CN108604534B - Apparatus and method for measuring concentration of photoresist component - Google Patents
Apparatus and method for measuring concentration of photoresist component Download PDFInfo
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- CN108604534B CN108604534B CN201680079908.3A CN201680079908A CN108604534B CN 108604534 B CN108604534 B CN 108604534B CN 201680079908 A CN201680079908 A CN 201680079908A CN 108604534 B CN108604534 B CN 108604534B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
- G01N23/223—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material by irradiating the sample with X-rays or gamma-rays and by measuring X-ray fluorescence
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
Abstract
The dissolved photoresist of the recycled photoresist stripper increases and denatures with time, so that the concentration measurement based on the absorbance has a problem of deviating from the standard curve. A photoresist component concentration measuring device is characterized by comprising a measuring unit for specifying an element which is contained in a photoresist but not contained in a photoresist stripping stock solution and measuring the concentration of the specified element in the photoresist stripping solution.
Description
Technical Field
The present invention relates to a photoresist component concentration measuring apparatus and a concentration measuring method for measuring a photoresist concentration in a photoresist stripping liquid used in lithography.
Background
IC. In LSI and the like, miniaturization and multilayering of wiring circuits have been progressing with high integration of semiconductor elements and reduction in chip size. In addition to such minute parts, a minute wiring circuit is required for forming pixels in an FPD (Flat Panel Display) such as a liquid crystal Display. In order to produce such a minute wiring circuit, a photolithography technique is required.
In photolithography, a material film for forming a wiring circuit is formed, and a photoresist is coated on the film. Then, the photoresist is exposed to light in a pattern corresponding to the wiring and removed, and then the material film is etched. Finally, the photoresist is removed. In a positive photoresist, a photoresist stripper is used to remove the photoresist after exposure.
The photoresist stripper is repeatedly used to some extent, so that the photoresist concentration is gradually increased. The repeated use of the photoresist stripper is an economic problem. In addition, there is a problem in quality of the product in that the use is stopped when the concentration of the photoresist is increased to a certain extent.
That is, the photoresist stripper needs to monitor the photoresist concentration during use, and if the photoresist concentration is higher than a predetermined concentration, all or a part of the photoresist stripper is replaced.
For the measurement of the photoresist concentration in the photoresist stripping liquid, some methods are considered. In a factory where mass production is performed, a method capable of determining the photoresist concentration with a certain degree of accuracy in a short time is required.
Patent document 1 discloses a method for determining the photoresist concentration in a photoresist stripping solution from the absorbance. In this method, a phenomenon is utilized in which the absorbance increases as the photoresist concentration in the photoresist stripping liquid increases. That is, the absorbance of the photoresist stripper whose photoresist concentration is known in advance is determined in advance, and the absorbance is plotted as a calibration curve to determine the photoresist concentration.
However, in the concentration measurement based on absorbance, there is a problem that even if the photoresist concentration is constant, the absorbance of the photoresist stripping liquid changes with time. This is considered to be because the photoresist dissolved in the photoresist stripping solution is gradually decomposed into low molecules, and the peak of the absorption spectrum shifts to the lower wavelength side.
In addition, temperature control of the object to be measured is important in concentration measurement based on absorbance.
In the actual manufacturing process, the production is continued while the photoresist stripper is replenished for several weeks. That is, dissolved decomposition components of the photoresist having various absorption spectra are mixed in the photoresist stripping solution. Thus, it can be said that the method of patent document 1 is difficult to measure an accurate photoresist concentration.
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open publication No. H07-235487
Disclosure of Invention
Problems to be solved by the invention
Patent document 1 is a method using absorbance. The photoresist dissolved in the photoresist stripping solution is gradually decomposed into low molecules, and the peak of the absorption spectrum shifts to the low wavelength side. As a result, molecules of photoresist components having various absorption spectra are mixed in the photoresist stripping solution.
As a result, there are problems as follows: the calibration curve obtained in advance by the method using absorbance becomes unusable over time, and accuracy is not sufficient, and the concentration of the photoresist dissolved in the photoresist stripping liquid cannot be accurately grasped. There are also the following problems: the photoresist component of the photoresist stripping solution decomposes, thereby changing the color tone, and causing an error in the concentration measurement.
