CN108538735B - 金属凸块装置及其制造方法 - Google Patents

金属凸块装置及其制造方法 Download PDF

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CN108538735B
CN108538735B CN201710118714.6A CN201710118714A CN108538735B CN 108538735 B CN108538735 B CN 108538735B CN 201710118714 A CN201710118714 A CN 201710118714A CN 108538735 B CN108538735 B CN 108538735B
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metal
layer
metal layer
recess
metal bump
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CN108538735A (zh
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薛兴涛
何智清
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Semiconductor Manufacturing International Shanghai Corp
Semiconductor Manufacturing International Beijing Corp
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Semiconductor Manufacturing International Shanghai Corp
Semiconductor Manufacturing International Beijing Corp
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Priority to CN201710118714.6A priority Critical patent/CN108538735B/zh
Priority to US15/891,745 priority patent/US10312208B2/en
Publication of CN108538735A publication Critical patent/CN108538735A/zh
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Abstract

本发明公开了一种金属凸块装置及其制造方法，涉及半导体技术领域。该制造方法包括：提供衬底结构，该衬底结构包括：衬底和在该衬底之上的金属层，该金属层具有凹口；通过植球工艺在该金属层的凹口上形成金属凸块；以及通过印刷工艺在该金属凸块上形成焊膏。相比现有技术中的化学电镀方法，本发明的上述方法所需要时间更短，效率更高，并且成本更低。

Description

金属凸块装置及其制造方法
技术领域
本发明涉及半导体技术领域，特别涉及一种金属凸块装置及其制造方法。
背景技术
在现在的半导体封装工艺过程中，需要在晶圆上制造铜柱凸块(Copper PillarBump)。目前，铜柱凸块主要通过化学电镀的方法获得。但是这样的电镀工艺所需时间很长(例如，有时需要60至70分钟)，而且电镀机台比较昂贵。这导致制造工艺的效率较低而且生产成本较高。
发明内容
本发明的发明人发现上述现有技术中存在问题，并因此针对所述问题中的至少一个问题提出了一种新的技术方案。
根据本发明的第一方面，提供了一种金属凸块装置的制造方法，包括：提供衬底结构，所述衬底结构包括：衬底和在所述衬底之上的金属层，所述金属层具有凹口；通过植球工艺在所述金属层的凹口上形成金属凸块；以及通过印刷工艺在所述金属凸块上形成焊膏。
在一个实施例中，所述方法还包括：在形成所述焊膏后执行回流处理。
