CN103487198A - Pressure sensor and manufacturing method thereof - Google Patents
Pressure sensor and manufacturing method thereof Download PDFInfo
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- CN103487198A CN103487198A CN201310231557.1A CN201310231557A CN103487198A CN 103487198 A CN103487198 A CN 103487198A CN 201310231557 A CN201310231557 A CN 201310231557A CN 103487198 A CN103487198 A CN 103487198A
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- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
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Abstract
The invention provides a pressure sensor and a manufacturing method thereof. External leads are fixed under the condition that a force is applied to the external leads, so that no creak is generated in flexible enclosure resin which forms adhesive, the problems of poor insulation or corrosion of pressure detection elements caused by invasion of external water are solved and the pressure can be detected accurately. The pressure sensor comprises a connector part (14) with a flow path (12), a pressure detection element (16) opposite to the flow path of the connector part, an enclosure resin part (68) disposed in a gap formed in a cover part (66) and forming the adhesive, and a lead clamping and fixing part (60) used for fixing an external lead (62) connected with the pressure detection element. The upper end (68a) enclosed in the resin part is configured to be below the plane the same as the upper surface (60d) of the lead clamping and fixing part.
Description
Technical field
The present invention relates to the manufacture method of pressure transducer and the pressure transducer of liquid-seal type.
Background technology
All the time, detect the pressure transducer of use as hydrodynamic pressure, at patent documentation 1(TOHKEMY 2012-68105 communique) in the pressure transducer 100 of making the liquid-seal type of structure very close to each other in order not allow moisture enter from outside is disclosed.
As shown in Figure 7, this pressure transducer 100 consists of the combination of pressure detecting element 102, joint component 104 and cap assembly 106.
And the periphery edge of metal diaphragm 108 utilizes welding to wait a square end face (bottom surface) that hermetic is fastened on pressure detecting element 102.Terminal pin 114 is connected with the sensor chip 110 of the lower surface that is arranged on pressure detecting element 102 by wire-bonded 112.
Have, as shown in Figure 7, this terminal pin 114 is connected with substrate 116, and is connected with outside lead 118 again.And the space in cap assembly 106 is enclosed the inclosure resin 122 consisted of bonding agent, and the inclosure resin 124 consisted of bonding agent is also enclosed in the space between cap assembly 106 and joint component 104.Thus, eliminate gap, the liquid of prevention moisture etc. enters inside.
The prior art document
Patent documentation
Patent documentation 1: TOHKEMY 2012-68105 communique
Summary of the invention
Yet, in the pressure transducer 100 of this liquid-seal type of putting down in writing at existing patent documentation 1, in the situation that outside lead 118 has been applied to power, as shown in Figure 7, because outside lead 118 is not fixed, therefore in the inclosure resin 122 of soft formation bonding agent, crack etc., moisture enters from outside and produces defective insulation or bring the impact of corrosion etc. to pressure detecting element 102, can't carry out pressure detection accurately.
Have, when the inclosure resin 122 that makes to consist of bonding agent solidifies, the inclosure resin 122 that forms bonding agent spreads rising because of surface tension upward along terminal pin 114 again, and outstanding and cause the quality such as outward appearance to descend from the upper end 122a that encloses resin 122.
The present invention is the scheme proposed in view of this present situation, purpose is to provide the manufacture method of a kind of pressure transducer and pressure transducer, in the situation that outside lead has been applied to power, outside lead is fixed, can on the inclosure resin of soft formation bonding agent, not crack etc., can not enter and produce defective insulation from outside because of moisture, or bring the impact of corrosion etc. to pressure detecting element, can carry out pressure detection accurately, and, when making to form the inclosure resin solidification of bonding agent, the inclosure resin that forms bonding agent can not spread rising along outside lead upward because of surface tension, and outstanding and cause the quality of outward appearance etc. to descend from enclosing the resin upper end.