The present invention has been made to solve the above-described conventional problems, and an object of the present invention is to provide a photoresist component concentration measuring apparatus and a photoresist component concentration measuring method, which are capable of accurately and precisely measuring the concentration of a photoresist dissolved in a photoresist stripping liquid even when the photoresist dissolved in the photoresist stripping liquid is gradually decomposed into low molecules.
Means for solving the problems
In order to achieve the object, the present invention is configured to specify an element contained in a photoresist and not contained in a photoresist stripping solution, and to measure the concentration of the specified element in the photoresist stripping solution.
Specifically, the specified element is sulfur, and more specifically, the amount of sulfur is measured by fluorescent X-ray. More specifically, the concentration of the photoresist component in the photoresist stripping solution is calculated from the measured amount of the fluorescent X-ray.
The composition is used by specifying a component which is contained in the photoresist but not contained in the photoresist stripping stock solution and is not decomposed or changed in the photoresist stripping solution, and measuring the concentration of the specified component in the photoresist stripping solution.
According to this configuration, the concentration of the dissolved resist in the photoresist stripping solution, which is the photoresist dissolved in the photoresist stripping solution, can be measured accurately and precisely.
As the predetermined component, for example, when sulfur is contained in a photosensitive material component of the photoresist and sulfur is not contained in the photoresist stripping stock solution, sulfur is present.
The predetermined component may be an element, a chemical substance, or a chemical component as long as it is contained in the photoresist stripping solution, but is not contained in the photoresist stripping solution, and is not decomposed in the photoresist stripping solution.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present invention, a configuration is employed for specifying an element contained in a photoresist but not contained in a photoresist stripping stock solution and measuring the concentration of the specified element specified in the photoresist stripping solution.
Thus, it is possible to provide a photoresist component concentration measuring apparatus and a photoresist component concentration measuring method capable of accurately and precisely measuring the photoresist concentration in the photoresist stripping liquid, that is, the concentration of the photoresist dissolved in the photoresist stripping liquid, that is, the concentration of the dissolved photoresist.
In addition, even if the color tone is changed by the decomposition of the photoresist component of the photoresist stripping liquid, no error is generated in the concentration measurement.
Drawings
FIG. 1 is a view showing the configuration of a photoresist stripping apparatus equipped with a photoresist component concentration measuring apparatus of the present invention.
Fig. 2 is a diagram showing the configuration of the photoresist component concentration measuring apparatus.
Fig. 3 is a graph showing experimental results obtained by measuring the sulfur concentration in the photoresist stripping liquid using fluorescent X-rays.
Detailed Description
Hereinafter, an apparatus for measuring the concentration of a photoresist component according to the present invention will be described with reference to the drawings. The following description illustrates an embodiment of the present invention, but the present invention is not limited to the following description. And can be freely changed within a scope not departing from the gist of the present invention.
Fig. 1 shows a configuration of a photoresist stripping apparatus 50 to which the apparatus for measuring the concentration of a photoresist component according to the present embodiment is attached. The photoresist stripping apparatus 50 has: a photoresist stripping solution tank 52, a conveyor belt 54 for conveying the object 60 to be processed, a shower 56 for spraying the photoresist stripping solution M on the object 60 to be processed, and a photoresist component concentration measuring apparatus 10.
The photoresist stripper 50 operates as follows. The object to be treated 60 is placed on the conveyor belt 54 and conveyed. Then, the photoresist stripping solution M is spread on the photoresist stripping solution tank 52, and the photoresist is stripped. The photoresist stripper M is recycled.
Components that are contained in the photoresist but not contained in the photoresist stripping solution and that do not decompose or change in the photoresist stripping solution are specified. The predetermined component may be an element, a chemical substance, or a chemical component as long as the photoresist contains, is not contained in the photoresist stripping solution, and is not decomposed or changed in the photoresist stripping solution. Here, the photoresist stripping stock solution refers to an unused photoresist stripping solution after preparation.
For example, in the case where the photoresist contains NQD (naphthoquinone diazide sulfonate) as a photosensitizer and a novolac resin as a polymer resin, the photoresist contains sulfur, that is, a sulfur element.
For example, when the photoresist stripping solution is composed of MEA (monoethanolamine), BDG (diethylene glycol monobutyl ether), and water, the photoresist stripping solution does not contain sulfur, i.e., sulfur element.
When a component or element contained in the photoresist stripping solution but not contained in the photoresist stripping solution is designated as sulfur element, the sulfur element itself does not change even if the component containing sulfur changes by decomposition or the like in the photoresist stripping solution.
