CN111081695B - 一种可堆叠微电子封装结构 - Google Patents
一种可堆叠微电子封装结构 Download PDFInfo
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- CN111081695B CN111081695B CN201911411258.XA CN201911411258A CN111081695B CN 111081695 B CN111081695 B CN 111081695B CN 201911411258 A CN201911411258 A CN 201911411258A CN 111081695 B CN111081695 B CN 111081695B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/165—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
Abstract
Description
Claims (8)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010938076.4A CN111987087B (zh) | 2019-12-31 | 2019-12-31 | 一种可堆叠微电子封装控制方法 |
CN201911411258.XA CN111081695B (zh) | 2019-12-31 | 2019-12-31 | 一种可堆叠微电子封装结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201911411258.XA CN111081695B (zh) | 2019-12-31 | 2019-12-31 | 一种可堆叠微电子封装结构 |
Related Child Applications (1)
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CN202010938076.4A Division CN111987087B (zh) | 2019-12-31 | 2019-12-31 | 一种可堆叠微电子封装控制方法 |
Publications (2)
Publication Number | Publication Date |
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CN111081695A CN111081695A (zh) | 2020-04-28 |
CN111081695B true CN111081695B (zh) | 2020-12-01 |
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CN202010938076.4A Active CN111987087B (zh) | 2019-12-31 | 2019-12-31 | 一种可堆叠微电子封装控制方法 |
CN201911411258.XA Active CN111081695B (zh) | 2019-12-31 | 2019-12-31 | 一种可堆叠微电子封装结构 |
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CN202010938076.4A Active CN111987087B (zh) | 2019-12-31 | 2019-12-31 | 一种可堆叠微电子封装控制方法 |
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CN (2) | CN111987087B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111613613A (zh) * | 2020-06-30 | 2020-09-01 | 青岛歌尔智能传感器有限公司 | 双面封装结构及电子设备 |
US11456272B2 (en) | 2020-09-11 | 2022-09-27 | Western Digital Technologies, Inc. | Straight wirebonding of silicon dies |
CN113410193B (zh) * | 2021-05-27 | 2024-05-03 | 元成科技(苏州)有限公司 | 一种8+1堆叠式芯片封装装置 |
Citations (8)
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US4588342A (en) * | 1982-08-13 | 1986-05-13 | Hitachi Electronics Engineering Co., Ltd. | IC magazine supply system |
US5380681A (en) * | 1994-03-21 | 1995-01-10 | United Microelectronics Corporation | Three-dimensional multichip package and methods of fabricating |
KR20070000729A (ko) * | 2005-06-28 | 2007-01-03 | 주식회사 하이닉스반도체 | 적층형 패키지. |
KR20070049348A (ko) * | 2005-11-08 | 2007-05-11 | 삼성전자주식회사 | 폭 조절용 슬라이딩 판을 갖는 칩 실장 프레임 스택커어셈블리 |
CN202058712U (zh) * | 2011-04-29 | 2011-11-30 | 京隆科技(苏州)有限公司 | 芯片支持框抽放治具 |
KR20140003881A (ko) * | 2012-06-29 | 2014-01-10 | (주) 영호엔지니어링 | 태양전지의 라미네이팅 시스템 |
CN106098653A (zh) * | 2016-08-22 | 2016-11-09 | 王文庆 | 一种多芯片堆叠式的散热装置 |
CN109690761A (zh) * | 2016-10-19 | 2019-04-26 | 美光科技公司 | 具有高效热路径及模制底填充的堆叠式半导体裸片组合件 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
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JP3688312B2 (ja) * | 1994-11-18 | 2005-08-24 | 株式会社日立製作所 | 半導体集積回路装置 |
US5604377A (en) * | 1995-10-10 | 1997-02-18 | International Business Machines Corp. | Semiconductor chip high density packaging |
US5838060A (en) * | 1995-12-12 | 1998-11-17 | Comer; Alan E. | Stacked assemblies of semiconductor packages containing programmable interconnect |
US20060118933A1 (en) * | 2004-12-07 | 2006-06-08 | Tessera, Inc. | Stackable frames for packaging microelectronic devices |
TWI349995B (en) * | 2007-10-16 | 2011-10-01 | Advanced Semiconductor Eng | A tenon-and-mortise packaging structure and manufacturing method of the same |
US8963013B2 (en) * | 2010-12-07 | 2015-02-24 | Masud Beroz | Three dimensional interposer device |
US8390109B2 (en) * | 2011-02-17 | 2013-03-05 | Oracle America, Inc. | Chip package with plank stack of semiconductor dies |
CN106098647B (zh) * | 2016-06-20 | 2018-12-14 | 绍兴杭铭饰品有限公司 | 一种多芯片叠堆式集成电路封装 |
CN110010589B (zh) * | 2018-01-04 | 2022-03-08 | 长鑫存储技术有限公司 | 堆叠型半导体封装方法及封装结构 |
CN108183162A (zh) * | 2018-03-28 | 2018-06-19 | 澳洋集团有限公司 | 一种用于led芯片组件安装的侧向导热安装机构 |
CN208256944U (zh) * | 2018-04-13 | 2018-12-18 | 郴州博太超细石墨股份有限公司 | 石墨烯复合电极 |
CN209150109U (zh) * | 2018-12-19 | 2019-07-23 | 安庆师范大学 | 一种可堆叠微电子封装结构 |
-
2019
- 2019-12-31 CN CN202010938076.4A patent/CN111987087B/zh active Active
- 2019-12-31 CN CN201911411258.XA patent/CN111081695B/zh active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4588342A (en) * | 1982-08-13 | 1986-05-13 | Hitachi Electronics Engineering Co., Ltd. | IC magazine supply system |
US5380681A (en) * | 1994-03-21 | 1995-01-10 | United Microelectronics Corporation | Three-dimensional multichip package and methods of fabricating |
KR20070000729A (ko) * | 2005-06-28 | 2007-01-03 | 주식회사 하이닉스반도체 | 적층형 패키지. |
KR20070049348A (ko) * | 2005-11-08 | 2007-05-11 | 삼성전자주식회사 | 폭 조절용 슬라이딩 판을 갖는 칩 실장 프레임 스택커어셈블리 |
CN202058712U (zh) * | 2011-04-29 | 2011-11-30 | 京隆科技(苏州)有限公司 | 芯片支持框抽放治具 |
KR20140003881A (ko) * | 2012-06-29 | 2014-01-10 | (주) 영호엔지니어링 | 태양전지의 라미네이팅 시스템 |
CN106098653A (zh) * | 2016-08-22 | 2016-11-09 | 王文庆 | 一种多芯片堆叠式的散热装置 |
CN109690761A (zh) * | 2016-10-19 | 2019-04-26 | 美光科技公司 | 具有高效热路径及模制底填充的堆叠式半导体裸片组合件 |
Also Published As
Publication number | Publication date |
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CN111987087B (zh) | 2022-06-03 |
CN111987087A (zh) | 2020-11-24 |
CN111081695A (zh) | 2020-04-28 |
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