CN108624859A - A kind of two-sided physical vapor deposition coating film equipment and its principle - Google Patents
A kind of two-sided physical vapor deposition coating film equipment and its principle Download PDFInfo
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- CN108624859A CN108624859A CN201810791002.5A CN201810791002A CN108624859A CN 108624859 A CN108624859 A CN 108624859A CN 201810791002 A CN201810791002 A CN 201810791002A CN 108624859 A CN108624859 A CN 108624859A
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- Prior art keywords
- ion
- cavity
- sided
- vapor deposition
- physical vapor
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/568—Transferring the substrates through a series of coating stations
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/28—Vacuum evaporation by wave energy or particle radiation
- C23C14/30—Vacuum evaporation by wave energy or particle radiation by electron bombardment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
Abstract
The invention discloses a kind of two-sided physical vapor deposition coating film equipment,Including vacuum chamber,Sample platform system,Vacuum pump system and electric system,Magnetron sputtering cavity is housed in vacuum chamber,Ion assisted evaporative cavity,Magnetron sputtering inside cavity is equipped with magnetic control sputtering system,Heating system,The double-sided coating designs,For needing to do the base material of two-sided physical vapor deposition coating film,No turn-over operation,Reduce operating process,Improve yields,Reduce production line cost,Simultaneously,The design of relatively traditional two-sided magnetron sputtering plating,Because introducing the IED modes that more excellent plating membrane property may be implemented,Single side film properties can be promoted,For some, there are the two-sided membrane modules divided in primary and secondary face,Such as there is the photovoltaic cell of main light-receiving surface,The luminescent device of main light-emitting surface,Display device etc.,For,The design can accomplish Cost And Performance preferably to balance.
Description
Technical field：
The present invention relates to robotic technology field, more particularly to a kind of two-sided physical vapor deposition coating film equipment and its principle.
Background technology：
Physical vapor deposition technology refers to that film source material is first converted to gaseous state, the process for film forming of then sublimating in substrate, this mistake
Cheng Zhong, chemical component itself is no or changes few.Physical vapour deposition (PVD) includes：Magnetron sputtering, electric heating evaporation, electron beam steam
The modes such as hair, reaction and plasma deposition.Physical vapor deposition technology has a wide range of application in industrial production and scientific research, especially
It is in semiconductor, display, photovoltaic, LED illumination, environmental protection, high-end building materials, aerospace, digital communication, optical industry etc. crowd
Voluminous industry plays important, the even effect of core.
In order to cope with complicated vacuum coating production procedure, equipment cost, failure rate are reduced, production maintenance cost is promoted
Yields, it is necessary to avoid excessive automatic flow.
Invention content：
The purpose of the present invention be that provide to solve the above-mentioned problems a kind of two-sided physical vapor deposition coating film equipment and its
Principle solves the problems, such as of the existing technology.
To solve the above-mentioned problems, the present invention provides a kind of technical solutions：
A kind of two-sided physical vapor deposition coating film equipment, including vacuum chamber, sample platform system, vacuum pump system and power train
System, the vacuum chamber is interior to be equipped with magnetron sputtering cavity and ion assisted evaporative cavity, and the magnetron sputtering inside cavity is equipped with
Magnetic control sputtering system, heating system；Electron beam system, ion source, film thickness gauge and gear are housed in the ion assisted evaporative cavity
Plate system.
Preferably, including in the vacuum chamber：High-seal valve, the external substance for vacuum chamber exchange,
Highly stable sealing may be implemented when being closed, protect inside cavity vacuum state；Optical observation window system, can be to cavity inside information
Shape is observed；Vacuum cavity valve is logical between magnetron sputtering cavity and ion assisted evaporative cavity with closing and opening
Road；Lighting device makes observation apparent.
Preferably, the magnetic control sputtering system does upper surface plated film from top to substrate, which includes plated film
Cathode installs plated film target；Direct current（Or intermediate frequency, radio frequency）Power supply, transmitting argon ion stream bombard target；Magnetic deflection field controls argon
Ion stream direction.
Preferably, the heating system is located at below sample stage position, for being heated to substrate.
Preferably, the electron beam system includes：Film source substance crucible, one group 4-12, being positioned over one can choose to install
On disk, after material consumption in a crucible, next crucible is placed on heating location by disc rotary；Electron beam
Transmitter, by heating tungsten filament flow of emitted electrons；Electron accelerator promotes beam energy；Magnetic deflection field controls electron beam side
To.
Preferably, the ion source includes：Argon gas conveying device；Ion generator so that argon gas atmo ionization becomes
Argon ion；Ion acceleration field, Accelerated argon-ions form high energy ion current.
Preferably, the baffle system includes：Baffle A is that electron beam evaporation gaseous material is evenly distributed in the cavity；
Baffle B so that the gaseous material of ionic state is more uniformly distributed substrate deposition；Baffle C so that ion flow power should not be excessively
It concentrates, uniform ionization distillation state film source substance.