For solving the method for problem
The present invention is problem in order to realize above-mentioned prior art and purpose and the invention that proposes, and pressure transducer of the present invention is characterised in that to possess: the joint component that is formed with stream; In order to detect the hydrodynamic pressure in above-mentioned stream, be fastened on above-mentioned joint component, and the pressure detecting element configured in the opposed mode of the stream with joint component; Be filled in the gap that the inside of cap assembly forms, and form the inclosure resin portion of bonding agent; And the down-lead card bonding part of the fixing outside lead be connected with above-mentioned pressure detecting element, the upper end of above-mentioned inclosure resin portion is configured to below the plane identical at the upper surface with above-mentioned down-lead card bonding part.
In addition, the manufacture method of pressure transducer of the present invention is characterised in that to possess: the joint component that is formed with stream; In order to detect the hydrodynamic pressure in above-mentioned stream, be fastened on above-mentioned joint component, and the pressure detecting element configured in the opposed mode of the stream with joint component; Be filled in the gap that the inside of cap assembly forms, and form the inclosure resin portion of bonding agent; And the down-lead card bonding part of the fixing outside lead be connected with above-mentioned pressure detecting element,
Fill to enclose resin in the gap of the inside that is formed at cap assembly, make below the plane identical at the upper surface with above-mentioned down-lead card bonding part, the upper end of above-mentioned inclosure resin portion.
By such formation, the down-lead card bonding part that possesses the fixing outside lead be connected with pressure detecting element, fill to enclose resin in the gap of the inside that is formed at cap assembly, make below the plane identical at the upper surface with the down-lead card bonding part, the upper end of enclosing resin portion.
Therefore, in the situation that outside lead has been applied to power, outside lead is fixed by the down-lead card bonding part, therefore can on the inclosure resin of soft formation bonding agent, not crack etc., can not enter because of moisture the impact that produces defective insulation or bring corrosion etc. to pressure detecting element from outside, carry out pressure detection accurately.
And, enclose resin owing to filling in the gap of the formation of the inside at cap assembly, make below the plane identical at the upper surface with above-mentioned down-lead card bonding part, the upper end of enclosing resin portion, therefore when making to form the inclosure resin solidification of bonding agent, the inclosure resin that forms bonding agent can be because surface tension spreads rising upward along outside lead, and outstanding and cause the quality of appearance etc. to descend from the upper end of enclosing resin.
In addition, the invention is characterized in, above-mentioned down-lead card bonding part has the engaging grooving hole of fixed outer lead-in wire.
By such formation, even in the situation that outside lead has been applied to power, also because the engaging grooving hole of outside lead by the down-lead card bonding part firmly fixes, therefore can on the inclosure resin of soft formation bonding agent, not crack etc., can not enter because of moisture the impact that produces defective insulation or bring corrosion etc. to pressure detecting element from outside, carry out pressure detection more accurately.
In addition, the invention is characterized in, be configured to by the grooving in above-mentioned engaging grooving hole by outside lead with the inserted mode engaging in engaging grooving hole.
By such formation, due to the grooving by engaging grooving hole by outside lead with the inserted mode engaging in engaging grooving hole, therefore utilize the operation of the engaging grooving hole fixed outer lead-in wire of down-lead card bonding part to become easily, can reduce costs and time and labour.
Effect of the present invention is as follows.
According to the present invention, the down-lead card bonding part that possesses the fixing outside lead be connected with pressure detecting element, to enclose in the gap that resin filling forms in the inside of cap assembly, make below the plane identical at the upper surface with above-mentioned down-lead card bonding part, the upper end of enclosing resin portion.
Therefore, even in the situation that be to have added power to outside lead, also because outside lead is fixed by the down-lead card bonding part, therefore can on the inclosure resin of soft formation bonding agent, not crack etc., can not enter because of moisture the impact that produces defective insulation or bring corrosion etc. to pressure detecting element from outside, carry out pressure detection accurately.
And, enclose resin owing to filling in the gap of the formation of the inside at cap assembly, make below the plane identical at the upper surface with above-mentioned down-lead card bonding part, the upper end of enclosing resin portion, therefore when making to form the inclosure resin solidification of bonding agent, the inclosure resin that forms bonding agent can be because surface tension spreads rising upward along outside lead, and it is outstanding and cause the quality of appearance etc. to descend to enclose the upper end of resin.
The accompanying drawing explanation
Fig. 1 is the longitudinal section of pressure transducer of the present invention.
