CN108538718A - Cutting apparatus - Google Patents
Cutting apparatus Download PDFInfo
- Publication number
- CN108538718A CN108538718A CN201810159197.1A CN201810159197A CN108538718A CN 108538718 A CN108538718 A CN 108538718A CN 201810159197 A CN201810159197 A CN 201810159197A CN 108538718 A CN108538718 A CN 108538718A
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- cutting
- current value
- load current
- main shaft
- unit
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- 238000005520 cutting process Methods 0.000 title claims abstract description 149
- 238000001514 detection method Methods 0.000 claims abstract description 13
- 238000003754 machining Methods 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims description 5
- 230000008569 process Effects 0.000 claims description 4
- 230000004069 differentiation Effects 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 238000001179 sorption measurement Methods 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- 230000015654 memory Effects 0.000 description 4
- 230000009467 reduction Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N ferric oxide Chemical compound O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- -1 TEG Chemical class 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000008450 motivation Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Milling Processes (AREA)
Abstract
Cutting apparatus is provided, in the cutting of machined object, operator is easy to determine to be equipped with the position that the load current value of the main shaft of cutting tool is got higher.Cutting apparatus (1) has：The main shaft (111) being driven in rotation；And cutting tool (113), it is mounted on the front end of main shaft (111), the machined object (W) kept to chuck table (10) is cut, the cutting apparatus (1) carries out machining along processing preset lines to machined object (W), wherein, which has：The load current value of load current value detection unit (15), the main shaft (111) when to machining is detected；And display unit (18), the load current value detected to load current value detection unit (15) are shown.Preset lines will be processed and the load current value of the main shaft (111) when being processed to processing preset lines is accordingly shown on display unit (18).
Description
Technical field
The present invention relates to the cutting apparatus cut machined object.
Background technology
In cutting apparatus, cutting tool is made to be cut into the processing preset lines of machined object and be cut.Cutting tool
It is configured to be mounted on main shaft, by the rotation of main shaft, cutting tool is also rotated.
It, may when cutting tool occurs abrasion and cutting power is made to reduce in the machining based on cutting tool
Appear in the problems such as chipping is generated on machined object.Therefore, it in cutting apparatus, is rotated with certain rotating speed according to main shaft
Mode controlled, and the load current value of main shaft is monitored, in the case where load current value rises, is carried out to cutting
The processing such as the finishing of cutting knife tool, to realize the maintenance of cutting quality (for example, referring to patent document 1).
Patent document 1：Japanese Unexamined Patent Publication 2009-283604 bulletins
But rise even if load current value can be held in cutting by being monitored to load current value,
But know that the situation is which item to process being not easy to of being generated when the cutting of preset lines at.Therefore, it is impossible to processed being held in
Object is divided and there are problems in which of multiple chips of the formation quality of chip.On the other hand, if operator can be
Great load current value is detected when being held in cutting where, then is easy determination and thinks the chip of problems in quality.
Invention content
The present invention is completed in view of this problem, and project is to provide a kind of cutting apparatus, in machined object
Cutting when, operator is easy to determine to be equipped with the position that the load current value of the main shaft of cutting tool is got higher.
The present invention is cutting apparatus, which has：Chuck table keeps machined object；Main shaft,
The main shaft is driven in rotation；And cutting tool, it is mounted on the front end of the main shaft, is added to what the chuck table was kept
Work object is cut, which carries out machining along processing preset lines to the machined object, wherein the cutting tool
Have：The load current value of load current value detection unit, main shaft when to machining is detected；Display unit,
Its load current value detected to the load current value detection unit is shown；And control unit, it is at least negative to this
Set current value detection unit and the display unit are controlled, the control unit will process preset lines with to the processing preset lines into
The load current value of main shaft when row processing is accordingly shown on the display unit.
In above-mentioned cutting apparatus, preferably control unit utilizes color area according to the value of the load current value of the main shaft
Point, line style distinguish in either or both and by processing preset lines include on the display unit.
In the present invention, the load of main shaft when control unit will be processed preset lines and be processed to the processing preset lines
Current value accordingly shows on the display unit, therefore can produce at a glance being held in when which item processes the cutting of preset lines
Great load current is given birth to.Therefore, in this way it is easy to determine go out to think the chip of problems in quality.
