CN108627756B - Circuit board test system, circuit board test method and circuit board installation device - Google Patents
Circuit board test system, circuit board test method and circuit board installation device Download PDFInfo
- Publication number
- CN108627756B CN108627756B CN201710224444.7A CN201710224444A CN108627756B CN 108627756 B CN108627756 B CN 108627756B CN 201710224444 A CN201710224444 A CN 201710224444A CN 108627756 B CN108627756 B CN 108627756B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- clamping
- displacement
- substrate
- test
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 167
- 238000009434 installation Methods 0.000 title description 2
- 238000010998 test method Methods 0.000 title description 2
- 230000003139 buffering effect Effects 0.000 claims abstract description 5
- 238000006073 displacement reaction Methods 0.000 claims description 138
- 239000000758 substrate Substances 0.000 claims description 137
- 230000007246 mechanism Effects 0.000 claims description 86
- 238000000034 method Methods 0.000 claims description 13
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000007689 inspection Methods 0.000 description 6
- 239000000523 sample Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
- G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Tests Of Electronic Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Abstract
A circuit board testing system comprises a testing device, a buffer carrying platform, two clamping tools, a pick-and-place device and one or more controllers. The testing device is provided with a testing carrier. The buffering carrying platform is positioned outside the testing device. The clamping tools are respectively placed on the test carrier and the buffer carrier and are respectively configured to clamp the two circuit boards. The test device is configured to test a circuit board placed over a test stage. The pick-and-place device comprises two pick-and-place modules. Each pick-and-place module is configured to move between the test carrier and the buffer carrier and is configured to grab or place one of the clamping tools. The one or more controllers are configured to drive the pick-and-place module to exchange the placement position of the clamping tool after the testing device tests the circuit board placed above the test stage. Therefore, the test period of the circuit board can be effectively reduced.
Description
Technical Field
The invention relates to a circuit board testing system, a circuit board testing method and a circuit board mounting device.
Background
Generally, in order to inspect the electrical conductivity of the circuit on the printed circuit board (abbreviated as pcb), a testing apparatus is used to perform a test by contacting the inspection probe with the contact point on the pcb. During testing, the circuit board is fixed on a carrying platform in the testing device. Then, the inspection probe is extended downward to the circuit board and brought into contact with the contact of the circuit board, thereby inspecting whether or not the electrical conduction has been made.
However, the aforementioned test apparatus may sometimes fail to perform the inspection stably with a sufficiently high accuracy. For example, when inspecting a flexible printed circuit board, the center portion of the flexible printed circuit board may sag due to gravity, so that it cannot be maintained in a flat state all the time. For this reason, when such a flexible circuit board is inspected by a test apparatus, the inspection probe may not reliably come into contact with the contact of the flexible circuit board. Even when the testing apparatus is equipped with a precision inspection probe having high positioning accuracy, the precision inspection probe is easily damaged due to the deflection or deformation of the flexible circuit board exceeding its physical tolerance.
In addition, the conventional testing device only has one carrier, so that a user needs to wait for the completion of the test to take away the tested circuit board before putting the next circuit board for continuous testing, and the testing period of the circuit board is longer.
Disclosure of Invention
In view of the above, an objective of the present invention is to provide a circuit board testing system and method capable of effectively reducing the testing period of a circuit board, and a circuit board mounting apparatus capable of improving the testing accuracy.
To achieve the above objective, according to one embodiment of the present invention, a circuit board testing system includes a testing device, a buffer stage, two clamping tools, a pick-and-place device, and one or more controllers. The testing device is provided with a testing carrier. The buffering carrying platform is positioned outside the testing device. The clamping tools are respectively placed on the test carrier and the buffer carrier and are respectively configured to clamp the two circuit boards. The test device is configured to test a circuit board placed over a test stage. The pick-and-place device comprises two pick-and-place modules. Each pick-and-place module is configured to move between the test carrier and the buffer carrier and is configured to grab or place one of the clamping tools. The one or more controllers are configured to drive the pick-and-place module to exchange the placement position of the clamping tool after the testing device tests the circuit board placed above the test stage.
In one or more embodiments of the present invention, each of the pick-and-place modules includes a rail, a moving member, and a pick-and-place unit. The track extends between the test stage and the buffer stage. The moving member is slidably engaged with the rail. The pick-and-place unit is connected with the moving part and is configured to pick up or place one of the clamping tools.
In order to achieve the above object, according to an embodiment of the present invention, a method for testing a circuit board includes: placing the clamping tool with the circuit board clamped on a test platform deck of the test device; providing another clamping tool for clamping another circuit board on a buffer carrying platform outside the testing device; testing the circuit board placed above the test loading platform by using the testing device; after the test apparatus tests the circuit board placed above the test stage, the placement positions of the holding tools are exchanged.
In one or more embodiments of the present invention, the step of placing another clamping tool with another circuit board on the buffer carrier includes: placing another clamping tool on the buffering carrying platform; and clamping the other circuit board on the other clamping tool.
In one or more embodiments of the present invention, the step of placing another holding tool holding another circuit board on the buffer stage is performed during the testing of the circuit board placed on the test stage by the testing device.
To achieve the above object, according to one embodiment of the present invention, a circuit board mounting apparatus includes a clamping tool. The clamping tool comprises a first base body and a plurality of clamping mechanisms. The clamping mechanisms respectively comprise a fixed substrate, a displacement assembly, a clamping head, at least one first elastic piece and at least one second elastic piece. The fixed base plate is detachably fixed on the first seat body. The displacement assembly is slidably disposed on the fixed substrate along a first direction. The clamping head is arranged on the displacement assembly and is configured to move towards or away from the displacement assembly. The first elastic piece is connected with the fixed substrate and the displacement assembly and is configured to drive the displacement assembly to move outwards relative to the first seat body based on the fixed substrate. The second elastic piece is connected with the displacement assembly and the clamping head and is configured to drive the clamping head to abut against the displacement assembly.
In one or more embodiments of the present invention, the circuit board mounting apparatus further includes an unlocking device, which includes a second base and a plurality of unlocking mechanisms. The second seat is configured to be disposed under the clamping tool. The unlocking mechanism is fixed on the second seat body and respectively corresponds to the clamping mechanisms. Each unlocking mechanism comprises a pushing component. The pushing component is configured to push the corresponding clamping head so as to enable the corresponding clamping head to leave the corresponding displacement component.
In one or more embodiments of the present invention, the first base is a frame and has a plurality of corners. The clamping mechanisms are respectively arranged adjacent to the corners.