Fig. 2 is the vertical view of pressure transducer of the present invention.
Fig. 3 is the longitudinal section of summary of the manufacturing process of explanation pressure transducer of the present invention.
Fig. 4 is the longitudinal section of summary of the manufacturing process of explanation pressure transducer of the present invention.
Fig. 5 is the longitudinal section of summary of the manufacturing process of explanation pressure transducer of the present invention.
Fig. 6 is the longitudinal section of summary of the manufacturing process of explanation pressure transducer of the present invention.
Fig. 7 means the longitudinal section of the pressure transducer 100 of existing liquid-seal type.
In figure:
10-pressure transducer, 12-stream, 14-joint component, 14a-flange part, 16-pressure detecting element, 18-element body, 20-central opening, 22-seal glass, 24-diaphragm, 26-intercommunicating pore, 28-diaphragm protective cover, 30-fluid-tight chamber, 32-sensor chip, 34-terminal pin, 34a-front end, 36-metal wire, 38-terminal board, 38a-surface, 40-pressure chamber, the fixing wall of using of 42-terminal, 42a-inserting hole, 44-lower sidewalls, 46-top sidewall, 48-terminal, 48a-outer end, 50-chimeric the stage portion of using, 52-connecting portion, 54-cover, 56-upper plate portion, 58-sidewall, 60-down-lead card bonding part, 60a～60c-engaging grooving hole, 60d-upper surface, 60e-lower surface, 62-outside lead, 62a～62c-outside lead, 64-connecting portion, 66-cap assembly, 66a-base end part, 66b-peristome, 68-inclosure resin portion, 68a-upper end, 100-pressure transducer, 102-pressure detecting element, 104-joint component, 106-cap assembly, 108-diaphragm, 110-sensor chip, 112-wire-bonded, 114-terminal pin, 116-substrate, 118-outside lead, 122-inclosure resin, 124-inclosure resin, S1-first space, S2-second space, S3-gap, T-gap.
Embodiment
Below, based on accompanying drawing, embodiments of the present invention (embodiment) are elaborated.
Fig. 1 is the longitudinal section of pressure transducer of the present invention, and Fig. 2 is the vertical view of pressure transducer of the present invention, and Fig. 3～Fig. 6 is the longitudinal section of summary of the manufacturing process of explanation pressure transducer of the present invention.
In Fig. 1～Fig. 2, symbol 10 integrally means pressure transducer of the present invention.
As shown in Figure 1, pressure transducer 10 of the present invention is pressure transducers of liquid-seal type, possesses: the joint component 14 that is formed with stream 12; And the pressure detecting element 16 that detects the hydrodynamic pressure in stream 12.
And, configure pressure detecting element 16 in the opposed mode of stream 12 with this joint component 14, and fastening at its circumference and joint component 14 welding.
In addition, as shown in Figure 1, the element body 18 of pressure detecting element 16, metal diaphragm 24 and the diaphragm protective cover 28 that is formed with intercommunicating pore 26 are fastened as a whole by welding in their periphery edge.
And, by this structure, in the part of the central opening 20 of element body 18, be formed with between seal glass 22 and diaphragm 24 and enclose oily fluid-tight chamber 30.
On the other hand, as shown in Figure 1, at the face of the fluid-tight chamber of seal glass 22 30 sides, utilize bonding agent to be fixed with the sensor chip 32 of single chip architecture.
This sensor chip 32 is provided in fluid-tight chamber 30, as the pressure elements of detected pressures and the integrally formed pressure transducer sheet of integrated circuit that the output signal of this pressure detecting element is processed and form.
In addition, on seal glass 22, with breakthrough status, utilize encapsulation process to be fixed with a plurality of terminal pins 34 respectively, the plurality of terminal pin 34 is for carrying out to the input and output of the signal of sensor chip 32.
In this embodiment, although not shown, terminal pin 34 is provided with eight altogether., be provided with as the outside lead 62a(Vout described later of terminal for input and output), 62b(Vcc), 62c(GND) use three terminal pins 34 and as five terminal pins 34 of the terminal of the adjustment use of sensor chip 32.
