CN108811339A - A kind of non-heavy copper hole weld-ring corrosion method of thick copper coin of optimization - Google Patents
A kind of non-heavy copper hole weld-ring corrosion method of thick copper coin of optimization Download PDFInfo
- Publication number
- CN108811339A CN108811339A CN201810712303.4A CN201810712303A CN108811339A CN 108811339 A CN108811339 A CN 108811339A CN 201810712303 A CN201810712303 A CN 201810712303A CN 108811339 A CN108811339 A CN 108811339A
- Authority
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- China
- Prior art keywords
- copper
- wiring board
- heavy copper
- plate face
- carries out
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1438—Treating holes after another process, e.g. coating holes after coating the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials For Photolithography (AREA)
Abstract
A kind of non-heavy copper hole weld-ring corrosion method of thick copper coin of optimization, includes the following steps, S1, a kind of plank of flame resistant material of input are cut into the required size of production；S2, the plank after cutting is carried out to internal layer figure turn operation；S3, the wiring board brown for turning to obtain by internal layer figure by the plank obtained in S2, carry out pressing plate, then be processed with numerically-controlled machine tool within the brown time；S4, it drills to the plate face of the wiring board after processing, then carries out removing glue Slag treatment；S5, the plate face in the wiring board obtained in step S4 is subjected to heavy copper, carries out electro-coppering after heavy copper, pattern transfer then is carried out to plate face, carries out electric tin later；Its effective benefit is：Optimize two driller's skills, avoids list（It is two-sided）Thickness copper non-heavy copper hole weld-ring in face corrodes, and avoids corroding the risk scrapped because of hole weld-ring.And it designs that pad is face-up, reduces because two bore the burr generated after character.
Description
Technical field
The present invention relates to pcb board field, the non-heavy copper hole weld-ring corrosion method of specially a kind of thick copper coin of optimization.
Background technology
With the sustainable development of electronics industry, various new products emerge one after another.Material Cost, human cost,
Under the overall situation that environmentally friendly cost and energy cost continue to increase, the design method of pcb board is constantly brought forth new ideas and is changed, and especially some are high
The design requirement of end plate, special technique pad, thick copper base are both needed to meet, its corresponding production difficulty also greatly promotes.
Such as the non-heavy copper eyelet welding ring design of single side of some thick substrates, used general technology flow includes electric tin now
It carries out two afterwards to bore, such method will produce larger weld-ring side etching quantity, base copper 2OZ thickness copper coin one-sided test amounts about 0.17mm.
Invention content
The present invention is at least one defect overcome described in the above-mentioned prior art（It is insufficient）, it is non-to provide a kind of thick copper coin of optimization
Heavy copper hole weld-ring corrosion method.
In order to solve the above technical problems, technical scheme is as follows：
A kind of non-heavy copper hole weld-ring corrosion method of thick copper coin of optimization, includes the following steps,
S1, a kind of plank of flame resistant material of input, are cut into the required size of production；
S2, the plank after cutting is carried out to internal layer figure turn operation；
S3, the wiring board brown for turning to obtain by internal layer figure by the plank obtained in S2, carry out pressing plate, then use within the brown time
Numerically-controlled machine tool is processed；
S4, it drills to the plate face of the wiring board after processing, then carries out removing glue Slag treatment, de-smear is that hole pars intramuralis is more
Remaining brill dirt is gone out, while epoxy resin is aoxidized away a part, to avoid interior layer separation；
S5, the plate face in the wiring board obtained in step S4 is carried out to heavy copper, electro-coppering is carried out after heavy copper, then to plate face into
Row pattern transfer will paste last layer photosensitive film layer, under the irradiation of ultraviolet light, by the film on the copper face crossed into mistake copper-coating
Line pattern on egative film is transferred on copper face, forms a kind of mask pattern against corrosion, then carries out electric tin；
S6, the outer layer of the wiring board after electric tin in step S4 is etched, is tested after moving back tin；
S7, aluminium flake consent, that is, drill out the aluminium flake for needing consent, halftone be made, and consent is carried out on screen printer, then to circuit
Plate carries out welding resistance；
S8, the wiring board after welding resistance in step S7 is subjected to silk-screen character, pad is placed up, carried out two and bore, then complete
Lead-free tin spray；
S9, molding is processed to the wiring board after spray tin, then cleans plate face, automatic optics inspection is carried out after cleaning plate face.
