CN108801536A - A kind of sheet type high sensitivity pressure sensor - Google Patents

A kind of sheet type high sensitivity pressure sensor Download PDF

Info

Publication number
CN108801536A
CN108801536A CN201810549035.9A CN201810549035A CN108801536A CN 108801536 A CN108801536 A CN 108801536A CN 201810549035 A CN201810549035 A CN 201810549035A CN 108801536 A CN108801536 A CN 108801536A
Authority
CN
China
Prior art keywords
sheet type
pressure sensor
polymer
sialco
potsherds
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201810549035.9A
Other languages
Chinese (zh)
Other versions
CN108801536B (en
Inventor
赵友
赵玉龙
张琪
葛晓慧
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JIANGSU OLIVE SENSORS HIGH-TECH Co.,Ltd.
Original Assignee
Xian Jiaotong University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xian Jiaotong University filed Critical Xian Jiaotong University
Priority to CN201810549035.9A priority Critical patent/CN108801536B/en
Publication of CN108801536A publication Critical patent/CN108801536A/en
Application granted granted Critical
Publication of CN108801536B publication Critical patent/CN108801536B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/02Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning
    • G01L9/06Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning of piezo-resistive devices

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

A kind of sheet type high sensitivity pressure sensor, including polymer SiAlCO potsherds, it the upper surface of polymer SiAlCO potsherds and is closely connect with a piece of sheet type metal electrode separately below, it is connected with metal pins in the other side of sheet type metal electrode, sheet type metal electrode, polymer SiAlCO potsherds and metal pins are encapsulated by the fully wrapped around realization vacuum tightness formula of high molecular polymer encapsulating shell, are only retained two metal pins and are stretched out outside envelope high molecular polymer encapsulating shell;Sheet type high sensitivity pressure sensor is pasted onto the surface of testpieces, and sheet type high sensitivity pressure sensor forms series circuit by metal pins and external stability resistance, and DC voltage is added at the both ends of series circuit;Voltage by measuring polymer SiAlCO potsherds both ends can indicate the variation of ambient pressure;The present invention has the characteristics that reliable simple in structure, principle, high sensitivity and easy to use.