And, from the stream 12 of joint component 14 be delivered to hydrodynamic pressure in pressure chamber 40 by the intercommunicating pore 26 of diaphragm protective cover 28 by the surface of pressuring film plate 24, and utilize the sensor chips 32 in fluid-tight chamber 30 to survey this signature pressure.
In addition, as shown in Figure 1, on the top of pressure detecting element 16, the terminal board 38 that Special composition forms the first space formation parts of parts is adjacent to configuration with the top of the element body 18 of pressure detecting element 16, and utilizes for example bonding agent to be fixed on the element body 18 of pressure detecting element 16.
As shown in Figure 1, this terminal board 38 is the general cylindrical shape shape, is formed with terminal in its substantial middle section fixing with wall 42, and this terminal is fixing with being formed with on wall 42 for for terminal pin 34, inserting logical inserting hole 42a.And this terminal board 38 is formed with from this terminal is fixing and extends the lower sidewalls 44 arranged downwards and extend upward from the fixing wall 42 of using of terminal the top sidewall 46 arranged with wall 42.
Thus, as shown in Figure 1, between pressure detecting element 16 and terminal board 38, form by fixing the first space S 1 of surrounding by wall 42 and lower sidewalls 44 of terminal.
And the front end 34a of the terminal pin 34 of pressure detecting element 16 inserts and to lead in inserting hole 42a, the terminal 48 arranged with the mode of top sidewall 46 to connect terminal board 38 utilizes and for example welds and be electrically connected at connecting portion 52.
In addition, in this embodiment, although not shown, as described later as shown in Figure 2, be provided with outside lead 62a(Vout), 62b(Vcc), 62c(GND) three terminals 48 of use.
And, as shown in Figure 1 and Figure 2, above terminal board 38 sidewall 46 be formed with chimeric by stage portion 50, the cover 54 that the second space that Special composition forms parts forms parts with this chimeric mode chimeric by stage portion 50, be adjacent to configuration with terminal board 38.
, cover 54 is for possessing the roughly cup-shaped of upper plate portion 56 and sidewall 58, is configured to the chimeric chimeric by stage portion 50 of sidewall 58 and the top sidewall 46 that is formed at terminal board 38.
Thus, as shown in Figure 1, between cover 54 and terminal board 38, form by the terminal of terminal board 38 fixing with wall 42 and above sidewall 46, the upper plate portion 56 of cover 54 and the second space S2 that sidewall 58 surrounds.
, by forming like this, as shown in Figure 1, utilize terminal board 38 and with the cover 54 of terminal board 38 disposed adjacent, form larger space overburden pressure detecting element 16, that formed by above-mentioned space S 1 and space S 2 together with terminal board 38.
, become connected state with wall 42 between above-mentioned space S 1, S2 the terminal of terminal board 38 is fixing, thus, utilize terminal board 38 and cover 54 to form the larger space of overburden pressure detecting elements 16.
And, as shown in Figure 1 and Figure 2, at the sidewall 58 of cover 54, be formed with the outstanding down-lead card bonding part 60 arranged laterally.As shown in Figure 2, this down-lead card bonding part 60 is the essentially rectangular shape, with three outside leads 62,, outside lead 62a(Vout), 62b(Vcc), 62c(GND) be formed with respectively accordingly engaging grooving hole 60a, 60b, the 60c of down-lead card bonding part 60.
, outside lead 62a(Vout), 62b(Vcc), 62c(GND) shown in arrow A as shown in Figure 1, Figure 2, embed engaging grooving hole 60a, 60b, 60c and fix.
On the other hand, as shown in Figure 1, outside lead 62 connecting portion 64 by such as solder, welding etc. with connect terminal board 38 above the outer end 48a of the terminal 48 that arranges of the mode of sidewall 46 be electrically connected to.
In addition, as shown in the arrow B of Fig. 1, the peristome 66b side of cap assembly 66 is inserted from joint component 14 1 sides, at the base end part 66a of the flange shape of the interior side-prominent setting of cap assembly 66, becomes the state with the flange part 14a butt of joint component 14.
Thus, as shown in Figure 1, at formation gap, the inside of cap assembly 66 S3, in the S3 of this gap, from the peristome 66b side of cap assembly 66, fill the inclosure resin that forms bonding agent, form and enclose resin portion 68.