Preferably, the vacuum pump system includes：Mechanical pump and molecular pump.
Preferably, the electric system includes：Power supply；Power control unit；Power off overload protection.
Its principle is presented below：
Coating material is placed horizontally on hollow out frame, since it is desired that being supported to base material, and prevents plated film winding degree, frame
Frame needs to contact the surrounding of base material to realize that carrying out mechanical support and winding degree to it prevents, while for maximum increase plated film
Area, reduces masking, and material edge contact width can be controlled between 0.5-1mm.
First, the hollow out frame of carrying substrates enters magnetron sputtering technique cavity, carries out coating operation；Until upper plated film
After completion, lower coating operation is carried out into the ion auxiliary electron beam evaporation cavity, because of the ion auxiliary electron beam
The physical characteristic of evaporation cavity, it is best to do coating effects, and easily realizes；Complete the ion auxiliary electron beam evaporation cavity plating
After film, go out chamber, two-sided physical vapour deposition (PVD) flow terminates, special suggestion, magnetron sputtering plating and the ion auxiliary electron beam
The sequence of evaporation cavity plated film can adjust, point of no priority.
The double-sided coating designs, and for needing to do the base material of two-sided physical vapor deposition coating film, no turn-over operation reduces
Operating process improves yields, reduces production line cost, meanwhile, the design of relatively traditional two-sided magnetron sputtering plating,
Because introducing the ion auxiliary electron beam evaporation cavity mode that more excellent plating membrane property may be implemented, single side film property can be promoted
Can, for some there are primary and secondary face point two-sided membrane module, such as have the photovoltaic cell of main light-receiving surface, main light-emitting surface shine
Device, display device etc., for, which can accomplish Cost And Performance preferably to balance.
Two-sided physical vapor deposition coating film equipment, hereinafter referred to as equipment, including vacuum chamber, sample platform system, vacuum pump
System and electric system, magnetic control sputtering system, heating system, electron beam system, ion source, film thickness gauge and baffle system etc..
Beneficial effects of the present invention：The double-sided coating designs, for needing to do the base material of two-sided physical vapor deposition coating film,
No turn-over operation, reduces operating process, improves yields, reduce production line cost, meanwhile, relatively traditional double-side magnetic
The design of sputter coating is controlled, because introducing the IED modes that more excellent plating membrane property may be implemented, single side film properties can be promoted,
For some there are primary and secondary face point two-sided membrane module, such as have the photovoltaic cell of main light-receiving surface, main light-emitting surface photophore
Part, display device etc., for, which can accomplish Cost And Performance preferably to balance.
Description of the drawings：
The present invention is described in detail by following specific implementations and attached drawing for ease of explanation,.
Fig. 1 is the work flow diagram of equipment proposed by the invention；
Fig. 2 is one of plant engineering structure proposed by the invention schematic diagram（First magnetron sputtering, rear ion assisted evaporative）；
Fig. 3 is two schematic diagrams of plant engineering structure proposed by the invention（First ion assisted evaporative, rear magnetron sputtering）.
In figure：1, vacuum chamber；2, sample platform system；3, vacuum pump system；4, electric system；5, ion assisted evaporative chamber
Body；6, magnetic control sputtering system；7, heating system；8, electron beam system；9, ion source；10, film thickness gauge；11, baffle system；12、
Magnetron sputtering cavity.
Specific implementation mode：
As shown in Figs. 1-3, present embodiment uses following technical scheme：A kind of two-sided physical vapor deposition coating film equipment,
Including vacuum chamber 1, sample platform system 2, vacuum pump system 3 and electric system 4, magnetron sputtering cavity is housed in vacuum chamber 1
12 and ion assisted evaporative cavity 5,12 inside of magnetron sputtering cavity is equipped with magnetic control sputtering system 6, heating system 7；Ion assists
Electron beam system 8, ion source 9, film thickness gauge 10 and baffle system 11 are housed in evaporation cavity 5.
Wherein, include in vacuum chamber 1：High-seal valve, the external substance for vacuum chamber exchanges, when being closed
Highly stable sealing may be implemented, protect inside cavity vacuum state；Optical observation window system can see situation in cavity
It examines；Vacuum cavity valve, with the channel closed between unlatching magnetron sputtering cavity 12 and ion assisted evaporative cavity 5；According to
Bright device makes observation apparent.
Wherein, magnetic control sputtering system 6 does upper surface plated film from top to substrate, which includes plated film cathode, peace
Fill plated film target；Direct current or intermediate frequency, radio-frequency power supply, transmitting argon ion stream bombard target；Magnetic deflection field, control argon ion stream side
To.
Wherein, heating system 7 is located at below sample stage position, for being heated to substrate.
