CN108538718B - Cutting device - Google Patents
Cutting device Download PDFInfo
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- CN108538718B CN108538718B CN201810159197.1A CN201810159197A CN108538718B CN 108538718 B CN108538718 B CN 108538718B CN 201810159197 A CN201810159197 A CN 201810159197A CN 108538718 B CN108538718 B CN 108538718B
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- 238000005520 cutting process Methods 0.000 title claims abstract description 170
- 238000001514 detection method Methods 0.000 claims abstract description 13
- 238000003754 machining Methods 0.000 claims description 18
- 238000009966 trimming Methods 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 238000003384 imaging method Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Milling Processes (AREA)
Abstract
A cutting device is provided, which is easy for an operator to identify a position where the load current value of a spindle on which a cutting tool is mounted becomes high when cutting an object to be machined. The cutting device (1) is provided with: a main shaft (111) which is rotationally driven; and a cutting tool (113) that is attached to the front end of the spindle (111) and cuts the workpiece (W) held by the chuck table (10), wherein the cutting device (1) cuts the workpiece (W) along a line to be cut, and wherein the cutting device (1) comprises: a load current value detection means (15) that detects the load current value of the spindle (111) during cutting; and a display unit (18) that displays the load current value detected by the load current value detection unit (15). A line to be processed is displayed on a display unit (18) in correspondence with the load current value of a spindle (111) when the line to be processed is processed.
Description
Technical Field
The present invention relates to a cutting device for cutting a workpiece.
Background
In a cutting device, a cutting tool is cut into a line to be machined of a workpiece to perform cutting. The cutting tool is mounted on a spindle, and the cutting tool is rotated by the rotation of the spindle.
In cutting processing by a cutting tool, when the cutting tool is worn and the cutting ability is lowered, a problem such as chipping may occur in a workpiece. Accordingly, in a cutting device, a load current value of a spindle is monitored while the spindle is controlled to rotate at a constant rotational speed, and when the load current value increases, a process such as dressing of a cutting tool is performed to maintain cutting quality (for example, refer to patent document 1).
Patent document 1: japanese patent laid-open No. 2009-283604
However, even if the load current value is monitored to grasp the increase in the load current value at the time of cutting, it is not easy to know which line to cut. Therefore, it is impossible to grasp which of the plurality of chips is formed by dividing the workpiece, and there is a problem in quality. On the other hand, if the operator can grasp where the load current value is detected during cutting, it is easy to identify a chip that is considered to be problematic in quality.
Disclosure of Invention
The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a cutting device in which an operator can easily identify a portion where a load current value of a spindle to which a cutting tool is attached is high when cutting an object to be machined.
The present invention is a cutting device, comprising: a chuck table for holding a workpiece; a spindle which is rotationally driven; and a cutting tool attached to a front end of the spindle for cutting a workpiece held by the chuck table, the cutting device cutting the workpiece along a line to be machined, wherein the cutting tool includes: a load current value detection unit for detecting a load current value of the spindle during cutting; a display unit that displays the load current value detected by the load current value detection unit; and a control unit that controls at least the load current value detection unit and the display unit, the control unit displaying a line to be processed on the display unit in correspondence with a load current value of the spindle when the line to be processed is processed.
In the cutting device, it is preferable that the control means displays the line to be machined on the display means by using one or both of color distinction and line distinction, based on the value of the load current value of the spindle.
In the present invention, the control means displays the line to be machined on the display means in association with the load current value of the spindle at the time of machining the line to be machined, and therefore, it is possible to grasp at a glance which load current is generated at the time of cutting of which line to be machined. Therefore, it is easy to identify a chip considered to have a problem in quality.
Drawings
Fig. 1 is a perspective view showing an example of a cutting device.
Fig. 2 is a perspective view showing an example of a workpiece.
Fig. 3 is a front view showing a display example in the display unit.
