CN205803589U - A kind of dual chamber magnetron sputtering electron beam coater - Google Patents
A kind of dual chamber magnetron sputtering electron beam coater Download PDFInfo
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- CN205803589U CN205803589U CN201620762959.3U CN201620762959U CN205803589U CN 205803589 U CN205803589 U CN 205803589U CN 201620762959 U CN201620762959 U CN 201620762959U CN 205803589 U CN205803589 U CN 205803589U
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Abstract
The utility model discloses a kind of dual chamber magnetron sputtering electron beam coater, including magnetron sputtering coating system, electron beam coating system, converting system and master control cabinet, the control end controlling end, the control end of described electron beam coating system and described converting system of described magnetron sputtering coating system is all connected with described master control cabinet；Magnetron sputtered vacuum cavity, electron beam vacuum cavity are connected by this utility model one dual chamber magnetron sputtering electron beam coater with conversion vacuum cavity, make when plated film sample is carried out plated film, magnetron sputtering plating and electron beam plated film can be realized in the case of not destroying vacuum environment, make the associativity between the film tunic of multicoating more preferably, more firmly, finer and close.
Description
Technical field
This utility model relates to vacuum coating equipment, particularly relates to a kind of dual chamber magnetron sputtering electron beam coater.
Background technology
The ultimate principle of magnetron sputtering is to utilize the plasma in Ar gas under the effect of electric field and alternating magnetic field, is added
The high-energy particle bombardment target material surface of speed, after energy exchange, the atom of target material surface departs from former lattice and escapes, and transfers to matrix
Surface and film forming.The feature of magnetron sputtering is that rate of film build is high, and substrate temperature is low, and the adhesiveness of film is good, can realize large area plating
Film, this technology can be divided into direct current magnetron sputtering process and radio-frequency magnetron sputter method.
Electron-beam vapor deposition method is to utilize electron beam to carry out directly heating evaporation material under vacuum, makes evaporation material gas
Changing and transport to substrate, condensing the method forming thin film in substrate, in electron beam heater, heated material is placed
In the Citrus chachiensis Hort. whirlpool of water-cooled, can avoid evaporating material and Citrus chachiensis Hort. misfortune wall reacts and affects the quality of thin film, therefore, electron beam evaporation sinks
Area method can prepare high purity films, multiple increasing can be disposed to bring disaster upon, it is achieved at the same time or separately in same vapor deposition apparatus simultaneously
Evaporation, deposits multiple different material.By electron beam evaporation, any material can be evaporated, and different materials needs to use
Different types of increasing exhausts to obtain evaporation rate to be reached.
The excellent specific property that multicoating has makes it from be found, and just illustrates before tempting application to the mankind
Scape.But wanting reality application multicoating to be restricted by series of factors again, this is that the coating process etc. of various Coating Materials is asked
Topic (associativities of two kinds of unlike materials), for the difference of two kinds of plated film modes, has the plated film side of optimum for Coating Materials
Formula.
The multicoating used at present need to use the mode of different plated film mode to be that a kind of plated film mode has plated a kind of material
After after vacuum chamber take out, reinstall another vacuum chamber plate a kind of material, sample meeting therebetween by another kind of plated film mode
Contact air, can have a significant impact coating, next layer of coating and final coating are had the biggest performance impact (multilamellar
Associativity, firmness and compactness between thin film).
Utility model content
The purpose of this utility model is that provides a kind of dual chamber magnetron sputtering electron beam plating to solve the problems referred to above
Film machine.