Description

A kind of sheet type high sensitivity pressure sensor
Technical field
The present invention relates to pressure sensor technique field, more particularly to a kind of sheet type high sensitivity pressure sensor.
Background technology
With the development of intelligence manufacture and aerospace cause, more and more industrial productions and automation field need Carry out pressure measurement, pressure measurement especially carried out under the mal-conditions such as high temperature, high pressure, deep-etching, such as aero-engine and Down-hole pressure measurement, component assembly and preload are reliable in rotor blade surface pressure measurement, petroleum industry in gas turbine turntable Property monitoring etc..Due to the complexity and application of application environment have special construction requirement etc., it is often necessary to use patch Chip pressure sensor, and require pressure sensor with small, thickness is thin, the performance characteristics of high sensitivity.
Traditional paster type resistor strain gauge sensitive can be parallel to the pulling force and pressure signal of chip surface, but for Pressure signal perpendicular to chip surface can not measure.Although all types of pressure sensor energy based on elastic deformation structure Enough realize the measurement of pressure signal, but since the presence of elastic deformation structure causes sensor volume itself bigger, it cannot In testpieces surface mount, the normal motor function of limit assay part is understood after pasting reluctantly or influences testpieces surfactant fluid Flowing law.It is formed by pressure in order to measure the flowing of testpieces surfactant fluid but does not influence the stream of testpieces surfactant fluid again Dynamic rule, the method for being typically employed in testpieces surface punching installation pressure sensor at present, this method can effectively solve the problem that shadow The problem of ringing testpieces surfactant fluid flowing law, but the structural intergrity that destroys testpieces itself and to reduce structure strong Degree, be easy to cause the consequence that testpieces is damaged by stress concentration.Therefore, design and research and development can be in the thin of testpieces surface mount Chip pressure sensor has great practical value and wide application prospect.
Invention content
In order to overcome the deficiencies of existing technologies, the purpose of the present invention is to provide a kind of sheet type high sensitivity pressure sensings Device has the characteristics that reliable simple in structure, principle, high sensitivity and easy to use.
In order to achieve the above object, the technical solution that the present invention takes is:
A kind of sheet type high sensitivity pressure sensor, including polymer SiAlCO potsherds 4, polymer SiAlCO ceramics It the upper surface of piece 4 and closely connect with a piece of sheet type metal electrode 3, connects in the other side of sheet type metal electrode 3 separately below Metal pins 5 are connected to, sheet type metal electrode 3, polymer SiAlCO potsherds 4 and metal pins 5 are sealed by high molecular polymer Dress shell 2 is fully wrapped around to realize that vacuum tightness formula encapsulates, and only retains two metal pins 5 and stretches out high molecular polymer encapsulating shell 2。
The lower surface of the sheet type high sensitivity pressure sensor is pasted onto the table of testpieces 6 using high-temperature plastic 8 The pressure from outside P is born in face, upper surface.
The polymer SiAlCO potsherds 4 are a kind of polymerizations obtained by the thermolysis process of polymer precursor Object ceramic material there is piezoresistive effect outstanding, piezoresistance coefficient to be up to 7000~16000, polymer SiAlCO ceramic materials It is fabricated to the thin slice that thickness is 50 μm, resistance change is generated under ambient pressure effect, is used for pressure measurement.
The preparation process of the polymer SiAlCO potsherds (4) is:
1. liquid phase organic siliconresin is with tri-butyl aluminum with 1:5% mass ratio mixing, is stirred using electromagnetism at ambient temperature Mix technical finesse 6 hours;
2. uniformly mixed liquid phase mixture is placed in high temperature oven, carried out 18 hours under 150 DEG C of environment temperature Thermal crosslinking treatment;
3. the material after heat cross-linking to be carried out in 350 DEG C of high purity argon environment to 4 hours heat treatment process;
4. the solids formed after fully crosslinked handles to obtain a diameter of 1 micron of fine granularity powder by ball milling and sieving End;
5. it is 50 μm, a diameter of actually required size that obtained powder, which is fabricated to thickness, by screen printing technique Film;
6. obtained film is pressed into sensor wafer under the pressure effect of 20MPa, then in the pressure of 200MPa Cold isostatic compaction is carried out under power;
7. the chip for passing through cold isostatic compaction in previous step is placed in tube furnace, in 1100 DEG C of high-purity argon compression ring 4 hours are pyrolyzed in border to obtain polymer SiAlCO potsherds 4.
