CN202003971U - 晶圆传输装置 - Google Patents
晶圆传输装置 Download PDFInfo
- Publication number
- CN202003971U CN202003971U CN2011200782640U CN201120078264U CN202003971U CN 202003971 U CN202003971 U CN 202003971U CN 2011200782640 U CN2011200782640 U CN 2011200782640U CN 201120078264 U CN201120078264 U CN 201120078264U CN 202003971 U CN202003971 U CN 202003971U
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- wafer
- transfer device
- cooling water
- wafer transfer
- placing plate
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2011200782640U CN202003971U (zh) | 2011-03-23 | 2011-03-23 | 晶圆传输装置 |
Applications Claiming Priority (1)
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CN2011200782640U CN202003971U (zh) | 2011-03-23 | 2011-03-23 | 晶圆传输装置 |
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CN202003971U true CN202003971U (zh) | 2011-10-05 |
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CN2011200782640U Expired - Fee Related CN202003971U (zh) | 2011-03-23 | 2011-03-23 | 晶圆传输装置 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20160090760A (ko) * | 2015-01-22 | 2016-08-01 | 어플라이드 머티어리얼스, 인코포레이티드 | 배치 가열 및 냉각 챔버 또는 로드록 |
CN108807312A (zh) * | 2016-08-22 | 2018-11-13 | 漳州龙文区炼盛合信息技术有限公司 | 一种散热装置 |
CN108955080A (zh) * | 2018-06-26 | 2018-12-07 | 武汉华星光电半导体显示技术有限公司 | 一种冷却设备 |
-
2011
- 2011-03-23 CN CN2011200782640U patent/CN202003971U/zh not_active Expired - Fee Related
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20160090760A (ko) * | 2015-01-22 | 2016-08-01 | 어플라이드 머티어리얼스, 인코포레이티드 | 배치 가열 및 냉각 챔버 또는 로드록 |
CN105826226A (zh) * | 2015-01-22 | 2016-08-03 | 应用材料公司 | 批量加热和冷却腔室或负载锁定装置 |
CN105826226B (zh) * | 2015-01-22 | 2020-08-21 | 应用材料公司 | 批量加热和冷却腔室或负载锁定装置 |
US11315806B2 (en) | 2015-01-22 | 2022-04-26 | Applied Materials, Inc. | Batch heating and cooling chamber or loadlock |
KR102444827B1 (ko) * | 2015-01-22 | 2022-09-20 | 어플라이드 머티어리얼스, 인코포레이티드 | 배치 가열 및 냉각 챔버 또는 로드록 |
CN108807312A (zh) * | 2016-08-22 | 2018-11-13 | 漳州龙文区炼盛合信息技术有限公司 | 一种散热装置 |
CN108955080A (zh) * | 2018-06-26 | 2018-12-07 | 武汉华星光电半导体显示技术有限公司 | 一种冷却设备 |
CN108955080B (zh) * | 2018-06-26 | 2020-12-04 | 武汉华星光电半导体显示技术有限公司 | 一种冷却设备 |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION Effective date: 20130419 |
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C41 | Transfer of patent application or patent right or utility model | ||
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Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100176 DAXING, BEIJING |
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TR01 | Transfer of patent right |
Effective date of registration: 20130419 Address after: 100176 No. 18, Wenchang Avenue, Beijing economic and Technological Development Zone, Beijing Patentee after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203, Zhangjiang Road, Shanghai, Shanghai, No. 18, Pudong New Area Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111005 Termination date: 20190323 |