CN108655945B - 一种基于波形匹配的石英晶片研磨控制系统 - Google Patents
一种基于波形匹配的石英晶片研磨控制系统 Download PDFInfo
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- CN108655945B CN108655945B CN201810502283.8A CN201810502283A CN108655945B CN 108655945 B CN108655945 B CN 108655945B CN 201810502283 A CN201810502283 A CN 201810502283A CN 108655945 B CN108655945 B CN 108655945B
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- 238000000227 grinding Methods 0.000 title claims abstract description 68
- 239000010453 quartz Substances 0.000 title claims abstract description 62
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 62
- 238000005259 measurement Methods 0.000 claims abstract description 143
- 238000000034 method Methods 0.000 claims abstract description 131
- 230000008569 process Effects 0.000 claims abstract description 92
- 230000002159 abnormal effect Effects 0.000 claims abstract description 20
- 239000004576 sand Substances 0.000 claims abstract description 18
- 238000012544 monitoring process Methods 0.000 claims abstract description 14
- 238000012360 testing method Methods 0.000 claims description 46
- 238000012545 processing Methods 0.000 claims description 29
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- 241000208340 Araliaceae Species 0.000 claims 1
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- 235000003140 Panax quinquefolius Nutrition 0.000 claims 1
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- 238000004519 manufacturing process Methods 0.000 abstract description 16
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R23/00—Arrangements for measuring frequencies; Arrangements for analysing frequency spectra
- G01R23/02—Arrangements for measuring frequency, e.g. pulse repetition rate; Arrangements for measuring period of current or voltage
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Numerical Control (AREA)
Abstract
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CN201810502283.8A CN108655945B (zh) | 2016-01-22 | 2016-01-22 | 一种基于波形匹配的石英晶片研磨控制系统 |
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CN201810502283.8A CN108655945B (zh) | 2016-01-22 | 2016-01-22 | 一种基于波形匹配的石英晶片研磨控制系统 |
CN201610045507.8A CN105666310B (zh) | 2016-01-22 | 2016-01-22 | 一种基于波形匹配方法的石英晶片研磨控制方法 |
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CN201610045507.8A Active CN105666310B (zh) | 2016-01-22 | 2016-01-22 | 一种基于波形匹配方法的石英晶片研磨控制方法 |
CN201810502299.9A Active CN108710025B (zh) | 2016-01-22 | 2016-01-22 | 基于波形匹配的石英晶片研磨控制与测频方法 |
CN201810502284.2A Active CN108614153B (zh) | 2016-01-22 | 2016-01-22 | 基于波形匹配的石英晶片研磨控制方法 |
CN201810502283.8A Active CN108655945B (zh) | 2016-01-22 | 2016-01-22 | 一种基于波形匹配的石英晶片研磨控制系统 |
CN201810500285.3A Active CN108705442B (zh) | 2016-01-22 | 2016-01-22 | 基于波形优化匹配的石英晶片研磨控制方法 |
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CN201810502299.9A Active CN108710025B (zh) | 2016-01-22 | 2016-01-22 | 基于波形匹配的石英晶片研磨控制与测频方法 |
CN201810502284.2A Active CN108614153B (zh) | 2016-01-22 | 2016-01-22 | 基于波形匹配的石英晶片研磨控制方法 |
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Families Citing this family (9)
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CN106771580B (zh) * | 2016-12-23 | 2019-07-12 | 浙江大学台州研究院 | 基于惯性导航机制的石英晶片在线研磨的测控方法 |
CN106644053B (zh) * | 2016-12-23 | 2019-06-07 | 浙江大学台州研究院 | 石英晶片研磨在线测频的自动搜索方法 |