在一个实施例中，通过植球工艺在所述金属层的凹口上形成金属凸块的步骤包括：在所述金属层上方设置植球网版，所述植球网版具有与所述凹口相对准的第一网孔；经由所述第一网孔在所述凹口中形成助焊剂；经由所述第一网孔利用所述助焊剂在所述凹口上粘结金属凸块；以及去除所述植球网版。
在一个实施例中，其中，所述第一网孔的大小为所述凹口大小的70％至90％。
在一个实施例中，通过印刷工艺在所述金属凸块上形成焊膏的步骤包括：在所述金属凸块上方设置印刷网版，所述印刷网版具有与所述金属凸块相对准的第二网孔；经由所述第二网孔在所述金属凸块上形成焊膏；以及去除所述印刷网版。
在一个实施例中，所述金属凸块的材料包括：铜；所述焊膏的材料包括：锡或锡银。
在一个实施例中，所述金属凸块的直径为60μm至100μm，长度为60μm至150μm。
在一个实施例中，在提供衬底结构的步骤中，所述衬底结构还包括：在所述衬底上的衬垫层；在所述衬垫层的部分上的绝缘物层；以及在所述绝缘物层上的钝化层，所述钝化层具有露出所述衬垫层的开口和在所述开口边缘上的凸出部，所述凸出部与被露出的所述衬垫层的上表面形成凹陷；其中，所述金属层形成在所述钝化层和所述衬垫层上，所述金属层的位于所述凹陷内的部分形成凹口。
在一个实施例中，所述方法还包括：去除所述金属层的位于所述凹陷之外的部分。
在一个实施例中，所述金属层包括：在所述衬底之上的第一金属层和在所述第一金属层上的第二金属层；其中，所述金属凸块形成在所述第二金属层上。
本发明的上述制造方法中，通过植球工艺在金属层的凹口上形成金属凸块，并且通过印刷工艺在金属凸块上形成焊膏。相比现有技术中的化学电镀方法，本发明的上述方法所需要时间更短，效率更高，并且成本更低。
根据本发明的第二方面，提供了一种金属凸块装置，包括：衬底；在所述衬底之上的金属层，所述金属层具有凹口；通过植球工艺在所述金属层的凹口上形成的金属凸块；以及通过印刷工艺在所述金属凸块上形成的焊膏。
在一个实施例中，其中，所述金属凸块与所述金属层通过助焊剂粘结在一起。
在一个实施例中，所述金属凸块的材料包括：铜；所述焊膏的材料包括：锡或锡银。
在一个实施例中，所述金属凸块的直径或宽度小于所述凹口的宽度。
在一个实施例中，所述金属凸块的直径为60μm至100μm，长度为60μm至150μm。
在一个实施例中，所述金属凸块还包括：在所述衬底上的衬垫层；在所述衬垫层的部分上的绝缘物层；以及在所述绝缘物层上的钝化层，所述钝化层具有露出所述衬垫层的开口和在所述开口边缘上的凸出部，所述凸出部与被露出的所述衬垫层的上表面形成凹陷；其中，所述金属层在所述凹陷上，并且形成凹口。
在一个实施例中，所述金属层包括：在所述衬底之上的第一金属层和在所述第一金属层上的第二金属层；其中，所述金属凸块在所述第二金属层上。
本发明的上述金属凸块装置，相比现有的金属凸块装置，具有制造工艺简单、制造时间更短、效率更高以及成本更低的优点。
通过以下参照附图对本发明的示例性实施例的详细描述，本发明的其它特征及其优点将会变得清楚。
附图说明
构成说明书的一部分的附图描述了本发明的实施例，并且连同说明书一起用于解释本发明的原理。
参照附图，根据下面的详细描述，可以更加清楚地理解本发明，其中：
图1是示出根据本发明一个实施例的金属凸块装置的制造方法的流程图。
图2至图11是示意性地示出根据本发明一个实施例的金属凸块装置的制造过程中若干阶段的结构的横截面图。
具体实施方式
现在将参照附图来详细描述本发明的各种示例性实施例。应注意到：除非另外具体说明，否则在这些实施例中阐述的部件和步骤的相对布置、数字表达式和数值不限制本发明的范围。
同时，应当明白，为了便于描述，附图中所示出的各个部分的尺寸并不是按照实际的比例关系绘制的。
以下对至少一个示例性实施例的描述实际上仅仅是说明性的，决不作为对本发明及其应用或使用的任何限制。
对于相关领域普通技术人员已知的技术、方法和设备可能不作详细讨论，但在适当情况下，所述技术、方法和设备应当被视为授权说明书的一部分。
在这里示出和讨论的所有示例中，任何具体值应被解释为仅仅是示例性的，而不是作为限制。因此，示例性实施例的其它示例可以具有不同的值。
应注意到：相似的标号和字母在下面的附图中表示类似项，因此，一旦某一项在一个附图中被定义，则在随后的附图中不需要对其进行进一步讨论。