Description of the drawings
Fig. 1 is the stereogram of an example for showing cutting apparatus.
Fig. 2 is the stereogram of an example for showing machined object.
Fig. 3 is to show to show exemplary front view in display unit.
Label declaration
1：Cutting apparatus；10：Chuck table；100：Adsorption section；100a：Retaining surface；101：Framework；102：Cover；103：
Rotary unit；11：Cutting unit；110：Shell；111：Main shaft；112：Motor；113：Cutting tool；114：Cutter hood；
115：Cutting water provides nozzle；12：Cutting feed unit；120：Ball-screw；121：Guide rail；122：Motor；123：Movably
Plate；13：Index feed unit；130：Ball-screw；131：Guide rail；132：Motor；133：Movable plate；14：Incision feeding is single
Member；140：Ball-screw；141：Guide rail；142：Motor；143：Holder；145：Wall portion；15：Load current value detection unit；
16：Control unit；17：Storage unit；18：Display unit；19：Aligned units；190：Shooting unit；W：Machined object；Wa：Just
Face；Wb：The back side；T：Dicing tape；F：Ring-shaped frame；G：Cutting slot.
Specific implementation mode
Cutting apparatus 1 shown in FIG. 1 is the device for implementing machining to machined object W, is for example, at least had：Chuck
Workbench 10 keeps machined object W；And cutting unit 11, it is processed to what chuck table 10 was kept
Object W is cut.
Having in the front (+Y direction side) of the base station 1A of cutting apparatus 1 keeps chuck table 10 reciprocal in the X-axis direction
Mobile cutting feed unit 12.Cutting feed unit 12 includes：Ball-screw 120, the axle center with X-direction；It is a pair of
Guide rail 121, they are parallelly arranged with ball-screw 120；Motor 122 makes ball-screw 120 rotate；And movable plate
123, internal nut is screwed togather with ball-screw 120, and the bottom of the movable plate 123 and 121 sliding contact of guide rail.And
And when motor 122 make ball-screw 120 rotate when, along with this movable plate 123 by guide rail 121 guide and in the X-axis direction
Mobile, the chuck table 10 being disposed on movable plate 123 moves in the X-axis direction with the movement of movable plate 123, to
The machined object W kept to chuck table 10 carries out cutting feed.
Chuck table 10 shown in FIG. 1 has：Adsorption section 100, by the porous member adsorbed to machined object W
Deng composition；And framework 101, adsorption section 100 is supported.Adsorption section 100 is connected to attraction source (not shown), in conduct
Attracting holding is carried out to machined object W on the retaining surface 100a of the exposed surface of adsorption section 100.10 quilt cover 102 of chuck table from
Surrounding is surrounded, and can be rotated by being disposed in the rotary unit 103 of bottom surface side of chuck table 10 and being driven.In addition,
Circumferentially about equably it is arranged that there are four stationary fixtures 104 that ring-shaped frame F is fixed in framework 101.
Having on the base station 1A of cutting apparatus 1 makes the index feed list that cutting unit 11 moves back and forth in the Y-axis direction
Member 13.Index feed unit 13 includes：Ball-screw 130, the axle center with Y direction；A pair of guide rails 131, they with rolling
Ballscrew 130 is parallelly arranged；Motor 132 makes ball-screw 130 rotate；Movable plate 133, internal nut and rolling
Ballscrew 130 screws togather, and the bottom of the movable plate 133 and 131 sliding contact of guide rail.Also, when motor 132 makes ball wire
When thick stick 130 rotates, movable plate 133 is guided and moved in the Y-axis direction by guide rail 131 along with this, is disposed on movable plate 133
Cutting unit 11 moved in the Y-axis direction with the movement of movable plate 133, to cutting unit 11 indexed into
It gives.
Wall portion 145 integrally erects setting from movable plate 133, and having on the side of the +X direction side of wall portion 145 makes
The incision feed unit 14 that cutting unit 11 moves back and forth in the Z-axis direction.Cutting feed unit 14 includes：Ball-screw 140,
Its axle center with Z-direction；A pair of guide rails 141, they are parallelly arranged with ball-screw 140；Motor 142, makes ball
Leading screw 140 rotates；And holder 143, internal nut are screwed togather with ball-screw 140, and the side of the holder 143 with lead
141 sliding contact of rail.Also, when motor 142 makes ball-screw 140 rotate, holder 143 is drawn by guide rail 141 along with this
Lead and move in the Z-axis direction, the cutting unit 11 supported by holder 143 by shell 110 with the movement of holder 143 and
It moves in the Z-axis direction.