Description of the reference numerals
1: A cutting device; 10: a chuck table; 100: an adsorption unit; 100a: a holding surface; 101: a frame; 102: a cover; 103: a rotating unit; 11: a cutting unit; 110: a housing; 111: a main shaft; 112: a motor; 113: a cutting tool; 114: a cutter cover; 115: a cutting water supply nozzle; 12: a cutting feed unit; 120: a ball screw; 121: a guide rail; 122: a motor; 123: a movable plate; 13: an indexing feeding unit; 130: a ball screw; 131: a guide rail; 132: a motor; 133: a movable plate; 14: an infeed unit; 140: a ball screw; 141: a guide rail; 142: a motor; 143: a bracket; 145: a wall portion; 15: a load current value detection unit; 16: a control unit; 17: a storage unit; 18: a display unit; 19: an alignment unit; 190: a photographing unit; w: a workpiece; wa: a front face; wb: a back surface; t: dicing tape; f: an annular frame; g: cutting grooves.
Detailed Description
The cutting device 1 shown in fig. 1 is a device for performing cutting processing on a workpiece W, and includes, for example, at least: a chuck table 10 for holding a workpiece W; and a cutting unit 11 for cutting the workpiece W held by the chuck table 10.
A cutting feed unit 12 for reciprocally moving the chuck table 10 in the X-axis direction is provided in front of (+y-direction side) of the base 1A of the cutting device 1. The cutting feed unit 12 includes: a ball screw 120 having an axis in the X-axis direction; a pair of guide rails 121 disposed parallel to the ball screw 120; a motor 122 that rotates the ball screw 120; and a movable plate 123, the nut of which is screwed with the ball screw 120, and the bottom of the movable plate 123 is in sliding contact with the guide rail 121. When the motor 122 rotates the ball screw 120, the movable plate 123 is guided by the guide rail 121 and moves in the X-axis direction, and the chuck table 10 disposed on the movable plate 123 moves in the X-axis direction in accordance with the movement of the movable plate 123, so that the workpiece W held by the chuck table 10 is cut and fed.
The chuck table 10 shown in fig. 1 has: an adsorption unit 100 configured by a porous member or the like that adsorbs the workpiece W; and a housing 101 that supports the suction unit 100. The suction unit 100 communicates with a suction source, not shown, and suctions and holds the workpiece W on a holding surface 100a, which is an exposed surface of the suction unit 100. The chuck table 10 is surrounded by a cover 102 from the periphery and is rotatable by being driven by a rotation unit 103 disposed on the bottom surface side of the chuck table 10. Four fixing jigs 104 for fixing the annular frame F are equally arranged around the housing 101 in the circumferential direction.
The base 1A of the cutting device 1 has an indexing unit 13 for reciprocating the cutting unit 11 in the Y-axis direction. The indexing feed unit 13 includes: a ball screw 130 having an axis in the Y-axis direction; a pair of guide rails 131 disposed parallel to the ball screw 130; a motor 132 that rotates the ball screw 130; the movable plate 133 has a nut in the interior thereof screwed with the ball screw 130, and the bottom of the movable plate 133 is in sliding contact with the guide rail 131. When the motor 132 rotates the ball screw 130, the movable plate 133 is guided by the guide rail 131 and moves in the Y-axis direction, and the cutting unit 11 disposed on the movable plate 133 moves in the Y-axis direction in accordance with the movement of the movable plate 133, thereby indexing the cutting unit 11.
The wall 145 is integrally erected from the movable plate 133, and the wall 145 has an infeed unit 14 for reciprocally moving the cutter unit 11 in the Z-axis direction on a side surface on the +x-direction side. The infeed unit 14 includes: a ball screw 140 having an axis in the Z direction; a pair of guide rails 141 disposed parallel to the ball screw 140; a motor 142 that rotates the ball screw 140; and a bracket 143, an inner nut of which is screwed with the ball screw 140, and a side portion of the bracket 143 is in sliding contact with the guide rail 141. When the motor 142 rotates the ball screw 140, the holder 143 is guided by the guide rail 141 and moves in the Z-axis direction, and the cutting unit 11 supported by the holder 143 via the housing 110 moves in the Z-axis direction along with the movement of the holder 143.
The cutting unit 11 has: a housing 110 supported by a bracket 143; a main shaft 111 rotatably supported by the housing 110; a motor 112 that rotationally drives the main shaft 111; and a cutting tool 113 mounted on a front end portion of the spindle 112.
