CN208672210U - A kind of circuit board assembly structure of automobile differential pressure pickup - Google Patents
A kind of circuit board assembly structure of automobile differential pressure pickup Download PDFInfo
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- CN208672210U CN208672210U CN201821627203.3U CN201821627203U CN208672210U CN 208672210 U CN208672210 U CN 208672210U CN 201821627203 U CN201821627203 U CN 201821627203U CN 208672210 U CN208672210 U CN 208672210U
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- circuit board
- pcb
- combined type
- pedestal
- differential pressure
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Abstract
The utility model discloses a kind of circuit board assembly structures of automobile differential pressure pickup, including pedestal and combined type PCB circuit board, it is provided with positioning column on the pedestal, is correspondingly situated at the location hole for offering and being mutually equipped with positioning column for positioning pedestal and combined type PCB circuit board in the combined type PCB circuit board above pedestal；Pedestal via hole is also provided on the pedestal, circuit board via is coaxially offered in combined type PCB circuit board above corresponding pedestal aperture, chip wafer is stained in combined type PCB circuit board right above circuit board via, chip wafer is electrically connected by gold thread with combined type PCB circuit board；Another part electrical connection conditioning chip and peripheral devices of combined type PCB circuit board.The utility model can be analyzed and processed when facilitating failure on the basis of guaranteeing chip reliability, while unrestricted choice and the pairing of model can also be carried out to the chip on circuit board, met the needs of different use environments, improved its versatility.
Description
Technical field
The utility model relates to automobile differential pressure pickup technical field, especially a kind of circuit that differential pressure pickup uses
Plate assembly structure.
Background technique
Differential pressure pickup is a kind of sensor for measuring difference between two pressure, is commonly used to measure a certain equipment
Or the pressure difference of component rear and front end, principle be it is former directly acted on the diaphragm of sensor by measuring pressure, make diaphragm generate with
The directly proportional micro-displacement of hydraulic pressure, makes the capacitance of sensor change, then detects this variation with electronic circuit, and converts defeated
The canonical measure signal of a corresponding pressure out.
Differential pressure pickup includes shell, and installation chip wafer and the circuit board assembly of conditioning chip etc. are provided in shell.
Traditional automobile differential pressure pickup circuit board assembly is using packaged pressure difference chip, i.e. chip wafer and conditioning chip
Circuit is potted in encapsulation, then on patch to PCB circuit board.The circuit board assembly of this structure, although easy making process,
The type selecting of differential pressure chip is less, it is more difficult to select suitable chip for automobile differential pressure pickup, and packaged pressure difference passes
Sensor chip does not carry out anti-corrosion treatment, and pressure difference chip interior, which goes wrong, can not carry out accident analysis, needs to remove envelope
It is analyzed again after dress, not only increases operation difficulty, but also damage, impact analysis result can be generated to chip.
Summary of the invention
The utility model technical issues that need to address are to provide a kind of automobile differential pressure pickup circuit board assembly structure,
It is convenient to be analyzed and processed when sensor breaks down on the basis of guaranteeing chip reliability, while can also be to circuit board
On chip carry out model unrestricted choice and pairing, meet the needs of different use environments, improve its versatility.
In order to solve the above technical problems, technical solution adopted in the utility model is as follows.
A kind of circuit board assembly structure of automobile differential pressure pickup, including the pedestal and combined type PCB being oppositely arranged up and down
Circuit board is provided with several positioning columns on the pedestal, is correspondingly situated in the combined type PCB circuit board above pedestal and offers
The location hole for positioning pedestal and combined type PCB circuit board is mutually equipped with positioning column；One end of the combined type PCB circuit board
Chip wafer is bonded on top end face, chip wafer is electrically connected by gold thread with combined type PCB circuit board, and chip wafer week is located at
It is bonded with jube in the combined type PCB circuit board on side, the groove in combined type PCB circuit board between jube and chip wafer
The interior gel filled with protection chip wafer and gold thread；Electrical connection conditioning core on the other end top end face of combined type PCB circuit board
Piece.