Wherein, electron beam system 8 includes：Film source substance crucible, one group 4-12, being positioned over one can choose to install on disk,
After material consumption in a crucible, next crucible is placed on heating location by disc rotary；Electron beam emitter,
By heating tungsten filament flow of emitted electrons；Electron accelerator promotes beam energy；Magnetic deflection field controls beam direction.
Wherein, ion source 9 includes：Argon gas conveying device；Ion generator so that argon gas atmo ionization becomes argon ion；
Ion acceleration field, Accelerated argon-ions form high energy ion current.
Wherein, baffle system 11 includes：Baffle A is that electron beam evaporation gaseous material is evenly distributed in the cavity；Baffle B,
So that the gaseous material of ionic state being more uniformly distributed in substrate deposition；Baffle C so that ion flow power not concentrated excessively,
Uniform ionization distillation state film source substance.
Wherein, vacuum pump system 3 includes：Mechanical pump and molecular pump.
Wherein, electric system 4 includes：Power supply；Power control unit；Power off overload protection.
Its principle is presented below：
Coating material is placed horizontally on hollow out frame, since it is desired that being supported to base material, and prevents plated film winding degree, frame
Frame needs to contact the surrounding of base material to realize that carrying out mechanical support and winding degree to it prevents, while for maximum increase plated film
Area, reduces masking, and material edge contact width can be controlled between 0.5-1mm.
First, the hollow out frame of carrying substrates enters magnetron sputtering technique cavity, carries out coating operation；Until upper plated film
After completion, lower coating operation is carried out into ion auxiliary electron beam evaporation cavity 5, because of ion auxiliary electron beam evaporation cavity
5 physical characteristic, it is best to do coating effects, and easily realizes；After completing 5 plated film of ion auxiliary electron beam evaporation cavity, go out chamber,
Two-sided physical vapour deposition (PVD) flow terminates, special suggestion, magnetron sputtering plating and 5 plated film of ion auxiliary electron beam evaporation cavity
Sequence can adjust, point of no priority.
The double-sided coating designs, and for needing to do the base material of two-sided physical vapor deposition coating film, no turn-over operation reduces
Operating process improves yields, reduces production line cost, meanwhile, the design of relatively traditional two-sided magnetron sputtering plating,
Because introducing 5 mode of ion auxiliary electron beam evaporation cavity that more excellent plating membrane property may be implemented, single side film property can be promoted
Can, for some there are primary and secondary face point two-sided membrane module, such as have the photovoltaic cell of main light-receiving surface, main light-emitting surface shine
Device, display device etc., for, which can accomplish Cost And Performance preferably to balance.
Two-sided physical vapor deposition coating film equipment, hereinafter referred to as equipment, including vacuum chamber 1, sample platform system 2, vacuum
Pumping system 3 and electric system 4, magnetic control sputtering system 6, heating system 7, electron beam system 8, ion source 9, film thickness gauge 10 and baffle
System 11 etc..
The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention, the technology of the industry
Personnel are it should be appreciated that the present invention is not limited to the above embodiments, and the above embodiments and description only describe this
The principle of invention, without departing from the spirit and scope of the present invention, various changes and improvements may be made to the invention, these changes
Change and improvement all fall within the protetion scope of the claimed invention, the claimed scope of the invention by appended claims and its
Equivalent thereof.
Claims (9)
1. a kind of two-sided physical vapor deposition coating film equipment, including vacuum chamber（1）, sample platform system（2）, vacuum pump system
（3）And electric system（4）, it is characterised in that：The vacuum chamber（1）It is interior that magnetron sputtering cavity is housed（12）It assists steaming with ion
Send out cavity（5）, the magnetron sputtering cavity（12）Inside is equipped with magnetic control sputtering system（6）, heating system（7）；The ion is auxiliary
Help evaporation cavity（5）It is interior that electron beam system is housed（8）, ion source（9）, film thickness gauge（10）And baffle system（11）.
2. a kind of two-sided physical vapor deposition coating film equipment according to claim 1, which is characterized in that the vacuum chamber
（1）Include inside：High-seal valve, the external substance for vacuum chamber are exchanged, be may be implemented when being closed highly stable close
Envelope protects inside cavity vacuum state；Optical observation window system can observe situation in cavity；Vacuum cavity valve is used
With closing and unlatching magnetron sputtering cavity（12）With ion assisted evaporative cavity（5）Between channel；Lighting device allows and observes more
It is clear.
3. a kind of two-sided physical vapor deposition coating film equipment according to claim 1, which is characterized in that the magnetron sputtering
System（6）Upper surface plated film is done to substrate from top, which includes plated film cathode, installs plated film target；Direct current（Or
Intermediate frequency, radio frequency）Power supply, transmitting argon ion stream bombard target；Magnetic deflection field, control argon ion stream direction.