The cutting tool 113 shown in fig. 1 is, for example, a hub tool, which has: an aluminum base formed in a disk shape and having a mounting hole in the center; and a cutting edge fixed to the outer peripheral portion of the base. The cutting tool 113 is not limited to the hub tool, and may be a washer-type tool having an annular outer shape.
The axial direction of the spindle 111 is a direction (Y-axis direction) perpendicular to the horizontal direction (X-axis direction) of the chuck table 10, and the rear end side (-Y-direction side end side) of the spindle 111 is coupled to an axis transmitting the rotational force of the motor 112, and the cutting tool 113 is mounted on the front end side of the spindle 111. Then, as the spindle 111 is rotationally driven by the motor 112, the cutting tool 113 is also rotated at a high speed.
The motor 112 is an electric motor, and the motor 112 is connected to: a power supply, not shown, that supplies electric power to the motor 112; and a load current value detection unit 15 that detects a load current value of electric power supplied to the motor 112.
A cutter housing 114 is mounted on the housing 110. The tool cover 114 has an opening in a substantially central portion thereof for mounting the cutting tool 113, and the cutting tool 113 is positioned in the opening so as to cover the cutting tool 113 from above. A cutting water supply nozzle 115 for supplying cutting water to a machining point where the workpiece W contacts the cutting tool 113 is attached to the tool cover 114. For example, two cutting water supply nozzles 115 formed in an L shape as viewed from the Y-axis direction are arranged so as to sandwich the cutting tool 113 from both sides in the Y-axis direction, and each of them has an injection port facing a side surface of the cutting tool 113, and communicates with a cutting water supply source, not shown.
An alignment unit 19 is disposed on a side surface of the housing 110. The alignment unit 19 includes an imaging unit 190 that images the workpiece W, and the imaging unit 190 includes, for example: a light irradiation unit that irradiates the workpiece W with light; and a camera including an optical system for capturing reflected light from the workpiece W, and a photographing device (CCD) for outputting an electric signal corresponding to the reflected light. The alignment unit 19 can detect a line to be machined of the workpiece W from the image acquired by the imaging unit 190. The alignment unit 19 is integrally formed with the cutting unit 11, and moves in both the Y-axis direction and the Z-axis direction in conjunction with each other.
The cutting device 1 has a control unit 16 which is composed of a CPU and a memory element such as a memory, and controls the entire device. The control unit 16 is connected to each device component such as the cutting feed unit 12 and the plunge feed unit 14 through wiring, and controls the cutting feed operation of the chuck table 10 in the X-axis direction by the cutting feed unit 12, the plunge feed operation of the cutting unit 11 in the Z-axis direction by the plunge feed unit 14, and the like under the control of the control unit 16. Further, the control unit 16 is connected to the load current value detection unit 15, and the load current value detection unit 15 can transmit information on the detected load current value of the motor 112 to the control unit 16, and the control unit 16 performs control based on the load current value.
The control unit 16 has: a storage unit 17 having a storage element such as a memory; and a display unit 18 that displays the output information from the control unit 16 on a screen.
The operation of the cutting device 1 in the case of cutting the workpiece W shown in fig. 1 vertically and horizontally to perform the dividing processing will be described below. The workpiece W shown in fig. 1 is formed in a rectangular shape, and a plurality of devices are formed in a lattice-like region inside the workpiece W. The back surface Wb of the work W is attached to the dicing tape T and protected by the dicing tape T. A ring frame F having a circular opening is adhered to an outer peripheral region of the adhesion surface of the dicing tape T, and the workpiece W is supported by the ring frame F via the dicing tape T. The workpiece W is not limited to a rectangular shape.
First, the operator inputs processing conditions such as the cutting feed speed of the chuck table 10, the size of the workpiece W, the interval between adjacent cutting lines, and the cutting depth of the cutting tool 113 to the control unit 16 by an operation unit not shown.