Polymer SiAlCO potsherds 4 are transferred on sheet type metal electrode 3 and are sealed by film transferring technique Dress, obtains sheet type high sensitivity pressure sensor.
The initial resistivity value of the sheet type high sensitivity pressure sensor is R, sheet type high sensitivity pressure sensing Device passes through metal pins 5 and external stability resistance R0Series circuit is formed, DC voltage U is added at the both ends of series circuit0;When Ambient pressure P, which is acted on, causes the resistance value of polymer SiAlCO potsherds 4 to occur on sheet type high sensitivity pressure sensor Variation, the voltage U for further causing 4 both ends of polymer SiAlCO potsherds changes, and voltage U and acts on sheet type Gao Ling Pressure P on sensitivity pressure sensor is linear, and the variation of ambient pressure can be indicated by measuring voltage U.
The sheet type high sensitivity pressure sensor 1 by micro manufacturing technique by being fabricated to sheet type pressure sensing Sheet type array of pressure sensors 7 is pasted onto 6 surface of testpieces by device array 7, right by sheet type array of pressure sensors 7 The situation of change in the measurement reflection flow field of 6 surface pressing P of testpieces.
The present invention has the advantages that compared with prior art:
1, the present invention can on a large scale paste on testpieces surface and the pressure measured perpendicular to testpieces surface is distributed letter Breath has filled up the domestic technological gap in the application field.Existing sheet type strain ga(u)ge can only measure both at home and abroad at present It is parallel to stress, the strain on strain gauge surface, the pressure perpendicular to sheet type strain ga(u)ge surface cannot be measured.Testpieces table The measurement of face normal pressure can only be by beating instrument connection on testpieces surface and will have the installation of large volume of pressure sensor Pressure measurement is carried out in the instrument connection, this method is highly vulnerable to breakage the intensity of testpieces itself and the flow field on testpieces surface The characteristics of motion causes to measure obtained pressure law and actual conditions error is larger.The sheet type pressure sensing of the present invention Device, using SiAlCO ceramic materials positive pressure effect under have the characteristics that obviously piezoresistive effect this, can make At extensive, covering type sensor array, it is affixed directly to testpieces surface and carries out pressure measurement, simple installation does not influence to try Part intensity itself and the surface flow field regularity of distribution are tested, measurement result is accurate and reliable.
2, the present invention uses polymer SiAlCO ceramic materials as sensor sensing resistance, than conventional semiconductors silicon materials Piezoresistance coefficient be higher by 2 to 3 orders of magnitude, therefore the sensitivity of sensor itself can be increased substantially.Polymer SiAlCO Ceramic material not only high temperature resistant, but also there is excellent high-temperature heat engine tool performance, by reasonably selecting high temperature packaging material, no Only sensor can be made to meet pressure measurement demand under normal temperature environment, be tested in high temperature pressures such as oil well pressure, engine pressures It also has a good application prospect in environment.
3, the present invention is suitable for the measurement of a variety of pressure conditions such as gauge pressure and absolute pressure.It is totally-enclosed inside inventive sensor Structure and vacuum state can be used for gauge pressure measurement when sensor is located in standard atmospheric pressure environment;When sensor is being tested Part surface mount becomes an entirety, makes between sensor and testpieces be bonded that there is no air completely, can be used for testing experiment Absolute pressure in part local environment, including negative pressure condition.Need design pressure sensitive compared to conventional absolute pressure sensor The case where film and vacuum cavity configuration could carry out absolute pressure measurement has the advantages that small, thickness is thin, applied widely.
4, array film originally can be fabricated to paste on a large scale on testpieces surface and carry out surface pressure measurement.SiAlCO Ceramic material manufacturing process and many micro manufacturing process compatibles, therefore the present invention has extensive, mass manufacturing capacity, it can It is fabricated to variously-shaped and size, Pasting sheet type pressure sensor battle array by micro manufacturing technique and screen printing technique Row, the testpieces surface large area met in different structure and shape pastes the demand used, and being pasted by large area should Thin-film pressure sensor array can realize the accurate measurement to testpieces surface pressing and flow field, solve conventional pressure biography Sensor is difficult to largely arrange the problem of application on testpieces surface, and tester is contributed to obtain more abundant and accurate flow field letter Breath.
