CN108633177B - 印刷布线板 - Google Patents

印刷布线板 Download PDF

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CN108633177B
CN108633177B CN201810240773.5A CN201810240773A CN108633177B CN 108633177 B CN108633177 B CN 108633177B CN 201810240773 A CN201810240773 A CN 201810240773A CN 108633177 B CN108633177 B CN 108633177B
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opening
hole
wiring board
printed wiring
substrate
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CN108633177A (zh
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日比野敏明
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Ibiden Co Ltd
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    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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Abstract

本发明涉及印刷布线板，目的在于提供具备可靠性高的通孔导体的印刷布线板。在芯基板(30)的构成贯通孔(24)的第1开口(24F)与第2开口(24S)的接合处形成中央缩径部(24C)。由于在贯通孔(24)的大致中央部分形成了中央缩径部(24C)，因而在电镀时在中央部分不容易残留空孔，将贯通孔(24)进行电镀填充而成的通孔导体(36)的可靠性高。

Description

印刷布线板
技术领域
本发明涉及具备在贯通孔中进行电镀填充而成的通孔导体的印刷布线板。
背景技术
在专利文献1中公开了一种印刷布线板，在该印刷布线板中，从两面向芯基板照射激光，形成孔径自两表面侧朝向中心减小的中央缩径形状的贯通孔，在该贯通孔中进行电镀填充，形成通孔导体。
现有技术文献
专利文献
专利文献1：日本特开2012-69926号公报
发明内容
[专利文献1的课题]
在专利文献1中，从两面向芯基板照射激光，形成孔径自两表面侧朝向中心减小的中央缩径形状的贯通孔，在该贯通孔中通过电镀填充来形成通孔导体时，据信在贯通孔内的中央缩径部分不容易残留空孔(ボイド)。但是，在为了减薄印刷布线板的厚度而使芯基板的厚度为100μm以下时，即使从两面照射激光，也会成为中央无缩径的单纯圆筒形状的贯通孔。因此据信在贯通孔内的中央部分容易残留空孔。
解决课题的手段
本发明的印刷布线板具备在贯通孔中进行电镀填充而成的通孔导体，该贯通孔形成于具有第1面以及与第1面相反的一侧的第2面的基板。并且，上述基板的厚度为30μm以上、100μm以下；上述贯通孔由第1开口和第2开口构成，所述第1开口被设为口径自上述第1面侧朝向上述第2面减小的锥形，所述第2开口与上述第1开口相连，被设为口径自上述第2面侧朝向上述第1面减小的锥形；上述第1开口的中心线与上述第2开口的中心线错开上述基板的厚度以下的距离。
[实施方式的效果]
根据本发明的实施方式，在构成通孔用贯通孔的自第1面侧朝向第2面的第1开口、以及自第2面侧朝向第1面的第2开口中，第1开口的中心线与第2开口的中心线错开基板的厚度以下的距离。因此，即使基板的厚度为100μm以下，也能够将第1开口设为口径自第1面侧朝向第2面减小的锥形，将第2开口设为口径自第2面侧朝向第1面减小的锥形，在中央形成缩径部分。因此，在由第1开口和第2开口构成的贯通孔中进行电镀填充时，在中央部分不容易残留空孔，通孔导体的可靠性高。
附图说明
图1中，(A)是本发明第1实施方式的印刷布线板的截面图，(B)是第2实施方式的印刷布线板的截面图，(C)是贯通孔的说明图。
图2是第1实施方式的印刷布线板的制造流程图。
图3是第1实施方式的印刷布线板的制造流程图。
具体实施方式
[第1实施方式]
图1(A)是第1实施方式的印刷布线板的截面图。