In one or more embodiments of the present invention, the displacement assembly includes a first displacement substrate, a second displacement substrate, and a third elastic element. The first displacement substrate is slidably disposed on the fixed substrate. The first elastic element is connected with the fixed substrate and the first displacement substrate. The second displacement substrate is slidably disposed on the first displacement substrate along a second direction. The clamping head is arranged on the second displacement substrate. The second elastic piece is connected with the second displacement substrate and the clamping head. The third elastic element is connected with the first displacement substrate and the second displacement substrate and is configured to drive the second displacement substrate to move outwards relative to the first seat body based on the first displacement substrate.
In one or more embodiments of the present invention, each of the unlocking mechanisms further includes a first abutting block and a second abutting block. The first pushing block is configured to push the corresponding first displacement substrate, so that the corresponding first displacement substrate moves inwards relative to the first seat body based on the corresponding fixed substrate. The second pushing block is configured to push the corresponding second displacement substrate, so that the corresponding second displacement substrate moves inwards relative to the first seat body based on the corresponding first displacement substrate.
In one or more embodiments of the present invention, the first elastic element is configured to make the first displacement substrate move substantially away from one of the other clamping mechanisms relative to the fixed substrate. The third elastic element is configured to enable the second displacement substrate to move towards and away from the other clamping mechanism substantially relative to the first displacement substrate.
In one or more embodiments of the present invention, the fixed substrate has at least one guiding block. The first displacement substrate has at least one guiding groove. The guide block is slidably engaged in the guide groove. The first elastic piece is connected between the guide block and one end of the guide groove.
In one or more embodiments of the present invention, the first displacement substrate has at least one guiding block. The second displacement substrate has at least one guiding groove. The guide block is slidably engaged in the guide groove. The third elastic piece is connected between the guide block and one end of the guide groove.
In one or more embodiments of the present invention, the second displacement substrate includes a plate body, a linkage plate and a fourth elastic element. The plate body is slidably arranged on the first displacement substrate. The third elastic element is connected with the first displacement substrate and the plate body. The linkage plate is slidably arranged on the plate body along a first direction. The clamping head is arranged on the linkage plate. The fourth elastic element is connected with the plate body and the linkage plate and is configured to drive the linkage plate to move inwards based on the plate body relative to the fixed substrate.
In one or more embodiments of the present invention, each of the unlocking mechanisms further includes a third abutting block. The third pushing block is configured to push the corresponding linkage plate, so that the corresponding linkage plate moves outwards relative to the first seat body based on the corresponding plate body.
In one or more embodiments of the present invention, the pushing assembly includes a moving substrate, a guide rod, a fixing element, and a spring. The moving substrate is configured to move toward or away from the corresponding clamping head and has a first surface and a second surface opposite to each other. The guide rod is slidably arranged through the first surface and the second surface and is provided with a first end and a second end. The first end is configured to abut against the first surface. The fixing piece is connected with the second end and is configured to push against the corresponding clamping head. The spring is sleeved outside the guide rod and configured to drive the fixing piece to move away from the second surface, so that the first end is configured to abut against the first surface.
In one or more embodiments of the present invention, the fixing member includes a fixing block and a roller. The fixed block is connected with the second end. The roller is pivoted with the fixing block and is configured to push against the corresponding clamping head.
In one or more embodiments of the present invention, each of the unlocking devices further includes a cylinder module. The cylinder module has a cylinder rod. The pushing component is arranged on the cylinder rod.
In summary, according to the circuit board testing system and the circuit board testing method of the present invention, the clamping tool with the circuit board clamped thereon can be placed on the testing stage in the testing apparatus for testing. During the testing of the testing device, the user can clamp another circuit board on another clamping tool in advance on a buffer carrier outside the testing device. Therefore, after the test device completes the test, the placing position of the clamping tool can be quickly exchanged by using the pick-and-place device, so that the test device can immediately detect the next circuit board, and the test period of the circuit board is effectively reduced. In addition, according to the clamping tool of the circuit board mounting device, after the clamping head is abutted to the displacement assembly to clamp the circuit board, the elastic piece is utilized to drive the displacement assembly to move outwards relative to the first base body based on the fixed base plate, so that the circuit board is expanded outwards to ensure that the circuit board keeps a plane state, and the test accuracy can be further improved. According to the unlocking device of the circuit board mounting device, the pushing block can be used for pushing the displacement assembly to enable the circuit board to be restored to the non-expanded state, and the pushing assembly is used for pushing the clamping head to leave the displacement assembly to release the circuit board. Therefore, the circuit board mounting device completes the mounting and unlocking of the circuit board in a purely mechanical mode, can save complex wiring and is suitable for being matched with the circuit board testing system and the circuit board testing method.
The invention is described in detail below with reference to the drawings and specific examples, but the invention is not limited thereto.
Drawings
FIG. 1 is a perspective view of a circuit board testing system according to an embodiment of the present invention;
FIG. 2 is a circuit diagram showing a part of the components of the circuit board testing system according to one embodiment of the present invention;
FIG. 3 is a flow chart showing a circuit board testing method according to an embodiment of the invention;
FIG. 4 is a perspective view showing a circuit board mounting apparatus according to an embodiment of the present invention;
FIG. 5 is a perspective view showing the clamping tool of FIG. 4;
FIG. 6 is a perspective view showing the unlocking device of FIG. 4;
FIG. 7 is a perspective view of a portion of one of the clamping mechanisms of FIG. 5;
FIG. 8 is a perspective view showing a portion of one of the unlocking mechanisms of FIG. 6;
FIG. 9A is a front view of a set of clamping mechanism and unlocking mechanism of one embodiment of the present invention, wherein the unlocking mechanism has not unlocked the clamping mechanism;
FIG. 9B is a top view showing all the components in FIG. 9A;
FIG. 10A is a front view of a set of clamping mechanism and unlocking mechanism showing the clamping mechanism unlocked by the unlocking mechanism in accordance with one embodiment of the present invention;
fig. 10B is a top view showing all the components in fig. 10A.