The workpiece W is placed on the holding surface 100a with the dicing tape T side facing downward so that the center of the chuck table 10 shown in fig. 1 coincides with the center of the workpiece W. Then, a suction force generated by a suction source, not shown, is applied to the holding surface 100a, and the back surface Wb of the workpiece W, which is the surface opposite to the workpiece surface Wa, is sucked and held by the chuck table 10. The ring frame F is fixed by each fixing jig 104.
Next, the cutting feed unit 12 conveys the workpiece W held by the chuck table 10 in the +x direction, and the alignment unit 19 detects a line to be machined into which the cutting tool 113 is to be cut. That is, the alignment unit 19 performs image processing such as pattern matching based on the image of the front face Wa of the workpiece W captured by the capturing unit 190, and detects a line to be machined into which the cutting tool 113 is to be cut. As the machining target line is detected, the cutting unit 11 is driven in the Y-axis direction by the illustrated indexing unit 13, and the machining target line to be cut is aligned with the cutting tool 113 in the Y-axis direction.
Ac power is supplied to the motor 112 constituting the cutting unit 11, and the spindle 111 and the cutting tool 113 are rotated at high speed. In this state, the cutting unit 11 performs cutting feed in the-Z direction by the cutting feed unit 14, and positions the cutting tool 113 at a predetermined height position.
In a state where the cutting tool 113 and the detected line to be machined are aligned in the Y-axis direction, the chuck table 10 holding the workpiece W is further fed in the +x direction at a predetermined cutting feed rate, and the chuck table 10 and the cutting tool 113 are relatively moved in the cutting feed direction (X-axis direction) at a predetermined rate, and the cutting tool 113 is rotated at a high speed while cutting into the detected line to be machined of the workpiece W, and cuts the line to be machined. During cutting, cutting water is supplied from the cutting water supply nozzle 115 to the cutting tool 113.
Next, the cutting unit 11 performs indexing feed in the Y-axis direction at intervals of adjacent lines to cut the completed line to cut the same. In this way, the indexing feed and the cutting are repeated, and all the lines to be machined in the same direction are cut. Further, by rotating the chuck table 10 by 90 degrees and then performing the same cutting, all the lines to be processed are cut vertically and horizontally as shown in fig. 2, and divided into individual chips.
During the cutting thus performed, the control unit 16 detects the position of the workpiece W in the X-axis direction based on control information (e.g., the number of pulses supplied to the motor 122 or information from an encoder) related to the motor 122 constituting the cutting feed unit 12, and detects the position of the cutting tool 113 in the Y-axis direction based on control information (e.g., the number of pulses supplied to the motor 132 or information from an encoder) related to the motor 132 constituting the indexing feed unit 13. That is, based on these two pieces of control information, the control unit 16 recognizes the current cutting position. As shown in fig. 3, the machined cutting groove G is displayed on the display unit 18 in real time.
In parallel with this, the control unit 16 sequentially reads the load current in the load current value detection unit 15. Then, machining position-to-load current value information, which corresponds to a load current value at the time of machining the machining position, is stored in the storage unit 17. In addition, the control unit 16 displays the load current value information corresponding to the machining position on the display unit 18 in real time in correspondence with the progress of the machining.
When cutting is performed by the cutting tool 113, the cutting tool 113 needs a stronger rotational force when a load applied to the cutting tool 113 becomes large. The control unit 16 controls the motor 112 so that the spindle 111 rotates at a constant rotational speed, and thus when the load acting on the cutting tool 113 increases, the load current value of the motor 112 increases. As shown in fig. 3, the control unit 16 displays the workpiece W in a state seen from above, and also displays the cutting groove G formed by the cutting process, and displays the load current value at the time of forming the cutting groove G in correspondence with the cutting groove G. In the example of fig. 3, the thickness of the cutting groove G is changed in accordance with the load current value, so that the position where the load current value is high can be grasped at a glance. That is, the example shown in fig. 3 shows a state in which cutting of all the lines to be machined is completed and cutting grooves are formed along all the lines to be machined.