This utility model is achieved through the following technical solutions above-mentioned purpose:
A kind of dual chamber magnetron sputtering electron beam coater, including magnetron sputtering coating system, electron beam coating system, conversion
System and master control cabinet, described magnetron sputtering coating system control end, the control end of described electron beam coating system and described
The control end of converting system is all connected with described master control cabinet；
Described converting system includes changing vacuum cavity, sample stage, magnetron sputtering membrane sample transmission system, electron beam plating
Membrane sample transmission system, sample changeover transmission system, conversion vacuum cavity inflator and conversion vacuum cavity air exhauster, described turn
Changing and be provided with sample import and export on vacuum cavity, described sample is imported and exported and between described sample stage by sample turnover transmission is
System connect, the air inlet of described conversion vacuum cavity air exhauster and the outlet of described conversion vacuum cavity inflator all with described turn
Change the inside connection of vacuum cavity, described conversion vacuum cavity is provided with magnetron sputtering plating mouth and electron beam plated film mouth, institute
State sample changeover transmission system to be arranged between described magnetron sputtering plating mouth and described electron beam plated film mouth；
Described magnetron sputtering coating system includes magnetron sputtered vacuum cavity, magnetic control sputtering system, magnetron sputtered vacuum chamber
Body sample adapting system and magnetron sputtered vacuum cavity air exhauster, described magnetic control sputtering system is arranged on described magnetron sputtered vacuum
In cavity, the air inlet of described magnetron sputtered vacuum cavity air exhauster connects with described magnetron sputtered vacuum inside cavity, described
Being provided with sample port on magnetron sputtered vacuum cavity, described magnetron sputtered vacuum cavity sample adapting system is arranged on described sample
Between mouth and described magnetic control sputtering system, described magnetron sputtered vacuum cavity and described conversion vacuum cavity are spattered by described magnetic control
Penetrating plated film mouth to connect with described sample port, described magnetron sputtered vacuum cavity sample adapting system with the transmission of described sample changeover is
System and magnetron sputtering membrane sample transmission system connect；
Described electron beam coating system includes that electron beam vacuum cavity, electron beam system, electron beam vacuum cavity sample turn
Welding system and electron beam vacuum cavity air exhauster, described electron beam system is arranged in described electron beam vacuum cavity, described electricity
The air inlet of son bundle vacuum cavity air exhauster is internal with described electron beam vacuum cavity to be connected, and described electron beam vacuum cavity sets
Be equipped with sample port, described electron beam vacuum cavity sample adapting system be arranged on described sample port and described electron beam system it
Between, described electron beam vacuum cavity is connected with described sample port by described electron beam plated film mouth with described conversion vacuum cavity,
Described electron beam vacuum cavity sample adapting system and described sample changeover transmission system and electron beam plated film sample transmission system
Connect.
Further, described magnetron sputtering coating system also includes that magnetron sputtering sample heating device, magnetron sputtering sample turn
Dynamic system and magnetron-sputtered film thickness supervising device, magnetron sputtering sample is arranged on described magnetic control sputtering system and described magnetron sputtering
Between sample heating device, described magnetron-sputtered film thickness supervising device is arranged on described magnetron sputtering sample and described magnetron sputtering
Between system, described magnetron sputtering sample rotation system controls described magnetron sputtering sample and rotates；
Described electron beam coating system also includes electron beam plated film sample heating device, electron beam plated film sample rotation system
With electron beam film thickness monitoring device, electron beam plated film sample is arranged on described electron beam system and adds with described electron beam plated film sample
Between thermal, described electron beam film thickness monitoring device be arranged on described electron beam plated film sample and described electron beam system it
Between, described electron beam plated film sample rotation system controls described electron beam plated film sample and rotates.
The sample in respective chamber is controlled by magnetron sputtering sample rotation system and electron beam plated film sample rotation system
Rotate, the uniformity of plated film thin film can be improved；Hot charging is added by electron beam plated film sample heating device and magnetron sputtering sample
Put and plated film sample is heated, fastness and the compactness of thin film can be improved.
Further, described magnetron sputtered vacuum cavity and described electron beam vacuum cavity are respectively arranged with magnetron sputtering
Vacuum cavity inflator and electron beam vacuum cavity inflator, and magnetron sputtered vacuum cavity inflator and electron beam vacuum cavity
Inflator only maintenance and maintenance equipment be use.
The beneficial effects of the utility model are:
This utility model one dual chamber magnetron sputtering electron beam coater is by magnetron sputtered vacuum cavity, electron beam vacuum chamber
Body connects with conversion vacuum cavity, makes when plated film sample is carried out plated film, can be real in the case of not destroying vacuum environment
Existing magnetron sputtering plating and electron beam plated film, make the associativity between the film tunic of multicoating more preferably, more firmly, finer and close.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of dual chamber magnetron sputtering electron beam coater described in the utility model.