印刷布线板10具有芯基板30，该芯基板30具备第1面F以及与第1面相反的一侧的第2面S。构成芯基板30的绝缘基板20由包含无机颗粒的树脂和增强材料形成。芯基板30在第1面F侧形成第1导体层34F，在第2面S侧形成第2导体层34S。第1导体层34F和第2导体层34S藉由通孔(スルーホール)导体36进行连接，该通孔导体36是在形成于芯基板30的贯通孔24中进行电镀填充而成的。印刷布线板在芯基板30的第1面F上和第2面S上设有累积层。即，在芯基板30的第1面F上和第1导体层34F上形成上侧的树脂绝缘层50F。在上侧的树脂绝缘层50F上形成上侧的导体层58F。第1导体层34F和上侧的导体层58F藉由贯穿上侧的树脂绝缘层50F的通路(ビア)导体60F进行连接。在上侧的树脂绝缘层50F和上侧的导体层58F上形成具备开口71F的阻焊层70F。自开口71F露出的上侧的导体层58F具有用于搭载IC芯片等电子部件的上侧的焊盘73F。在芯基板30的第2面S上和第2导体层34S上形成下侧的树脂绝缘层50S。在下侧的树脂绝缘层50S上形成下侧的导体层58S。第2导体层34S与下侧的导体层58S藉由贯穿下侧的树脂绝缘层50S的通路导体60S进行连接。在下侧的树脂绝缘层50S和下侧的导体层58S上形成具备开口71S的阻焊层70S。自开口71S露出的下侧的导体层58S具有用于与母板等电路基板连接的下侧的焊盘73S。上侧的树脂绝缘层50F和下侧的树脂绝缘层50S不具备芯材。
芯基板30的贯通孔24由第1开口24F和第2开口24S构成，所述第1开口24F被设为口径自第1面F侧朝向第2面S减小的锥形，所述第2开口24S与第1开口24F相连，被设为口径自第2面S侧朝向第1面F减小的锥形。贯通孔24在第1开口24F与第2开口24S的接合处形成了中央缩径部24C。在第1实施方式中，由于在贯通孔24的大致中央部分形成中央缩径部24C，因而在电镀时在中央部分不容易残留空孔，将贯通孔24进行电镀填充而成的通孔导体36的可靠性高。
第1开口24F的中心线f1与第2开口24S的中心线s1错开构成芯基板30的绝缘基板20的厚度T以下的距离d。距离d优选为绝缘基板20的厚度T的1/20以上。进而特别优选距离d为绝缘基板20的厚度T的1/10以上。绝缘基板20的厚度T为100μm以下、30μm以上。若厚度超过100μm，则在不错开第1开口24F的中心线f1与第2开口24S的中心线s1的情况下通过从绝缘基板的两面照射激光就能够将第1开口24F、第2开口24S设为锥形。另一方面，绝缘基板20的厚度T不足30μm的情况下，即使错开第1开口24F的中心线f1与第2开口24S的中心线s1并从两面照射激光来形成第1开口24F、第2开口24S，也会成为中央无缩径的单纯圆筒形状的贯通孔。
[第1实施方式的制造方法]
第1实施方式的印刷布线板10的制造方法如图2、图3所示。
准备图2(A)所示的起始基板。起始基板20z由具有第1面F以及与第1面相反的一侧的第2面S的绝缘基板20、层叠于绝缘基板20的第1面F的第1铜箔22F、以及层叠于绝缘基板20的第2面S的第2铜箔22S形成。绝缘基板20的厚度T为100μm以下、30μm以上。在本例中为80μm。绝缘基板20由树脂和增强部件形成。绝缘基板20也可以具有无机颗粒。绝缘基板20的树脂的示例为环氧树脂或BT(双马来酰亚胺三嗪)树脂。绝缘基板20的增强部件的示例为玻璃布或芳族聚酰胺纤维。绝缘基板20的无机颗粒的示例为二氧化硅或氧化铝。
如图2(B)所示，对第1铜箔22F照射CO2激光。在绝缘基板的第1面F侧形成第1开口24F。第1开口24F自第1面朝向第2面S呈锥形。按照形成锥形的方式来设定激光的条件。激光的条件为照射次数(ショット数)、脉冲宽度、输出功率等。可以使第2次照射的照射径小于第1次照射的照射径。
如图2(C)所示，向第2铜箔22S照射CO2激光。在绝缘基板的第2面S侧形成第2开口24S。第2开口24S自第2面S朝向第1面F呈锥形。按照形成锥形的方式来设定激光的条件。激光的条件为照射次数、脉冲宽度、输出功率等。可以使第2次照射的照射径小于第1次照射的照射径。由第1开口24F和第2开口24S形成贯通孔24。在第1开口和第2开口的接合处形成接合面24P。接合面如图1(C)所示。在图1(C)中的接合面描绘斜线，接合面24P的外周构成中央缩径部24C。第1开口24F按照中心线f1相对于绝缘基板20垂直的方式来形成。第2开口24S按照中心线s1相对于绝缘基板20垂直的方式来形成。此处，第1开口、第2开口是按照相对于绝缘基板20垂直的方式形成的，但也可以倾斜地形成。第1开口、第2开口倾斜的情况下，第1开口24F的中心线f1与第2开口24S的中心线s1的距离d是指两中心线最接近的最小间隔处的距离。