In the example of fig. 3, the display is performed so that the operator can recognize a portion showing a normal load current value and a portion showing a value larger than the normal load current value. Specifically, a portion in which the load current value during cutting is a normal value is shown as a thin line, a portion in which the load current value during cutting is 1.0A is shown as a thick line G1, a portion in which the load current value during cutting is 1.5A is shown as an extremely thick line G2, a portion in which the load current value during cutting is 2.0A is shown as a broken line G3, and a portion in which the load current value during cutting is 2.5A is shown as a wavy line G4. In addition, instead of the line type identification (line type identification) based on the line to be processed, the value of the load current value may be identified by, for example, color identification. In addition, line distinction and color distinction may be used in combination.
For a portion where the load current value is not high, it is estimated that the processing quality is not low; the portion where the load current value is high is estimated to have low processing quality. Therefore, the operator can estimate that some machining failure occurs at the portion where the load current value is high, and can easily identify the portion. Further, it is possible to inspect only chips on both sides of the cutting groove where the load current value is high, and productivity can be improved.
A metal called TEG (TEST ELEMENT Group) is also buried in the line to be processed. When the cutting tool 113 cuts into a metal such as TEG, a load applied to the cutting tool 113 increases, and thus a load current value of the motor 112 increases. For example, when the load current value at the time of cutting a portion without a TEG is 1.5A, the load current value reaches about 2.0A when cutting the TEG. Therefore, when the load current value locally increases, it is estimated that the TEG is present, and it can be determined that the increase in the load current value is not based on a decrease in the cutting ability of the cutting tool 113. Further, since the existence position of the TEG can be checked, when the same kind of workpiece is cut, the cutting order of the line to be machined can be adjusted according to the existence position of the TEG. For example, by finally cutting a line to be machined in which a TEG is present, the number of times of dressing or the number of times of replacement of the cutting tool can be reduced, thereby improving productivity.
In the case where the cutting ability is reduced due to long-term use of the cutting tool 113, the load current value also becomes high. For example, when the load current value reaches 2.5A to 3.0A, the processing quality is lowered. When the load current value is high due to a decrease in the cutting ability, the state in which the load current value is high is continued. Accordingly, when the operator determines that the state in which the load current value is high due to the reduction of the cutting ability of the cutting tool 113 is continued based on the processing position-to-load current value information displayed on the display unit 18, the trimming of the cutting tool is performed. For example, a trimming plate, not shown, or the like is disposed near the chuck table 10 shown in fig. 1, and the cutting tool 113 is cut into the trimming plate, whereby the cutting ability of the cutting tool can be improved. Instead of trimming, the cutting tool 113 may be replaced.
Further, since the total distance of the machining target line on which cutting has been performed can be obtained from the size of the workpiece W, when the cutting capability after trimming is reduced again and the load current value becomes equal to or greater than the predetermined value, the total cutting distance from the time of restarting cutting after trimming to the time of the load current value becoming equal to or greater than the predetermined value is calculated, and it is possible to grasp at what distance to perform trimming (intermediate trimming) at which time the cutting has been performed.
The processing position-corresponding load current value information displayed on the display unit 18 can be stored in the storage unit 17 shown in fig. 1. That is, load current value information corresponding to the machining position can be stored in advance for each workpiece. Therefore, quality control of the chip can be performed for each workpiece. Further, since the load current values of all the machining lines can be stored, it is possible to confirm the position where the load current value is considered to be abnormal even for the workpiece whose cutting has been completed.
In the present embodiment, the position of the cutting portion of the workpiece in the X-axis direction is identified based on the control information of the motor constituting the cutting feed unit, and the position of the cutting portion of the workpiece in the Y-axis direction is identified based on the control information of the motor constituting the indexing feed unit. For example, the scales may be arranged in the X-axis direction and the Y-axis direction, respectively, and the cutting portions may be identified by the read values of the scales.
In the present embodiment, it is configured to be possible to grasp at which portion of the line to be processed the load current value rise has occurred, but it is also possible to grasp only at which line to be processed the load current value rise has occurred, and not to determine the position in the line to be processed. In this case, the machining scheduled line may be determined based on only the control information of the motor 132 constituting the indexing-feed unit 13, and the control information of the motor 122 constituting the cutting-feed unit 12 may not be used.