Detailed description of the invention
The utility model is described in further detail below in conjunction with the accompanying drawings:
As it is shown in figure 1, this utility model one dual chamber magnetron sputtering electron beam coater, including magnetron sputtering plating system
System, electron beam coating system, converting system and master control cabinet, the control end of magnetron sputtering coating system, electron beam coating system
The control end controlling end and converting system be all connected with master control cabinet；
Converting system includes changing vacuum cavity 4, sample stage 3, magnetron sputtering membrane sample transmission system 10, electron beam plating
Membrane sample transmission system 11, sample changeover transmission system 14, conversion vacuum cavity inflator 25 and conversion vacuum cavity air exhauster
7, conversion vacuum cavity 4 is provided with sample and imports and exports 1, sample is imported and exported and is passed in and out transmission system by sample between 1 and sample stage 3
System 2 connection, conversion vacuum cavity air exhauster 7 air inlet and conversion vacuum cavity inflator 25 outlet all with change vacuum chamber
The inside connection of body 4, conversion vacuum cavity 4 is provided with magnetron sputtering plating mouth and electron beam plated film mouth, and sample changeover is transmitted
System 14 is arranged between magnetron sputtering plating mouth and electron beam plated film mouth；
Magnetron sputtering coating system includes magnetron sputtered vacuum cavity 5, magnetic control sputtering system 17, magnetron sputtered vacuum cavity
Sample adapting system 12, magnetron sputtered vacuum cavity air exhauster 8, magnetron sputtering sample heating device 21, magnetron sputtering sample turn
Dynamic system 19 and magnetron-sputtered film thickness supervising device 23, magnetic control sputtering system 17 is arranged in magnetron sputtered vacuum cavity 5, magnetic control
The air inlet of sputtering vacuum cavity air exhauster 8 is internal with magnetron sputtered vacuum cavity 5 to be connected, and magnetron sputtered vacuum cavity 5 sets
Being equipped with sample port, magnetron sputtered vacuum cavity sample adapting system 12 is arranged between sample port and magnetic control sputtering system 17, magnetic
Control sputtering vacuum cavity 5 is connected with sample port by magnetron sputtering plating mouth with conversion vacuum cavity 4, magnetron sputtered vacuum cavity
Sample adapting system 12 is connected with sample changeover transmission system 14 and magnetron sputtering membrane sample transmission system 10, magnetron sputtering sample
Product 15 are arranged between magnetic control sputtering system 17 and magnetron sputtering sample heating device 21, and magnetron-sputtered film thickness supervising device 23 sets
Putting between magnetron sputtering sample 15 and magnetic control sputtering system 17, magnetron sputtering sample rotation system 19 controls magnetron sputtering sample
15 rotate；
Electron beam coating system includes that electron beam vacuum cavity 6, electron beam system 18, electron beam vacuum cavity sample are transferred
System 13, electron beam vacuum cavity air exhauster 9, electron beam plated film sample heating device 22, electron beam plated film sample rotation system
20 and electron beam film thickness monitoring device 24, electron beam system 18 is arranged in electron beam vacuum cavity 6, and electron beam vacuum cavity is taken out
The air inlet of mechanism of qi 9 is internal with electron beam vacuum cavity 6 to be connected, and electron beam vacuum cavity 6 is provided with sample port, and electron beam is true
Cavity body sample adapting system 13 is arranged between sample port and electron beam system 18, electron beam vacuum cavity 6 and conversion vacuum
Cavity 4 is connected with sample port by electron beam plated film mouth, and electron beam vacuum cavity sample adapting system 13 transmits with sample changeover
System 14 and electron beam plated film sample transmission system 11 connect, and electron beam plated film sample 16 is arranged on electron beam system 18 and electronics
Between bundle plated film sample heating device 22, electron beam film thickness monitoring device 24 is arranged on electron beam plated film sample 16 and electron beam system
Between system 18, electron beam plated film sample rotation system 20 controls electron beam plated film sample 16 and rotates.
Magnetron sputtered vacuum cavity inflator it is respectively arranged with on magnetron sputtered vacuum cavity 5 and electron beam vacuum cavity 6
26 and electron beam vacuum cavity inflator 27, and magnetron sputtered vacuum cavity inflator 26 and electron beam vacuum cavity inflator 27
Only maintenance and maintenance equipment be use.
Each subsystem in magnetron sputtering coating system, electron beam coating system, converting system all with master control cabinet
Control end to connect.