Therefore, by measuring the concentration of sulfur, which is a predetermined element, in the photoresist stripping solution, the photoresist concentration in the photoresist stripping solution, that is, the concentration of the photoresist dissolved in the photoresist stripping solution, that is, the concentration of the dissolved photoresist can be calculated, and the concentration of the photoresist dissolved in the photoresist stripping solution can be accurately and precisely measured.
The photoresist stripping liquid M that is recycled is stored in the photoresist stripping liquid tank 52, and is sent to the shower 56 through the shower pipe 56b by the pump 56 a. The shower pipe 56b is preferably provided with a filter 56 c. This is because clogging due to solid components of the photoresist and the like can be prevented.
Then, the object 60 to be processed is returned to the photoresist stripping liquid tank 52 after the photoresist is stripped. This recycles the photoresist stripper M. The photoresist in the photoresist stripping solution M is dissolved in the photoresist stripping solution M after stripping.
This increases the concentration of the dissolved photoresist in the photoresist stripper tank 52 over time. Therefore, when the dissolved photoresist reaches a certain concentration, the photoresist stripper M in the photoresist stripper tank 52 is partially or entirely replaced with a new photoresist stripper stock solution.
The photoresist component concentration measuring apparatus 10 of the present invention takes out the photoresist stripping solution M from the photoresist stripping solution tank 52, measures the amount of sulfur as a predetermined element in the dissolved photoresist, and returns the measured amount to the photoresist stripping solution tank 52 again.
The reference numeral 12i denotes an inlet port of the photoresist stripping liquid M, and the reference numeral 18o denotes an outlet port for returning the photoresist stripping liquid M, in which the amount of sulfur in the dissolved photoresist is measured, to the photoresist stripping liquid tank 52.
Although not shown, the photoresist stripping liquid M after the amount of sulfur is measured may be discharged outside the system and not returned to the photoresist stripping liquid tank 52.
Fig. 2 shows the configuration of the photoresist component concentration measuring apparatus 10. The photoresist component concentration measuring apparatus 10 includes: an extraction pipe 12 communicating with the photoresist stripping solution tank 52, the extraction pipe 12, a measurement unit 14 for measuring the photoresist stripping solution M passing through the extraction pipe 12, and a return pipe 18 for returning the photoresist stripping solution M to the photoresist stripping solution tank 52.
Further, the present invention also includes: a fluorescent X-ray measuring device 20 serving as a measuring means for measuring the amount of sulfur as a predetermined element in the photoresist stripping liquid M in the measuring section 14; and a controller 30 as a calculating means for calculating the concentration of the photoresist component in the photoresist stripping liquid M based on the sulfur amount measurement value of the fluorescent X-ray measuring device 20.
The extraction pipe 12 takes out a part of the photoresist stripping solution M from the photoresist stripping solution tank 52. Further, a pump 12a for feeding the photoresist stripper M is provided in the extraction pipe 12. The pump 12a adjusts the pressure in the extraction pipe 12 so that the photoresist stripping liquid M is processed without hindrance by the measurement unit 14 provided on the downstream side.
The measurement unit 14 as a measurement means is a fluorescent X-ray measurement device 20 continuously provided in the extraction pipe 12 for measuring the amount of sulfur in the photoresist stripping liquid M, that is, the amount of sulfur. In fig. 2, the portion is continuously provided in the extraction pipe 12. In order to irradiate the photoresist stripping liquid M with X-rays from the fluorescent X-ray measurement device 20, the measurement unit 14 uses a material that transmits X-rays.
The form of the measuring unit 14 as the measuring means is not particularly limited. For example, the following modes are considered: a tube for observing a resin through which X-rays are transmitted from fluorescent X-rays is provided as a measurement portion 14, and is connected to the extraction pipe 12, or a measurement container for temporarily storing the photoresist stripping liquid M from the extraction pipe 12 is continuously provided in the extraction pipe 12.
In the present embodiment, a case will be described in which the measurement unit 14 is configured by a pipe (hereinafter referred to as "transmission pipe") 24 through which the X-rays that communicate with the extraction pipe 12 are transmitted.