Further, in step s 5, the base copper thickness is 2 OZ；The overall thickness of the electro-coppering is 78.7-
118.6um。
Further, in step s 8, after pad being placed up, the outermost layer position in the hole before being bored to two is drawn
Copper treatment；It carries out drawing copper with the brill nozzle of a diameter of 1.0mm, and draws the copper of 0.8mm diameters, carry out after drawing Copper treatment, ensure that
The two preceding holes of brill are hollow, ensure preferably to complete to drill and reduce burr.
Further, non-heavy copper hole design needs the plate face in two brill wiring underlayer plates to put brill upward in wiring underlayer
Hole.
Compared with prior art, the advantageous effect of technical solution of the present invention is：Change is bored after the electric tin of design cycle two
It is bored for after character two, optimizes two driller's skills, avoid list（It is two-sided）Thickness copper non-heavy copper hole weld-ring in face corrodes, and avoids corroding because of hole weld-ring
The risk scrapped.And it designs that pad is face-up, reduces because two bore the burr generated after character.
Description of the drawings
Fig. 1 is a kind of non-heavy copper hole weld-ring corrosion method flow chart of the thick copper coin of optimization.
The attached figures are only used for illustrative purposes and cannot be understood as limitating the patent；It is attached in order to more preferably illustrate the present embodiment
Scheme certain components to have omission, zoom in or out, does not represent the size of actual product；To those skilled in the art,
The omitting of some known structures and their instructions in the attached drawings are understandable；Same or analogous label corresponds to same or similar
Component；The terms describing the positional relationship in the drawings are only for illustration, should not be understood as the limitation to this patent.
Specific implementation mode
The technical solution of invention is described further with reference to the accompanying drawings and examples.
Embodiment 1
A kind of non-heavy copper hole weld-ring corrosion method of thick copper coin of optimization, includes the following steps, as shown in Figure 1,
S1, a kind of plank of flame resistant material of input, are cut into the required size of production；
S2, the plank after cutting is carried out to internal layer figure turn operation；
S3, obtained wiring board brown will be turned by internal layer figure in S2, and carry out pressing plate within the brown time, then with numerically-controlled machine tool into
Row processing；
S4, it drills to the plate face of the wiring board after processing, then carries out removing glue Slag treatment, de-smear is that hole pars intramuralis is more
Remaining brill dirt is gone out, while epoxy resin is aoxidized away a part, to avoid interior layer separation；
S5, the plate face in the wiring board obtained in step S4 is carried out to heavy copper, electro-coppering is carried out after heavy copper, then to plate face into
Row pattern transfer will paste last layer photosensitive film layer, under the irradiation of ultraviolet light, by the film on the copper face crossed into mistake copper-coating
Line pattern on egative film is transferred on copper face, forms a kind of mask pattern against corrosion, then carries out electric tin；
S6, the outer layer of the wiring board after electric tin in step S4 is etched, is tested after moving back tin；
S7, aluminium flake consent, that is, drill out the aluminium flake for needing consent, halftone be made, and consent is carried out on screen printer, then to circuit
Plate carries out welding resistance；
S8, the wiring board after welding resistance in step S7 is subjected to silk-screen character, pad is placed up, carried out two and bore, then complete
Lead-free tin spray；
S9, molding is processed to the wiring board after spray tin, then cleans plate face, automatic optics inspection is carried out after cleaning plate face.
In this embodiment, two brills avoid list after the character taken（It is two-sided）Thickness copper non-heavy copper hole weld-ring in face corrodes, and avoids
Because hole weld-ring corrodes the risk scrapped.And it designs that pad is face-up, reduces because two bore the burr generated after character.
Embodiment 2
The main distinction of the present embodiment and embodiment 1 is that the brill nozzle using a diameter of 1.0mm carries out drawing copper, and before drawing two brills
Hole outermost layer position size be 0.8mm diameters copper.It carries out after drawing Copper treatment, ensure that the preceding hole of two brills is hollow, protect
Card preferably completes drilling and reduces burr.
Obviously, the above embodiment of the present invention be only to clearly illustrate example of the present invention, and not be pair
The restriction of embodiments of the present invention.For those of ordinary skill in the art, may be used also on the basis of the above description
To make other variations or changes in different ways.There is no necessity and possibility to exhaust all the enbodiments.It is all this
All any modification, equivalent and improvement etc., should be included in the claims in the present invention made by within the spirit and principle of invention
Protection domain within.