A kind of using method of dual chamber magnetron sputtering electron beam coater:
(1) by plated film sample by conversion vacuum cavity 4 sample import and export 1 and sample turnover transmission system 2 place to
On sample stage 3, then bled by conversion vacuum cavity 4, magnetron sputtered vacuum cavity air exhauster 8 and electron beam vacuum cavity are bled
Conversion vacuum cavity 4, magnetron sputtered vacuum cavity 5 and electron beam vacuum cavity 6 are extracted into the vacuum meeting technological requirement by machine 9
Degree；
(2) judging the sequencing of the film plating layer of two-layer coating, if first carrying out magnetron sputtering plating, then jumping to step
(3), if first carrying out electron beam plated film, step (5) is jumped to
(3) by magnetron sputtering membrane sample transmission system 10, plated film sample is transferred to magnetron sputtered vacuum cavity sample
Adapting system 12, is then placed in plated film sample between magnetic control sputtering system 17 and magnetron sputtering sample heating device 21, carries out
Magnetron sputtering membrane operations；
(4), after magnetron sputtering plating completes, by magnetron sputtered vacuum cavity sample adapting system 12, plated film sample is passed
It is handed to sample port, then transmits adapting system by sample and plated film sample is transferred to electron beam vacuum cavity sample adapting system
13, then plated film sample is placed between electron beam system 18 and electron beam plated film sample heating device 22, carries out electron beam plating
Membrane operations, after electron beam plated film completes, jumps to step (7)；
(5) by magnetic electronic bundle membrane sample transmission system, plated film sample being transferred to the switching of electron beam vacuum cavity sample is
System 13, is then placed in plated film sample between electron beam system 18 and electron beam plated film sample heating device 22, carries out electron beam
Coating operation；
(6), after electron beam plated film completes, by electron beam vacuum cavity sample adapting system 13, plated film sample is transferred to
Sample port, then transmits adapting system by sample and plated film sample is transferred to magnetron sputtered vacuum cavity sample adapting system
12, then plated film sample is placed between electron beam system 18 and magnetron sputtering sample heating device 21, carries out magnetron sputtering
Membrane operations, after magnetron sputtering plating completes, jumps to step (7)；
(7) in cavity, air or protective gas are backfilled, then by plated film sample by conversion vacuum cavity inflator 25
It is transferred to sample stage 3, then imports and exports 1 by sample taking-up by sample turnover transmission system 2 and sample.
The technical solution of the utility model is not limited to the restriction of above-mentioned specific embodiment, every according to skill of the present utility model
The technology deformation that art scheme is made, within each falling within protection domain of the present utility model.
Claims (3)
1. a dual chamber magnetron sputtering electron beam coater, it is characterised in that: include magnetron sputtering coating system, electron beam plated film
System, converting system and master control cabinet, control end, the control of described electron beam coating system of described magnetron sputtering coating system
The control end of end and described converting system is all connected with described master control cabinet；
Described converting system includes changing vacuum cavity, sample stage, magnetron sputtering membrane sample transmission system, electron beam plated film sample
Product transmission system, sample changeover transmission system, conversion vacuum cavity inflator and conversion vacuum cavity air exhauster, described conversion is true
Being provided with sample in cavity body to import and export, described sample is imported and exported and is connected by sample turnover transmission system between described sample stage
Connecing, the air inlet of described conversion vacuum cavity air exhauster and the outlet of described conversion vacuum cavity inflator are all true with described conversion
The inside connection of cavity body, described conversion vacuum cavity is provided with magnetron sputtering plating mouth and electron beam plated film mouth, described sample
Product conversion transfer system is arranged between described magnetron sputtering plating mouth and described electron beam plated film mouth；
Described magnetron sputtering coating system includes magnetron sputtered vacuum cavity, magnetic control sputtering system, magnetron sputtered vacuum cavity sample
Product adapting system and magnetron sputtered vacuum cavity air exhauster, described magnetic control sputtering system is arranged on described magnetron sputtered vacuum cavity
In, the air inlet of described magnetron sputtered vacuum cavity air exhauster connects with described magnetron sputtered vacuum inside cavity, described magnetic control
Sputtering vacuum cavity on be provided with sample port, described magnetron sputtered vacuum cavity sample adapting system be arranged on described sample port with
Between described magnetic control sputtering system, described magnetron sputtered vacuum cavity and described conversion vacuum cavity are by described magnetron sputtering
Film mouth connects with described sample port, described magnetron sputtered vacuum cavity sample adapting system and described sample changeover transmission system and
Magnetron sputtering membrane sample transmission system connects；
Described electron beam coating system includes that the switching of electron beam vacuum cavity, electron beam system, electron beam vacuum cavity sample is
System and electron beam vacuum cavity air exhauster, described electron beam system is arranged in described electron beam vacuum cavity, described electron beam
The air inlet of vacuum cavity air exhauster is internal with described electron beam vacuum cavity to be connected, and described electron beam vacuum cavity is provided with
Sample port, described electron beam vacuum cavity sample adapting system is arranged between described sample port and described electron beam system, institute
State electron beam vacuum cavity to be connected with described sample port by described electron beam plated film mouth with described conversion vacuum cavity, described electricity
Son bundle vacuum cavity sample adapting system is connected with described sample changeover transmission system and electron beam plated film sample transmission system.