In addition, in this case, as shown in Figure 1, the upper end 68a of inclosure resin portion 68 wishes to be preferably placed between the upper surface 60d and lower surface 60e of down-lead card bonding part 60 for the height below the identical plane of the height of the upper surface 60d of the down-lead card bonding part 60 with cover 54.
The pressure transducer of the present invention 10 formed is like this manufactured by the operation shown in Fig. 3～Fig. 6.
, as shown in Figure 3, prepare in advance the pressure detecting element 16 of assembling integratedly, welding joint parts 14 on this pressure detecting element 16.
Then, as shown in Figure 4, in the lower sidewalls 44 of the top of the element body 18 of pressure detecting element 16 configuration terminal board 38, utilize for example bonding agent to be fixed.Under this state, the front end 34a of the terminal pin 34 of pressure detecting element 16 becomes the state of the fixing inserting hole 42a with wall 42 of the terminal of inserting logical terminal board 38.
Under this state, the front end 34a of the terminal pin 34 of pressure detecting element 16 inserts logical inserting hole 42a, at connecting portion 52, utilizes for example to weld the front end 34a of terminal pin 34 is electrically connected to the terminal 48 that the mode of top sidewall 46 with perforation terminal board 38 arranges.
In addition, under this state, as shown in Figure 4, between pressure detecting element 16 and terminal board 38, form by fixing the first space S 1 of surrounding by wall 42 and lower sidewalls 44 of terminal.
And, as shown in Figure 5, connecting portion 64 utilize such as welding, solders etc. by outside lead 62 with perforation terminal board 38 above the outer end 48a of the terminal 48 that arranges of the mode of sidewall 46 be electrically connected to.
In addition, the chimeric chimeric mode of stage portion 50 of using with the top sidewall 46 with being formed at terminal board 38, be adjacent to configure cover 54 with terminal board 38.
Thus, as shown in Figure 5, become between cover 54 and terminal board 38, form by the terminal of terminal board 38 fixing with wall 42 and above sidewall 46, the upper plate portion 56 of cover 54 and the state of the second space S2 that sidewall 58 surrounds.
In addition, as shown in the arrow A of Fig. 2, Fig. 5, by outside lead 62a(Vout), 62b(Vcc), 62c(GND) embed respectively and be fixed on engaging grooving hole 60a, 60b, the 60c of down-lead card bonding part 60.
Under this state, as shown in Figure 6, become the peristome 66b side of cap assembly 66 is inserted from joint component 14 1 sides, at the state of the flange part 14a butt of the base end part 66a of the flange shape of the interior side-prominent setting of cap assembly 66 and joint component 14.In addition, as required, utilize such as welding and wait the flange part 14a of butt junction parts 14 and the base end part 66a of cap assembly 66 to be fixed.
Finally, as shown in Figure 1, at the gap of the inside that is formed at cap assembly 66 S3, from the peristome 66b side of cap assembly 66, fill the inclosure resin that forms bonding agent, form and enclose resin portion 68.
And, under this state, as shown in Figure 1, the connecting portion 52 of the terminal pin 34 of pressure detecting element 16 and the terminal 48 be connected with outside lead 62 becomes to be positioned at the state that following space mode configures, the first space that this space forms parts by Special composition forms the cover 54 that the terminal board 38 of parts and second space that Special composition forms parts form parts and forms, and does not form by filling the space S 1, the S2 that enclose resin.
The terminal pin 34 that this state is pressure detecting element 16 and the connecting portion 52 of the terminal 48 that is connected outside lead 62 are positioned at the state in space, rather than as in the past by the state of enclosing resin and covering.Therefore, even, in the situation that pressure transducer repeatedly is heated or is cooled, can not produce thermal stress, the tolerance thermal shock experiment that becomes, can not produce defective insulation or short circuit, can not bring impact to pressure detecting element yet, can carry out pressure detection accurately.
Pressure transducer of the present invention 10 according to such formation, on the pressure detecting element 16 only configured in the opposed mode of stream 12 with joint component 14, be adjacent to configure terminal board 38 with pressure detecting element 16, and be adjacent to configure cover 54 with terminal board 38, just can form by cover 54 and terminal board 38 space S 1, the S2 of overburden pressure detecting element 16.
