CN108895994B - Method and apparatus for measuring plating - Google Patents
Method and apparatus for measuring plating Download PDFInfo
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- CN108895994B CN108895994B CN201810558812.6A CN201810558812A CN108895994B CN 108895994 B CN108895994 B CN 108895994B CN 201810558812 A CN201810558812 A CN 201810558812A CN 108895994 B CN108895994 B CN 108895994B
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- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B15/00—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons
- G01B15/02—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons for measuring thickness
- G01B15/025—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons for measuring thickness by measuring absorption
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Abstract
The application discloses a plating layer measuring method and device. The method comprises the steps of respectively emitting a first ray and a second ray to the same point or two points on a measuring line of a substrate with a plated layer, respectively receiving the first ray and the second ray which penetrate through the substrate, and determining the receiving intensity of the first ray and the receiving intensity of the second ray, wherein the emitting intensity of the first ray and the emitting intensity of the second ray are different, and the measuring line is perpendicular to the full length direction of the substrate; and determining the thickness of the coating at the position of the measuring line on the substrate according to the emission intensity and the receiving intensity of the first ray and the emission intensity and the receiving intensity of the second ray. The method and the device solve the technical problems that in the prior art, the thickness of the coating can not be accurately determined and measured on a strip steel coating production line, and whether the thickness of the coating of the strip steel meets the standard or not can not be verified in time.
Description
Technical Field
The application relates to the technical field of measurement, in particular to a plating layer measuring method and device.
Background
At present, an important technical index for measuring the quality of products on coating production lines such as a hot tinning production line and the like is the thickness and the uniformity of the coating. The excessive thickness of the plating layer can affect the electric welding property and the adhesiveness of the product and also cause the waste of plating layer materials; too thin a coating affects the corrosion resistance of the product. Therefore, the accurate and fast measurement of the plating thickness of the plating plate is very important, which puts high technical requirements on the plating thickness control technology. The prerequisite for obtaining a uniform and stable coating on the surface of strip steel is that the coating thickness can be accurately measured on line, and valuable input values can be provided for a control module, so that the coating thickness can be effectively controlled by coating thickness control equipment such as an air knife, a squeeze roller and the like.
At present, a method for measuring the thickness of a plating layer by using the principle of fluorescence generated by ray excitation is widely adopted on a hot tinning production line. According to the method, the coating material on the strip steel substrate is irradiated by rays along a specific angle, so that the fluorescence of the corresponding coating is excited, and the thickness of the coating on the strip steel substrate can be obtained by performing fluorescence spectrum comparison according to the fluorescence.
In the process of implementing the embodiment of the present application, the inventor finds that the prior art has at least the following problems:
in the prior art, by adopting a fluorescent coating measuring method, the requirement on the angle deviation between a detector and a strip steel substrate is extremely strict (the angle deviation needs to be less than 0.5 degrees), when the deviation requirement is met, the measuring accuracy is extremely high, but the tension of strip steel on a strip steel coating production line is small, the strip steel vibration amplitude is large, the torsional vibration angle of the strip steel is also large, the requirement on the angle deviation between the detector and the strip steel substrate cannot be ensured, the thickness of a measured coating cannot be accurately determined on the strip steel coating production line, and whether the coating thickness of the strip steel meets the standard cannot be verified in time.
Disclosure of Invention
The application mainly aims to provide a coating measuring method and device to solve the problems that the coating thickness cannot be accurately determined and measured on a strip steel coating production line, and whether the coating thickness of strip steel meets the standard or not cannot be verified in time.
In order to achieve the above object, in a first aspect, a plating layer measuring method provided in an embodiment of the present application includes:
respectively emitting a first ray and a second ray to the same point or two points on a measuring line of a substrate with a coating, respectively receiving the first ray and the second ray which penetrate through the substrate, and determining the receiving intensity of the first ray and the receiving intensity of the second ray, wherein the emitting intensity of the first ray is different from that of the second ray, and the measuring line is perpendicular to the full length direction of the substrate;
and determining the thickness of the coating at the position of the measuring line on the substrate according to the emission intensity and the receiving intensity of the first ray and the emission intensity and the receiving intensity of the second ray.