Cutting unit 11 has：Shell 110 is supported by holder 143；Main shaft 111, being by the bearing of shell 110 can
Rotation；Motor 112 carries out rotation driving to main shaft 111；And cutting tool 113, it is mounted on the front end of main shaft 112
Portion.
Cutting tool 113 shown in FIG. 1 is, for example, wheel hub cutter, is had：The base station of aluminum is formed as discoid,
There is mounting hole in center；And cutting edge, it is fixed on the peripheral part of base station.In addition, cutting tool 113 is not limited to wheel hub
It is cricoid grommet-type cutter that cutter, which can also be shape,.
The axial direction of main shaft 111 be relative to chuck table 10 moving direction (X-direction) it is vertical in the horizontal direction
Direction (Y direction), the rear end side (end side of -Y direction side) of main shaft 111 and the axis for the rotary force for transmitting motor 112 connect
Knot, cutting tool 113 is equipped in the front end side of main shaft 111.Also, main shaft 111 is rotated with by motor 112
Driving, cutting tool 113 also carry out high speed rotation.
Motor 112 is electric motor, is connected on motor 112：Power supply (not shown) is carried to motor 112
For electric power；And load current value detection unit 15, it is examined to being provided to the load current value of electric power of motor 112
It surveys.
Cutter hood 114 is installed on shell 110.Cutter hood 114 has in its substantially central portion for installing bite
The opening portion of tool 113, is positioned at opening portion by cutting tool 113 and covers from above cutting tool 113.In addition, in cutter hood
Cutting water is installed on 114, nozzle 115 is provided, the processing stand contacted to machined object W with cutting tool 113 provides cutting
Water.Such as be formed as from Y direction L fonts cutting water provide nozzle 115 clip bite according to from Y direction both sides
There are two the mode of tool 113 is arranged, they have the jet port towards the side of cutting tool 113, with cutting water (not shown)
Offer source is connected to.
Aligned units 19 are equipped on the side of shell 110.Aligned units 19, which have, shoots machined object W
Shooting unit 190, shooting unit 190 for example with：Illumination part, to machined object W irradiation lights；And camera, by catching
Catch the optics system of the reflected light from machined object W and the capturing element (CCD) of output electric signal corresponding with reflected light
Deng composition.Aligned units 19 can be according to the image acquired in shooting unit 190 to machined object W the processing to be cut
Preset lines are detected.Aligned units 19 are integrally constituted with cutting unit 11, and the two is in linkage along Y direction and Z-direction
It is mobile.
Cutting apparatus 1 has control unit 16, is made of memory elements such as CPU and memories, carries out device entirety
Control.Control unit 16 is connect by wiring with each apparatus structure element such as cutting feed unit 12 and incision feed unit 14,
Under the control of control unit 16, the cutting feed of chuck table 10 that cutting feed unit 12 is realized to X-direction
The cutting unit 11 that action, incision feed unit 14 are realized is controlled to the incision feed motion etc. of Z-direction.In addition,
Control unit 16 is connect with load current value detection unit 15, and load current value detection unit 15 can will be about the electricity detected
The information conveyance of the load current value of motivation 112 to control unit 16, control unit 16 is controlled based on load current value.
Control unit 16 has：Storage unit 17, with memory elements such as memories；And display unit 18, it is right
Output information from control unit 16 carries out picture and shows.
Hereinafter, being split the cutting apparatus in the case of processing to cutting machined object W shown in FIG. 1 in length and breadth
1 action illustrates.Machined object shown in FIG. 1 is W-shaped to become rectangular-shaped, is formed with inside it in the region of clathrate more
A device.The back side Wb of machined object W is pasted onto on dicing tape T and is protected by dicing tape T.Dicing tape T bonding plane it is outer
All regions are pasted with the ring-shaped frame F with circular opening, and machined object W is supported by dicing tape T by ring-shaped frame F.
In addition, machined object W is not limited to rectangle.
First, by operator by operating unit (not shown) by the cutting feed speed of chuck table 10, be processed
It is single that the processing conditions such as the penetraction depth at interval, cutting tool 113 between the size of object W, adjacent the line of cut are input to control
Member 16.