CN116852253A (zh) * | 2017-12-19 | 2023-10-10 | 浙江大学台州研究院 | 一种高可靠的研磨机关停控制装置 |
CN109495117B (zh) * | 2018-12-18 | 2021-08-24 | 北京品驰医疗设备有限公司 | 无线能量传输频率校准方法及装置 |
CN111230724B (zh) * | 2019-03-27 | 2021-06-15 | 浙江大学台州研究院 | 石英晶片谐振频率的整盘频率补偿和整盘散差统计方法 |
CN110076646A (zh) * | 2019-06-04 | 2019-08-02 | 马鞍山荣泰科技有限公司 | 一种石英晶片研磨测频装置 |
CN118671439A (zh) * | 2019-07-08 | 2024-09-20 | 浙江大学台州研究院 | 阻抗匹配的石英晶片抛光研磨在线测频系统 |
CN111693770B (zh) * | 2020-06-05 | 2023-02-03 | 中国人民解放军63921部队 | 一种用于测控站/测量船的上行频率扫描方法 |
US20240045399A1 (en) * | 2022-05-17 | 2024-02-08 | Applied Materials, Inc. | Analysis of multi-run cyclic processing procedures |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0463676A (ja) * | 1990-06-29 | 1992-02-28 | Nippon Dempa Kogyo Co Ltd | 圧電体の研磨制御装置 |
JP2001246559A (ja) * | 2000-03-02 | 2001-09-11 | Inst Of Physical & Chemical Res | 水晶素板加工装置と機上での水晶素板の共振周波数測定制御方法 |
JP2002190628A (ja) * | 2000-12-22 | 2002-07-05 | Daishinku Corp | 圧電体の研磨装置及び圧電体の研磨方法 |
CN102339744A (zh) * | 2010-07-23 | 2012-02-01 | 苏州普锐晶科技有限公司 | 一种超高频晶片的抛光方法 |
CN203390714U (zh) * | 2013-06-28 | 2014-01-15 | 苏州奇盟晶体材料制品有限公司 | 一种晶片研磨装置 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1167730A (en) * | 1959-09-18 | 1969-10-22 | Gen Electric & English Elect | Improvements in or relating to apparatus for giving an indication of the frequency of an oscillatory signal |
US5136817A (en) * | 1990-02-28 | 1992-08-11 | Nihon Dempa Kogyo Co., Ltd. | Automatic lapping apparatus for piezoelectric materials |
CN1192238C (zh) * | 2000-11-29 | 2005-03-09 | 友讯科技股份有限公司 | 用以检测石英振荡器频率的测试器 |
JP2004328122A (ja) * | 2003-04-22 | 2004-11-18 | Atokku:Kk | 水晶振動子およびその製造方法 |
US7394326B2 (en) * | 2004-03-30 | 2008-07-01 | Citizen Holdings Co., Ltd. | Quartz oscillator manufacturing method and quartz oscillator |
JP2012121130A (ja) * | 2010-11-18 | 2012-06-28 | Nagatsu Precision Mold Co Ltd | 研磨装置 |
JP2012205258A (ja) * | 2011-03-28 | 2012-10-22 | Seiko Instruments Inc | 研磨方法、圧電振動片の製造方法、圧電振動子、発振器、電子機器及び電波時計 |
CN202330603U (zh) * | 2011-12-12 | 2012-07-11 | 王慧斌 | 石英晶体器件工艺优化测试平台 |
US9201156B2 (en) * | 2012-03-29 | 2015-12-01 | Chevron U.S.A. Inc. | System and method for measurement incorporating a crystal resonator |
CN103001627B (zh) * | 2012-11-22 | 2015-12-09 | 北京信息科技大学 | 石英晶体谐振频率微调控制系统 |
CN103063292B (zh) * | 2012-12-10 | 2015-12-02 | 中国飞机强度研究所 | 一种压电晶片谐振频率测定方法 |
CN103056114B (zh) * | 2013-02-01 | 2015-04-01 | 浙江大学台州研究院 | 石英晶片厚度分选机及分选方法 |
CN103128451B (zh) * | 2013-02-28 | 2015-04-22 | 莆田学院 | 一种利用超快激光进行石英晶体调频的方法及其设备 |
CN104215326B (zh) * | 2013-06-03 | 2016-08-17 | 西北核技术研究所 | 基于晶体谐振器的光功率参数测量方法和装置 |
KR101389532B1 (ko) * | 2013-12-19 | 2014-04-25 | 주식회사 케이씨텍 | 화학 기계적 연마 장비의 웨이퍼 막두께 측정 방법 |
CN103698639B (zh) * | 2013-12-27 | 2016-06-22 | 广东大普通信技术有限公司 | 晶体振荡器波形参数自动测量系统和方法 |
CN204008918U (zh) * | 2014-08-06 | 2014-12-10 | 廊坊中电熊猫晶体科技有限公司 | 温度补偿石英晶体振荡器的室温频率测试系统 |
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2016
- 2016-01-22 CN CN201610045507.8A patent/CN105666310B/zh active Active
- 2016-01-22 CN CN201810502299.9A patent/CN108710025B/zh active Active
- 2016-01-22 CN CN201810502284.2A patent/CN108614153B/zh active Active
- 2016-01-22 CN CN201810502283.8A patent/CN108655945B/zh active Active
- 2016-01-22 CN CN201810500285.3A patent/CN108705442B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0463676A (ja) * | 1990-06-29 | 1992-02-28 | Nippon Dempa Kogyo Co Ltd | 圧電体の研磨制御装置 |