Optionally, determining the thickness of the plating layer at the position of the measurement line on the substrate according to the emission intensity and the reception intensity of the first ray and the emission intensity and the reception intensity of the second ray, including:
and determining the thickness of the coating at the measuring position through a coating thickness operation equation constructed based on a substance-to-ray absorption rule formula, wherein the emission intensity and the receiving intensity of the first ray, the emission intensity and the receiving intensity of the second ray, the absorption coefficients of the substrate material for the first ray and the second ray respectively, and the absorption coefficient numbers of the coating material for the first ray and the second ray respectively serve as calculation factors of the coating thickness operation equation.
Optionally, determining the thickness of the coating at the measurement position by a coating thickness operation equation constructed based on a formula of absorption law of the substance on the radiation includes determining the thickness of the coating by the following formula:
in the formula, hBThickness of the coating at the location of the measuring line on the substrate, E1Is the emission intensity of the first ray, E2Is the emission intensity of the second ray, E'1Is the received intensity of the first ray, E'2Is the received intensity of the second ray, k1AIs the absorption coefficient, k, of the substrate material to the first ray2AIs the absorption coefficient, k, of the substrate material to the second ray1BIs the absorption coefficient, k, of the coating material to the first ray2BIs the absorption coefficient of the coating material for the second radiation.
Optionally, the emitting the first ray and the second ray to the same point or two points on a measuring line of the substrate with the coating completed respectively comprises:
emitting a first ray to a first point on a measuring line of the substrate with the coating at a first preset position, and emitting a second ray to a second point on the measuring line of the substrate with the coating at a second preset position, wherein the substrate passes through the first preset position and the second preset position after passing through the coating thickness control equipment, the measuring line is perpendicular to the advancing direction of the substrate, and the first point on the measuring line and the second point on the measuring line are the same point or two different points on the measuring line;
the plating layer measuring method further comprises:
and sending the thickness of the coating at the position of the measuring line on the substrate to a control device so that the control device controls the coating thickness control equipment to adjust the subsequent substrate coating according to the coating thickness.
Optionally, the substrate travel distance from the first preset position to the plating thickness control device and the substrate travel distance from the second preset position to the plating thickness control device are both between 0 and 100 m.
In a second aspect, an embodiment of the present application provides a plating layer measuring apparatus, including:
the ray thickness measuring unit is used for respectively emitting a first ray and a second ray to the same point or two points on a measuring line of the substrate with the coating, respectively receiving the first ray and the second ray which penetrate through the substrate, and determining the receiving intensity of the first ray and the receiving intensity of the second ray, wherein the emitting intensity of the first ray is different from that of the second ray, and the measuring line is perpendicular to the full length direction of the substrate;
and the thickness determining unit is used for determining the thickness of the coating at the position of the measuring line on the substrate according to the emission intensity and the receiving intensity of the first ray and the emission intensity and the receiving intensity of the second ray.
Optionally, a thickness determination unit for:
and determining the thickness of the coating at the measuring position through a coating thickness operation equation constructed based on a substance-to-ray absorption rule formula, wherein the emission intensity and the receiving intensity of the first ray, the emission intensity and the receiving intensity of the second ray, the absorption coefficients of the substrate material for the first ray and the second ray respectively, and the absorption coefficient numbers of the coating material for the first ray and the second ray respectively serve as calculation factors of the coating thickness operation equation.
Optionally, determining the thickness of the coating at the measurement position by a coating thickness operation equation constructed based on a formula of absorption law of the substance on the radiation includes determining the thickness of the coating by the following formula:
in the formula, hBThickness of the coating at the location of the measuring line on the substrate, E1Is the emission intensity of the first ray, E2Is the emission intensity of the second ray, E'1Is the received intensity of the first ray, E'2Is the received intensity of the second ray, k1AIs the absorption coefficient, k, of the substrate material to the first ray2AIs the absorption coefficient, k, of the substrate material to the second ray1BIs the absorption coefficient, k, of the coating material to the first ray2BIs the absorption coefficient of the coating material for the second radiation.