Machined object W according to the center of the chuck table 10 shown in FIG. 1 mode consistent with the center of machined object W,
The sides dicing tape T are made to be placed on retaining surface 100a downward.Also, attraction caused by attraction source (not shown) is made to act on
Retaining surface 100a is attracted to the back side Wb as the face opposite with machined surface Wa of machined object W by chuck table 10
It keeps.In addition, ring-shaped frame F is fixed by each stationary fixture 104.
Then, the machined object W that cutting feed unit 12 is kept chuck table 10 is conveyed to +X direction, by right
The processing preset lines that quasi- unit 19 cuts cutting tool 113 to be made are detected.That is, according to captured by shooting unit 190
The image of the positive Wa of machined object W, aligned units 19 execute the image procossings such as pattern match, are cut to cutting tool 113 to be made
The processing preset lines entered are detected.With to processing preset lines be detected, cutting unit 11 pass through shown in index feed
Unit 13 is driven in the Y-axis direction, carries out the processing preset lines to be cut and pair of cutting tool 113 in the Y-axis direction
Position.
AC power is provided to the motor 112 for constituting cutting unit 11, main shaft 111 and cutting tool 113 carry out high speed
Rotation.In this state, incision feed unit 14 carries out incision feeding to cutting unit 11 to -Z direction, by cutting tool 113
It is positioned at defined height and position.
In the state of having carried out the contraposition of cutting tool 113 and the processing preset lines that are detected in Y direction, to being added
The chuck table 10 that work object W is kept further is sent to +X direction with defined cutting feed speed, to chuck
Workbench 10 is relatively moved with defined speed in cutting feed direction (X-direction) with cutting tool 113, cutting tool
113 are cut into the detected processing preset lines of machined object W while high speed rotation, are cut to the processing preset lines
It cuts.In cutting, provides nozzle 115 from cutting water and provide cutting water to cutting tool 113.
Then, indexable feeding is carried out in the Y-axis direction to cutting unit 11 according to the interval of adjacent processing preset lines, and
It is similarly cut, to which the adjacent processing preset lines for the processing preset lines completed to cutting are cut.In this way, repeatedly
Indexable feeding and cutting are carried out, to cut equidirectional all processing preset lines.In addition, making chuck table 10
It is similarly cut after being rotated by 90 °, to which processing preset lines all as shown in Figure 2 are cut and divided in length and breadth
It is cut into each chip.
During the cutting carried out in this way, control unit 16 is according to the motor 122 for constituting cutting feed unit 12
Relevant control information (such as be delivered to the umber of pulse of motor 122 or carry out the information of self-encoding encoder) is to the X-axis of machined object W
The position in direction is detected, and (such as defeated according to the 132 relevant control information of motor for constituting index feed unit 13
Send to the umber of pulse of motor 132 or come the information of self-encoding encoder) position of the Y direction of cutting tool 113 is detected.
That is, according to the two control information, current machining position is identified in control unit 16.Also, as shown in figure 3,
It includes on display unit 18 that processing, which is formed by cutting slot G in real time,.
In addition, parallel with this, control unit 16 gradually reads in the load current in load current value detection unit 15.And
And by Working position load current corresponding with the corresponding Working position of load current value when being processed to the Working position
Value information is stored in storage unit 17.In addition, Working position is corresponded to load current value information and the row of processing by control unit 16
Into consistently real-time display on display unit 18.
When carrying out machining using cutting tool 113, when the load for being applied to cutting tool 113 becomes larger, bite
Tool 113 needs stronger rotary force.Control unit 16 is according to main shaft 111 to motor in such a way that certain rotating speed is rotated
112 are controlled, therefore when the load for acting on cutting tool 113 becomes larger, and the load current value of motor 112 rises.Such as
Shown in Fig. 3, control unit 16 shows the machined object W of state viewed from above, and to shape due to machining
At cutting slot G shown that load current value when by the formation of cutting slot G is accordingly shown with cutting slot G.Fig. 3's
In example, consistently change the thickness of cutting slot G with load current value, so as to hold load current value height at a glance
Position.That is, example shown in Fig. 3 shows that the cutting of all processing preset lines terminates and along all processing preset lines
Form the state of cutting slot.