图1是示出根据本发明一个实施例的金属凸块装置的制造方法的流程图。
在步骤S102，提供衬底结构，该衬底结构包括：衬底和在该衬底之上的金属层，该金属层具有凹口。
在步骤S104，通过植球工艺在金属层的凹口上形成金属凸块。
例如，该金属凸块的材料可以包括：铜等。该金属凸块的直径可以为60μm至100μm(例如，70μm、80μm或90μm等)，长度可以为60μm至150μm(例如90μm、110μm或140μm等)。该金属凸块的形状可以为长方体状或者圆柱体状等。
可选地，该步骤S104可以包括：在金属层上方设置植球网版，该植球网版具有与凹口相对准的第一网孔。例如，该第一网孔的大小可以为凹口大小的70％至90％。优选地，该第一网孔的大小为凹口大小的80％。一方面，该第一网孔不会因为太大而使得在后续形成助焊剂时导致助焊剂太多而溢出凹口，从而可以防止不同凹口中的助焊剂相连；另一方面，该第一网孔不会因为太小而在形成金属凸块时不能保证金属凸块被下放到凹口中。
可选地，该步骤S104还可以包括：经由第一网孔在凹口中形成助焊剂。例如，可以经由第一网孔向凹口中注入助焊剂。
可选地，该步骤S104还可以包括：经由第一网孔利用助焊剂在凹口上粘结金属凸块。
可选地，该步骤S104还可以包括：去除植球网版。
在步骤S106，通过印刷工艺在金属凸块上形成焊膏。
可选地，该步骤S106可以包括：在金属凸块上方设置印刷网版，该印刷网版具有与金属凸块相对准的第二网孔。
可选地，该步骤S106还可以包括：经由第二网孔在金属凸块上形成焊膏。例如，可以将焊膏涂覆在印刷网版上，然后利用刮板将位于第二网孔之外的焊膏刮掉，从而在第二网孔中且在金属凸块上表面上形成了焊膏。该焊膏的材料可以包括：锡或锡银等。
可选地，该步骤S106还可以包括：去除印刷网版。
在上述实施例中，提供一种金属凸块装置的制造方法。该制造方法中，通过植球工艺在金属层的凹口上形成金属凸块，并且通过印刷工艺在金属凸块上形成焊膏。相比现有技术中的化学电镀方法，本发明的上述方法所需要时间更短，效率更高，并且由于不需要电镀设备而成本更低。
在一个实施例中，上述制造方法还可以包括：在形成焊膏后执行回流处理。该回流处理可以使得焊膏成型(例如焊膏回缩成圆柱体状)，并且可以使得焊膏与金属凸块的界面间发生化学反应，从而增加焊膏与金属凸块的接合力。另外，该回流处理(由于温度较高)还可以使得助焊剂的粘结力更大，从而将金属凸块更牢固地粘结在金属层上。
例如，该回流处理的温度范围可以是240℃至250℃，例如回流处理的温度可以为245℃等。
图2至图11是示意性地示出根据本发明一个实施例的金属凸块装置的制造过程中若干阶段的结构的横截面图。下面结合图2至图11详细描述根据本发明一个实施例的金属凸块装置的制造过程。
首先，如图2所示，提供衬底结构。在一个实施例中，该衬底结构可以包括衬底201。例如，该衬底可以为硅衬底。该衬底结构还可以包括在该衬底201上的衬垫层202。例如该衬垫层202的材料可以包括铝等。该衬底结构还可以包括在衬垫层202的部分上的绝缘物层203。这里，绝缘物层203并没有将衬垫层202全部覆盖。例如该绝缘物层的材料可以包括二氧化硅。该衬底结构还可以包括在绝缘物层203上的钝化层(例如氮化硅)204。该钝化层204具有露出衬垫层202的开口205和在开口205边缘上的凸出部214。该凸出部214与被露出的衬垫层202的上表面形成凹陷。在一个实施例中，在提供图2所示的衬底结构后，可以对该衬底结构进行预清洁处理，以清除衬底结构上可能存在的杂物等。
接下来，如图3所示，例如通过溅射工艺在钝化层204和衬垫层202的被露出部分上形成金属层310。即，在该衬底结构中，该金属层310形成在钝化层204和衬垫层202上，该金属层310的位于凹陷内的部分形成凹口315。例如，该金属层310的材料可以包括：Ti(钛)/Cu(铜)或者Ti(钛)/Cu(铜)/Ni(镍)等。
在一个实施例中，该金属层310可以包括：在衬底201之上(例如在钝化层204和衬垫层202上)的第一金属层311和在该第一金属层311上的第二金属层312。例如，第一金属层的材料可以包括钛，第二金属层的材料可以包括铜。在一个实施例中，该第一金属层和该第二金属层的厚度可以分别为零点几微米，例如，第一金属层的厚度为0.1μm，第二金属层的厚度为0.3μm。