Optionally, the plating layer measuring apparatus further comprises a transmitting unit;
the ray thickness measuring unit is used for emitting a first ray to a first point on a measuring line of the substrate with the coating at a first preset position and emitting a second ray to a second point on the measuring line of the substrate with the coating at a second preset position, wherein the substrate passes through the first preset position and the second preset position after passing through the coating thickness control equipment, and the first point on the measuring line and the second point on the measuring line are the same point or two different points on the measuring line;
the sending unit is used for sending the coating thickness of the position of the measuring line on the substrate to the control device so that the control device controls the coating thickness control equipment to adjust the subsequent substrate coating according to the coating thickness.
Optionally, the substrate travel distance from the first preset position to the plating thickness control device and the substrate travel distance from the second preset position to the plating thickness control device are both between 0 and 100 m.
In the coating measuring method provided in the embodiment of the application, the first ray and the second ray are respectively emitted to the same point or two points on a measuring line of a substrate with a coated layer, the first ray and the second ray penetrating through the substrate are respectively received, the receiving intensity of the first ray and the receiving intensity of the second ray are determined, wherein the emitting intensity of the first ray and the emitting intensity of the second ray are different, and the measuring line is vertical to the full length direction of the substrate; and determining the thickness of the coating at the position of the measuring line on the substrate according to the emission intensity and the receiving intensity of the first ray and the emission intensity and the receiving intensity of the second ray. The plating layer thickness method is characterized in that the plating layer thickness is directly measured by emitting rays, so that the plating layer measuring structure is insensitive to vibration of strip steel, and the technical problems that the plating layer thickness cannot be accurately determined and measured on a strip steel plating layer production line and whether the plating layer thickness of the strip steel meets the standard or not in time can be solved.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, serve to provide a further understanding of the application and to enable other features, objects, and advantages of the application to be more apparent. The drawings and their description illustrate the embodiments of the invention and do not limit it. In the drawings:
FIG. 1 is a flow chart of a method of measuring a coating according to an embodiment of the present application;
FIG. 2 is a flow chart of another method of measuring plating according to an embodiment of the present application;
FIG. 3 is a schematic structural view of a plating measuring apparatus according to an embodiment of the present application;
FIG. 4 is a schematic structural diagram of another plating measuring apparatus according to an embodiment of the present application.
Detailed Description
In order to make the technical solutions better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only partial embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged under appropriate circumstances such that embodiments of the application described herein may be used. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.
The embodiment of the application provides a plating layer measuring method, as shown in fig. 1, the method includes the following steps S100 and S200:
s100, respectively emitting a first ray and a second ray to the same point or two points on a measuring line of the substrate with the plated layer, respectively receiving the first ray and the second ray which penetrate through the substrate, and determining the receiving intensity of the first ray and the receiving intensity of the second ray, wherein the emitting intensity of the first ray is different from that of the second ray, and the measuring line is perpendicular to the full length direction of the substrate.
In this embodiment, the measuring line is perpendicular to the entire length direction of the substrate, and when the method is applied to a plating production line such as a hot tin plating production line, the entire length direction of the substrate is the traveling direction of the substrate, and the thickness of the plating layer at the position of the measuring line on the substrate is equal to the thickness of the substrate due to the influence of the plating layer generation process. The first ray and the second ray can be emitted through the two ray generating devices, the first ray and the second ray which penetrate through the substrate are received through the two ray detectors, at the moment, the first ray intensity and the second ray intensity which are respectively detected by the two ray detectors are the receiving intensity of the first ray and the second ray, and the ray generating devices and the ray detectors which are used for receiving and sending the same ray can be arranged on the same ray thickness gauge. The geometric shape of the substrate is a thin plate, the coating material is coated on the upper surface and/or the lower surface of the substrate to form a coating on the substrate, the substrate can be made of strip steel and the like, and the coating can be made of zinc, tin and the like or alloy. When the emission intensity of the first ray is different from the emission intensity of the second ray, the thickness of the coating at the position of the measuring line on the substrate can be determined according to the two groups of measured ray receiving intensities.