Claims (2)
1. A cutting device, the cutting device comprising:
a chuck table for holding a workpiece;
A spindle which is rotationally driven; and
A cutting tool attached to a front end of the spindle for cutting a workpiece held by the chuck table,
The cutting device cuts the workpiece along a line to be machined,
Wherein,
The cutting tool has:
a load current value detection unit for detecting a load current value of the spindle during cutting;
a display unit that displays the load current value detected by the load current value detection unit; and
A control unit that controls at least the load current value detection unit and the display unit,
The control unit displays a machining scheduled line on the display unit corresponding to the load current value of the main shaft when machining the machining scheduled line,
The control means displays the processing position-to-load current value information corresponding to the processing position and the load current value at the time of processing the processing position on the display means in real time so that the operator can recognize a portion showing a normal load current value and a portion showing a value larger than the normal load current value in correspondence with the progress of processing.
2. The cutting device according to claim 1, wherein,
The control unit displays a machining target line on the display unit by using one or both of color distinction and line distinction according to the value of the load current value of the spindle.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-038158 | 2017-03-01 | ||
| JP2017038158A JP6814662B2 (en) | 2017-03-01 | 2017-03-01 | Cutting equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108538718A CN108538718A (en) | 2018-09-14 |
| CN108538718B true CN108538718B (en) | 2024-05-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810159197.1A Active CN108538718B (en) | 2017-03-01 | 2018-02-26 | Cutting device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6814662B2 (en) |
| KR (1) | KR102341606B1 (en) |
| CN (1) | CN108538718B (en) |
| TW (1) | TWI745541B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102018204402A1 (en) * | 2018-03-22 | 2019-09-26 | Siemens Aktiengesellschaft | Method and device for taking a sample and use of such a device |
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| JP2006235776A (en) * | 2005-02-23 | 2006-09-07 | Mitsubishi Heavy Ind Ltd | Machine tool and processing method by this machine tool |
| CN105690462A (en) * | 2014-12-12 | 2016-06-22 | 东和株式会社 | Cutting apparatus and cutting method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6165051A (en) * | 1998-10-29 | 2000-12-26 | Kulicke & Soffa Investments, Inc. | Monitoring system for dicing saws |
| JP5134216B2 (en) * | 2006-06-23 | 2013-01-30 | 株式会社ディスコ | Wafer processing result management method |
| JP2008004885A (en) * | 2006-06-26 | 2008-01-10 | Disco Abrasive Syst Ltd | Processing machine |
| JP5149072B2 (en) * | 2008-05-21 | 2013-02-20 | 株式会社ディスコ | Cutting equipment |
| JP5561222B2 (en) * | 2011-03-29 | 2014-07-30 | 株式会社デンソー | CUTTING DEVICE, CUTTING METHOD USING CUTTING DEVICE, AND PRODUCT MANUFACTURING METHOD |
| JP6280459B2 (en) * | 2014-06-27 | 2018-02-14 | 株式会社ディスコ | Tape expansion unit |
| JP6695102B2 (en) * | 2015-05-26 | 2020-05-20 | 株式会社ディスコ | Processing system |
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2017
- 2017-03-01 JP JP2017038158A patent/JP6814662B2/en active Active
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2018
- 2018-02-05 TW TW107103993A patent/TWI745541B/en active
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| JPH04289071A (en) * | 1990-12-28 | 1992-10-14 | Noritake Co Ltd | Cutter and cutting method using rotary body |
| JPH11224116A (en) * | 1998-02-06 | 1999-08-17 | Mitsubishi Electric Corp | Working information display method and device for machine tool |
| JP2006235776A (en) * | 2005-02-23 | 2006-09-07 | Mitsubishi Heavy Ind Ltd | Machine tool and processing method by this machine tool |
| CN105690462A (en) * | 2014-12-12 | 2016-06-22 | 东和株式会社 | Cutting apparatus and cutting method |
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| CN108538718A (en) | 2018-09-14 |
| TWI745541B (en) | 2021-11-11 |
| KR102341606B1 (en) | 2021-12-22 |
| JP2018147913A (en) | 2018-09-20 |
| TW201834045A (en) | 2018-09-16 |
| KR20180100497A (en) | 2018-09-11 |
| JP6814662B2 (en) | 2021-01-20 |
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