A kind of dual chamber magnetron sputtering electron beam coater the most according to claim 1, it is characterised in that: described magnetron sputtering
Coating system also includes magnetron sputtering sample heating device, magnetron sputtering sample rotation system and magnetron-sputtered film thickness monitoring dress
Putting, magnetron sputtering sample is arranged between described magnetic control sputtering system and described magnetron sputtering sample heating device, described magnetic control
Sputtering film thickness monitoring device is arranged between described magnetron sputtering sample and described magnetic control sputtering system, described magnetron sputtering sample
Rotation system controls described magnetron sputtering sample and rotates；
Described electron beam coating system also includes electron beam plated film sample heating device, electron beam plated film sample rotation system and electricity
Son bundle film thickness monitoring device, electron beam plated film sample is arranged on described electron beam system and adds hot charging with described electron beam plated film sample
Between putting, described electron beam film thickness monitoring device is arranged between described electron beam plated film sample and described electron beam system, institute
State electron beam plated film sample rotation system and control the rotation of described electron beam plated film sample.
A kind of dual chamber magnetron sputtering electron beam coater the most according to claim 2, it is characterised in that: described magnetron sputtering
It is respectively arranged with magnetron sputtered vacuum cavity inflator and electron beam vacuum chamber on vacuum cavity and described electron beam vacuum cavity
Body inflator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620762959.3U CN205803589U (en) | 2016-07-19 | 2016-07-19 | A kind of dual chamber magnetron sputtering electron beam coater |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620762959.3U CN205803589U (en) | 2016-07-19 | 2016-07-19 | A kind of dual chamber magnetron sputtering electron beam coater |
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| CN205803589U true CN205803589U (en) | 2016-12-14 |
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| CN201620762959.3U Active CN205803589U (en) | 2016-07-19 | 2016-07-19 | A kind of dual chamber magnetron sputtering electron beam coater |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108277469A (en) * | 2018-04-02 | 2018-07-13 | 杭州赛威斯真空技术有限公司 | A kind of magnetron sputtering and the compound coating machine of electron beam |
| CN108624859A (en) * | 2018-07-18 | 2018-10-09 | 无锡爱尔华精机有限公司 | A kind of two-sided physical vapor deposition coating film equipment and its principle |
| CN110055507A (en) * | 2019-05-06 | 2019-07-26 | 成都精密光学工程研究中心 | A kind of low defect Multicarity coating apparatus based on multiparticle deposition |
-
2016
- 2016-07-19 CN CN201620762959.3U patent/CN205803589U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108277469A (en) * | 2018-04-02 | 2018-07-13 | 杭州赛威斯真空技术有限公司 | A kind of magnetron sputtering and the compound coating machine of electron beam |
| CN108277469B (en) * | 2018-04-02 | 2023-08-01 | 杭州赛威斯真空技术有限公司 | Magnetron sputtering and electron beam compound type film plating machine |
| CN108624859A (en) * | 2018-07-18 | 2018-10-09 | 无锡爱尔华精机有限公司 | A kind of two-sided physical vapor deposition coating film equipment and its principle |
| CN110055507A (en) * | 2019-05-06 | 2019-07-26 | 成都精密光学工程研究中心 | A kind of low defect Multicarity coating apparatus based on multiparticle deposition |
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