Optionally, the first and second rays are both X-rays.
In this embodiment, when the first and second radiation beams are X-rays, the plating layer measuring method is more economical and has better safety.
S200, determining the thickness of the plating layer at the position of the measuring line on the substrate according to the emission intensity and the receiving intensity of the first ray and the emission intensity and the receiving intensity of the second ray.
In the embodiment, two groups of data are obtained by respectively irradiating the measuring lines on the substrate with the plated layer by two rays with different emission intensities, and the thickness of the plated layer on the substrate can be calculated according to the two groups of data and the absorption coefficients of the substrate material and the plated layer material to the rays. Meanwhile, in this embodiment, the larger the difference between the atomic number of the main material of the substrate and the atomic number of the plating material is, the more accurate the plating thickness at the position of the measurement line on the substrate determined by the method is. Therefore, when the method is applied to a tinning production line, the measured thickness of the coating is the most accurate.
The absorption coefficient of the substrate material to the first ray and the second ray, the absorption coefficient of the coating material to the first ray and the second ray, and the emission intensity of the first ray and the second ray can be measured before the coating measuring method is implemented, and specifically, the method comprises the following steps:
emitting a first ray and a second ray through a ray generating device, wherein the emitted first ray and the second ray penetrate through a plating layer with known thickness and are received by a ray detector, and calculating absorption coefficients of a plating material on the first ray and the second ray according to a formula of a rule of absorption of a substance on the ray;
the method comprises the steps that a first ray and a second ray are emitted through a ray generating device, the emitted first ray and the emitted second ray do not penetrate through a substrate and a coating and are directly received by a ray detector, and the ray intensity measured by the ray detector is the emission intensity of the first ray and the emission intensity of the second ray;
the method comprises the steps that a first ray and a second ray are emitted through a ray generating device, the emitted first ray and the emitted second ray respectively penetrate through a substrate with known thickness and are received by a ray detector, and the absorption coefficient of the substrate to the first ray and the absorption coefficient of the substrate to the second ray are calculated according to the absorption rule formula of a substance to the rays.
Optionally, S200, determining the thickness of the plating layer at the position of the measurement line on the substrate according to the emission intensity and the reception intensity of the first ray and the emission intensity and the reception intensity of the second ray, includes:
and determining the thickness of the coating at the measuring position through a coating thickness operation equation constructed based on a substance-to-ray absorption rule formula, wherein the emission intensity and the receiving intensity of the first ray, the emission intensity and the receiving intensity of the second ray, the absorption coefficients of the substrate material for the first ray and the second ray respectively, and the absorption coefficient numbers of the coating material for the first ray and the second ray respectively serve as calculation factors of the coating thickness operation equation.
In this embodiment, the formula of the absorption rule of the substance on the ray may be as follows:
E(h)＝E0e-kh
wherein E (h) is the received intensity of the ray, E0The transmission intensity of the radiation, e is a natural base number, k is defined as the absorption coefficient of the substance to the radiation, and h is the thickness of the measured substance.
Optionally, determining the thickness of the coating at the measurement position by a coating thickness operation equation constructed based on a formula of absorption law of the substance on the radiation includes determining the thickness of the coating by the following formula:
in the formula, hBThickness of the coating at the location of the measuring line on the substrate, E1Is the emission intensity of the first ray, E2Is the emission intensity of the second ray, E'1Is the received intensity of the first ray, E'2Is the received intensity of the second ray, k1AIs the absorption coefficient, k, of the substrate material to the first ray2AIs the absorption coefficient, k, of the substrate material to the second ray1BIs the absorption coefficient, k, of the coating material to the first ray2BIs the absorption coefficient of the coating material for the second radiation. Wherein, the formula can be constructed according to the formula of the absorption rule of the substance on the ray. In the formula, the data to be measured is less, so that the measurement error can be effectively reduced, and the accuracy of measuring the thickness of the coating is improved.