In this configuration, the amount of sulfur in the photoresist stripping liquid M flowing through the permeation pipe 24 is measured. The transmission pipe 24 is made of a material which is not easily deteriorated in the photoresist stripping solution and transmits the fluorescent X-ray. Examples thereof include fluororesin, polyester, polypropylene, and the like, and are composed of a material which transmits fluorescent X-rays when measuring sulfur by fluorescent X-rays.
The transmission pipe 24 may not be entirely made of a material that transmits X-rays. That is, the transmission pipe 24 may be formed only in the portion where the X-ray is irradiated and the fluorescent X-ray is generated, and the other portion may be formed of a metal pipe made of stainless steel or the like. Further, only a part of the extraction pipe 12 may be made of a pipe material that transmits X-rays.
The photoresist stripping solution M obtained from the extraction pipe 12 may be temporarily received in a measurement container, and the amount of sulfur in the photoresist stripping solution in the container may be measured.
The return pipe 18 communicates with the permeation pipe 24. Therefore, the photoresist stripping liquid M sucked up from the photoresist stripping liquid tank 52 by the pump 12a passes through the lead-out pipe 12, passes through the permeation pipe 24, and is returned to the photoresist stripping liquid tank 52 through the return pipe 18.
The fluorescent X-ray measuring device 20 as a measuring unit measures sulfur (S) as a predetermined specified element in the photoresist stripping liquid M. Positive photoresists are composed of NQD (naphthoquinone diazide sulfonate) of a photosensitizer and a novolac resin.
The sensitized NQDs are converted to indene carboxylic acid in the presence of alcohol and dissolved in an alkaline solution. Thus, the binding of the novolak resins is interrupted, and the photosensitive photoresist is peeled off and dissolved by the alkali solution.
The photoresist stripping liquid M is composed of a new liquid that is a stock solution of the photoresist stripping liquid M, a dissolved novolac resin, and dissolved NQDs including those whose structures have been changed by dissolution. The dissolved novolak resin and the dissolved NQDs, including also the NQDs that dissolved to change the structure, are referred to as photoresist components. The photoresist component is dissolved photoresist.
These photoresist components, i.e., the soluble photoresist, are not all in a single form, but include those having a large block size or a basic structure which dissolves and decomposes into a novolak resin.
Then, a new photoresist component is added as the photoresist stripper M is circulated. Further, as time passes, a photoresist component as a dissolved photoresist is decomposed and changed.
However, the amount of sulfur present in the NQDs did not change. Therefore, by measuring the amount of sulfur in the photoresist stripping liquid M, the concentration of the photoresist component in the photoresist stripping liquid M, that is, the dissolved photoresist concentration can be stably measured.
Here, the amount of sulfur, that is, the amount of sulfur, can be measured by measuring the intensity of fluorescent X-rays of sulfur. That is, the amount of sulfur may be the intensity of characteristic X-rays of sulfur (kcps).
As described above, the photoresist component concentration measuring apparatus of the present invention uses sulfur in the photoresist component as an index of the concentration of the photoresist component, i.e., the dissolved photoresist concentration. Therefore, if the components in the photoresist stripping solution contain a sulfate group, the concentration of the photoresist component cannot be accurately measured.
As described above, the photoresist stripping solution is often used by discarding or discharging a part of the used photoresist stripping solution and replenishing a new solution or a regeneration solution as a photoresist stripping stock solution to the remainder.
When sulfur is contained in the photoresist stripping stock solution, it is not distinguished whether the current amount of sulfur is derived from the photoresist component or the photoresist stripping solution itself.
Therefore, the apparatus 10 for measuring the concentration of a photoresist component of the present invention can be used when the photoresist stripping solution is composed of only a material having no sulfur element.
The concentration of the specified element in the photoresist stripping solution is measured.
Thus, since the element itself is not decomposed or changed in the photoresist stripping solution, even if the dissolved resist dissolved in the photoresist stripping solution is decomposed, the dissolved resist concentration in the photoresist stripping solution can be accurately determined.
Fig. 2 shows a case where the X-ray irradiation unit and the light receiving unit are integrated with each other for the detection unit 20a of the fluorescent X-ray measurement device 20. However, the irradiation unit and the light receiving unit may be configured separately.
The controller 30 may be provided to convert the amount of sulfur in the photoresist stripper M measured by the fluorescent X-ray measuring device 20 into a concentration. The controller 30 calculates the concentration of the photoresist component in the photoresist stripping liquid M based on the flow rate of the photoresist stripping liquid M in the transmission pipe 24 and the measured amount of sulfur obtained by the fluorescent X-ray measuring device 20, and displays the calculated concentration on the display 30 a.
