666A (en) | 2013-12-19 |
| CN103487198A (en) | 2014-01-01 |
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