Wherein the reference numerals
100: circuit board test system
110: testing device
111: test carrying platform
120: buffering carrying platform
130: clamping tool
131: first seat body
132: clamping mechanism
132 a: fixed substrate
132a1, 132b 12: guide block
132 b: displacement assembly
132b 1: first displacement substrate
132b11, 132b 22: guide groove
132b 2: second displacement substrate
132b 21: plate body
132b 23: linkage board
132b 24: fourth elastic member
132b 25: clamping bottom plate
132b 26: stop block
132b 3: third elastic member
132 c: clamping head
132 d: lifting bottom plate
132 e: second elastic member
132 f: first elastic member
140: taking and placing module
141: track
142: moving part
143: pick-and-place unit
150: controller
160: unlocking device
161: second seat body
162: unlocking mechanism
162 a: push-against component
162a 1: moving substrate
162a 11: first surface
162a 12: second surface
162a 2: guide rod
162a 21: first end
162a 22: second end
162a 3: fixing piece
162a 31: fixed block
162a 32: roller wheel
162a 4: spring
162 b: first pushing block
162 c: second pushing block
162 d: third pushing block
163: cylinder module
163 a: cylinder rod
S101 to S105: step (ii) of
Detailed Description
In the following description, for purposes of explanation, numerous implementation details are set forth in order to provide a thorough understanding of the various embodiments of the present invention. It should be understood, however, that these implementation details are not to be interpreted as limiting the invention. That is, in some embodiments of the invention, such implementation details are not necessary. In addition, some conventional structures and elements are shown in simplified schematic form in the drawings.
Please refer to fig. 1 and fig. 2. Fig. 1 is a perspective view illustrating a circuit board testing system 100 according to an embodiment of the invention. Fig. 2 is a circuit diagram showing a part of the components of the circuit board testing system 100 according to an embodiment of the invention. As shown in fig. 1 and fig. 2, in the present embodiment, the circuit board testing system 100 includes a testing apparatus 110, a buffer stage 120, two clamping tools 130, a pick-and-place apparatus, and one or more controllers 150 (only one is exemplarily shown in fig. 2). The test apparatus 110 has a test stage 111. The buffer carrier 120 is located outside the testing device 110. The clamping tools 130 are respectively disposed on the test stage 111 and the buffer stage 120, and are respectively configured to clamp two circuit boards. The testing apparatus 110 is configured to test a circuit board placed over a test stage 111. The specific components of testing apparatus 110 for testing circuit boards are not described in detail herein. The pick-and-place device comprises two pick-and-place modules 140. Each pick-and-place module 140 is configured to move between the test stage 111 and the buffer stage 120, and configured to pick or place one of the holding tools 130. The one or more controllers 150 are configured to drive the pick-and-place module 140 to exchange the placement positions of the clamping tools 130 after the testing device 110 tests the circuit board placed on the test stage 111.
Specifically, each pick-and-place module 140 includes a rail 141, a moving member 142, and a pick-and-place unit 143. The rail 141 extends between the test stage 111 and the buffer stage 120. The moving member 142 slidably engages the rail 141. The pick-and-place unit 143 is connected to the moving member 142 and configured to pick up or place one of the holding tools 130.
In some embodiments, the moving member 142 can be implemented by using a servo motor with a linear slide rail or other alternative ways, which is forbidden.
In some embodiments, the pick-and-place unit 143 may be formed by a lifting rod or a multi-axis robot, but the invention is not limited thereto.
In some embodiments, the pick-and-place unit 143 may pick or place the clamping tool 130 by using a mechanical clamping jaw or an absorption method, but the invention is not limited thereto. Further, the aforementioned suction method may include a magnetic suction method (e.g., using an electromagnet to suck a magnetic conductive element disposed on the clamping tool 130) and an air suction method (e.g., using a suction cup or vacuum pumping).
Fig. 3 is a flow chart showing a circuit board testing method according to an embodiment of the invention. The circuit board testing method of the present embodiment can be used in combination with the circuit board testing system 100 shown in fig. 1. The circuit board testing method comprises steps S101 to S105.
In step S101, the clamping tool 130 holding the circuit board is placed on the test stage 111 of the test apparatus 110.
In step S102, the testing device 110 is used to test a circuit board placed on the testing stage 111.
In step S103, another clamping tool 130 is placed on the buffer stage 120 outside the testing device 110.
In step S104, another circuit board is clamped on another clamping tool 130. In the present embodiment, the step S104 is executed after the step S103, but the invention is not limited thereto. Since the buffer carrier 120 is located outside the testing device 110 and close to the user, the user can easily place another clamping tool 130. In the present embodiment, step S103 and step S104 are performed during step S102, but the invention is not limited thereto.
In step S105, after the testing device 110 tests the circuit board placed on the test stage 111, the placing positions of the clamping tools 130 are exchanged.
As can be seen from the above configuration and operation steps, the clamping tool 130 holding a circuit board can be placed on the test stage 111 in the testing apparatus 110 for testing. During testing of the testing device 110, a user may clamp another circuit board on another clamping tool 130 in advance on the buffer stage 120 outside the testing device 110. Therefore, after the testing device 110 completes the testing, the pick-and-place device can be used to quickly exchange the placement positions of the holding tools 130, so that the testing device 110 can immediately detect another circuit board on another holding tool 130, thereby effectively reducing the testing cycle of the circuit board.
Please refer to fig. 4 to 6. Fig. 4 is a perspective view illustrating a circuit board mounting device according to an embodiment of the present invention. Fig. 5 is a perspective view illustrating the clamping tool 130 of fig. 4. Fig. 6 is a perspective view showing the unlocking device 160 in fig. 4. As shown in fig. 4 to 6, in the present embodiment, the circuit board mounting apparatus includes a clamping tool 130 and an unlocking apparatus 160. The clamping tool 130 includes a first base 131 and four clamping mechanisms 132 (only one is exemplarily shown in fig. 4). The first base 131 is a frame and has four corners. The clamping mechanisms 132 are respectively disposed adjacent to the corners. The unlocking device 160 includes a second seat 161 and four unlocking mechanisms 162 (only one is exemplarily shown in fig. 4). The second seat 161 is configured to be disposed under the clamping tool 130. Specifically, the first base 131 can be carried on the buffer stage 120, and the second base 161 is disposed under the buffer stage 120. The unlocking mechanisms 162 are fixed on the second seat 161 and respectively correspond to the clamping mechanisms 132. In practical applications, the number of the clamping mechanisms 132, the number of the corners of the first base 131, and the number of the unlocking mechanisms 162 included in the unlocking device 160 of the clamping tool 130 are not limited to the present embodiment. The structure and function of the components included in the clamping mechanism 132 and the unlocking mechanism 162, as well as the connection and seating relationship between the components, will be described in detail below.