Description of the drawings
Fig. 1 is the structural schematic diagram of the embodiment of the present invention.
Fig. 2 is the measuring circuit schematic diagram of the embodiment of the present invention.
Fig. 3 is the practical application schematic diagram of the embodiment of the present invention.
Specific implementation mode
Invention is further described in detail with reference to the accompanying drawings and examples.
Referring to Figure 1 and Figure 3, a kind of sheet type high sensitivity pressure sensor, including polymer SiAlCO potsherds 4 gather It closes the upper surface of object SiAlCO potsherds 4 and is closely connect with a piece of sheet type metal electrode 3 separately below, in sheet type metal electricity The other side of pole 3 is connected with metal pins 5, and sheet type metal electrode 3, polymer SiAlCO potsherds 4 and metal pins 5 are high 2 fully wrapped around realization vacuum tightness formula of Molecularly Imprinted Polymer encapsulating shell encapsulates, and only retains two metal pins 5 and stretches out envelope polyphosphazene polymer It closes outside object encapsulating shell 2;The lower surface of the sheet type high sensitivity pressure sensor is pasted onto testpieces using high-temperature plastic 8 The pressure from outside P is born in 6 surface, upper surface.
The polymer SiAlCO potsherds 4 are a kind of polymerizations obtained by the thermolysis process of polymer precursor Object ceramic material, specific preparation process are:1. liquid phase organic siliconresin is with tri-butyl aluminum with 1:5% mass ratio mixing, in room It uses electromagnetic agitating technology to handle 6 hours to reach well-mixed purpose under the conditions of temperature, 2. mixes uniformly mixed liquid phase Object is placed in high temperature oven, 18 hours thermal crosslinking treatments is carried out under 150 DEG C of environment temperature, 3. by the material after heat cross-linking 4 hours heat treatment process are carried out in 350 DEG C of high purity argon environment, 4. the fully crosslinked rear solids formed passes through ball Mill and sieving handle to obtain the fine granularity powder of a diameter of 1 microns, 5. by screen printing technique by obtained powder End is fabricated to thickness as 50 μm, the film of a diameter of actually required size, and 6. obtained film is under the pressure effect of 20MPa Be pressed into sensor wafer, cold isostatic compaction then carried out under the pressure of 200MPa, 7. by previous step through supercooling The chip of isostatic pressing is placed in tube furnace, and 4 hours are pyrolyzed in 1100 DEG C of high-purity argon gas environment to obtain polymer 8. obtained polymer SiAlCO potsherds 4 are transferred to sheet type metal by SiAlCO potsherds 4 by film transferring technique It on electrode 3 and is packaged, obtains sheet type high sensitivity pressure sensor.SiAlCO materials have outstanding physics and chemistry Characteristic, with many micro manufacturing process compatibles, with outstanding high-temperature heat engine tool performance, good anti-oxidant and corrosion resistance, Most importantly the ceramic material has piezoresistive effect outstanding, its piezoresistance coefficient is up to 7000~16000 after tested, than tradition The piezoresistance coefficient of silicon semiconductor material is higher by 2 to 3 orders of magnitude.Polymer SiAlCO ceramic materials can be directly in ambient pressure Effect is lower to generate resistance change, and can be fabricated to the thin slice that thickness is 50 μm, is used for pressure measurement.Therefore, very suitable Cooperation is the sensitive resistance of sheet type pressure sensor.
The characteristic that the high molecular polymer encapsulating shell 2 corrodes with high temperature resistant and acid and alkali resistance, such as epoxy resin, Polytetrafluoroethylene (PTFE) etc.;
With reference to Fig. 2, the initial resistivity value of the sheet type high sensitivity pressure sensor is R, and sheet type is highly sensitive Pressure sensor passes through metal pins 5 and external stability resistance R0Series circuit is formed, direct current is added at the both ends of series circuit Voltage U0;Lead to the electricity of polymer SiAlCO potsherds 4 when ambient pressure P is acted on sheet type high sensitivity pressure sensor Resistance value changes, and the voltage U for further causing 4 both ends of polymer SiAlCO potsherds changes, voltage U with act on it is thin Pressure P on chip high sensitivity pressure sensor is linear, and the change of ambient pressure can be indicated by measuring voltage U Change.
With reference to Fig. 3, the sheet type high sensitivity pressure sensor 1 not only can individually be pasted onto 6 surface of testpieces The pressure P of a certain regional area is measured, sheet type array of pressure sensors 7 can also be fabricated to by micro manufacturing technique, it will be thin Chip array of pressure sensors 7 is pasted onto 6 surface of testpieces, is pressed 6 surface of testpieces by sheet type array of pressure sensors 7 The situation of change in the measurement reflection flow field of power P.