A kind of circuit board assembly structure of above-mentioned automobile differential pressure pickup is also provided with pedestal via hole on the pedestal, right
It answers and coaxially offers circuit board via in the combined type PCB circuit board above pedestal aperture, chip wafer is arranged in circuit board mistake
In combined type PCB circuit board right above hole.
A kind of circuit board assembly structure of above-mentioned automobile differential pressure pickup, the combined type PCB circuit board include being located at together
The ceramic pcb board and glass of one plane setting tie up pcb board, and ceramic pcb board and glass tie up the adjacent respective side of pcb board along respectively
It is provided with several bonding welding pads, the other side edge opposite with bonding welding pad is provided with and external devices on glass dimension pcb board
The via pad of electrical connection；It is connected between bonding welding pad on two pieces of pcb boards by aluminum steel.
Divide on a kind of circuit board assembly structure of above-mentioned automobile differential pressure pickup, the ceramics pcb board and glass dimension pcb board
It is not provided with cylindrical location hole, the gap between ceramic pcb board and glass dimension pcb board forms strip location hole；Correspondingly
Positioning column on pedestal also includes the cylindricality positioning column being equipped with cylindrical location hole and the length being mutually equipped with strip location hole
Strip positioning column；The strip positioning column is located at the underface of aluminum steel, and the top end face of strip positioning column and ceramic pcb board
It is concordant with the glass dimension top end face of pcb board.
A kind of circuit board assembly structure of above-mentioned automobile differential pressure pickup, the chip wafer and circuit board via are all provided with
It sets on ceramic pcb board；Conditioning chip and peripheral devices setting are on glass dimension pcb board.
A kind of circuit board assembly structure of above-mentioned automobile differential pressure pickup, the circuit board mistake of the ceramics pcb board bottom face
Hole edge is connect with the pedestal via hole rim seal in Chuck top face.
A kind of circuit board assembly structure of above-mentioned automobile differential pressure pickup, the glass dimension pcb board setting via pad
One end is stretched out outside pedestal.
Due to using above technical scheme, technological progress acquired by the utility model is as follows.
The utility model by wafer carry out specially treated, strengthen the reliability of differential pressure pickup circuit board assembly,
And from pressure difference chip wafer to conditioning chip, can unrestricted choice model matched, meet the need of different use environments
It asks, versatility is greatly improved；In addition, the circuit board assembly structure of the utility model eliminates encapsulating structure, using pressure
Poor wafer gold thread bonding technology, when sensor break down when, can on the basis of guaranteeing chip integrity, it is convenient, fast,
Accurately carry out accident analysis.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of utility model；
Fig. 2 is the side view of the utility model；
Fig. 3 is the structural exploded view of the utility model；
Fig. 4 is the structural schematic diagram of combined type PCB circuit board described in the utility model.
Wherein: 1, pedestal, 2, combined type PCB circuit board, 21, glass dimension pcb board, 22, ceramic pcb board, the 23, first bonding
Pad, 24, aluminum steel, the 25, second bonding welding pad, 3, jube, 4, chip wafer, 5, positioning column, 6, conditioning chip, 7, gold thread, 8,
Gel, 9, circuit board via, 10, pedestal via hole, 11, via pad, 12, location hole.
Specific embodiment
Below in conjunction with the drawings and specific embodiments, the present invention will be further described in detail.
A kind of circuit board assembly structure of automobile differential pressure pickup, structure is as shown in Figure 1 to Figure 3, including opposite up and down
The pedestal 1 and combined type PCB circuit board 2 of setting, are bonded in one by sealant between pedestal 1 and combined type PCB circuit board 2
It rises.It is provided with several positioning columns 5 on pedestal, is correspondingly situated in the combined type PCB circuit board above pedestal and offers location hole
12, location hole 12 is mutually equipped with positioning column for positioning pedestal 1 and combined type PCB circuit board 2.