As shown in fig. 2, optionally, S100, emitting a first ray and a second ray to the same point or two points on a measurement line of a substrate with a plated layer, respectively, includes:
emitting a first ray to a first point on a measuring line of the substrate with the coating at a first preset position, and emitting a second ray to a second point on the measuring line of the substrate with the coating at a second preset position, wherein the substrate passes through the first preset position and the second preset position after passing through the coating thickness control equipment, the measuring line is perpendicular to the advancing direction of the substrate, and the first point on the measuring line and the second point on the measuring line are the same point or two different points on the measuring line;
the plating layer measuring method further includes the following step S300:
s300, the thickness of the coating at the position of the measuring line on the substrate is sent to a control device, so that the control device controls coating thickness control equipment to adjust the subsequent substrate coating according to the coating thickness.
In this embodiment, the coating measuring method can be applied to a hot coating production line (e.g., a hot dip galvanizing production line, a hot tin plating production line), positions are provided for emitting a first ray and a second ray by setting a first preset position and a second preset position, respectively, and two ray thickness gauges for emitting the first ray and the second ray can be respectively placed near the first preset position and the second preset position; the first preset position and the second preset position are both positioned behind coating thickness control equipment such as an extrusion roller, an air knife and the like in a hot coating production line, and the substrate passes through the coating thickness control equipment, so that the coating of the substrate is finished and then passes through the first preset position and the second preset position. In addition, the measured thickness of the coating is fed back to the control device on the production line, when the measured thickness of the coating is within the range of the qualified thickness preset by the control device, the control device does not adjust the coating of the subsequent substrate, and when the measured thickness of the coating is not within the range of the qualified thickness preset by the control device, the control device adjusts the transmission speed of the substrate, the power of the coating thickness control equipment and the like so as to adjust the thickness of the coating on the subsequent substrate.
Alternatively, when both the first and second rays are irradiated on the same point of the measurement line on the substrate, a line connecting the first preset position to the second preset position should be parallel to the traveling direction of the substrate (or the entire length direction of the substrate).
Alternatively, when the first and second rays are irradiated on two different points of the measurement line on the substrate, respectively, a line connecting the first preset position to the second preset position may be perpendicular to the traveling direction of the substrate (or the full length direction of the substrate); in this way, two radiation generating devices for emitting the first radiation and the second radiation may be arranged side by side above the course of the substrate.
Optionally, the substrate travel distance from the first preset position to the plating thickness control device and the substrate travel distance from the second preset position to the plating thickness control device are both between 0 and 100 m.
In this embodiment, the substrate travel distance from the first preset position to the plating thickness control device and the substrate travel distance from the second preset position to the plating thickness control device are both between 0 and 100m, that is, the connection line from the first preset position to the second preset position is perpendicular to the traveling direction of the substrate, two ray generating devices for emitting the first ray and the second ray are arranged above the traveling route of the substrate in parallel, and the first preset position and the second preset position are both between 0 and 100m behind the plating thickness control device, so that the measured substrate plating thickness can be fed back to the control device in time, when the plating thickness does not meet the requirement, the plating on the subsequent substrate is adjusted in time, and the material loss under a large length is avoided, so that the yield of the product is greatly improved. In the prior art, in order to accurately determine the thickness of the coating by the fluorescence generated when the coating is irradiated on the substrate by radiation, it is necessary to move the measuring point at least 100m (or even 200 m) away from the gas knife in order to minimize the vibration of the substrate, but even then, because the substrate must vibrate during transmission, the prior art method cannot ensure the accuracy of the measured data, when the prior art measures the thickness of the coating at least 100m away from the air knife, once the coating thickness does not meet the standard, this results in an unacceptable substrate coating thickness of at least 100m or more, which wastes material significantly, increases production costs, and, therefore, whether the thickness of a plating layer is qualified or not is generally judged according to personal experience of skilled workers on the current plating production line, and plating layer adjustment is carried out in time.
Optionally, the substrate travel distance from the first preset position to the plating thickness control device and the substrate travel distance from the second preset position to the plating thickness control device are both 2 m.