Please refer to fig. 7, fig. 9A and fig. 9B. Fig. 7 is a partial perspective view of one of the clamping mechanisms 132 shown in fig. 5. Specifically, fig. 7 illustrates the upper right clamping mechanism 132 of fig. 5 as an example. Fig. 9A is a front view illustrating a set of clamping mechanism 132 and unlocking mechanism 162 according to an embodiment of the invention, wherein the unlocking mechanism 162 has not unlocked the clamping mechanism 132. Fig. 9B is a top view showing all the components in fig. 9A. In the present embodiment, each of the clamping mechanisms 132 includes a fixed substrate 132a, a displacement assembly 132b, a clamping head 132c, a second elastic member 132e (refer to fig. 9A), and four first elastic members 132f (fig. 7 only illustrates one of the first elastic members by way of example). In practical applications, the number of the first elastic members 132f is not limited in this embodiment. The fixed base 132a is detachably fixed to the first housing 131 (see fig. 5). The displacement assembly 132b is slidably disposed on the fixed base plate 132a along the first direction a 1. The gripping head 132c is disposed on the displacement assembly 132b and is configured to move toward or away from the displacement assembly 132 b. The first elastic element 132f is connected to the fixed substrate 132a and the displacement element 132b, and configured to drive the displacement element 132b to move outwards relative to the first base 131 based on the fixed substrate 132a (refer to fig. 5). The second elastic member 132e connects the displacement assembly 132b and the clamping head 132c, and is configured to urge the clamping head 132c to abut against the displacement assembly 132 b.
In detail, in the present embodiment, the displacement assembly 132b includes a first displacement substrate 132b1, a second displacement substrate 132b2, and four third elastic elements 132b3 (only one is exemplarily shown in fig. 7). In practical applications, the number of the third elastic members 132b3 is not limited in this embodiment. The first displacement substrate 132b1 is slidably disposed on the fixed substrate 132 a. The first elastic element 132f connects the fixed substrate 132a and the first displacement substrate 132b 1. The second displacement substrate 132b2 is slidably disposed on the first displacement substrate 132b1 along the second direction a 2. The clamping head 132c is disposed on the second displacement substrate 132b 2. The second elastic member 132e connects the second displacement base 132b2 and the clamping head 132 c. The third elastic element 132b3 connects the first displacement substrate 132b1 and the second displacement substrate 132b2, and is configured to drive the second displacement substrate 132b2 to move outward along the second direction a2 based on the first displacement substrate 132b1 relative to the first housing 131 (refer to fig. 5).
Referring to fig. 5, in the present embodiment, the first elastic element 132f is configured to make the first displacement substrate 132b1 move substantially away from one of the other clamping mechanisms 132 (i.e., move away from the lower right clamping mechanism 132 in fig. 5) relative to the fixed substrate 132 a. The third resilient member 132b3 is configured to urge the second displacement substrate 132b2 to move substantially away from the other of the other clamping mechanisms 132 (i.e., away from the upper left clamping mechanism 132 in fig. 5) relative to the first displacement substrate 132b 1.
In the present embodiment, the fixed substrate 132a has four guiding blocks 132a1 (fig. 7 only shows one exemplary). The first displacement substrate 132b1 has four guide grooves 132b11 (only one is exemplarily shown in fig. 7). The guide block 132a1 is slidably engaged in the guide groove 132b 11. The first elastic element 132f is connected between the guiding block 132a1 and one end of the guiding slot 132b11, so as to drive the first movable substrate 132b1 to move outwards along the first direction a1 based on the fixed substrate 132a relative to the first seat 131. In practical applications, the number of the guiding blocks 132a1 and the guiding slots 132b11 is not limited by the present embodiment.
In the present embodiment, the first displacement substrate 132b1 has four guiding blocks 132b12 (fig. 7 only shows one exemplary). The second displacement substrate 132b2 has four guide grooves 132b22 (only one is exemplarily shown in fig. 7). The guide block 132b12 is slidably engaged in the guide groove 132b 22. The third elastic element 132b3 is connected between the guiding block 132b12 and one end of the guiding slot 132b22, so as to drive the second displacement substrate 132b2 to move outwards along the second direction a2 based on the first displacement substrate 132b1 relative to the first seat 131. In practical applications, the number of the guiding blocks 132b12 and the guiding slots 132b22 is not limited by the present embodiment.
Further, the second displacement substrate 132b2 includes a plate body 132b21, a linking plate 132b23, a fourth elastic member 132b24, a clamping bottom plate 132b25, and a stopper 132b 26. The plate 132b21 is slidably disposed on the first displacement substrate 132b 1. The guide groove 132b22 is disposed on the plate 132b 21. The third elastic member 132b3 connects the first shift substrate 132b1 and the plate 132b 21. The linkage plate 132b23 is slidably disposed on the plate body 132b21 along the first direction a 1. The holding head 132c is disposed on the linking plate 132b 23. The clamping base 132b25 is fixed to the plate 132b21 and configured to be abutted by the clamping head 132 c. The clamping mechanism 132 also includes a lift base 132 d. The lifting bottom plate 132d passes through the linking plate 132b23 to connect to the clamping head 132c, and the second elastic element 132e is compressed between the linking plate 132b23 and the lifting bottom plate 132d, so as to drive the clamping head 132c to clamp toward the clamping bottom plate 132b 25. The stopper 132b26 is fixed to the plate 132b 21. The fourth elastic member 132b24 connects the plate body 132b21 and the linking plate 132b23, and is configured to drive the linking plate 132b23 to move inward along the first direction a1 relative to the fixed substrate 132a based on the plate body 132b 21. Specifically, the fourth elastic element 132b24 is compressed between the stopper 132b26 and the linking plate 132b23 on the plate 132b21, so as to drive the linking plate 132b23 to move away from the stopper 132b26 and abut against the lifting bottom plate 132d (refer to fig. 9A).
Please refer to fig. 8, 10A and 10B. Fig. 8 is a partial perspective view of one of the unlocking mechanisms 162 shown in fig. 6. Specifically, fig. 8 illustrates the upper right unlocking mechanism 162 in fig. 5. Fig. 10A is a front view showing a set of clamping mechanism 132 and unlocking mechanism 162 according to an embodiment of the present invention, wherein the unlocking mechanism 162 unlocks the clamping mechanism 132. Fig. 10B is a top view showing all the components in fig. 10A. In the present embodiment, each unlocking device 160 further includes a cylinder module 163. The cylinder block 163 has a cylinder rod 163 a. The unlocking mechanism 162 includes a push-against component 162 a. The pushing assembly 162a is disposed on the cylinder rod 163a and configured to push the corresponding clamping head 132c (the clamping head 132c is driven by pushing the lifting bottom plate 132 d), so that the corresponding clamping head 132c is away from the clamping bottom plate 132b25 on the second displacement substrate 132b2 of the corresponding displacement assembly 132 b.