Claims (6)

1. a kind of sheet type high sensitivity pressure sensor, it is characterised in that:Including polymer SiAlCO potsherds (4), polymerization It the upper surface of object SiAlCO potsherds (4) and is closely connect with a piece of sheet type metal electrode (3) separately below, in sheet type metal The other side of electrode (3) is connected with metal pins (5), sheet type metal electrode (3), polymer SiAlCO potsherds (4) and gold Belong to pin (5) to be encapsulated by the fully wrapped around realization vacuum tightness formula of high molecular polymer encapsulating shell (2), only retains two metal pins (5) envelope high molecular polymer encapsulating shell (2) is stretched out outside;
The polymer SiAlCO potsherds (4) are a kind of polymer obtained by the thermolysis process of polymer precursor Ceramic material there is piezoresistive effect outstanding, piezoresistance coefficient to be up to 7000~16000, polymer SiAlCO ceramic material systems It is made the thin slice that thickness is 50 μm, resistance change is generated under ambient pressure effect, is used for pressure measurement.
2. a kind of sheet type high sensitivity pressure sensor according to claim 1, it is characterised in that:The sheet type The lower surface of highly sensitive pressure sensor is pasted onto the surface of testpieces (6) using high-temperature plastic (8), and upper surface bears to come from External pressure P.
3. a kind of sheet type high sensitivity pressure sensor according to claim 1, which is characterized in that the polymer The preparation process of SiAlCO potsherds (4) is:
1. liquid phase organic siliconresin is with tri-butyl aluminum with 1:5% mass ratio mixing, uses electromagnetic agitation skill at ambient temperature Art is handled 6 hours;
2. uniformly mixed liquid phase mixture is placed in high temperature oven, 18 hours heat is carried out under 150 DEG C of environment temperature Crosslinking Treatment;
3. the material after heat cross-linking to be carried out in 350 DEG C of high purity argon environment to 4 hours heat treatment process;
4. the solids formed after fully crosslinked handles to obtain a diameter of 1 micron of fine granularity powder by ball milling and sieving;
5. by screen printing technique by obtained powder be fabricated to thickness be 50 μm, a diameter of actually required size it is thin Film;
6. obtained film is pressed into sensor wafer under the pressure effect of 20MPa, then under the pressure of 200MPa Carry out cold isostatic compaction;
7. the chip for passing through cold isostatic compaction in previous step is placed in tube furnace, in 1100 DEG C of high-purity argon gas environment 4 hours are pyrolyzed to obtain polymer SiAlCO potsherds (4).
4. a kind of sheet type high sensitivity pressure sensor according to claim 3, which is characterized in that shifted by film Polymer SiAlCO potsherds (4) are transferred on sheet type metal electrode (3) and are packaged by technology, obtain sheet type Gao Ling Sensitivity pressure sensor.
5. a kind of sheet type high sensitivity pressure sensor according to claim 1, it is characterised in that:The sheet type The initial resistivity value of highly sensitive pressure sensor is R, and sheet type high sensitivity pressure sensor is by metal pins (5) and outside Portion fixed resistance R0Series circuit is formed, DC voltage U is added at the both ends of series circuit0;When ambient pressure P acts on thin slice Cause the resistance value of polymer SiAlCO potsherds (4) to change on formula high sensitivity pressure sensor, further causes poly- The voltage U for closing object SiAlCO potsherds (4) both ends changes, and voltage U and acts on sheet type high sensitivity pressure sensor On pressure P it is linear, can indicate the variation of ambient pressure by measuring voltage U.
6. a kind of sheet type high sensitivity pressure sensor according to claim 1, it is characterised in that:The sheet type Highly sensitive pressure sensor (1) is fabricated to sheet type array of pressure sensors (7) by micro manufacturing technique, by sheet type pressure Sensor array (7) is pasted onto testpieces (6) surface, is pressed testpieces (6) surface by sheet type array of pressure sensors (7) The situation of change in the measurement reflection flow field of power P.
CN201810549035.9A 2018-05-31 2018-05-31 Slice type high-sensitivity pressure sensor Active CN108801536B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810549035.9A CN108801536B (en) 2018-05-31 2018-05-31 Slice type high-sensitivity pressure sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810549035.9A CN108801536B (en) 2018-05-31 2018-05-31 Slice type high-sensitivity pressure sensor

Publications (2)

Publication Number Publication Date
CN108801536A true CN108801536A (en) 2018-11-13
CN108801536B CN108801536B (en) 2020-05-15

Family

ID=64089749

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810549035.9A Active CN108801536B (en) 2018-05-31 2018-05-31 Slice type high-sensitivity pressure sensor

Country Status (1)