In this embodiment, the closer the first preset position and the second preset position are to the plating thickness control device, the better the technical effect is, because the closer the first preset position and the second preset position are to the plating thickness control device, the faster it can be determined whether the plating thickness meets the requirements, and the adjustment is performed in time, the less the waste material is, the higher the yield of the product is, but because of the plating thickness control device, etc., the first preset position and the second preset position can be properly set at a position 2m away from the plating thickness control device.
Optionally, emitting a first ray at a first predetermined position to a first point on a measurement line of a substrate with a finished coating, and emitting a second ray at a second predetermined position to a second point on the measurement line of the substrate with a finished coating, comprises:
and emitting a first ray to a first point on a measuring line of the substrate with the coating finished at a first preset position along a first preset measuring angle, and emitting a second ray to a second point on the measuring line of the substrate with the coating finished at a second preset position along a second preset measuring angle.
In this embodiment, the first predetermined measurement angle is an angle formed between the emitted first ray and the substrate, and the second predetermined measurement angle is an angle formed between the emitted second ray and the portion of the substrate. When the first preset measurement angle is not equal to 90 degrees, namely the first ray obliquely irradiates to the substrate, the receiving intensity of the first ray can be converted according to the first preset measurement angle, and the receiving intensity of the first ray when the first ray vertically irradiates to the substrate is obtained; when the second preset measuring angle is not equal to 90 degrees, namely the second ray obliquely irradiates to the substrate, the receiving intensity of the second ray can be converted according to the second preset measuring angle, the receiving intensity of the second ray is obtained when the second ray vertically irradiates to the substrate which is coated, and the coating thickness on the measuring position is obtained according to the two receiving intensities and the ray absorption coefficient of the coating material.
Optionally, the first preset measurement angle and the second preset measurement angle are both equal to 90 °.
In the embodiment, the coating thickness method is not sensitive to vibration of the strip steel, and particularly when the first preset measurement angle and the second preset measurement angle are equal to 90 degrees, the vibration direction of the strip steel is usually vertical vibration, so that the measurement result is not influenced, and the coating measurement result with high precision can be obtained.
In the plating layer measuring method provided in the embodiment of the application, through S100, a first ray and a second ray are respectively emitted to the same point or two points on a measuring line of a substrate with a plated layer, the first ray and the second ray which pass through the substrate are respectively received, and the receiving intensity of the first ray and the receiving intensity of the second ray are determined, wherein the emitting intensity of the first ray and the emitting intensity of the second ray are different, and the measuring line is perpendicular to the entire length direction of the substrate; s200, determining the thickness of the plating layer at the position of the measuring line on the substrate according to the emission intensity and the receiving intensity of the first ray and the emission intensity and the receiving intensity of the second ray. The plating layer thickness method is characterized in that the plating layer thickness is directly measured by emitting rays, so that the plating layer measuring structure is insensitive to vibration of strip steel, and the technical problems that the plating layer thickness cannot be accurately determined and measured on a strip steel plating layer production line and whether the plating layer thickness of the strip steel meets the standard or not in time can be solved.
Based on the same technical concept as the plating layer measuring method, the embodiment of the present application further provides a plating layer measuring apparatus, as shown in fig. 3, including:
the ray thickness measuring unit 10 is used for respectively emitting a first ray and a second ray to the same point or two points on a measuring line of the substrate with the coating, respectively receiving the first ray and the second ray which penetrate through the substrate, and determining the receiving intensity of the first ray and the receiving intensity of the second ray, wherein the emitting intensity of the first ray is different from that of the second ray, and the measuring line is perpendicular to the full length direction of the substrate;
and the thickness determining unit 20 is used for determining the thickness of the coating at the position of the measuring line on the substrate according to the emission intensity and the receiving intensity of the first ray and the emission intensity and the receiving intensity of the second ray.
Optionally, a thickness determination unit 20 for:
and determining the thickness of the coating at the measuring position through a coating thickness operation equation constructed based on a substance-to-ray absorption rule formula, wherein the emission intensity and the receiving intensity of the first ray, the emission intensity and the receiving intensity of the second ray, the absorption coefficients of the substrate material for the first ray and the second ray respectively, and the absorption coefficient numbers of the coating material for the first ray and the second ray respectively serve as calculation factors of the coating thickness operation equation.