The structure of combined type PCB circuit board 2 is as shown in figure 4, include the ceramic pcb board 22 and glass for being generally aligned in the same plane setting
Fiber pcb board 21.The advantages of the advantages of combined type PCB circuit board has taken into account ceramic pcb board and glass dimension pcb board, price also compares
Ceramic pcb board decreases so that PCB circuit board design is more flexible, reliable, can satisfy on automobile severe use environment with
And high performance requirement.
The side edge of ceramic pcb board 22 is provided with several first bonding welding pads 23, for being electrically connected with glass dimension pcb board
It connects；The glass dimension pcb board 21 side edge adjacent with the first bonding welding pad 3 on ceramic pcb board is provided with several second and is bonded weldering
Disk 25, the glass dimension pcb board other side edge opposite with the second bonding welding pad 25 are provided with the mistake being electrically connected with external devices
Hole pad 11, glass is tieed up pcb board 21 and is arranged outside one end stretching pedestal 1 of via pad 11, for welding connector etc..Ceramics
Connect between the first bonding welding pad 23 and the second bonding welding pad 25 of glass dimension pcb board 21 on pcb board 22 by the way that aluminum steel 24 is corresponding
It connects.
In the utility model, it is respectively arranged with cylindrical location hole on ceramic pcb board 22 and glass dimension pcb board 21, ceramics
Gap between pcb board 22 and glass dimension pcb board 21 forms strip location hole；Positioning column in corresponding pedestal also include with
The strip positioning column cylindrical location hole equipped cylindricality positioning column and be mutually equipped with strip location hole；Strip positioning column
Positioned at the underface of aluminum steel, and the top end face of the top end face of strip positioning column and ceramic pcb board 22 and glass dimension pcb board 21 is flat
Together.
Wherein, ceramic pcb board 22 is provided centrally with corrosion-resistant chip wafer 4, and chip wafer 4 is bonded in by sealant
On ceramic pcb board 22, chip wafer 4 is electrically connected by gold thread 7 with combined type PCB circuit board.Pottery positioned at 4 periphery of chip wafer
It is bonded with jube 3 on porcelain pcb board 22, gel is filled in the groove on ceramic pcb board 22 between jube and chip wafer 4
8, gel is formed by the height that gel layer height is higher than chip wafer and gold thread, for protecting chip wafer and gold thread.
Circuit board via 9 is offered vertically on the ceramic pcb board 22 immediately below chip wafer 4, circuit board via 9
Diameter is less than the minimum outer diameter of chip wafer；Pedestal via hole 10, pedestal are offered on pedestal immediately below corresponding circuits plate via hole 9
Via hole 10 and circuit board via 9 are coaxially disposed, and the diameter of pedestal via hole 10 is greater than the maximum outside diameter of chip wafer 4；Ceramic PCB
9 edge of circuit board via of 22 bottom face of plate and 10 edge of pedestal via hole in Chuck top face are tightly connected by sealant, are protected
Demonstrate,proving gas can be normal through pedestal via hole, circuit board via, and leads directly to chip wafer bottom.
In the utility model on ceramic pcb board circuit board via 9 and pedestal via hole 10 setting, can be in the utility model
After being installed to the shell of sensor, the connection reversed with outside is formed, facilitates the detection for carrying out reverse differential pressure；That is, this is practical
In differential pressure pickup, extraneous gas can be connected to the top end face of chip wafer for new application, be detected to positive pressure difference,
It can also be connected to the bottom face of chip wafer, reverse differential pressure is detected.
Glass, which is tieed up, welds conditioning chip and peripheral devices on pcb board 21, as shown in Figure 1, to guarantee chip stitch and circuit
The reliability of plate pad connection.
The utility model is applied in the manufacturing process of automobile differential pressure pickup, can chip wafer to differential pressure pickup with
And conditioning chip is reasonably selected, and the requirement of different use environments is met；By the way that chip wafer is used gel encapsulating
Mode handled, ensure that the reliability of chip.Since chip wafer and conditioning chip are disposed on unlike material
On circuit board, and conditioning chip is connect using conventional soldering techniques with circuit board, therefore conveniently in failure, to chip into
Row analysis and research.