4. a kind of two-sided physical vapor deposition coating film equipment according to claim 1, which is characterized in that the heating system
（7）Below sample stage position, for being heated to substrate.
5. a kind of two-sided physical vapor deposition coating film equipment according to claim 1, which is characterized in that the electron beam system
System（8）Including：Film source substance crucible, one group 4-12, being positioned over one can choose to install on disk, when material consumption in a crucible
After, next crucible is placed on heating location by disc rotary；Electron beam emitter, by heating tungsten filament launching electronics
Stream；Electron accelerator promotes beam energy；Magnetic deflection field controls beam direction.
6. a kind of two-sided physical vapor deposition coating film equipment according to claim 1, which is characterized in that the ion source
（9）Including：Argon gas conveying device；Ion generator so that argon gas atmo ionization becomes argon ion；Ion acceleration field accelerates argon
Ion forms high energy ion current.
7. a kind of two-sided physical vapor deposition coating film equipment according to claim 1, which is characterized in that the baffle system
（11）Including：Baffle A is that electron beam evaporation gaseous material is evenly distributed in the cavity；Baffle B so that the gaseous state of ionic state
Substance is more uniformly distributed substrate deposition；Baffle C so that ion flow power not concentrated excessively, uniform ionization distillation state film
Source substance.
8. a kind of two-sided physical vapor deposition coating film equipment according to claim 1, which is characterized in that the vacuum pump system
System（3）Including：Mechanical pump and molecular pump.
9. a kind of two-sided physical vapor deposition coating film equipment according to claim 1, which is characterized in that the electric system
（4）Including：Power supply；Power control unit；Power off overload protection；
Its principle is presented below；
Coating material is placed horizontally on hollow out frame, since it is desired that being supported to base material, and prevents plated film winding degree, frame
Frame needs to contact the surrounding of base material to realize that carrying out mechanical support and winding degree to it prevents, while for maximum increase plated film
Area, reduces masking, and material edge contact width can be controlled between 0.5-1mm；
First, the hollow out frame of carrying substrates enters magnetron sputtering technique cavity, carries out coating operation；Until upper plated film is completed
Later, into the ion auxiliary electron beam evaporation cavity（5）Lower coating operation is carried out, because the ion auxiliary electron beam steams
Send out cavity（5）Physical characteristic, it is best to do coating effects, and easily realizes；Complete the ion auxiliary electron beam evaporation cavity
（5）After plated film, go out chamber, two-sided physical vapour deposition (PVD) flow terminates, special suggestion, magnetron sputtering plating and ion auxiliary electricity
Beamlet evaporation cavity（5）The sequence of plated film can adjust, point of no priority；
The double-sided coating designs, and for needing to do the base material of two-sided physical vapor deposition coating film, no turn-over operation reduces operation
Flow improves yields, reduces production line cost, meanwhile, the design of relatively traditional two-sided magnetron sputtering plating, because
Introduce the ion auxiliary electron beam evaporation cavity that more excellent plating membrane property may be implemented（5）Mode can promote single side film properties,
For some there are primary and secondary face point two-sided membrane module, such as have the photovoltaic cell of main light-receiving surface, main light-emitting surface photophore
Part, display device etc., for, which can accomplish Cost And Performance preferably to balance；
Two-sided physical vapor deposition coating film equipment, hereinafter referred to as equipment, including vacuum chamber（1）, sample platform system（2）, vacuum
Pumping system（3）And electric system（4）, magnetic control sputtering system（6）, heating system（7）, electron beam system（8）, ion source（9）, film
Thick instrument（10）And baffle system（11）Etc..
Priority Applications (1)
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|---|---|---|---|
| CN201810791002.5A CN108624859A (en) | 2018-07-18 | 2018-07-18 | A kind of two-sided physical vapor deposition coating film equipment and its principle |
Applications Claiming Priority (1)
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| CN201810791002.5A CN108624859A (en) | 2018-07-18 | 2018-07-18 | A kind of two-sided physical vapor deposition coating film equipment and its principle |
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| CN108624859A true CN108624859A (en) | 2018-10-09 |
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| CN201810791002.5A Pending CN108624859A (en) | 2018-07-18 | 2018-07-18 | A kind of two-sided physical vapor deposition coating film equipment and its principle |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109825813A (en) * | 2019-04-04 | 2019-05-31 | 浙江工业大学 | A kind of vacuum magnetic control rotary double-face coating clamp |
| CN111235532A (en) * | 2020-01-15 | 2020-06-05 | 长钛工程技术研究院(北京)有限公司 | Coating device combining ion coating and electron beam evaporation coating and coating method thereof |
| CN112831756A (en) * | 2020-12-31 | 2021-05-25 | 苏州佑伦真空设备科技有限公司 | Automatic vacuum evaporation method |
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