Optionally, determining the thickness of the coating at the measurement position by a coating thickness operation equation constructed based on a formula of absorption law of the substance on the radiation includes determining the thickness of the coating by the following formula:
in the formula, hBThickness of the coating at the location of the measuring line on the substrate, E1Is the emission intensity of the first ray, E2Is the emission intensity of the second ray, E'1Is the received intensity of the first ray, E'2Is the received intensity of the second ray, k1AIs the absorption coefficient, k, of the substrate material to the first ray2AIs the absorption coefficient, k, of the substrate material to the second ray1BIs the absorption coefficient, k, of the coating material to the first ray2BIs the absorption coefficient of the coating material for the second radiation.
Alternatively, as shown in fig. 4, the plating layer measuring apparatus further includes a transmitting unit 30;
the ray thickness measuring unit 10 is used for emitting a first ray to a first point on a measuring line of the substrate with the coating at a first preset position and emitting a second ray to a second point on the measuring line of the substrate with the coating at a second preset position, wherein the substrate passes through the first preset position and the second preset position after passing through the coating thickness control equipment, and the first point on the measuring line and the second point on the measuring line are the same point or two different points on the measuring line;
and the sending unit 30 is configured to send the plating thickness of the position of the measurement line on the substrate to the control device, so that the control device controls the plating thickness control device to adjust the subsequent substrate plating according to the plating thickness.
Optionally, the substrate travel distance from the first preset position to the plating thickness control device and the substrate travel distance from the second preset position to the plating thickness control device are both between 0 and 100 m.
The coating measuring device provided in the embodiment of the application is used for respectively emitting a first ray and a second ray to the same point or two points on a measuring line of a coated substrate through a ray thickness measuring unit 10, respectively receiving the first ray and the second ray which penetrate through the substrate, and determining the receiving intensity of the first ray and the receiving intensity of the second ray, wherein the emitting intensity of the first ray is different from that of the second ray, and the measuring line is perpendicular to the full length direction of the substrate; and the thickness determining unit 20 is used for determining the thickness of the coating at the position of the measuring line on the substrate according to the emission intensity and the receiving intensity of the first ray and the emission intensity and the receiving intensity of the second ray. The plating layer thickness method is characterized in that the plating layer thickness is directly measured by emitting rays, so that the plating layer measuring structure is insensitive to vibration of strip steel, and the technical problems that the plating layer thickness cannot be accurately determined and measured on a strip steel plating layer production line and whether the plating layer thickness of the strip steel meets the standard or not in time can be solved.
It will be apparent to those skilled in the art that the modules or steps of the present application described above may be implemented by a general purpose computing device, they may be centralized on a single computing device or distributed across a network of multiple computing devices, and they may alternatively be implemented by program code executable by a computing device, such that they may be stored in a storage device and executed by a computing device, or fabricated separately as individual integrated circuit modules, or fabricated as a single integrated circuit module from multiple modules or steps. Thus, the present application is not limited to any specific combination of hardware and software.
The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims (6)
1. A plating layer measuring method, characterized by comprising:
respectively emitting a first ray and a second ray to the same point or two points on a measuring line of a substrate with a plated layer, respectively receiving the first ray and the second ray which penetrate through the substrate, and determining the receiving intensity of the first ray and the receiving intensity of the second ray, wherein the emitting intensity of the first ray is different from that of the second ray, and the measuring line is perpendicular to the full length direction of the substrate;
determining the thickness of the coating at the position of the measuring line on the substrate according to the emission intensity and the receiving intensity of the first ray and the emission intensity and the receiving intensity of the second ray;
determining the thickness of the coating at the measuring position through a coating thickness operation equation constructed based on a substance-to-ray absorption rule formula, wherein the coating thickness is determined through the following formula:
in the formula, hBIs the thickness of the coating at the position of the measuring line on the substrate, E1Is the emission intensity of the first ray, E2Is the emission intensity of the second ray, E'1Is the received intensity, E 'of the first ray'2Is the received intensity, k, of the second ray1AIs the absorption coefficient, k, of the substrate material to said first ray2AIs the absorption coefficient, k, of the substrate material to the second ray1BIs the absorption coefficient, k, of the coating material to said first ray2BIs the absorption coefficient of the coating material to the second ray.