The photoresist component concentration can be calculated as follows. First, a calibration liquid having a determined photoresist component concentration is flowed through the permeation pipe 24 at a predetermined flow rate. Then, the measurement is performed by the fluorescent X-ray measuring device 20.
From this measurement, a standard curve of the photoresist component concentration with respect to the measured sulfur amount was obtained. The concentration of the photoresist component in the photoresist stripping liquid M can be calculated based on the calibration curve.
The controller 30 may have a transmission line 30b that transmits a signal to other devices when the photoresist composition concentration reaches a certain value. In order to replace all or a part of the photoresist stripping liquid M in the photoresist stripping liquid tank 52 when the concentration of the photoresist component in the photoresist stripping liquid M reaches a certain value.
The operation of the photoresist component concentration measuring apparatus 10 having the above-described configuration will be described. The photoresist stripping solution M is sent to a photoresist component concentration measuring apparatus 10 (see fig. 1) through a lead-out pipe 12.
The pump 12a adjusts the internal pressure in the extraction pipe 12, and the photoresist stripping liquid M is sent to the transmission pipe 24. The photoresist stripping liquid M that has passed through the transmission pipe 24 is returned to the photoresist stripping liquid tank 52 through the return pipe 18.
The fluorescent X-ray measurement device 20 measures the amount of sulfur in the photoresist stripping liquid M flowing through the transmission pipe 24 in accordance with the instruction of the controller 30. And the measured value is notified to the controller 30.
The controller 30 calculates the sulfur concentration in the photoresist stripper M using a previously prepared calibration curve. Therefore, the controller 30 performing such an operation can be said to be a calculating means. The calculated sulfur concentration is displayed on the display 30 a. And is transmitted (30b) as a signal to another device.
As described above, the apparatus 10 for measuring the concentration of a photoresist component in the photoresist stripping liquid M measures the concentration of a photoresist component in the photoresist stripping liquid M based on, for example, sulfur atoms in a photoresist not contained in the stock solution of the photoresist stripping liquid but contained in a dissolved photoresist, and therefore, even if the dissolved resist component in the photoresist stripping liquid M is decomposed, changes with time, and/or changes in color tone, accurate concentration measurement can be performed.
Examples
The following shows experimental results obtained by measuring the photoresist composition with a fluorescent X-ray measuring apparatus. As the analyzer, a scanning type fluorescent X-ray analyzer (ZSX PrimusII) manufactured by Rigaku Corporation was used.
The photoresist stripping solution was composed of MEA (monoethanolamine) 19%, BDG (diethylene glycol monobutyl ether) 60%, and water 21%. No sulfur element is present in any material.
As the photoresist component of the sample, a positive photoresist using a novolak resin was used, which was exposed to light and dried to be powdered. Sulfur is made the designated element.
< Experimental method >
For the photoresist stripper, the photoresist components (powder) of the sample were dissolved to prepare a simulated photoresist stripper of 0.1, 0.3, 0.6, 1.0 wt%. Then, the X-ray (K α ray) intensity of only sulfur of each of the simulated photoresist stripping liquids was measured by the above-mentioned analyzer. The results are shown in FIG. 3.
In fig. 3, the horizontal axis represents the concentration of the photoresist component (expressed as "PR addition concentration [ wt% ]") as the concentration of the dissolved photoresist, and the vertical axis represents the intensity of the fluorescent X-rays (expressed as "X-ray intensity (kcps)").
Referring to fig. 3, the photoresist additive concentration to the stripping solution has a high positive correlation with the X-ray intensity from sulfur (S) in a wide range from a low concentration of 0.1 wt% or less to a high concentration of 1.0 wt%. Further, the same product was left for 1 week and re-measured, and no change was observed.
The graph shows the results of measuring the concentration of the photoresist component, that is, the amount of sulfur in the photoresist stripper in which the concentration of the dissolved photoresist is known in advance, with fluorescent X-rays. Which can be used as a calibration curve as a calculation unit.
When the concentration of the photoresist component, that is, the amount of sulfur in the photoresist stripper in which the concentration of the dissolved photoresist is unknown is measured by the fluorescent X-ray, the concentration of the photoresist component can be determined from the intensity of the X-ray by a reverse method.