在另一个实施例中，该金属层还可以包括在第二金属层上的第三金属层(图中未示出，例如该第三金属层的材料可以包括铜等)，该第三金属层的厚度大于第二金属层的厚度，这样可以增加金属层的厚度，从而可以增加凹口的平整度。例如第三金属层的厚度可以为3μm至4μm。例如，形成该第三金属层的过程可以包括：在第二金属层上形成图案化的掩模层(例如光刻胶)，该掩模层覆盖第二金属层的位于凹口315之外的部分，露出该凹口315；然后在被露出的凹口上形成第三金属层；接下来去除该掩模层。通过该过程，可以在第二金属层的凹口上形成第三金属层，从而部分地增加了金属层的厚度。
接下来，如图4所示，在金属层310上方设置植球网版420，该植球网版420具有与凹口315相对准的第一网孔421。该第一网孔的大小适合于金属凸块的宽高比，保证金属凸块能够垂直落入凹口内。例如，该第一网孔的大小可以为凹口大小的70％至90％。优选地，该第一网孔的大小为凹口大小的80％。
接下来，如图4所示，经由第一网孔421在凹口315中形成助焊剂431。例如，可以经由第一网孔421向凹口315中注入助焊剂431。
接下来，如图5所示，经由第一网孔421利用助焊剂431在凹口上粘结金属凸块432。即利用助焊剂431将金属凸块432与金属层310粘结在一起。在该实施例中，金属凸块432形成在第二金属层312上。在另一个实施例中，在第二金属层上形成有第三金属层的情况下，则金属凸块432形成在第三金属层上。例如，该金属凸块432可以为铜柱凸块。在一个实施例中，金属凸块432的直径或宽度小于凹口315的宽度。
接下来，如图6所示，去除植球网版420。
接下来，如图7所示，在金属凸块432上方设置印刷网版540，该印刷网版540具有与金属凸块相对准的第二网孔542。
接下来，如图8所示，经由第二网孔542在金属凸块432上形成焊膏650。例如，如图8所示，可以将焊膏650涂覆在印刷网版540上，然后利用刮板545将位于第二网孔之外的焊膏650刮掉，从而在第二网孔542中且在金属凸块432上表面上形成了焊膏650。例如，该焊膏650可以为锡焊膏或者锡银焊膏。
接下来，如图9所示，去除印刷网版540。
接下来，如图10所示，例如通过刻蚀工艺去除金属层310的位于凹陷之外的部分。
接下来，如图11所示，在形成焊膏650后执行回流处理。该回流处理可以使得焊膏650成型，例如焊膏650回缩成圆柱体状，并且可以使得焊膏650与金属凸块432的界面间发生化学反应，从而增加焊膏650与金属凸块432的接合力。另外，该回流处理还可以使得助焊剂431的粘结力更大，从而将金属凸块432更牢固地粘结在金属层310上。
至此，提供一种金属凸块装置的制造方法。相比现有技术中的化学电镀方法，本发明的上述方法所需要时间更短，效率更高，并且由于不需要电镀设备而成本更低。
此外，在金属凸块装置形成之后，还可以在出货前对金属凸块装置进行出货质量管控(Outgoing quality control，简称为OQC)，例如利用光学检测设备对晶圆缺陷进行检测，然后去掉有问题的芯片，从而提供良好的芯片给后端封装。
由本发明的制造方法，还形成了一种金属凸块装置。例如如图11所示，该金属凸块装置可以包括：衬底201和在该衬底201之上的金属层310，该金属层310具有凹口315。在一个实施例中，该金属层310可以包括：在衬底201之上的第一金属层311和在该第一金属层311上的第二金属层312。
如图11所示，该金属凸块装置还可以包括：通过植球工艺在金属层310的凹口上形成的金属凸块432。其中，该金属凸块432与该金属层310通过助焊剂431粘结在一起。例如该金属凸块432的材料可以包括：铜等。该金属凸块的形状可以为长方体状或者圆柱体状等。该金属凸块可以起到支撑和导电的作用。
在一个实施例中，金属凸块432可以在第二金属层312上。在另一个实施例中，金属层310还可以包括在第二金属层312上的第三金属层(图中未示出)，在这样的情况下，金属凸块432可以在第三金属层上。
