CN108878382A - A kind of encapsulating structure and its process with electromagnetic shielding - Google Patents
A kind of encapsulating structure and its process with electromagnetic shielding Download PDFInfo
- Publication number
- CN108878382A CN108878382A CN201810558861.XA CN201810558861A CN108878382A CN 108878382 A CN108878382 A CN 108878382A CN 201810558861 A CN201810558861 A CN 201810558861A CN 108878382 A CN108878382 A CN 108878382A
- Authority
- CN
- China
- Prior art keywords
- metal
- substrate
- chip
- plastic packaging
- packaging material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Abstract
The present invention relates to a kind of encapsulating structure and its process with electromagnetic shielding, the structure includes substrate (1), substrate (1) front is provided with chip (3), chip (3) periphery is provided with multiple metal columns (2), the chip (3) and metal column (2) outer encapsulating have plastic packaging material (4), the height of the metal column (2) is higher than plastic packaging material (4), and plastic packaging material (4) surface and metal column (2) surface beyond plastic packaging material (4) are provided with metal sputtering layer (5).A kind of encapsulating structure and its process with electromagnetic shielding of the present invention, it does not need to be cut into single product and is sputtered when carrying out metal layer sputtering process, can directly use entire substrate directly be electroplated or sputter, production efficiency can be improved；In addition metal layer is grounded by metal column, can achieve the purpose of shielding.
Description
Technical field
The present invention relates to a kind of encapsulating structure and its process with electromagnetic shielding belongs to semiconductor packaging neck
Domain.
Background technique
Semiconductor packages be it is a kind of semiconductor chip is electrically electrically connected with substrate, half-and-half led using packing colloid
Body chip and substrate are protected, and the infringement of extraneous aqueous vapor and pollutant is avoided, and nowadays internal in electronic product there are tens
A semiconductor packages components a or up to a hundred, when operation can each encapsulation component can generate electromagnetic interference, lead to semiconductor
The electrical functionality for encapsulating component is abnormal, is needed at this time with semi-conductor electricity shielding techniques, it is ensured that each component operates normally.
The encapsulating structure and process of tradition electromagnetic shielding：
When substrate manufacture, earth lead is arranged in substrate layer (layer 2-3), upper piece chip is connected into connection with substrate, then into
Row encapsulating process protects chip and substrate, after the product encapsulated is cut into single, exposes substrate side surfaces ground line, then carry out
Back side pad pasting protective substrate back side pad, finally carries out metal sputtering processes, at this time single production of splash-proofing sputtering metal layer package well cutting
Product, the metal layer and substrate side surfaces ground line for sputtering at substrate side surfaces are connected.
The defect of traditional structure and technique：
The ground line of substrate side surfaces is exposed to the external environment after dicing, easy to oxidize, may cause ground line and
Metal layer poor contact, metal layer can not normal ground, therefore the effect of electromagnetic shielding is not achieved.
Summary of the invention
The technical problem to be solved by the present invention is to provide a kind of encapsulation with electromagnetic shielding for the above-mentioned prior art
Structure and its process, it is able to solve conventional sputter process requirement and product is cut into single, substrate side surfaces conducting wire is exposed
Be connected with metal sputtering layer may poor contact the problem of.
The present invention solve the above problems used by technical solution be：A kind of encapsulating structure with electromagnetic shielding, it is wrapped
Include substrate, the substrate front side is provided with chip, and the chip periphery is provided with multiple metal columns, outside the chip and metal column
It is encapsulated with plastic packaging material, the upper end of the metal column is higher than plastic packaging material, the plastic packaging material surface and the metal column beyond plastic packaging material
Surface is provided with metal sputtering layer.
Preferably, the metal column lower end is connected with the ground path of substrate.
Preferably, the chip is set to substrate surface by bonding material, passes through metal between the chip and substrate
Line is electrically connected.
A kind of process of the encapsulating structure with electromagnetic shielding, the described method comprises the following steps：
Step 1: taking a substrate, one circle metal column is formed by plating in substrate surface；
Step 2: in a circle metal column intermediate region by bonding material pasting chip, chip surface and substrate surface it
Between pass through metal wire be electrically connected；
Step 3: being encapsulated using encapsulating mold, upper mould group pastes soft glue film, when mold pressing, metal column
In the soft glue film of upper end jacking, after the completion of plastic packaging, soft glue film is removed, the metal post part of the soft glue film of jacking protrudes from plastic packaging
Material；
Step 4: carrying out metal sputtering processes on plastic packaging material surface, the splash-proofing sputtering metal layer of formation covers simultaneously protrudes from modeling
Seal the metal column surface of material.