The concentration can also be calculated in this way. The calibration curve may be a table composed of numerical data instead of the graph shown in fig. 3.
Industrial applicability
The apparatus for measuring the concentration of a photoresist component of the present invention can be suitably used in a photoresist stripping step for performing microfabrication using photolithography.
Description of the reference numerals
10 apparatus for measuring concentration of photoresist component
12 lead-out piping
12a pump
12i suction inlet
14 measurement unit
18 return piping
18o discharge outlet
20 fluorescent X-ray measuring apparatus
20a detection part
24-permeation piping
30 controller
30a display
30b transmission line
50 photoresist stripping device
52 Photoresist stripping liquid bath
54 conveyor belt
56 spray shower
60 object to be treated
56a pump
56b spray piping
56c Filter
M photoresist stripping liquid
Claims (9)
1. A photoresist component concentration measuring device used in a photoresist stripping device, the photoresist stripping device comprising:
photoresists comprising NQDs, naphthoquinone diazide sulfonate ester, and novolak resins; and
a photoresist stripping solution tank used for a photoresist stripping solution containing no sulfur element,
the amount of sulfur in the photoresist stripping solution was measured using a fluorescent X-ray measuring apparatus.
2. The apparatus for measuring the concentration of a photoresist component according to claim 1, comprising a calculating means for calculating the concentration of a photoresist component in the photoresist stripping liquid based on the amount measured by the fluorescent X-ray measuring device.
3. The apparatus for measuring the concentration of a photoresist component according to claim 2, wherein the measurement is performed by an extraction pipe communicating with the photoresist stripper tank and a measurement unit provided in the extraction pipe.
4. The apparatus for measuring concentration of a photoresist component according to claim 3, comprising an X-ray transmitting pipe communicating with the extraction pipe.
5. The apparatus for measuring concentration of a photoresist component according to claim 3, comprising a measuring container for receiving the photoresist stripper discharged from the extraction pipe.
6. A method for measuring the concentration of a photoresist component, which is used in a photoresist stripping apparatus, the photoresist stripping apparatus comprising:
photoresists comprising NQDs, naphthoquinone diazide sulfonate ester, and novolak resins; and
a photoresist stripping solution tank for a photoresist stripping solution containing no sulfur element,
the amount of sulfur in the photoresist stripping solution was measured using a fluorescent X-ray measuring apparatus.
7. The method of measuring the concentration of a photoresist component according to claim 6, comprising a calculation step of calculating the concentration of a photoresist component in the photoresist stripping liquid based on the amount of sulfur.
8. The method of claim 7, wherein the photoresist stripping solution is taken out from the photoresist stripping solution tank and the amount of sulfur in the flowing photoresist stripping solution taken out is measured.
9. The method of measuring the concentration of a photoresist component according to claim 7, wherein the amount of sulfur is measured after the photoresist stripping liquid is taken out from the photoresist stripping liquid tank and the taken-out photoresist stripping liquid is temporarily stored in a measuring container.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016012558A JP6643710B2 (en) | 2016-01-26 | 2016-01-26 | Photoresist component concentration measuring device and concentration measuring method |
| JP2016-012558 | 2016-01-26 | ||
| PCT/JP2016/088687 WO2017130620A1 (en) | 2016-01-26 | 2016-12-26 | Photoresist component concentration measurement device and concentration measurement method |
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| CN108604534A CN108604534A (en) | 2018-09-28 |
| CN108604534B true CN108604534B (en) | 2022-06-21 |
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| JP (1) | JP6643710B2 (en) |
| CN (1) | CN108604534B (en) |
| TW (1) | TWI697743B (en) |
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- 2016-12-26 WO PCT/JP2016/088687 patent/WO2017130620A1/en active Application Filing
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| JP2014096462A (en) * | 2012-11-08 | 2014-05-22 | Panasonic Corp | Device for measuring photoresist concentration and measuring method |
| JP2015162659A (en) * | 2014-02-28 | 2015-09-07 | 芝浦メカトロニクス株式会社 | Processing device and processing method |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017130620A1 (en) | 2017-08-03 |
| JP2017135204A (en) | 2017-08-03 |
| JP6643710B2 (en) | 2020-02-12 |
| TW201736987A (en) | 2017-10-16 |
| CN108604534A (en) | 2018-09-28 |
| TWI697743B (en) | 2020-07-01 |
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