在一个实施例中，金属凸块432的直径或宽度小于凹口315的宽度，这样有利于金属凸块能够准确植入凹口内。这与现有技术中利用化学电镀工艺形成的金属凸块不同，一般情况下，利用化学电镀制造的金属凸块的直径或宽度大于凹口的宽度。
例如，该金属凸块432的直径可以为60μm至100μm(例如，70μm、80μm或90μm等)，长度可以为60μm至150μm(例如90μm、110μm或140μm等)。
如图11所示，该金属凸块装置还可以包括：通过印刷工艺在金属凸块432上形成的焊膏650。例如，该焊膏的材料可以包括：锡或锡银等。该焊膏650可以为圆柱体状或其他形状。该焊膏可以用于与其他部件进行粘结。
在一个实施例中，如图11所示，该金属凸块装置还可以包括：在衬底201上的衬垫层202。
在一个实施例中，如图11所示，该金属凸块装置还可以包括：在该衬垫层202的部分上的绝缘物层203。该绝缘物层203并没有将衬垫层202全部覆盖。
在一个实施例中，如图11所示，该金属凸块装置还可以包括：在绝缘物层203上的钝化层204。该钝化层204具有露出衬垫层202的开口和在该开口边缘上的凸出部214。该凸出部214与被露出的衬垫层的上表面形成凹陷。其中，金属层310在该凹陷上，并且形成凹口315。
本发明的金属凸块装置，相比现有的金属凸块装置，具有制造工艺简单、制造时间更短、效率更高以及成本更低的优点。
至此，已经详细描述了根据本发明的制造金属凸块装置的方法和所形成的金属凸块装置。为了避免遮蔽本发明的构思，没有描述本领域所公知的一些细节。本领域技术人员根据上面的描述，完全可以明白如何实施这里公开的技术方案。
虽然已经通过示例对本发明的一些特定实施例进行了详细说明，但是本领域的技术人员应该理解，以上示例仅是为了进行说明，而不是为了限制本发明的范围。本领域的技术人员应该理解，可在不脱离本发明的范围和精神的情况下，对以上实施例进行修改。本发明的范围由所附权利要求来限定。

Claims (9)

1.一种金属凸块装置的制造方法，其特征在于，包括：
提供衬底结构，所述衬底结构包括：衬底和在所述衬底之上的金属层，所述金属层具有凹口；
通过植球工艺在所述金属层的凹口上形成金属凸块；以及
通过印刷工艺在所述金属凸块上形成焊膏；
其中，通过植球工艺在所述金属层的凹口上形成金属凸块的步骤包括：
在所述金属层上方设置植球网版，所述植球网版具有与所述凹口相对准的第一网孔；
经由所述第一网孔在所述凹口中形成助焊剂；
经由所述第一网孔利用所述助焊剂在所述凹口上粘结金属凸块；以及
去除所述植球网版。
2.根据权利要求1所述的方法，其特征在于，还包括：
在形成所述焊膏后执行回流处理。
3.根据权利要求1所述的方法，其特征在于，
其中，所述第一网孔的大小为所述凹口大小的70％至90％。
4.根据权利要求1所述的方法，其特征在于，通过印刷工艺在所述金属凸块上形成焊膏的步骤包括：
在所述金属凸块上方设置印刷网版，所述印刷网版具有与所述金属凸块相对准的第二网孔；
经由所述第二网孔在所述金属凸块上形成焊膏；以及
去除所述印刷网版。
5.根据权利要求1所述的方法，其特征在于，
所述金属凸块的材料包括：铜；
所述焊膏的材料包括：锡或锡银。
6.根据权利要求1所述的方法，其特征在于，
所述金属凸块的直径为60μm至100μm，长度为60μm至150μm。
7.根据权利要求1所述的方法，其特征在于，在提供衬底结构的步骤中，所述衬底结构还包括：
在所述衬底上的衬垫层；
在所述衬垫层的部分上的绝缘物层；以及
在所述绝缘物层上的钝化层，所述钝化层具有露出所述衬垫层的开口和在所述开口边缘上的凸出部，所述凸出部与被露出的所述衬垫层的上表面形成凹陷；
其中，所述金属层形成在所述钝化层和所述衬垫层上，所述金属层的位于所述凹陷内的部分形成凹口。
8.根据权利要求7所述的方法，其特征在于，还包括：
去除所述金属层的位于所述凹陷之外的部分。
9.根据权利要求1所述的方法，其特征在于，
所述金属层包括：在所述衬底之上的第一金属层和在所述第一金属层上的第二金属层；其中，所述金属凸块形成在所述第二金属层上。
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