Compared with the prior art, the advantages of the present invention are as follows：
A kind of encapsulating structure and its process with electromagnetic shielding of the present invention, it is carrying out metal layer sputtering process
When, it does not need to be cut into single product and is sputtered, directly can be directly electroplated using entire substrate or sputter, life can be improved
Produce efficiency；In addition metal layer is grounded by metal column, can achieve the purpose of shielding.
Detailed description of the invention
Fig. 1 is a kind of schematic diagram of the encapsulating structure with electromagnetic shielding of the present invention.
Fig. 2~Fig. 6 is a kind of flow diagram of the encapsulating structure process with electromagnetic shielding of the present invention.
Wherein：
Substrate 1
Metal column 2
Chip 3
Plastic packaging material 4
Metal sputtering layer 5
Bonding material 6
Metal wire 7.
Specific embodiment
The present invention will be described in further detail below with reference to the embodiments of the drawings.
As shown in Figure 1, one of the present embodiment has the encapsulating structure of electromagnetic shielding, it includes substrate 1, the substrate
1 front is provided with chip 3, and 3 periphery of chip is provided with multiple metal columns 2, and the chip 3 and 2 outer encapsulating of metal column have modeling
The upper end of envelope material 4, the metal column 2 is higher than plastic packaging material 4,4 upper surface of plastic packaging material and the metal column 2 beyond plastic packaging material 4
Surface is provided with metal sputtering layer 5；
2 lower end of metal column is connected with the ground path of substrate；
The chip 3 is set to 1 surface of substrate by bonding material 6, passes through metal wire 7 between the chip 3 and substrate 1
It is electrically connected.
Its process is as follows：
Step 1: referring to fig. 2, taking a substrate, one circle metal column is formed by plating in substrate surface；
Step 2: passing through bonding material pasting chip, chip surface and base in a circle metal column intermediate region referring to Fig. 3
It is electrically connected between plate surface by metal wire；
Step 3: referring to fig. 4, Fig. 5, encapsulated using encapsulating mold, upper mould group pastes soft glue film, when mold pressure
When conjunction, in the soft glue film of metal column upper end jacking, after the completion of plastic packaging, soft glue film, the metal column portion of the soft glue film of jacking are removed
Divide and protrudes from plastic packaging material；
Step 4: carrying out metal sputtering processes on plastic packaging material surface, the splash-proofing sputtering metal layer of formation covers simultaneously referring to Fig. 6
The metal column surface for protruding from plastic packaging material is connected by splash-proofing sputtering metal layer with metal column, and electromagnetic shielding is formed.
In addition to the implementation, all to use equivalent transformation or equivalent replacement the invention also includes there is an other embodiments
The technical solution that mode is formed should all be fallen within the scope of the hereto appended claims.
Claims (4)
1. a kind of encapsulating structure with electromagnetic shielding, it is characterised in that：It includes substrate (1), substrate (1) front setting
Have chip (3), chip (3) periphery is provided with multiple metal columns (2), and the chip (3) and metal column (2) outer encapsulating have modeling
Envelope material (4), the upper end of the metal column (2) is higher than plastic packaging material (4), plastic packaging material (4) upper surface and beyond plastic packaging material (4)
Metal column (2) surface be provided with metal sputtering layer (5).
2. a kind of encapsulating structure with electromagnetic shielding according to claim 1, it is characterised in that：The metal column (2)
Lower end is connected with the ground path of substrate.
3. a kind of encapsulating structure with electromagnetic shielding according to claim 1, it is characterised in that：The chip (3) is logical
It crosses bonding material (6) and is set to substrate (1) surface, be electrically connected between the chip (3) and substrate (1) by metal wire (7).
