CN108807312A - 一种散热装置 - Google Patents
一种散热装置 Download PDFInfo
- Publication number
- CN108807312A CN108807312A CN201810693310.4A CN201810693310A CN108807312A CN 108807312 A CN108807312 A CN 108807312A CN 201810693310 A CN201810693310 A CN 201810693310A CN 108807312 A CN108807312 A CN 108807312A
- Authority
- CN
- China
- Prior art keywords
- framework
- wall
- thermal conductive
- fixed
- conductive ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002826 coolant Substances 0.000 claims abstract description 36
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 30
- 239000000919 ceramic Substances 0.000 claims abstract description 27
- 230000003139 buffering effect Effects 0.000 claims abstract description 22
- 229910052742 iron Inorganic materials 0.000 claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 14
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 12
- 239000010439 graphite Substances 0.000 claims abstract description 12
- 230000005855 radiation Effects 0.000 claims abstract description 10
- 238000001816 cooling Methods 0.000 claims abstract description 8
- 239000007788 liquid Substances 0.000 claims description 14
- 239000012530 fluid Substances 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 7
- 239000000872 buffer Substances 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 2
- 229910052573 porcelain Inorganic materials 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 230000005611 electricity Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000000110 cooling liquid Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3731—Ceramic materials or glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810693310.4A CN108807312B (zh) | 2016-08-22 | 2016-08-22 | 一种散热装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610705010.4A CN106098653B (zh) | 2016-08-22 | 2016-08-22 | 一种多芯片堆叠式的散热装置 |
CN201810693310.4A CN108807312B (zh) | 2016-08-22 | 2016-08-22 | 一种散热装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610705010.4A Division CN106098653B (zh) | 2016-08-22 | 2016-08-22 | 一种多芯片堆叠式的散热装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108807312A true CN108807312A (zh) | 2018-11-13 |
CN108807312B CN108807312B (zh) | 2020-07-14 |
Family
ID=57225697
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610705010.4A Active CN106098653B (zh) | 2016-08-22 | 2016-08-22 | 一种多芯片堆叠式的散热装置 |
CN201810693310.4A Active CN108807312B (zh) | 2016-08-22 | 2016-08-22 | 一种散热装置 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610705010.4A Active CN106098653B (zh) | 2016-08-22 | 2016-08-22 | 一种多芯片堆叠式的散热装置 |
Country Status (1)
Country | Link |
---|---|
CN (2) | CN106098653B (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106098653B (zh) * | 2016-08-22 | 2018-06-15 | 深圳市铭瑞达五金制品有限公司 | 一种多芯片堆叠式的散热装置 |
CN108617149B (zh) * | 2018-06-25 | 2023-05-16 | 芜湖纯元光电设备技术有限公司 | 一种热传导效率高的散热片 |
CN109346418B (zh) * | 2018-10-10 | 2020-11-17 | 高劲(广东)芯片科技有限公司 | 一种嵌入式芯片封装及封装方法 |
CN111081695B (zh) * | 2019-12-31 | 2020-12-01 | 温州睿程机械科技有限公司 | 一种可堆叠微电子封装结构 |
CN111970906B (zh) * | 2020-08-24 | 2022-03-15 | 浙江集迈科微电子有限公司 | 相控阵雷达散热装置 |
CN113130470B (zh) * | 2021-04-21 | 2022-08-16 | 深圳市芯视佳半导体科技有限公司 | 一种微显示器结构及其制作方法 |
CN113410193B (zh) * | 2021-05-27 | 2024-05-03 | 元成科技(苏州)有限公司 | 一种8+1堆叠式芯片封装装置 |
CN114530406B (zh) * | 2022-01-14 | 2022-12-13 | 中山市木林森微电子有限公司 | 一种便于装卸的半导体封装结构 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003336954A (ja) * | 2002-05-17 | 2003-11-28 | Sumitomo Precision Prod Co Ltd | 冷却器およびその製造方法 |
CN202003971U (zh) * | 2011-03-23 | 2011-10-05 | 中芯国际集成电路制造(上海)有限公司 | 晶圆传输装置 |
CN105428266A (zh) * | 2015-11-30 | 2016-03-23 | 中国电子科技集团公司第三十八研究所 | 具有介质桥的芯片倒装共晶键合方法及获得的产物 |
CN106098653B (zh) * | 2016-08-22 | 2018-06-15 | 深圳市铭瑞达五金制品有限公司 | 一种多芯片堆叠式的散热装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR940006427Y1 (ko) * | 1991-04-12 | 1994-09-24 | 윤광렬 | 독서용 확대경 |
KR100461721B1 (ko) * | 2002-05-27 | 2004-12-14 | 삼성전기주식회사 | 리드 방열 세라믹 패키지 |
US7191516B2 (en) * | 2003-07-16 | 2007-03-20 | Maxwell Technologies, Inc. | Method for shielding integrated circuit devices |
US7429792B2 (en) * | 2006-06-29 | 2008-09-30 | Hynix Semiconductor Inc. | Stack package with vertically formed heat sink |
-
2016
- 2016-08-22 CN CN201610705010.4A patent/CN106098653B/zh active Active
- 2016-08-22 CN CN201810693310.4A patent/CN108807312B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003336954A (ja) * | 2002-05-17 | 2003-11-28 | Sumitomo Precision Prod Co Ltd | 冷却器およびその製造方法 |
CN202003971U (zh) * | 2011-03-23 | 2011-10-05 | 中芯国际集成电路制造(上海)有限公司 | 晶圆传输装置 |
CN105428266A (zh) * | 2015-11-30 | 2016-03-23 | 中国电子科技集团公司第三十八研究所 | 具有介质桥的芯片倒装共晶键合方法及获得的产物 |
CN106098653B (zh) * | 2016-08-22 | 2018-06-15 | 深圳市铭瑞达五金制品有限公司 | 一种多芯片堆叠式的散热装置 |
Also Published As
Publication number | Publication date |
---|---|
CN106098653B (zh) | 2018-06-15 |
CN108807312B (zh) | 2020-07-14 |
CN106098653A (zh) | 2016-11-09 |
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Legal Events
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20200611 Address after: 325000 No.6 Qianjin back road, qiansha village, Qidu street, Lucheng District, Wenzhou City, Zhejiang Province Applicant after: Lin Jinguo Address before: 363999 room 602, 10 garden, Nanchang garden, Longwen District, Zhangzhou, Fujian. Applicant before: ZHANGZHOU LONGWEN DISTRICT LIANSHENGHE INFORMATION TECHNOLOGY Co.,Ltd. |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20201204 Address after: 234000 building, Xiaodu Town, Suzhou City, Anhui Province Patentee after: Anhui bright noodle Co.,Ltd. Address before: 325000 No.6 Qianjin back road, qiansha village, Qidu street, Lucheng District, Wenzhou City, Zhejiang Province Patentee before: Lin Jinguo |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A heat dissipation device Effective date of registration: 20210514 Granted publication date: 20200714 Pledgee: Suzhou Xiaoxian sub branch of Huishang Bank Co.,Ltd. Pledgor: Anhui bright noodle Co.,Ltd. Registration number: Y2021980003626 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A heat dissipation device Effective date of registration: 20220530 Granted publication date: 20200714 Pledgee: Suzhou Xiaoxian sub branch of Huishang Bank Co.,Ltd. Pledgor: Anhui bright noodle Co.,Ltd. Registration number: Y2022980006156 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20231116 Granted publication date: 20200714 Pledgee: Suzhou Xiaoxian sub branch of Huishang Bank Co.,Ltd. Pledgor: Anhui bright noodle Co.,Ltd. Registration number: Y2022980006156 |