In detail, referring to fig. 8, 9A and 10A, the pushing assembly 162a includes a moving substrate 162a1, a guide bar 162a2, a fixing member 162a3 and a spring 162a 4. The moving substrate 162a1 is configured to move toward or away from the corresponding gripper head 132c and has a first surface 162a11 and a second surface 162a12 opposite thereto. The guide bar 162a2 slidably passes through the first surface 162a11 and the second surface 162a12, and has a first end 162a21 and a second end 162a 22. The first end 162a21 has a larger head and is therefore configured to abut the first surface 162a 11. The fastener 162a3 is connected to the second end 162a22 and is configured to push against the corresponding clamp head 132c (the clamp head 132c is driven by pushing against the lifting bottom plate 132 d). The spring 162a4 is disposed outside the guide bar 162a2 and configured to urge the fastener 162a3 away from the second surface 162a12 such that the first end 162a21 is configured to abut against the first surface 162a 11.
As shown in fig. 8, the unlocking mechanism 162 further includes a first abutting block 162b and a second abutting block 162 c. The first abutting block 162b and the second abutting block 162c are respectively connected to the movable substrate 162a1 of the abutting assembly 162 a. The first pushing block 162B is configured to push the corresponding first displacement substrate 132B1, so that the corresponding first displacement substrate 132B1 moves inwards along the first direction a1 based on the corresponding fixed substrate 132a relative to the first seat 131 (refer to fig. 10B). The second pushing block 162c is configured to push the corresponding second displacement substrate 132B2, so that the corresponding second displacement substrate 132B2 moves inwards along the second direction a2 based on the corresponding first displacement substrate 132B1 relative to the first seat 131 (refer to fig. 10B).
As shown in fig. 8, the unlocking mechanism 162 further includes a third abutting block 162 d. The third abutting block 162d is connected to the movable substrate 162a1 of the abutting assembly 162 a. The third pushing block 162d is configured to push the corresponding linking plate 132B23, so that the corresponding linking plate 132B23 moves outwards along the first direction a1 based on the plate body 132B21 of the corresponding second displacement substrate 132B2 relative to the first seat 131 (refer to fig. 5 and 10B).
Referring to fig. 8, 9A and 10A, the fixing member 162a3 includes a fixing block 162a31 and a roller 162a 32. A securing block 162a31 is coupled to second end 162a 22. The roller 162a32 pivots the fixed block 162a31 and is configured to push against the corresponding clamping head 132 c. Thereby, even if the lifting bottom plate 132d moves along the first direction a1 along with the linking plate 132b23 during the period that the roller 162a32 pushes against the lifting bottom plate 132d, the roller 162a32 can eliminate the friction force with the lifting bottom plate 132 d.
According to the above-mentioned configuration, when the circuit board is to be mounted, the unlocking mechanism 162 can be used to unlock the clamping mechanism 132, so that the clamping head 132c is separated from the clamping base plate 132b 25. Specifically, the cylinder module 163 can drive the cylinder rod 163a to extend to move toward the clamping mechanism 132, so as to drive the pushing component 162a to push the clamping head 132c (to drive the clamping head 132c by pushing the lifting bottom plate 132 d) to leave the clamping bottom plate 132B25, drive the first pushing block 162B to push the first displacement substrate 132B1 to move inward along the first direction a1 relative to the first seat 131, drive the second pushing block 162c to push the second displacement substrate 132B2 to move inward along the second direction a2 relative to the first seat 131, and drive the third pushing block 162d to push the linking plate 132B23 to move outward along the first direction a1 relative to the first seat 131, so that the clamping mechanism 132 can be moved to the unlocking state shown in fig. 10A and 10B. At this time, the user may project a portion of the circuit board between the clamping head 132c and the clamping base 132b25 to wait for clamping.
Then, during the period that the cylinder module 163 drives the cylinder rod 163a to retract to move away from the clamping mechanism 132, by designing the lengths of the pushing component 162a, the first pushing block 162B, the second pushing block 162c and the third pushing block 162d appropriately, the third pushing block 162d can be separated from the linkage plate 132B23, then the pushing component 162a is separated from the lifting bottom plate 132d to clamp the clamping head 132c on the clamping bottom plate 132B25, and finally the first pushing block 162B and the second pushing block 162c are separated from the first displacement substrate 132B1 and the second displacement substrate 132B2, respectively, so that the clamping mechanism 132 can be in the clamping state shown in fig. 9A and 9B.
In detail, during the cylinder module 163 drives the cylinder rod 163a to retract to move away from the clamping mechanism 132, the third pushing block 162d is firstly separated from the linking plate 132b23, so that the linking plate 132b23 moves inward along the first direction a1 relative to the first seat 131, and the clamping head 132c moves to a position closer to the center of the first seat 131. Since the spring 162a4 disposed between the moving substrate 162a1 and the fixing member 162a3 can make the roller 162a32 continuously push the lifting bottom plate 132d, the time of descending the clamping head 132c is delayed until the third pushing block 162d is separated from the linking plate 132b 23. After the clamping head 132c descends to clamp the circuit board on the clamping bottom plate 132b25, the cylinder rod 163a descending continuously makes the first abutting block 162b and the second abutting block 162c separate from the first displacement substrate 132b1 and the second displacement substrate 132b2, respectively, so that the first displacement substrate 132b1 and the second displacement substrate 132b2 move outwards relative to the first seat 131. At this time, the clamping head 132c clamping the circuit board moves outwards relative to the first base 131, so that the circuit board can be spread, thereby ensuring that the circuit board maintains a planar state and improving the test accuracy.
Furthermore, as can be seen from the foregoing embodiments, the circuit board mounting apparatus completes the mounting and unlocking of the circuit board in a purely mechanical manner, so that complicated wiring can be omitted, and the circuit board mounting apparatus is suitable for use with the circuit board testing system 100 and the circuit board testing method of the foregoing embodiments.
In some embodiments, the clamping mechanism 132 may omit the displacement assembly 132b, and the corresponding unlocking mechanism 162 may omit the first abutting block 162b and the second abutting block 162c, and perform the unlocking and clamping procedures substantially according to the principles of the foregoing embodiments. Such a clamping mechanism 132 does not actively hold the circuit board open during the clamping process, such as the lower left clamping mechanism 132 in fig. 5. Other details of such clamping mechanism 132 and corresponding unlocking mechanism 162 are not detailed herein.