4. a kind of process of the encapsulating structure with electromagnetic shielding, it is characterised in that the described method comprises the following steps：
Step 1: taking a substrate, one circle metal column is formed by plating in substrate surface；
Step 2: being led between chip surface and substrate surface in a circle metal column intermediate region by bonding material pasting chip
Cross metal wire electric connection；
Step 3: being encapsulated using encapsulating mold, upper mould group pastes soft glue film, when mold pressing, metal column upper end
In the soft glue film of jacking, after the completion of plastic packaging, soft glue film is removed, the metal post part of the soft glue film of jacking protrudes from plastic packaging material；
Step 4: carrying out metal sputtering processes on plastic packaging material surface, the splash-proofing sputtering metal layer of formation covers simultaneously protrudes from plastic packaging material
Metal column surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810558861.XA CN108878382A (en) | 2018-06-01 | 2018-06-01 | A kind of encapsulating structure and its process with electromagnetic shielding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810558861.XA CN108878382A (en) | 2018-06-01 | 2018-06-01 | A kind of encapsulating structure and its process with electromagnetic shielding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108878382A true CN108878382A (en) | 2018-11-23 |
Family
ID=64335112
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810558861.XA Withdrawn CN108878382A (en) | 2018-06-01 | 2018-06-01 | A kind of encapsulating structure and its process with electromagnetic shielding |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108878382A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109920779A (en) * | 2019-03-19 | 2019-06-21 | 吴静雯 | A kind of preparation method and encapsulating products of encapsulating products electro-magnetic screen layer |
| CN110010507A (en) * | 2019-04-04 | 2019-07-12 | 中电海康无锡科技有限公司 | SIP module subregion is electromagnetically shielded packaging method |
| CN113224500A (en) * | 2020-01-21 | 2021-08-06 | 华为技术有限公司 | Packaged antenna module, manufacturing method of packaged antenna module and terminal equipment |
| CN113314508A (en) * | 2021-05-28 | 2021-08-27 | 东莞记忆存储科技有限公司 | Flip chip packaging structure and processing method thereof |
| CN115642148A (en) * | 2022-12-22 | 2023-01-24 | 北京智芯微电子科技有限公司 | Magnetic shielding device, preparation method of magnetic shielding device and MRAM chip |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104011858A (en) * | 2011-10-17 | 2014-08-27 | 英闻萨斯有限公司 | Package-on-package assembly with wire bond vias |
| CN204792753U (en) * | 2015-06-04 | 2015-11-18 | 苏州日月新半导体有限公司 | Integrated circuit packaging body |
-
2018
- 2018-06-01 CN CN201810558861.XA patent/CN108878382A/en not_active Withdrawn
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104011858A (en) * | 2011-10-17 | 2014-08-27 | 英闻萨斯有限公司 | Package-on-package assembly with wire bond vias |
| CN204792753U (en) * | 2015-06-04 | 2015-11-18 | 苏州日月新半导体有限公司 | Integrated circuit packaging body |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109920779A (en) * | 2019-03-19 | 2019-06-21 | 吴静雯 | A kind of preparation method and encapsulating products of encapsulating products electro-magnetic screen layer |
| CN109920779B (en) * | 2019-03-19 | 2020-11-24 | 吴静雯 | Preparation method of electromagnetic shielding layer of packaged product and packaged product |
| CN110010507A (en) * | 2019-04-04 | 2019-07-12 | 中电海康无锡科技有限公司 | SIP module subregion is electromagnetically shielded packaging method |
| CN113224500A (en) * | 2020-01-21 | 2021-08-06 | 华为技术有限公司 | Packaged antenna module, manufacturing method of packaged antenna module and terminal equipment |
| CN113314508A (en) * | 2021-05-28 | 2021-08-27 | 东莞记忆存储科技有限公司 | Flip chip packaging structure and processing method thereof |
| CN115642148A (en) * | 2022-12-22 | 2023-01-24 | 北京智芯微电子科技有限公司 | Magnetic shielding device, preparation method of magnetic shielding device and MRAM chip |
| CN115642148B (en) * | 2022-12-22 | 2024-04-12 | 北京智芯微电子科技有限公司 | Magnetic shielding device, preparation method of magnetic shielding device and MRAM chip |
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| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 214400 No. 78 Changshan Road, Jiangyin High-tech Zone, Jiangyin City, Wuxi City, Jiangsu Province Applicant after: Jiangsu Changjiang Electronics Technology Co., Ltd. Address before: 214400 No. 78 Changshan Road, Chengjiang Town, Jiangyin City, Wuxi City, Jiangsu Province Applicant before: Jiangsu Changjiang Electronics Technology Co., Ltd. |
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| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20181123 |