CN105444706B - The measuring method of each thickness of coating in electronic component with complex metal plating layer - Google Patents
The measuring method of each thickness of coating in electronic component with complex metal plating layer Download PDFInfo
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- CN105444706B CN105444706B CN201610069964.0A CN201610069964A CN105444706B CN 105444706 B CN105444706 B CN 105444706B CN 201610069964 A CN201610069964 A CN 201610069964A CN 105444706 B CN105444706 B CN 105444706B
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- metal
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B15/00—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons
- G01B15/02—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons for measuring thickness
Abstract
The measuring method of each thickness of coating, comprises the following steps in a kind of electronic component with complex metal plating layer of the present invention：(1) culture substrate is prepared；(2) the factor of influence Δ for the coat of metal that material is M is determined；(3) measure.The method of the present invention can realize the accurate measurement to complex metal plating layer thickness in electronic component, and particularly when the situation that 2 material identical coats of metal are included in the complex metal plating layer of electronic component, measuring method is easy, cost is low, as a result favorable reproducibility.
Description
Technical field
The present invention relates to technical field of analysis and detection, more particularly to a kind of survey of each thickness of coating in complex metal plating layer
Amount method.
Background technology
The thickness of coating is the important indicator for weighing quality of coating.It is mainly to the mode of coated metal thickness measure at present
Tested using microtomy, measured after microsection manufacture is carried out to measured surface using survey tool.Shortcoming is:Due to
The ductility of the metals such as gold, silver, tin in itself, the coat of metal (the especially outermost coat of metal) is sent out during microsection manufacture
Life is extended and created a false impression, and it is bigger than normal to directly contribute measurement result.
Prior art generally use x-ray fluorescent thickness-measuring instrument measures to the coat of metal, and the measuring method is simple and efficient,
But the material for including at least two coats of metal in complex metal plating layer is x-ray fluorescent thickness-measuring instrument in the case of identical
The thickness that can not measure each coating, this is due to that X-ray fluorescent line is peculiar for various elements, is surveyed by x-ray fluorescence
The collection and analysis of thick method, the gross thickness of the coating of identical material can only be measured, can not measured each in complex metal plating layer
The thickness of coating.
In view of the above-mentioned problems, the method taken at present can using on the coat of metal to be measured again again plate one layer metal as
Protective layer, section is then fabricated to again thickness measuring is carried out to coating to be measured.But the shortcomings that this mode is to increase preparation flow, hold
Easily increase time and cost, sample generally also more difficult completion when examining.
Based on this, prior art is badly in need of developing a kind of measurement side of each thickness of coating in simple and efficient complex metal plating layer
Method.
The content of the invention
Based on this, it is an object of the invention to provide thickness is respectively plated in a kind of simple and quick, inexpensive complex metal plating layer
The measuring method of degree.
Specific technical scheme is as follows：
The measuring method of each thickness of coating, comprises the following steps in a kind of electronic component with complex metal plating layer：
The complex metal plating layer of the electronic component is stacked gradually in the coat of metal on substrate layer, and at least including n-layer
Have that the material M of two coats of metal is identical, n >=3；
(1) culture substrate is prepared
In the preparation of the sample of the electronic component, n culture substrate is entered together with the sample of the electronic component
Row electroplating operations, layer of metal coating is often electroplated, take out a culture substrate；
(2) the factor of influence Δ for the coat of metal that material is M is determined
The coat of metal that the material is M includes the first M coats of metal close to substrate layer and the 2nd M away from substrate layer
The coat of metal, x-ray fluorescent thickness-measuring instrument is used to measure the thickness of the first M coats of metal of corresponding culture substrate as x1；
X-ray fluorescent thickness-measuring instrument is used to measure in the sample of the electronic component material as the gross thickness of the M coat of metal
x0；
In the sample surfaces re-plating layer of metal diaphragm of the electronic component, the 2nd M is measured using microtomy
The actual (real) thickness of the coat of metal is y；
The factor of influence Δ=y/ (x0-x1)；
(3) measurement of testing sample
The thickness b of the 2nd M coats of metal measuring method is as follows in testing sample：
X-ray fluorescent thickness-measuring instrument is used to measure the thickness of the first M coats of metal of the testing sample as a1；
X-ray fluorescent thickness-measuring instrument is used to measure in the testing sample material as the gross thickness a0 of the M coat of metal；
B=Δs (a0-a1).
In one of the embodiments, the material of the coat of metal is selected from gold, silver, tin, copper or aluminium.
In one of the embodiments, the thickness range of the coat of metal is (0.1~5.0) μm.
In one of the embodiments, the top layer Plating measurement precision of the x-ray fluorescent thickness-measuring instrument is 5%.