Country Link
CN (1) CN108801536B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109678519A (en) * 2018-12-13 2019-04-26 西南交通大学 A kind of high-temp pressure sensor based on polymer precursor ceramics
CN111906592A (en) * 2020-07-02 2020-11-10 西安交通大学 Cutting force and cutting temperature measuring device and preparation and temperature compensation method thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102924020A (en) * 2012-10-26 2013-02-13 青岛理工大学 Piezoresistance/piezoelectric composite material, manufacturing method of material, sensor utilizing material and manufacturing method of sensor
CN104535253A (en) * 2015-01-19 2015-04-22 北京大学 High temperature pressure sensor and process method thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102924020A (en) * 2012-10-26 2013-02-13 青岛理工大学 Piezoresistance/piezoelectric composite material, manufacturing method of material, sensor utilizing material and manufacturing method of sensor
CN104535253A (en) * 2015-01-19 2015-04-22 北京大学 High temperature pressure sensor and process method thereof

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
YEJIE CAO ETC.: "Giant piezoresistivity in polymer-derived amorphous SiAlCO ceramics", 《J MATER SCI》 *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109678519A (en) * 2018-12-13 2019-04-26 西南交通大学 A kind of high-temp pressure sensor based on polymer precursor ceramics
CN109678519B (en) * 2018-12-13 2021-09-07 西南交通大学 High-temperature pressure sensor based on polymer precursor ceramic
CN111906592A (en) * 2020-07-02 2020-11-10 西安交通大学 Cutting force and cutting temperature measuring device and preparation and temperature compensation method thereof
CN111906592B (en) * 2020-07-02 2021-11-19 西安交通大学 Cutting force and cutting temperature measuring device and preparation and temperature compensation method thereof

Also Published As

Publication number Publication date
CN108801536B (en) 2020-05-15

Similar Documents

Publication Publication Date Title
CN106895924B (en) Flexible temperature and pressure sensor
CN108801536A (en) A kind of sheet type high sensitivity pressure sensor
CN107436205A (en) Temperature-compensating graphene pressure sensor in a kind of piece
CN111337083A (en) High-temperature graphene pressure/temperature integrated sensor
WO2022120990A1 (en) Dew point sensor
CN206891622U (en) A kind of ceramic capacitive pressure sensors
CN200989838Y (en) Pressure sensor
Ikegami et al. Thick-film thermistor and its applications
Huang et al. Flexible Porous Carbon Black-Polymer Composites with a High Gauge Factor.
CN108663154B (en) Flexible wearable air pressure sensor, preparation method and application thereof
CN207197705U (en) Temperature-compensating graphene pressure sensor in a kind of piece
CN104729768A (en) Pressure sensor
CN108872314A (en) A kind of piezo-electric type hydrogen gas sensor and its preparation method and application
Prasad et al. A low-power, micromachined, double spiral hotplate for MEMS gas sensors
CN208588778U (en) A kind of electric-field sensor based on electrostriction effect
CN106813814B (en) A kind of pressure sensor based on MEMS terminal type microwave power detector structure
CN110498387A (en) A kind of the MEMS pressure sensor preparation method and its sensor of two-way strain
CN207280367U (en) Mesh sensor
CN110174209A (en) Media-isolated pressure sensor
CN112985653B (en) Pressure sensor's chip package unit and pressure sensor
CN204718722U (en) A kind of pressure transducer
Xie et al. The sintering process and vibration characteristics for leadless package structure of pressure sensors
CN104167269A (en) Quick-response temperature-sensitive chip and manufacturing method thereof
CN201772965U (en) Soi engine oil pressure sensor
Zhang et al. Silicon strain gages bonded on stainless steel using glass frit for strain sensor applications

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20220208

Address after: No. 158, Xiangyuan Road, high tech Industrial Development Zone, Yangzhou, Jiangsu 225000

Patentee after: JIANGSU OLIVE SENSORS HIGH-TECH Co.,Ltd.

Address before: Beilin District Xianning West Road 710049, Shaanxi city of Xi'an province No. 28

Patentee before: XI'AN JIAOTONG University