In the example in figure 3, the position for showing common load current value can be identified according to operator and is shown than logical
The mode at the position of the big value of normal load current value is shown.Specifically, the load current value in cutting is common
The position of value shows with filament, cut in load current value shown with thick line G1 for the position of 1.0A, cut in load electricity
The position that flow valuve is 1.5A shows with extra thick line G2, cut in load current value shown with dotted line G3 for the position of 2.0A, be negative
Set current value is that the position of 2.5A is shown with wave G4.Alternatively, it is also possible to replace the identification of the line style based on processing preset lines
(line style differentiation), and for example the value of load current value is identified by color differentiation.Furthermore it is possible to be used in combination line style distinguish and
Color is distinguished.
For the not high position of load current value, it is not low to be estimated as processing quality；For the high position of load current value, push away
It is low to be set to processing quality.Therefore, operator can estimate produces some machining failures at the high position of load current value, can
It is readily determined the position.Alternatively, it is also possible to only to load current value show higher cutting slot both sides chip carry out
It checks, productivity can be improved.
Sometimes the gold for being referred to as TEG (Test Element Group, testing element group) is also embedded in processing preset lines
Belong to.When cutting tool 113 is cut into the metals such as TEG, the load for being applied to cutting tool 113 becomes larger, therefore motor 112
Load current value rises.Such as the load current value in the cutting at the position of no TEG be 1.5A in the case of, when to TEG into
When row cutting, load current value reaches 2.0A or so.Therefore, in the case where load current value locally rises, presumption exists
TEG can be judged as that the increase of load current value is not based on the reduction of the cutting power of cutting tool 113.In addition, can be true
Recognize the existence position of TEG, therefore when cutting machined object of the same race, it can be according to the existence position of TEG to processing
The cutting sequence of preset lines is adjusted.Such as by finally cutting the processing preset lines there are TEG, it can reduce and cut
The finishing number of cutting knife tool replaces number, thereby increasing productivity.
In the case where causing cutting power to reduce due to long-time service cutting tool 113, load current value is also got higher.
Such as when load current value reaches 2.5A~3.0A, processing quality reduces.Also, make to bear in the reduction due to cutting power
In the case that set current value is got higher, the high state of load current value is continued for.Therefore, single according to display is shown in operator
Working position in member 18 corresponds to load current value information and is judged as that the cutting power reduction due to cutting tool 113 causes to bear
In the case that the high state of set current value continues, the finishing of cutting tool is carried out.Such as chuck table 10 shown in Fig. 1
Finishing board (not shown) etc. is nearby arranged, cutting tool 113 is made to be cut into finishing board, so as to improve the cutting of cutting tool
Ability.Alternatively, it is also possible to replace modifying, cutting tool 113 is replaced.
In addition, according to the size of machined object W, the total distance for the processing preset lines for having been carried out cutting can be found out, because
This after conditioning cutting power reduce again and load current value reach as defined in value above in the case of, calculate after finishing
Start again at cutting reach up to load current value as defined in it is more than value during total cutting distance, be held in so as to handle
It is modified at the time of having carried out cutting to how many distance (centre finishing).
The Working position being shown on display unit 18, which corresponds to load current value information, can be stored in storage shown in FIG. 1
In unit 17.That is, can correspond to load current value information as unit of a machined object to Working position in advance respectively and carry out
Storage.Therefore, it is possible to carry out the qualitative control of chip according to each machined object.In addition, can be to all processing preset lines
Load current value is stored, therefore for the machined object that cutting has terminated, also can be to thinking load current value exception
Position is confirmed.
In the present embodiment, the cutting according to the control information for the motor for constituting cutting feed unit to machined object
The position of the X-direction at position is identified, according to the control information for the motor for constituting index feed unit to machined object
The positions of Y direction of cutting parts be identified, but for the identification of cutting parts, can also use other than these
Method.Such as can also be to be separately equipped with scale in X-direction and Y direction in advance, by the reading value of scale to cutting
Position is cut to be identified.
In addition, in the present embodiment, being configured to there is load current at which position of processing preset lines
Value rising is held but it is also possible to be only being held to producing load current value rising in which item processing preset lines,
Without being determined to the position in the processing preset lines.In this case, according only to the electronic of composition index feed unit 13
The control information of machine 132 and determine processing preset lines, the motor 122 for constituting cutting feed unit 12 can not used
Control information.