Beneficial effects of the present invention are as follows：
For the problem of complex operation, cost are high, result reappearance is low in the measuring method of prior art, the present invention provides
A kind of culture medium sheet metal thickness of coating measuring method.Substrate is cultivated, refers to the semi-finished product electroplated with sample, per electricity
One circulation of plating just cultivates substrate for reserved one, is then plated by measuring culture substrate and the corresponding metal composite that is calculated
The thickness of each layer metal of layer.This method is tested for multilayer composite metal coating, it is possible to achieve compound to electronic component
The accurate measurement of metal layer thickness, particularly when including 2 material identical metals in the complex metal plating layer of electronic component
The situation of coating.
Prior art generally use x-ray fluorescent thickness-measuring instrument measures to the coat of metal, and the measuring method is simple and efficient,
But the material for including at least two coats of metal in complex metal plating layer is x-ray fluorescent thickness-measuring instrument in the case of identical
The thickness that can not measure each coating of material identical.The present invention measuring method be：Factor of influence, compound gold are determined first
Belong to and the first M coats of metal positioned at internal layer (close to substrate layer) and the 2nd M positioned at outer layer (away from substrate layer) are included in coating
The coat of metal, thickness of the present invention using the measurement of x-ray fluorescent thickness-measuring instrument positioned at the first M coats of metal of internal layer, and material
, will be using the thickness of the 2nd M coats of metal of microtomy measurement as actual (real) thickness, then for the gross thickness of the M coat of metal
Calculate the factor of influence Δ for the coat of metal that material is M；Then when measuring testing sample, it is only necessary to using x-ray fluorescence
Calibrator measures the gross thickness for the coat of metal that the first M coats of metal and material are M, it is possible to calculates the by factor of influence
The thickness of the two M coats of metal.
The measuring method of the present invention is easy, cost is low, as a result favorable reproducibility.
Embodiment
The present invention is further elaborated by the following examples.
The measuring method of each thickness of coating in a kind of electronic component with complex metal plating layer of the present embodiment, including it is as follows
Step：
The complex metal plating layer of the electronic component includes 4 layers of coat of metal stacked gradually, respectively the first Ni metals
Coating, the first Au coats of metal, the 2nd Ni coats of metal and the 2nd Au coats of metal；
(1) culture substrate is prepared
In the preparation of the sample of the electronic component, 4 culture substrates are entered together with the sample of the electronic component
Row electroplating operations, layer of metal coating is often electroplated, take out a culture substrate；
(2) factor of influence Δ is determined
X-ray fluorescent thickness-measuring instrument is used to measure the thickness of the first Ni coats of metal of corresponding culture substrate as x1=1.5 μ
m；The Ni layer Plating measurements precision of x-ray fluorescent thickness-measuring instrument is 5%；
X-ray fluorescent thickness-measuring instrument is used to measure in the sample of the electronic component material as the gross thickness of the Ni coat of metal
X0=7.3 μm；
In the sample surfaces re-plating layer of metal diaphragm of the electronic component, the 2nd Ni is measured using microtomy
The thickness of the coat of metal is y1=2.5 μm；
Ni layer factor of influence Δ 1=y1/ (x0-x1)=0.43；
X-ray fluorescent thickness-measuring instrument is used to measure the thickness of the first Au coats of metal of corresponding culture substrate as z1=0.6 μ
m；
X-ray fluorescent thickness-measuring instrument is used to measure in the sample of the electronic component material as the gross thickness of the Au coat of metal
Z0=1.2 μm；
In the sample surfaces re-plating layer of metal diaphragm of the electronic component, the 2nd Au is measured using microtomy
The thickness of the coat of metal is y2=1.4 μm；
Ni layer factor of influence Δ 2=y2/ (z0-z1)=2.33；
(3) measurement of testing sample
The thickness b of the 2nd Ni coats of metal measuring method is as follows in testing sample：
X-ray fluorescent thickness-measuring instrument is used to measure the thickness of the first Ni coats of metal of the testing sample as a1=1.6 μm；
X-ray fluorescent thickness-measuring instrument is used to measure in the testing sample material as the gross thickness a0=of the Ni coat of metal
7.9μm；
B=Δs 1 (a0-a1)=2.7 μm；The actual (real) thickness that microtomy obtains is used as 2.8 μm；The two results contrast connects
Closely.
The thickness c of the 2nd Au coats of metal measuring method is as follows in testing sample：
X-ray fluorescent thickness-measuring instrument is used to measure the thickness of the first Au coats of metal of the testing sample as d1=0.7 μm；
X-ray fluorescent thickness-measuring instrument is used to measure in the testing sample material as the gross thickness d0=of the Ni coat of metal
1.5μm；
B=Δs 2 (d0-d1)=1.9 μm；The actual (real) thickness that microtomy obtains is used as 1.8 μm；The two results contrast connects
Closely.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope that this specification is recorded all is considered to be.
