CN108640683A - 一种纳米复合热电材料及其制备方法 - Google Patents
一种纳米复合热电材料及其制备方法 Download PDFInfo
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- CN108640683A CN108640683A CN201810299879.2A CN201810299879A CN108640683A CN 108640683 A CN108640683 A CN 108640683A CN 201810299879 A CN201810299879 A CN 201810299879A CN 108640683 A CN108640683 A CN 108640683A
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Abstract
Description
实施例1 | 实施例2 | 实施例3 | 对比例1 | 对比例2 | 对比例3 | 对比例4 | 对比例5 | |
电导率(104 Sm-1) | 11.5 | 10.4 | 10.1 | 8.3 | 9.2 | 8.6 | 9.7 | 9.4 |
Z(10-6K-1) | 552 | 533 | 512 | 452 | 481 | 441 | 465 | 472 |
断裂强度(Mpa) | 423 | 412 | 396 | 368 | 386 | 374 | 354 | 402 |
Claims (10)
Priority Applications (2)
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CN201810299879.2A CN108640683B (zh) | 2018-04-04 | 2018-04-04 | 一种纳米复合热电材料的制备方法 |
CN201910253459.5A CN109776093B (zh) | 2018-04-04 | 2018-04-04 | 纳米复合热电材料的制备方法 |
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CN201810299879.2A CN108640683B (zh) | 2018-04-04 | 2018-04-04 | 一种纳米复合热电材料的制备方法 |
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CN201910253459.5A Active CN109776093B (zh) | 2018-04-04 | 2018-04-04 | 纳米复合热电材料的制备方法 |
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Cited By (1)
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CN113013315A (zh) * | 2021-02-05 | 2021-06-22 | 西安交通大学 | N型银硫属化合物热电材料的制备方法及其多孔块体 |
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CN114345524A (zh) * | 2022-01-06 | 2022-04-15 | 南昌工程学院 | 一种纳米复合热电材料的改进型制备方法 |
Citations (3)
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JP2006167857A (ja) * | 2004-12-15 | 2006-06-29 | Ishikawajima Harima Heavy Ind Co Ltd | 微細ワイヤ及びその製造方法 |
JP2007081087A (ja) * | 2005-09-14 | 2007-03-29 | Ishikawajima Harima Heavy Ind Co Ltd | 微細ワイヤの製造方法及び微細ワイヤ |
CN103909264A (zh) * | 2013-06-07 | 2014-07-09 | 武汉理工大学 | 一种具有纳米孔结构的高性能Cu2Se块体热电材料及其快速制备方法 |
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JP3092463B2 (ja) * | 1994-10-11 | 2000-09-25 | ヤマハ株式会社 | 熱電材料及び熱電変換素子 |
CN103400932B (zh) * | 2008-08-29 | 2016-08-10 | Lg化学株式会社 | 新型热电转换材料及其制备方法,以及使用该新型热电转换材料的热电转换元件 |
KR101608887B1 (ko) * | 2009-04-17 | 2016-04-05 | 삼성전자주식회사 | 인버터와 그 제조방법 및 인버터를 포함하는 논리회로 |
WO2012071287A1 (en) * | 2010-11-22 | 2012-05-31 | E. I. Du Pont De Nemours And Company | Inks and processes to make a chalcogen-containing semiconductor |
CN102674842A (zh) * | 2012-05-14 | 2012-09-19 | 北京科技大学 | 一种Cu-S-Se三元热电材料及制备方法 |
CN103043629A (zh) * | 2012-12-19 | 2013-04-17 | 中国科学院合肥物质科学研究院 | 一种CuGaX2(X=S, Se, Te)系列化合物的低温合成方法 |
CN105503187B (zh) * | 2015-12-03 | 2018-02-27 | 清华大学深圳研究生院 | LaCuSeO热电化合物的制备方法 |
CN106276818B (zh) * | 2016-07-21 | 2019-01-29 | 苏州大学 | 双金属硫族三元半导体纳米颗粒及其制备方法 |
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2018
- 2018-04-04 CN CN201810299879.2A patent/CN108640683B/zh active Active
- 2018-04-04 CN CN201910253459.5A patent/CN109776093B/zh active Active
Patent Citations (3)
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JP2006167857A (ja) * | 2004-12-15 | 2006-06-29 | Ishikawajima Harima Heavy Ind Co Ltd | 微細ワイヤ及びその製造方法 |
JP2007081087A (ja) * | 2005-09-14 | 2007-03-29 | Ishikawajima Harima Heavy Ind Co Ltd | 微細ワイヤの製造方法及び微細ワイヤ |
CN103909264A (zh) * | 2013-06-07 | 2014-07-09 | 武汉理工大学 | 一种具有纳米孔结构的高性能Cu2Se块体热电材料及其快速制备方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113013315A (zh) * | 2021-02-05 | 2021-06-22 | 西安交通大学 | N型银硫属化合物热电材料的制备方法及其多孔块体 |
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CN109776093A (zh) | 2019-05-21 |
CN108640683B (zh) | 2019-07-05 |
CN109776093B (zh) | 2021-07-27 |
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