Claims (2)
1. a kind of cutting apparatus, which has：
Chuck table keeps machined object；
Main shaft, the main shaft are driven in rotation；And
Cutting tool is mounted on the front end of the main shaft, and the machined object kept to the chuck table is cut,
The cutting apparatus carries out machining along processing preset lines to the machined object,
Wherein,
The cutting tool has：
The load current value of load current value detection unit, main shaft when to machining is detected；
Display unit, the load current value detected to the load current value detection unit are shown；And
Control unit at least controls the load current value detection unit and the display unit,
It is corresponding with the load current value of main shaft when being processed to the processing preset lines that the control unit will process preset lines
Ground is shown on the display unit.
2. cutting apparatus according to claim 1, wherein
Described control unit is distinguished using color according to the value of the load current value of the main shaft, is in line style differentiation any one
Side or both sides and by processing preset lines include on the display unit.
Applications Claiming Priority (2)
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| JP2017-038158 | 2017-03-01 | ||
| JP2017038158A JP6814662B2 (en) | 2017-03-01 | 2017-03-01 | Cutting equipment |
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| JP (1) | JP6814662B2 (en) |
| KR (1) | KR102341606B1 (en) |
| CN (1) | CN108538718B (en) |
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| DE102018204402A1 (en) * | 2018-03-22 | 2019-09-26 | Siemens Aktiengesellschaft | Method and device for taking a sample and use of such a device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04289071A (en) * | 1990-12-28 | 1992-10-14 | Noritake Co Ltd | Cutter and cutting method using rotary body |
| JPH11224116A (en) * | 1998-02-06 | 1999-08-17 | Mitsubishi Electric Corp | Working information display method and device for machine tool |
| JP2006235776A (en) * | 2005-02-23 | 2006-09-07 | Mitsubishi Heavy Ind Ltd | Machine tool and processing method by this machine tool |
| CN105690462A (en) * | 2014-12-12 | 2016-06-22 | 东和株式会社 | Cutting apparatus and cutting method |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6165051A (en) * | 1998-10-29 | 2000-12-26 | Kulicke & Soffa Investments, Inc. | Monitoring system for dicing saws |
| JP5134216B2 (en) * | 2006-06-23 | 2013-01-30 | 株式会社ディスコ | Wafer processing result management method |
| JP2008004885A (en) * | 2006-06-26 | 2008-01-10 | Disco Abrasive Syst Ltd | Processing machine |
| JP5149072B2 (en) * | 2008-05-21 | 2013-02-20 | 株式会社ディスコ | Cutting equipment |
| JP5561222B2 (en) * | 2011-03-29 | 2014-07-30 | 株式会社デンソー | CUTTING DEVICE, CUTTING METHOD USING CUTTING DEVICE, AND PRODUCT MANUFACTURING METHOD |
| JP6280459B2 (en) * | 2014-06-27 | 2018-02-14 | 株式会社ディスコ | Tape expansion unit |
| JP6695102B2 (en) * | 2015-05-26 | 2020-05-20 | 株式会社ディスコ | Processing system |
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2017
- 2017-03-01 JP JP2017038158A patent/JP6814662B2/en active Active
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- 2018-02-05 TW TW107103993A patent/TWI745541B/en active
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04289071A (en) * | 1990-12-28 | 1992-10-14 | Noritake Co Ltd | Cutter and cutting method using rotary body |
| JPH11224116A (en) * | 1998-02-06 | 1999-08-17 | Mitsubishi Electric Corp | Working information display method and device for machine tool |
| JP2006235776A (en) * | 2005-02-23 | 2006-09-07 | Mitsubishi Heavy Ind Ltd | Machine tool and processing method by this machine tool |
| CN105690462A (en) * | 2014-12-12 | 2016-06-22 | 东和株式会社 | Cutting apparatus and cutting method |
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| Publication number | Publication date |
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| TWI745541B (en) | 2021-11-11 |
| KR102341606B1 (en) | 2021-12-22 |
| JP2018147913A (en) | 2018-09-20 |
| TW201834045A (en) | 2018-09-16 |
| KR20180100497A (en) | 2018-09-11 |
| JP6814662B2 (en) | 2021-01-20 |
| CN108538718B (en) | 2024-05-17 |
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