Claims (6)
1. a kind of non-heavy copper hole weld-ring corrosion method of the thick copper coin of optimization, it is characterised in that：Include the following steps,
S1, a kind of plank of flame resistant material of input, are cut into the required size of production；
S2, the plank after cutting is carried out to internal layer figure turn operation；
S3, the wiring board brown for turning to obtain by internal layer figure by the plank obtained in S2, carry out pressing plate, then use within the brown time
Numerically-controlled machine tool is processed；
S4, it drills to the plate face of the wiring board after processing, then carries out removing glue Slag treatment；
S5, the plate face in the wiring board obtained in step S4 is carried out to heavy copper, electro-coppering is carried out after heavy copper, then to plate face into
Row pattern transfer carries out electric tin later；
S6, the outer layer of the wiring board after electric tin in step S4 is etched, is tested after moving back tin；
S7, aluminium flake consent, that is, drill out the aluminium flake for needing consent, halftone be made, and consent is carried out on screen printer, then to circuit
Plate carries out welding resistance；
S8, the wiring board after welding resistance in step S7 is subjected to silk-screen character, pad is placed up, carried out two and bore, then complete
Lead-free tin spray；
S9, molding is processed to the wiring board after spray tin, then cleans plate face, automatic optics inspection is carried out after cleaning plate face.
2. a kind of non-heavy copper hole weld-ring corrosion method of the thick copper coin of optimization according to claim 1, it is characterised in that：In step
In S5, the base copper thickness is 2 OZ.
3. a kind of non-heavy copper hole weld-ring corrosion method of the thick copper coin of optimization according to claim 1, it is characterised in that：In step
In S5, the overall thickness of the electro-coppering is 78.7-118.6um.
4. a kind of non-heavy copper hole weld-ring corrosion method of the thick copper coin of optimization according to claim 1, it is characterised in that：In step
In S8, after pad is placed up, the outermost layer in the hole before being bored to two carries out drawing Copper treatment.
5. a kind of non-heavy copper hole weld-ring corrosion method of the thick copper coin of optimization according to claim 4, it is characterised in that：Use diameter
It carries out drawing copper for the brill nozzle of 1.0mm, and draws the copper of 0.8mm diameters.
6. a kind of non-heavy copper hole weld-ring corrosion method of the thick copper coin of optimization according to claim 1, it is characterised in that：Non- heavy copper
Hole is designed at wiring underlayer face, and the plate face in two brill wiring underlayer plates is needed to drill upward.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810712303.4A CN108811339A (en) | 2018-06-29 | 2018-06-29 | A kind of non-heavy copper hole weld-ring corrosion method of thick copper coin of optimization |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810712303.4A CN108811339A (en) | 2018-06-29 | 2018-06-29 | A kind of non-heavy copper hole weld-ring corrosion method of thick copper coin of optimization |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108811339A true CN108811339A (en) | 2018-11-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810712303.4A Pending CN108811339A (en) | 2018-06-29 | 2018-06-29 | A kind of non-heavy copper hole weld-ring corrosion method of thick copper coin of optimization |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1041609A (en) * | 1996-07-18 | 1998-02-13 | Hitachi Telecom Technol Ltd | Confirmation method of boring of printed wiring board |
| CN106572609A (en) * | 2016-11-04 | 2017-04-19 | 深圳市深联电路有限公司 | Manufacture method for manufacturing high-thermal-conductivity and single-sided aluminum substrate |
| CN106793569A (en) * | 2016-11-28 | 2017-05-31 | 江门崇达电路技术有限公司 | A kind of manufacture craft of metallic terminals |
| CN106793507A (en) * | 2016-12-19 | 2017-05-31 | 深圳崇达多层线路板有限公司 | A kind of preparation method in high thickness to diameter ratio producing circuit board metallized back drill hole |
| CN107660069A (en) * | 2017-09-07 | 2018-02-02 | 江门市君业达电子有限公司 | A kind of PCB plate production method with half bore |
-
2018
- 2018-06-29 CN CN201810712303.4A patent/CN108811339A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1041609A (en) * | 1996-07-18 | 1998-02-13 | Hitachi Telecom Technol Ltd | Confirmation method of boring of printed wiring board |
| CN106572609A (en) * | 2016-11-04 | 2017-04-19 | 深圳市深联电路有限公司 | Manufacture method for manufacturing high-thermal-conductivity and single-sided aluminum substrate |
| CN106793569A (en) * | 2016-11-28 | 2017-05-31 | 江门崇达电路技术有限公司 | A kind of manufacture craft of metallic terminals |
| CN106793507A (en) * | 2016-12-19 | 2017-05-31 | 深圳崇达多层线路板有限公司 | A kind of preparation method in high thickness to diameter ratio producing circuit board metallized back drill hole |
| CN107660069A (en) * | 2017-09-07 | 2018-02-02 | 江门市君业达电子有限公司 | A kind of PCB plate production method with half bore |
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Application publication date: 20181113 |
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| RJ01 | Rejection of invention patent application after publication |