In some embodiments, the clamping mechanism 132 may integrate the first displacement substrate 132b1 and the second displacement substrate 132b2 of the displacement assembly 132b into a single displacement substrate, and the corresponding unlocking mechanism 162 may omit the second pushing block 162c and perform the unlocking and clamping processes substantially according to the principles of the aforementioned embodiments. Such a clamping mechanism 132 only holds the circuit board apart along one direction during the process of clamping the circuit board, for example, the upper left clamping mechanism 132 in fig. 5 holds the circuit board apart along the first direction a1, and the lower right clamping mechanism 132 in fig. 5 holds the circuit board apart along the second direction a 2. Other details of such clamping mechanism 132 and corresponding unlocking mechanism 162 are not detailed herein.
As is apparent from the above detailed description of the embodiments of the present invention, according to the circuit board testing system and the circuit board testing method of the present invention, the clamping tool having a circuit board clamped thereon can be placed on the testing stage in the testing apparatus for testing. During the testing of the testing device, the user can clamp another circuit board on another clamping tool in advance on a buffer carrier outside the testing device. Therefore, after the test device completes the test, the placing position of the clamping tool can be quickly exchanged by using the pick-and-place device, so that the test device can immediately detect the next circuit board, and the test period of the circuit board is effectively reduced. In addition, according to the clamping tool of the circuit board mounting device, after the clamping head is abutted to the displacement assembly to clamp the circuit board, the elastic piece is utilized to drive the displacement assembly to move outwards relative to the first base body based on the fixed base plate, so that the circuit board is expanded outwards to ensure that the circuit board keeps a plane state, and the test accuracy can be further improved. According to the unlocking device of the circuit board mounting device, the pushing block can be used for pushing the displacement assembly to enable the circuit board to be restored to the non-expanded state, and the pushing assembly is used for pushing the clamping head to leave the displacement assembly to release the circuit board. Therefore, the circuit board mounting device completes the mounting and unlocking of the circuit board in a purely mechanical mode, can save complex wiring and is suitable for being matched with the circuit board testing system and the circuit board testing method.
Although the present invention has been described with reference to the above embodiments, it should be understood that various changes and modifications can be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (18)
1. A circuit board testing system, comprising:
a testing device having a testing platform;
a buffer carrying platform outside the testing device;
two clamping tools which are respectively arranged on the test carrying platform and the buffer carrying platform and are respectively configured to clamp two circuit boards, wherein the test device is configured to test the circuit board arranged above the test carrying platform;
the pick-and-place device comprises two pick-and-place modules, wherein each pick-and-place module is configured to move between the test carrier and the buffer carrier and is configured to grab or place one of the clamping tools; and
one or more controllers configured to drive the pick-and-place modules to exchange the placement positions of the holding tools after the testing device tests the circuit board placed above the test stage.
2. The circuit board testing system of claim 1, wherein each of the pick-and-place modules comprises:
a track extending between the test stage and the buffer stage;
a moving member capable of slidably engaging the rail; and
and the taking and placing unit is connected with the moving part and is configured to pick up or place one of the clamping tools.
3. A method for testing a circuit board, comprising:
placing a clamping tool for clamping a circuit board on a test carrying platform of a test device;
providing another clamping tool for clamping another circuit board on a buffer carrying platform outside the testing device;
testing the circuit board placed above the test carrying platform by using the test device;
after the testing device tests the circuit board placed above the test carrier, the placing positions of the clamping tools are exchanged.
4. The method as claimed in claim 3, wherein the step of providing the another clamping tool on the buffer carrier for clamping the another circuit board comprises:
placing the other clamping tool on the buffering carrying platform; and
and clamping the other circuit board on the other clamping tool.
5. The method as claimed in claim 3, wherein the step of providing the another holding tool on the buffer stage for holding the another circuit board is performed during the testing of the circuit board placed on the test stage by the testing apparatus.
6. A circuit board mounting apparatus, comprising a clamping tool, the clamping tool comprising:
a first base; and
a plurality of clamping mechanisms, each comprising:
a fixed base plate detachably fixed on the first seat body;
a displacement component which is arranged on the fixed substrate in a sliding way along a first direction;
a clamping head disposed on the displacement assembly and configured to move toward or away from the displacement assembly;
at least one first elastic piece, which is connected with the fixed substrate and the displacement component and is configured to drive the displacement component to move outwards relative to the first seat body based on the fixed substrate; and
at least one second elastic piece is connected with the displacement component and the clamping head and is configured to drive the clamping head to abut against the displacement component.
7. The apparatus as claimed in claim 6, wherein the first housing is a frame and has a plurality of corners, and the clamping mechanisms are disposed adjacent to the corners respectively.
8. A circuit board mounting apparatus according to claim 6, wherein the displacement assembly comprises:
a first displacement substrate, which can be slidably disposed on the fixed substrate, wherein the first elastic member connects the fixed substrate and the first displacement substrate;
a second displacement substrate slidably disposed on the first displacement substrate along a second direction, wherein the clamping head is disposed on the second displacement substrate, and the second elastic member connects the second displacement substrate and the clamping head; and
at least one third elastic element connected to the first displacement substrate and the second displacement substrate and configured to drive the second displacement substrate to move outwards relative to the first base body based on the first displacement substrate.
9. The circuit board mounting apparatus of claim 8, further comprising an unlocking device, the unlocking device comprising:
a second seat disposed below the clamping tool; and
a plurality of unlocking mechanisms, fixed on the second seat body and respectively corresponding to the clamping mechanisms, wherein each unlocking mechanism comprises:
a pushing component configured to push the corresponding clamping head so that the corresponding clamping head leaves the corresponding displacement component;
a first pushing block configured to push the corresponding first displacement substrate so that the corresponding first displacement substrate moves inwards relative to the first base body based on the corresponding fixed substrate; and
and the second pushing block is configured to push the corresponding second displacement substrate so that the corresponding second displacement substrate moves inwards relative to the first seat body based on the corresponding first displacement substrate.
10. A circuit board mounting apparatus according to claim 8, wherein the first resilient member is configured to move the first displacement substrate relative to the fixed substrate away from one of the other clamping mechanisms, and the third resilient member is configured to move the second displacement substrate relative to the first displacement substrate substantially away from the other of the other clamping mechanisms.
11. The apparatus of claim 8, wherein the fixed substrate has at least one guiding block, the first displacement substrate has at least one guiding slot, the guiding block is slidably engaged in the guiding slot, and the first resilient member is connected between the guiding block and one end of the guiding slot.
12. The apparatus of claim 8, wherein the first displacement substrate has at least one guiding block, the second displacement substrate has at least one guiding slot, the guiding block is slidably engaged in the guiding slot, and the third resilient member is connected between the guiding block and one end of the guiding slot.
