CN108698165B - 激光加工装置 - Google Patents

激光加工装置 Download PDF

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Publication number
CN108698165B
CN108698165B CN201780011198.5A CN201780011198A CN108698165B CN 108698165 B CN108698165 B CN 108698165B CN 201780011198 A CN201780011198 A CN 201780011198A CN 108698165 B CN108698165 B CN 108698165B
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China
Prior art keywords
laser
processing path
laser pulse
pulse
light source
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CN201780011198.5A
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Chinese (zh)
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CN108698165A (zh
Inventor
奥平恭之
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Sumitomo Heavy Industries Ltd
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Sumitomo Heavy Industries Ltd
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Publication of CN108698165A publication Critical patent/CN108698165A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
CN201780011198.5A 2016-03-09 2017-03-06 激光加工装置 Active CN108698165B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016-045341 2016-03-09
JP2016045341A JP2017159317A (ja) 2016-03-09 2016-03-09 レーザ加工装置
PCT/JP2017/008647 WO2017154800A1 (ja) 2016-03-09 2017-03-06 レーザ加工装置

Publications (2)

Publication Number Publication Date
CN108698165A CN108698165A (zh) 2018-10-23
CN108698165B true CN108698165B (zh) 2020-06-26

Family

ID=59790559

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780011198.5A Active CN108698165B (zh) 2016-03-09 2017-03-06 激光加工装置

Country Status (5)

Country Link
JP (1) JP2017159317A (ja)
KR (1) KR20180122605A (ja)
CN (1) CN108698165B (ja)
TW (1) TWI658892B (ja)
WO (1) WO2017154800A1 (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7125254B2 (ja) * 2017-10-12 2022-08-24 ビアメカニクス株式会社 レーザ加工装置及びレーザ加工方法
JP7190808B2 (ja) * 2017-11-08 2022-12-16 住友重機械工業株式会社 レーザ加工装置及びレーザ加工方法
JP7043128B2 (ja) * 2018-01-31 2022-03-29 住友重機械工業株式会社 レーザ制御装置及びレーザ加工方法
JP2020151736A (ja) * 2019-03-19 2020-09-24 住友重機械工業株式会社 レーザ制御装置及びパルスレーザ出力装置
JP7262410B2 (ja) * 2020-03-11 2023-04-21 住友重機械工業株式会社 加工順決定装置、レーザ加工装置、及びレーザ加工方法
JP2023007738A (ja) 2021-07-02 2023-01-19 住友重機械工業株式会社 レーザ制御装置及びレーザパルス切出し方法
CN115519243B (zh) * 2022-11-25 2023-03-21 武汉铱科赛科技有限公司 一种激光脉冲时空相关定位扫描方法、装置及系统

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1195591A (zh) * 1997-03-21 1998-10-14 住友重机械工业株式会社 激光加工设备
CN101172318A (zh) * 2006-11-02 2008-05-07 株式会社迪思科 激光加工装置
CN101266926B (zh) * 2007-01-24 2010-04-21 索尼株式会社 激光绘图方法和设备
JP2012106266A (ja) * 2010-11-18 2012-06-07 Sumitomo Heavy Ind Ltd レーザ加工方法及びレーザ加工装置
JP5638054B2 (ja) * 2007-01-26 2014-12-10 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド 材料加工のためのパルス列を生成する方法及びシステム
JP2015186822A (ja) * 2014-03-27 2015-10-29 住友重機械工業株式会社 レーザ加工装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7521651B2 (en) * 2003-09-12 2009-04-21 Orbotech Ltd Multiple beam micro-machining system and method
JP2010158691A (ja) * 2009-01-07 2010-07-22 Disco Abrasive Syst Ltd レーザー加工装置
TWM417976U (en) * 2011-07-13 2011-12-11 Chun-Hao Li Laser machining table
JP6415357B2 (ja) * 2015-03-06 2018-10-31 住友重機械工業株式会社 レーザ加工装置
TWM510208U (zh) * 2015-06-02 2015-10-11 E&R Engineering Corp 雷射加工裝置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1195591A (zh) * 1997-03-21 1998-10-14 住友重机械工业株式会社 激光加工设备
CN101172318A (zh) * 2006-11-02 2008-05-07 株式会社迪思科 激光加工装置
CN101266926B (zh) * 2007-01-24 2010-04-21 索尼株式会社 激光绘图方法和设备
JP5638054B2 (ja) * 2007-01-26 2014-12-10 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド 材料加工のためのパルス列を生成する方法及びシステム
JP2012106266A (ja) * 2010-11-18 2012-06-07 Sumitomo Heavy Ind Ltd レーザ加工方法及びレーザ加工装置
JP2015186822A (ja) * 2014-03-27 2015-10-29 住友重機械工業株式会社 レーザ加工装置

Also Published As

Publication number Publication date
CN108698165A (zh) 2018-10-23
TW201731617A (zh) 2017-09-16
WO2017154800A1 (ja) 2017-09-14
TWI658892B (zh) 2019-05-11
KR20180122605A (ko) 2018-11-13
JP2017159317A (ja) 2017-09-14

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