Claims (7)
1. a kind of circuit board assembly structure of automobile differential pressure pickup, it is characterised in that: including the pedestal (1) being oppositely arranged up and down
With combined type PCB circuit board (2), several positioning columns (5), the combined type being correspondingly situated above pedestal are provided on the pedestal
The location hole being mutually equipped with positioning column for positioning pedestal (1) and combined type PCB circuit board (2) is offered in PCB circuit board
(12)；It is bonded on one end top end face of the combined type PCB circuit board chip wafer (4), chip wafer (4) passes through gold thread
(7) it is electrically connected with combined type PCB circuit board, is located in the combined type PCB circuit board on chip wafer (4) periphery and is bonded with jube
(3), filled with protection chip wafer and gold in the groove in combined type PCB circuit board between jube and chip wafer (4)
The gel (8) of line；Conditioning chip (6) are electrically connected on the other end top end face of combined type PCB circuit board.
2. a kind of circuit board assembly structure of automobile differential pressure pickup according to claim 1, it is characterised in that: the base
It is also provided with pedestal via hole (10) on seat, coaxially offers circuit board in the combined type PCB circuit board above corresponding pedestal aperture
Via hole (9), chip wafer (4) are arranged in the combined type PCB circuit board right above circuit board via (9).
3. a kind of circuit board assembly structure of automobile differential pressure pickup according to claim 1, it is characterised in that: described group
Box-like PCB circuit board (2) includes the ceramic pcb board (22) and glass dimension pcb board (21) for being generally aligned in the same plane setting, ceramic PCB
Plate (22) and glass tie up pcb board (21) adjacent respective side and tie up pcb board (21) along several bonding welding pads, glass is respectively arranged with
The upper other side edge opposite with bonding welding pad is provided with the via pad (11) being electrically connected with external devices；Two pieces of pcb boards
On bonding welding pad between by aluminum steel (24) connect.
4. a kind of circuit board assembly structure of automobile differential pressure pickup according to claim 3, it is characterised in that: the pottery
Cylindrical location hole is respectively arranged on porcelain pcb board (22) and glass dimension pcb board (21), ceramic pcb board (22) and glass tie up PCB
Gap between plate (21) forms strip location hole；Positioning column in corresponding pedestal also includes equipped with cylindrical location hole
Cylindricality positioning column and the strip positioning column that is mutually equipped with strip location hole；The strip positioning column is being located at aluminum steel just
Lower section, and the top end face of strip positioning column is concordant with ceramic pcb board (22) and the glass dimension top end face of pcb board (21).
5. a kind of circuit board assembly structure of automobile differential pressure pickup according to claim 3, it is characterised in that: the crystalline substance
Round core piece (4) and circuit board via (9) are arranged on ceramic pcb board (22)；Conditioning chip and peripheral devices are arranged in glass
On fiber pcb board (21).
6. a kind of circuit board assembly structure of automobile differential pressure pickup according to claim 3, it is characterised in that: the pottery
Circuit board via (9) edge of porcelain pcb board (22) bottom face is connect with the pedestal via hole rim seal in Chuck top face.
7. a kind of circuit board assembly structure of automobile differential pressure pickup according to claim 3, it is characterised in that: the glass
One end that via pad (11) are arranged in fiber pcb board (21) is stretched out outside pedestal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821627203.3U CN208672210U (en) | 2018-10-08 | 2018-10-08 | A kind of circuit board assembly structure of automobile differential pressure pickup |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821627203.3U CN208672210U (en) | 2018-10-08 | 2018-10-08 | A kind of circuit board assembly structure of automobile differential pressure pickup |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208672210U true CN208672210U (en) | 2019-03-29 |
Family
ID=65821203
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821627203.3U Active CN208672210U (en) | 2018-10-08 | 2018-10-08 | A kind of circuit board assembly structure of automobile differential pressure pickup |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208672210U (en) |
-
2018
- 2018-10-08 CN CN201821627203.3U patent/CN208672210U/en active Active
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