And, from joint component 14 1 sides, assemble the base end part 66a of side's opening and the opposing party's side and the cap assembly 66 of joint component 14 butts.Then, fill the inclosure resin that forms bonding agent at the gap of the inside that is formed at cap assembly 66 S3, form and enclose resin portion 68.
Thus, as shown in Figure 1, the terminal board 38 of the terminal pin 34 of joint component 14, pressure detecting element 16, abutment pressure detecting element 16 and the terminal 48 be connected with outside lead 62 and cover 54 become one and are sealed.
Therefore, do not need structure complicated as existing pressure transducer, the component number of packages also reduces, and in assembling, does not need time and labor, can also reduce costs.
In addition, because the terminal board 38 of the terminal pin 34 of joint component 14, pressure detecting element 16, abutment pressure detecting element 16 and the terminal 48 be connected with outside lead 62 and cover 54 utilize the inclosure resin that forms bonding agents to become one and sealed, therefore can not enter from outside because of moisture and produce defective insulation or bring the impacts such as corrosion to pressure detecting element 16, can carry out pressure detection accurately.
And, as shown in Figure 1, owing to utilizing cover 54 and terminal board 38 to form space S 1, the S2 of overburden pressure detecting element 16, therefore enclosing resin can not enter inside and contact with pressure detecting element 16, pressure detecting element 16 can, because of the damaged damage of the thermal stress of enclosing resin, not carry out pressure detection accurately.
Have again, owing to assembling the base end part 66a of side's opening and the opposing party's side and the cap assembly 66 of joint component 14 butts from joint component 14 1 sides, therefore even, in the situation that outside lead 62 has been applied to tensile force, the base end part 66a of cap assembly 66 also can be lived by hooking with joint component 14 butts.
Thus, even apply power to enclosing resin, enclose on resin and also can not crack etc., can not enter because of moisture the impact that produces defective insulation or bring corrosion etc. to pressure detecting element 16 from outside, can carry out pressure detection accurately.
Have again, shown in arrow A as shown in Figure 1, Figure 2, outside lead 62a(Vout), 62b(Vcc), 62c(GND) embed respectively the engaging grooving hole 60a, 60b, 60c of the down-lead card bonding part 60 on the outstanding sidewall 58 that is arranged on cover 54 laterally and be fixed.
Therefore, even outside lead 62 is applied to power, on the inclosure resin portion 68 that also can not form at the inclosure resin by forming bonding agent of softness because outside lead 62 is fixed, crack etc., can not enter because of moisture the impact that produces defective insulation or pressure detecting element 16 is brought to corrosion etc. from outside, can carry out pressure detection accurately.
Have, outside lead 62 becomes in down-lead card bonding part 60 state that it separates up and down again.Thus, can prevent when making to form the inclosure resin solidification of bonding agent, the inclosure resin that forms bonding agent is climbed up by holding on to rising because of surface tension upward along outside lead 62, and outstanding and cause the quality of outward appearance etc. to descend from the upper end 68a that encloses resin portion 68.
In addition, in this situation, as shown in Figure 1, the upper end 68a that wish to enclose resin portion 68 is the height below the plane identical with the height of the upper surface 60d of the down-lead card bonding part 60 of cover 54, is preferably placed between the upper surface 60d and lower surface 60e of down-lead card bonding part 60.
Above the preferred embodiment of the present invention is illustrated, but the present invention is not limited thereto, for example in the above-described embodiments, terminal board 38 and cover 54 are parts separately, but terminal board 38 and cover 54 also can consist of the member of one etc., in the scope that does not break away from purpose of the present invention, can carry out various changes.
Utilizability on industry
The present invention can be applied to the manufacture method of pressure transducer and the pressure transducer of liquid-seal type.