Embodiment described above only expresses the several embodiments of the present invention, and its description is more specific and detailed, but simultaneously
Can not therefore it be construed as limiting the scope of the patent.It should be pointed out that come for one of ordinary skill in the art
Say, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (4)
1. the measuring method of each thickness of coating in a kind of electronic component with complex metal plating layer, it is characterised in that including such as
Lower step：
The complex metal plating layer of the electronic component is stacked gradually in the coat of metal on substrate layer including n-layer, and at least two
The material M of the individual coat of metal is identical, n >=3；
(1) culture substrate is prepared
In the preparation of the sample of the electronic component, n culture substrate is subjected to electricity together with the sample of the electronic component
Plating operation, often electroplates layer of metal coating, takes out a culture substrate；
(2) the factor of influence Δ for the coat of metal that material is M is determined
The coat of metal that the material is M includes the first M coats of metal close to substrate layer and the 2nd M metals away from substrate layer
Coating, x-ray fluorescent thickness-measuring instrument is used to measure the thickness of the first M coats of metal of corresponding culture substrate as x1；
X-ray fluorescent thickness-measuring instrument is used to measure in the sample of the electronic component material as the gross thickness x0 of the M coat of metal；
In the sample surfaces re-plating layer of metal diaphragm of the electronic component, the 2nd M metals are measured using microtomy
The actual (real) thickness of coating is y；
The factor of influence Δ=y/ (x0-x1)；
(3) measurement of testing sample
The thickness b of the 2nd M coats of metal measuring method is as follows in testing sample：
X-ray fluorescent thickness-measuring instrument is used to measure the thickness of the first M coats of metal of the testing sample as a1；
X-ray fluorescent thickness-measuring instrument is used to measure in the testing sample material as the gross thickness a0 of the M coat of metal；
B=Δs (a0-a1).
2. measuring method according to claim 1, it is characterised in that the material of the coat of metal be selected from gold, nickel,
Silver, tin, copper or aluminium.
3. measuring method according to claim 1, it is characterised in that the thickness range of the coat of metal is 0.1~5.0
μm。
4. measuring method according to claim 1, it is characterised in that the top layer coating of the x-ray fluorescent thickness-measuring instrument is surveyed
Accuracy of measurement is 5%.
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4764945A (en) * | 1984-10-05 | 1988-08-16 | Kawasaki Steel Corp. | Method of measuring layer thickness and composition of alloy plating |
| CN1407335A (en) * | 2001-08-07 | 2003-04-02 | 精工电子有限公司 | X-ray coating thickness device |
| CN101354363A (en) * | 2007-07-23 | 2009-01-28 | 比亚迪股份有限公司 | Method for measuring substrate surface coating |
| CN103075986A (en) * | 2013-01-11 | 2013-05-01 | 清华大学 | Method for measuring film thickness |
| CN103453861A (en) * | 2013-09-06 | 2013-12-18 | 鞍钢股份有限公司 | Method for measuring thickness of galvanized layer |
-
2016
- 2016-01-29 CN CN201610069964.0A patent/CN105444706B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4764945A (en) * | 1984-10-05 | 1988-08-16 | Kawasaki Steel Corp. | Method of measuring layer thickness and composition of alloy plating |
| CN1407335A (en) * | 2001-08-07 | 2003-04-02 | 精工电子有限公司 | X-ray coating thickness device |
| CN101354363A (en) * | 2007-07-23 | 2009-01-28 | 比亚迪股份有限公司 | Method for measuring substrate surface coating |
| CN103075986A (en) * | 2013-01-11 | 2013-05-01 | 清华大学 | Method for measuring film thickness |
| CN103453861A (en) * | 2013-09-06 | 2013-12-18 | 鞍钢股份有限公司 | Method for measuring thickness of galvanized layer |
Non-Patent Citations (1)
| Title |
|---|
| 复合金属镀层测试方法研究;刘磊等;《计量与测试技术》;20151231;第33卷(第6期);全文 * |
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Effective date of registration: 20160629 Address after: 510610 Tianhe District, Guangzhou, Dongguan Zhuang Road, No. 110, No. Applicant after: The 5th Electronic Research Institute of MIIT Address before: 510610 Tianhe District, Guangzhou, Dongguan Zhuang Road, No. 110, No. Applicant before: The 5th Electronic Research Institute of MIIT Applicant before: Guangzhou CEPREI Instrument and Equipment Co., Ltd. |
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