通过在第1铜箔22F和第2铜箔22S、贯通孔24的侧壁上进行无电解电镀处理而形成无电解电镀膜26(图2(D))。将无电解电镀膜26作为种子层，在种子层上形成电解电镀膜32(图2(E))。在电解电镀膜上形成耐蚀层28(图2(F))。自耐蚀层露出的电解电镀膜32与无电解电镀膜26、铜箔22F、22S利用蚀刻除去。除去耐蚀层，完成芯基板30(图3(A))。如图1(A)所示，在贯通孔24形成通孔导体36。同时形成包含通孔导体的焊盘(ランド)在内的第1导体层34F、第2导体层34S。第1开口24F的中心线f1与第2开口24S的中心线s1错开绝缘基板20的厚度T以下的距离d。因此，在100μm以下的厚度的绝缘基板20的第1开口24F与第2开口24S的接合处形成中央缩径部24C。在第1实施方式中，由于在贯通孔24的大致中央部分形成中央缩径部24C，因而在电镀时在中央部分不容易残留空孔，将贯通孔24进行电镀填充而成的通孔导体36的可靠性高。另外，贯通孔24的通过第1开口24F的中心线f1与第2开口24S的中心线s1的截面的形状为K字状。
在芯基板30的第1面F上形成上侧的树脂绝缘层50F，在第2面S上形成下侧的树脂绝缘层50S(图3(B))。上侧的树脂绝缘层50F、下侧的树脂绝缘层50S由包含不具备芯材的颗粒的树脂构成。作为树脂，可以举出环氧树脂、BT(双马来酰亚胺三嗪)树脂等。颗粒包含二氧化硅等无机颗粒与环氧树脂等热固化性树脂。利用CO2气体激光在上侧的树脂绝缘层50F中形成通向第1导体层34F的开口51F，在下侧的树脂绝缘层50S中形成通向第2导体层34S的开口51S(图3(C))。
在上侧的树脂绝缘层50F上和开口51F的内壁、下侧的树脂绝缘层50S和开口51S的内壁形成无电解镀铜膜52，在无电解镀铜膜52上形成抗镀层(未图示)。在自抗镀层露出的无电解镀铜膜52上形成电解镀铜膜54。此时，开口51F、51S利用电解镀铜膜54填充。在开口51F形成连接至第1导体层34F的通路导体60F，在开口51S形成连接至第2导体层34S的通路导体60S。除去抗镀层。除去未形成电解镀铜膜54的无电解镀铜膜52，形成上侧的导体层58F、下侧的导体层58S(图3(D))。
在上侧的树脂绝缘层50F和上侧的导体层58F上形成具备开口71F的阻焊层70F，在下侧的树脂绝缘层50S和下侧的导体层58S上形成具备开口71S的阻焊层70S，完成印刷布线板10(图1(A))。
[第2实施方式]
图1(B)为第2实施方式的印刷布线板的截面图。
印刷布线板110是将具备截面为K字形状的通孔导体36的芯基板30A、30B、30C层叠而成的。在第2实施方式的印刷布线板中，芯基板30A、30B、30C的厚度T2也为100μm以下、30μm以上。在本例中为60μm。各芯基板的贯通孔24中，第1开口24F的中心线f2与第2开口24S的中心线s2错开构成芯基板30的绝缘基板20的厚度T2以下的距离d2。绝缘基板20的贯通孔24由第1开口24F和第2开口24S构成，第1开口24F设为口径自第1面F侧朝向第2面S减小的锥形，第2开口24S与第1开口24F相连，设为口径自第2面S侧朝向第1面F减小的锥形。在贯通孔24，在第1开口24F与第2开口24S的接合处形成了中央缩径部24C。在第2实施方式的印刷布线板110中，由于在贯通孔24的大致中央部分形成了中央缩径部24C，因而在电镀时在中央部分不容易残留空孔，将贯通孔24进行电镀填充而成的通孔导体36的可靠性高。
符号说明
20 绝缘基板
24 贯通孔
24F 第1开口
24S 第2开口
30 芯基板
36 通孔导体
50F 上侧的树脂绝缘层
50S 下侧的树脂绝缘层
58F 上侧的导体层
58S 下侧的导体层

Claims (3)

1.一种印刷布线板，其具备在贯通孔中进行电镀填充而成的通孔导体，该贯通孔形成于具有第1面以及与第1面相反的一侧的第2面的基板；其中，
所述基板的厚度为30μm以上、100μm以下；
所述贯通孔由第1开口和第2开口构成，所述第1开口被设为口径自所述第1面侧朝向所述第2面减小的锥形，所述第2开口与所述第1开口相连，被设为口径自所述第2面侧朝向所述第1面减小的锥形；
所述第1开口的中心线与所述第2开口的中心线错开所述基板的厚度以下的距离；
所述贯通孔的通过所述第1开口的中心线与所述第2开口的中心线的截面的形状为K字状。
2.如权利要求1的印刷布线板，其中，在所述基板的所述第1面上和所述第2面上设有累积层。
3.如权利要求1的印刷布线板，其中，所述印刷布线板中层叠有多个所述基板。
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