Claims (6)
1. a pressure transducer, is characterized in that,
Possess: the joint component that is formed with stream;
In order to detect the hydrodynamic pressure in above-mentioned stream, be fastened on above-mentioned joint component, and the pressure detecting element configured in the opposed mode of the stream with joint component;
Be filled in the gap of the inside that is formed at cap assembly, and form the inclosure resin portion of bonding agent; And
The down-lead card bonding part of the fixing outside lead be connected with above-mentioned pressure detecting element,
The upper end of above-mentioned inclosure resin portion is configured to and is positioned at below the plane identical with the upper surface of above-mentioned down-lead card bonding part.
2. pressure transducer according to claim 1, is characterized in that,
Above-mentioned down-lead card bonding part has the engaging grooving hole of fixed outer lead-in wire.
3. pressure transducer according to claim 2, is characterized in that,
Be configured to by the grooving in above-mentioned engaging grooving hole outside lead is inserted to engaging in engaging grooving hole.
4. the manufacture method of a pressure transducer, is characterized in that,
Possess: the joint component that is formed with stream;
In order to detect the hydrodynamic pressure in above-mentioned stream, be fastened on above-mentioned joint component, and the pressure detecting element configured in the opposed mode of the stream with joint component;
Be filled in the gap of the inside that is formed at cap assembly, and form the inclosure resin portion of bonding agent; And
The down-lead card bonding part of the fixing outside lead be connected with above-mentioned pressure detecting element,
Fill and enclose resin in the gap of the inside that is formed at cap assembly, make the upper end of above-mentioned inclosure resin portion be positioned at below the plane identical with the upper surface of above-mentioned down-lead card bonding part.
5. the manufacture method of pressure transducer according to claim 4, is characterized in that,
Above-mentioned down-lead card bonding part has the engaging grooving hole of fixed outer lead-in wire.
6. the manufacture method of pressure transducer according to claim 5, is characterized in that,
Grooving by above-mentioned engaging grooving hole inserts engaging in engaging grooving hole by outside lead.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012132211 | 2012-06-11 | ||
| JP2012-132211 | 2012-06-11 | ||
| JP2012229677A JP5656318B2 (en) | 2012-06-11 | 2012-10-17 | Pressure sensor and method of manufacturing pressure sensor |
| JP2012-229677 | 2012-10-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103487198A true CN103487198A (en) | 2014-01-01 |
| CN103487198B CN103487198B (en) | 2016-03-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310231557.1A Expired - Fee Related CN103487198B (en) | 2012-06-11 | 2013-06-09 | The manufacture method of pressure transducer and pressure transducer |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR101483278B1 (en) |
| CN (1) | CN103487198B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105319004A (en) * | 2014-07-28 | 2016-02-10 | 福特全球技术公司 | Protective Cover For Pressure Sensor Nozzle |
| CN106461480A (en) * | 2014-02-28 | 2017-02-22 | 测量专业股份有限公司 | Differential pressure sensor |
| CN107024315A (en) * | 2016-01-29 | 2017-08-08 | 株式会社鹭宫制作所 | Refrigerant loop component parts |
| CN107543650A (en) * | 2016-06-29 | 2018-01-05 | 株式会社鹭宫制作所 | The manufacture method of pressure sensor and pressure sensor |
| CN110418950A (en) * | 2017-03-17 | 2019-11-05 | 株式会社鹭宫制作所 | Pressure sensor |
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| CN106461480A (en) * | 2014-02-28 | 2017-02-22 | 测量专业股份有限公司 | Differential pressure sensor |
| CN105319004A (en) * | 2014-07-28 | 2016-02-10 | 福特全球技术公司 | Protective Cover For Pressure Sensor Nozzle |
| CN105319004B (en) * | 2014-07-28 | 2020-06-26 | 福特全球技术公司 | Pressure sensor nozzle protective cover |
| CN107024315A (en) * | 2016-01-29 | 2017-08-08 | 株式会社鹭宫制作所 | Refrigerant loop component parts |
| CN107543650A (en) * | 2016-06-29 | 2018-01-05 | 株式会社鹭宫制作所 | The manufacture method of pressure sensor and pressure sensor |
| CN110418950A (en) * | 2017-03-17 | 2019-11-05 | 株式会社鹭宫制作所 | Pressure sensor |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101483278B1 (en) | 2015-01-14 |
| KR20130138666A (en) | 2013-12-19 |
| CN103487198B (en) | 2016-03-09 |
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