2. The method of claim 1, wherein the emitting the first radiation and the second radiation at the same point or at two points on a measurement line of the substrate on which the coating is formed, respectively, comprises:
emitting a first ray to a first point on the measuring line of the substrate with the plated layer at a first preset position, and emitting a second ray to a second point on the measuring line of the substrate with the plated layer at a second preset position, wherein the substrate passes through the first preset position and the second preset position after passing through a plating layer thickness control device, the measuring line is perpendicular to the advancing direction of the substrate, and the first point on the measuring line and the second point on the measuring line are the same point or two different points on the measuring line;
the method further comprises the following steps:
and sending the thickness of the coating at the position of the measuring line on the substrate to a control device, so that the control device controls the coating thickness control equipment to adjust the subsequent substrate coating according to the coating thickness.
3. The coating measurement method of claim 2, wherein the substrate travel distance from the first predetermined position to the coating thickness control device and the substrate travel distance from the second predetermined position to the coating thickness control device are each between 0 and 100 m.
4. A plating layer measuring apparatus, characterized in that the apparatus comprises:
the device comprises a ray thickness measuring unit, a measuring unit and a control unit, wherein the ray thickness measuring unit is used for respectively emitting a first ray and a second ray to the same point or two points on a measuring line of a substrate with a plated layer, respectively receiving the first ray and the second ray which penetrate through the substrate, and determining the receiving intensity of the first ray and the receiving intensity of the second ray, the emitting intensity of the first ray is different from that of the second ray, and the measuring line is perpendicular to the full length direction of the substrate;
the thickness determining unit is used for determining the thickness of the coating at the position of the measuring line on the substrate according to the emission intensity and the receiving intensity of the first ray and the emission intensity and the receiving intensity of the second ray;
determining the thickness of the coating at the measuring position through a coating thickness operation equation constructed based on a substance-to-ray absorption rule formula, wherein the coating thickness is determined through the following formula:
in the formula, hBIs the thickness of the coating at the position of the measuring line on the substrate, E1Is the emission intensity of the first ray, E2Is the emission intensity of the second ray, E'1Is the received intensity, E 'of the first ray'2Is the received intensity, k, of the second ray1AIs the absorption coefficient, k, of the substrate material to said first ray2AIs the absorption coefficient, k, of the substrate material to the second ray1BIs the absorption coefficient, k, of the coating material to said first ray2BIs the absorption coefficient of the coating material to the second ray.
5. The plating measuring apparatus according to claim 4, further comprising a transmitting unit;
the ray thickness measuring unit is used for emitting a first ray to a first point on the measuring line of the substrate with the plated layer at a first preset position and emitting a second ray to a second point on the measuring line of the substrate with the plated layer at a second preset position, wherein the substrate passes through the first preset position and the second preset position after passing through a plating layer thickness control device, and the first point on the measuring line and the second point on the measuring line are the same point or two different points on the measuring line;
and the sending unit is used for sending the coating thickness of the position of the measuring line on the substrate to a control device so that the control device controls the coating thickness control equipment to adjust the subsequent substrate coating according to the coating thickness.
6. The coating measuring device of claim 5, wherein the substrate travel distance from the first predetermined position to the coating thickness control apparatus and the substrate travel distance from the second predetermined position to the coating thickness control apparatus are each between 0 and 100 m.
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| JP2000097642A (en) * | 1998-09-22 | 2000-04-07 | Sharp Corp | Film thickness monitor |
| CN105486252A (en) * | 2014-09-19 | 2016-04-13 | 鞍钢股份有限公司 | Aluminum-zinc-plated layer thickness measurement compensation method |
| CN105444706B (en) * | 2016-01-29 | 2018-02-02 | 工业和信息化部电子第五研究所 | The measuring method of each thickness of coating in electronic component with complex metal plating layer |
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