13. A circuit board mounting apparatus according to claim 8, wherein the second displacement substrate comprises:
the third elastic piece is connected with the first displacement substrate and the plate body;
the linkage plate is arranged on the plate body in a sliding manner along the first direction, and the clamping head is arranged on the linkage plate; and
and the fourth elastic piece is connected with the plate body and the linkage plate and is configured to drive the linkage plate to move inwards relative to the fixed substrate based on the plate body.
14. The circuit board mounting apparatus of claim 13, further comprising an unlocking device, the unlocking device comprising:
a second seat disposed below the clamping tool; and
a plurality of unlocking mechanisms, fixed on the second seat body and respectively corresponding to the clamping mechanisms, wherein each unlocking mechanism comprises:
a pushing component configured to push the corresponding clamping head so that the corresponding clamping head leaves the corresponding displacement component;
a first pushing block configured to push the corresponding first displacement substrate so that the corresponding first displacement substrate moves inwards relative to the first base body based on the corresponding fixed substrate;
a second pushing block configured to push the corresponding second displacement substrate so that the corresponding second displacement substrate moves inwards relative to the first seat body based on the corresponding first displacement substrate; and
and the third pushing and abutting block is configured to push and abut against the corresponding linkage plate, so that the corresponding linkage plate moves outwards relative to the first seat body based on the corresponding plate body.
15. The circuit board mounting apparatus of claim 6, further comprising an unlocking device, the unlocking device comprising:
a second seat disposed below the clamping tool; and
and the unlocking mechanisms are fixed on the second seat body and respectively correspond to the clamping mechanisms, and each unlocking mechanism comprises a pushing component which is configured to push the corresponding clamping head so as to enable the corresponding clamping head to leave the corresponding displacement component.
16. A circuit board mounting apparatus according to claim 15, wherein the urging assembly comprises:
a movable substrate configured to move toward or away from the corresponding chuck head and having a first surface and a second surface opposite to each other;
a guide rod capable of slidably penetrating through the first surface and the second surface and having a first end and a second end, wherein the first end is configured to abut against the first surface;
a fixing member connected to the second end and configured to push against the corresponding clamping head; and
a spring sleeved outside the guide rod and configured to drive the fixing piece to move away from the second surface, so that the first end is configured to abut against the first surface.
17. A circuit board mounting apparatus according to claim 16, wherein the fixing member comprises:
a fixed block connected with the second end; and
a roller pivoted to the fixing block and configured to push against the corresponding clamping head.
18. The apparatus of claim 15, wherein each of the unlocking devices further comprises a cylinder module having a cylinder rod, and the pushing assembly is disposed on the cylinder rod.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106109389A TWI615342B (en) | 2017-03-21 | 2017-03-21 | Circuit board test system, circuit board test method, and circuit board clamping apparatus |
| TW106109389 | 2017-03-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108627756A CN108627756A (en) | 2018-10-09 |
| CN108627756B true CN108627756B (en) | 2021-01-08 |
Family
ID=62014620
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710224444.7A Active CN108627756B (en) | 2017-03-21 | 2017-04-07 | Circuit board test system, circuit board test method and circuit board installation device |
Country Status (3)
| Country | Link |
|---|---|
| JP (2) | JP2018159695A (en) |
| CN (1) | CN108627756B (en) |
| TW (1) | TWI615342B (en) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109129535A (en) * | 2018-10-26 | 2019-01-04 | 苏州富强科技有限公司 | A kind of test device |
| US11921151B2 (en) | 2019-01-24 | 2024-03-05 | Koh Young Technology Inc. | Jig for inspection apparatus, inspection apparatus, and inspection set |
| CN110133415B (en) * | 2019-06-05 | 2024-05-03 | 珠海格力智能装备有限公司 | Test mechanism and test device with same |
| CN111486872B (en) * | 2020-06-04 | 2024-04-05 | 苏州威达智科技股份有限公司 | Gyroscope function test equipment |
| CN112113979B (en) * | 2020-09-08 | 2023-08-22 | 荣成歌尔微电子有限公司 | Inspection device |
| CN112165784B (en) * | 2020-10-15 | 2023-07-21 | 广德东风电子有限公司 | Full-automatic circuit board horizontal copper deposition connecting line VCP electroplating device |
| CN113189469B (en) * | 2021-03-30 | 2022-11-22 | 深圳市磐锋精密技术有限公司 | Full-automatic detection equipment for mobile phone line and use method thereof |
| CN113267717B (en) * | 2021-06-11 | 2022-08-23 | 珠海市精实测控技术有限公司 | Circuit board test platform |
| CN114034889A (en) * | 2021-11-12 | 2022-02-11 | 杨丽 | Circuit board test platform for electronic information engineering |
| CN114325002B (en) * | 2022-01-07 | 2023-07-28 | 深圳市新世纪拓佳光电技术有限公司 | Touch screen function piece test fixture |
| CN114310729A (en) * | 2022-02-15 | 2022-04-12 | 惠州市艾斯谱光电有限公司 | Lamp panel clamp, LED chip mounting device and LED position detection device |
| CN115950889B (en) * | 2023-03-10 | 2023-05-23 | 济南华自达电子设备有限公司 | Circuit board detection table with high detection efficiency |
| CN116559632B (en) * | 2023-07-07 | 2023-11-14 | 西安交通大学城市学院 | Automatic detection device for contacts of electrical control circuit board |
| CN117310233B (en) * | 2023-11-29 | 2024-02-13 | 无锡格凡科技有限公司 | Test equipment of driver circuit board |
| CN117538798B (en) * | 2024-01-10 | 2024-03-22 | 国网辽宁省电力有限公司 | Electric leakage detector for power grid transmission line |
| CN117554789B (en) * | 2024-01-11 | 2024-03-19 | 远东(三河)多层电路有限公司 | PCB board test fixture |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW578918U (en) * | 2003-03-24 | 2004-03-01 | Forever Advanced Technology Co | Compound-type circuit board conveying mechanism of testing machine |