JP2001246559A (ja) * | 2000-03-02 | 2001-09-11 | Inst Of Physical & Chemical Res | 水晶素板加工装置と機上での水晶素板の共振周波数測定制御方法 |
JP2002190628A (ja) * | 2000-12-22 | 2002-07-05 | Daishinku Corp | 圧電体の研磨装置及び圧電体の研磨方法 |
CN102339744A (zh) * | 2010-07-23 | 2012-02-01 | 苏州普锐晶科技有限公司 | 一种超高频晶片的抛光方法 |
CN203390714U (zh) * | 2013-06-28 | 2014-01-15 | 苏州奇盟晶体材料制品有限公司 | 一种晶片研磨装置 |
Also Published As
Publication number | Publication date |
---|---|
CN108705442A (zh) | 2018-10-26 |
CN108710025A (zh) | 2018-10-26 |
CN108705442B (zh) | 2019-10-18 |
CN108614153B (zh) | 2020-07-07 |
CN108614153A (zh) | 2018-10-02 |
CN105666310A (zh) | 2016-06-15 |
CN108655945A (zh) | 2018-10-16 |
CN105666310B (zh) | 2018-07-06 |
CN108710025B (zh) | 2020-06-09 |
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Address after: 317600 cross border e-commerce Industrial Park of Yichang in Yuhuan mechanical and electrical industry functional zone, Taizhou City, Zhejiang Province (Yuhuan automobile parts industry innovation service complex building) Patentee after: RESEARCH INSTITUTE OF ZHEJIANG University TAIZHOU Address before: 318001 No.618, west section of Shifu Avenue, Taizhou City, Zhejiang Province Patentee before: RESEARCH INSTITUTE OF ZHEJIANG University TAIZHOU |
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Application publication date: 20181016 Assignee: Hangzhou liangchuang Technology Consulting Co.,Ltd. Assignor: RESEARCH INSTITUTE OF ZHEJIANG University TAIZHOU Contract record no.: X2022980017450 Denomination of invention: A Control System for Grinding Quartz Wafer Based on Waveform Matching Granted publication date: 20191018 License type: Common License Record date: 20221006 |
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Application publication date: 20181016 Assignee: Jiaxing Dingshan Information Technology Co.,Ltd. Assignor: RESEARCH INSTITUTE OF ZHEJIANG University TAIZHOU Contract record no.: X2022980017866 Denomination of invention: A Control System for Grinding Quartz Wafer Based on Waveform Matching Granted publication date: 20191018 License type: Common License Record date: 20221010 Application publication date: 20181016 Assignee: Jiaxing Juteng Information Technology Co.,Ltd. Assignor: RESEARCH INSTITUTE OF ZHEJIANG University TAIZHOU Contract record no.: X2022980017734 Denomination of invention: A Control System for Grinding Quartz Wafer Based on Waveform Matching Granted publication date: 20191018 License type: Common License Record date: 20221009 |
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Application publication date: 20181016 Assignee: Taizhou Zhike Feichuang Technology Co.,Ltd. Assignor: RESEARCH INSTITUTE OF ZHEJIANG University TAIZHOU Contract record no.: X2022980021547 Denomination of invention: A Control System for Grinding Quartz Wafer Based on Waveform Matching Granted publication date: 20191018 License type: Common License Record date: 20221114 |
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Application publication date: 20181016 Assignee: Taizhou cloud makes intelligent technology Ltd. Assignor: RESEARCH INSTITUTE OF ZHEJIANG University TAIZHOU Contract record no.: X2023980039510 Denomination of invention: A quartz wafer grinding control system based on waveform matching Granted publication date: 20191018 License type: Common License Record date: 20230814 |