| CN101726631A (en) * | 2008-10-23 | 2010-06-09 | 日本电产丽德株式会社 | Substrate checking clamp and substrate checking device with the same |
| TW201302583A (en) * | 2011-07-15 | 2013-01-16 | Hon Hai Prec Ind Co Ltd | Device for production line and production line thereof |
| CN103792481A (en) * | 2012-11-02 | 2014-05-14 | 纬创资通股份有限公司 | Circuit board automatic testing device and circuit board automatic testing method |
| JP2014519039A (en) * | 2011-06-03 | 2014-08-07 | 日本テキサス・インスツルメンツ株式会社 | Shuttle plate with pockets to accommodate multiple semiconductor package sizes |
| EP2490033A4 (en) * | 2009-10-16 | 2014-12-24 | Huizhou Tcl Mobile Comm Co Ltd | Test device and method for multimedia data card and multimedia data card of mobile phone |
| JP2015060988A (en) * | 2013-09-19 | 2015-03-30 | 日置電機株式会社 | Substrate transfer device |
| TWI569698B (en) * | 2015-11-06 | 2017-02-01 | 財團法人工業技術研究院 | Circuit board clipping and stretching device and control method thereof |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62171840A (en) * | 1986-01-24 | 1987-07-28 | Hitachi Electronics Eng Co Ltd | Platelike work handling mechanism |
| JPH06117964A (en) * | 1992-10-06 | 1994-04-28 | Hitachi Electron Eng Co Ltd | Table for placing film substrate |
| JPH06216496A (en) * | 1993-01-13 | 1994-08-05 | Hitachi Ltd | Jig for thin sheet |
| JP3557887B2 (en) * | 1998-01-14 | 2004-08-25 | 日立ハイテク電子エンジニアリング株式会社 | Contact device for IC device |
| JP3065612B1 (en) * | 1999-06-01 | 2000-07-17 | 日本電産リード株式会社 | Board inspection equipment |
| JP4929532B2 (en) * | 2001-05-11 | 2012-05-09 | イビデン株式会社 | Inspection method and inspection apparatus for printed wiring board |
| KR100602450B1 (en) * | 2004-03-12 | 2006-07-19 | 바이옵트로 주식회사 | Apparatus for testing of flexible printed circuit board |
| KR100670977B1 (en) * | 2005-05-11 | 2007-01-17 | 에버테크노 주식회사 | Carrier for a Polarizing Film |
| CN101430362B (en) * | 2005-12-17 | 2012-05-16 | 卡姆特有限公司 | Method and system for circuit detection |
| CN102027812B (en) * | 2008-05-14 | 2014-10-29 | 先进装配系统有限责任两合公司 | Application of viscous materials using stationary print heads |
| JP5179289B2 (en) * | 2008-08-18 | 2013-04-10 | 日置電機株式会社 | Circuit board fixing device and circuit board inspection device |
| JP5424015B2 (en) * | 2008-11-18 | 2014-02-26 | 日本電産リード株式会社 | Substrate holding device and substrate inspection device |
| JP5431179B2 (en) * | 2010-01-15 | 2014-03-05 | 日置電機株式会社 | Circuit board fixing device and circuit board inspection device |
| JP2013137286A (en) * | 2011-12-28 | 2013-07-11 | Advantest Corp | Electronic component testing device |
| TWM462366U (en) * | 2013-05-02 | 2013-09-21 | Test Research Inc | Circuit recheck machine |
-
2017
- 2017-03-21 TW TW106109389A patent/TWI615342B/en active
- 2017-04-07 CN CN201710224444.7A patent/CN108627756B/en active Active
- 2017-06-16 JP JP2017118970A patent/JP2018159695A/en active Pending
-
2018
- 2018-09-05 JP JP2018165687A patent/JP6574036B2/en not_active Expired - Fee Related
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW578918U (en) * | 2003-03-24 | 2004-03-01 | Forever Advanced Technology Co | Compound-type circuit board conveying mechanism of testing machine |
| CN101726631A (en) * | 2008-10-23 | 2010-06-09 | 日本电产丽德株式会社 | Substrate checking clamp and substrate checking device with the same |
| EP2490033A4 (en) * | 2009-10-16 | 2014-12-24 | Huizhou Tcl Mobile Comm Co Ltd | Test device and method for multimedia data card and multimedia data card of mobile phone |
| JP2014519039A (en) * | 2011-06-03 | 2014-08-07 | 日本テキサス・インスツルメンツ株式会社 | Shuttle plate with pockets to accommodate multiple semiconductor package sizes |
| TW201302583A (en) * | 2011-07-15 | 2013-01-16 | Hon Hai Prec Ind Co Ltd | Device for production line and production line thereof |
| CN103792481A (en) * | 2012-11-02 | 2014-05-14 | 纬创资通股份有限公司 | Circuit board automatic testing device and circuit board automatic testing method |
| JP2015060988A (en) * | 2013-09-19 | 2015-03-30 | 日置電機株式会社 | Substrate transfer device |
| TWI569698B (en) * | 2015-11-06 | 2017-02-01 | 財團法人工業技術研究院 | Circuit board clipping and stretching device and control method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI615342B (en) | 2018-02-21 |
| JP2019035757A (en) | 2019-03-07 |
| CN108627756A (en) | 2018-10-09 |
| JP2018159695A (en) | 2018-10-11 |
| TW201834953A (en) | 2018-10-01 |
| JP6574036B2 (en) | 2019-09-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108627756B (en) | Circuit board test system, circuit board test method and circuit board installation device | |
| TWI473201B (en) | Testing apparatus for electronic devices | |
| KR100854641B1 (en) | Handling apparatus and test set using the handling apparatus | |
| KR101696682B1 (en) | Electronic device handling apparatus and electronic device testing apparatus | |
| KR20070066001A (en) | Equipment for testing a semiconductor module | |
| CN112254639A (en) | Part detection device and bearing jig | |
| KR20190103957A (en) | Inspection system | |
| CN112296903A (en) | Part detection device, bearing jig and clamping and positioning mechanism | |
| JP2008221438A (en) | Robot hand and robot | |
| TWI662287B (en) | Circuit board test system and circuit board test method | |
| CN107918065B (en) | Fingerprint identification electronic component testing device and testing equipment thereof | |
| KR100432355B1 (en) | Mounting and Separating Device from Test Tray in Handler for Testing Semiconductor Devices | |
| JP4450081B2 (en) | Parts testing equipment | |
| KR100610778B1 (en) | Carrier Module for Semiconductor Test Handler | |
| KR102450768B1 (en) | The handler for the device test | |
| CN213580731U (en) | Die mark detection device | |
| CN209894905U (en) | Load-carrying type electric equipment | |
| TWI779822B (en) | Turning device and processing apparatus | |
| CN117607665B (en) | Probe station | |
| CN216434286U (en) | Circuit board testing device and circuit board testing machine | |
| CN218930961U (en) | Conveying mechanism and detection equipment | |
| CN220271381U (en) | Test fixture, voice coil motor frequency response test mechanism and test system thereof | |
| CN216434240U (en) | Circuit board testing machine | |
| CN217112561U (en) | Electronic component detection device | |
| CN213179865U (en) | Part detection device and bearing jig |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |