CN108526175A - 一种湿式制程设备液流物理洗净装置 - Google Patents

一种湿式制程设备液流物理洗净装置 Download PDF

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Publication number
CN108526175A
CN108526175A CN201810458577.5A CN201810458577A CN108526175A CN 108526175 A CN108526175 A CN 108526175A CN 201810458577 A CN201810458577 A CN 201810458577A CN 108526175 A CN108526175 A CN 108526175A
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wet process
teflon pipe
process equipment
liquid
bristle
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陈滢如
简健哲
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Anhui Hongshi Automation Equipment Co Ltd
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Anhui Hongshi Automation Equipment Co Ltd
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Priority to CN201810458577.5A priority Critical patent/CN108526175A/zh
Publication of CN108526175A publication Critical patent/CN108526175A/zh
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B11/00Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00Cleaning by methods involving the use of tools
    • B08B1/10Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/12Brushes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00Cleaning by methods involving the use of tools
    • B08B1/20Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02Cleaning by the force of jets or sprays
    • B08B3/022Cleaning travelling work
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

一种湿式制程设备液流物理洗净装置,横向安装在湿式制程设备中,包括本体,本体包括特氟龙管,所述特氟龙管为一端封口,另一端设有连接孔的圆柱形腔体,其连接孔端与湿式制程机台的药液进液管联通,且端部与湿式制程机台的传动装置轴套连接,特氟龙管的圆柱外壁设有均匀排列的通孔,特氟龙管外壁设有包覆的刷毛。本发明所述的一种湿式制程设备液流物理洗净装置,设计为整合型模刷清洗机构,特氟龙管一端通入药液,药液经特氟龙管上的通孔流出,可一边刷一边通入药液,药液从刷毛间流出,洗刷过程中的冲力可以使得脏污难以粘附在毛刷上,保持毛刷的洁净度,从而可保证对半导体晶圆刷洗过程中不带入污染物,提高良品率的同时,延长模刷的使用寿命。

Description

一种湿式制程设备液流物理洗净装置
技术领域
本发明涉及湿式制程设备领域,尤其涉及一种湿式制程设备液流物理洗净装置。
背景技术
半导体制程是在超洁净无尘室进行的,仍然有些污染源的存在,至于污染源的来源,不外乎设备本身材料产生、现场作业员或制程工程师人体自身与动作的影响、化学材料或制程药剂残留或不纯度的发生,以及制程反应产生物的结果,尤其是制程反应产生物一项,更成为制程污染的主要来源,大多会造成良率和可靠度的下降;在半导体制程中,无论是在去光阻、化学气相沉淀、氧化扩散、晶圆研磨以后等各阶段制程都需要反复清洗步骤。
湿式制程机台在半导体产业已是成熟发展,但有些机构设计,使用上有维修困难、耗液量大、均匀性不佳、漏液,背面脏污等等问题。其中,模刷机构最常被使用到,主要用来刷除基板上半导体晶圆表面残留的污染物等,但刷毛使用一段时间后,其表面经常会粘附脏污,容易将脏污带入到半导体晶圆上,影响产品的良率,另外,刷毛因容易粘附脏污,导致刷毛的使用寿命降低,需要经常更换,费时费力的同时,增加了设备成本降低了生产效率。
发明内容
本发明正是针对现有技术存在的不足,提供了一种湿式制程设备液流物理洗净装置。
为解决上述问题,本发明所采取的技术方案如下:
一种湿式制程设备液流物理洗净装置,横向安装在湿式制程设备中,包括本体,所述本体包括特氟龙管,所述特氟龙管为一端封口,另一端设有连接孔的圆柱形腔体,其连接孔端与湿式制程机台的药液进液管联通,且端部与湿式制程机台的传动装置轴套连接,特氟龙管的圆柱外壁设有均匀排列的通孔,特氟龙管外壁设有包覆的刷毛。
进一步的,所述湿式制程设备包括传动辊和喷淋管,所述传动辊为圆柱形,其上承载有基板,喷淋管位于载具上方,特氟龙管位于基板与喷淋管之间,且特氟龙管的刷毛与基板上表面紧贴。
进一步的,所述特氟龙管上通孔呈螺旋状均匀排列。
进一步的,所述刷毛外表面整体为海绵体型的波点。
本发明与现有技术相比较,本发明的有益效果如下:
本发明所述的一种湿式制程设备液流物理洗净装置,设计为整合型模刷清洗机构,特氟龙管一端可通入药液,药液经特氟龙管上的通孔流出,可一边刷一边通入药液,药液从刷毛间流出,洗刷过程中的冲力可以使得脏污难以粘附在毛刷上,保持毛刷的洁净度,从而可保证对半导体晶圆刷洗过程中不带入污染物,提高良品率的同时,延长模刷的使用寿命。
附图说明
图1为本发明所述的一种湿式制程设备液流物理洗净装置结构示意图。
具体实施方式
下面将结合具体的实施例来说明本发明的内容。
如图1所示为本发明所述的一种湿式制程设备液流物理洗净装置结构示意图,所述的一种湿式制程设备液流物理洗净装置,横向安装在湿式制程设备中,包括本体1,所述本体1包括特氟龙管2,所述特氟龙管2为一端封口,另一端设有连接孔的圆柱形腔体,其连接孔端与湿式制程机台的药液进液管3联通,且端部与湿式制程机台的传动装置轴套连接,特氟龙管2的圆柱外壁设有均匀排列的通孔4,特氟龙管2外壁设有包覆的刷毛5。
所述的一种湿式制程设备液流物理洗净装置,设计为整合型模刷清洗机构,特氟龙管2一端可通入药液,药液经特氟龙管2上的通孔4流出,可一边刷一边通入药液,药液从刷毛5间流出,洗刷过程中的冲力可以使得脏污难以粘附在刷毛5上,保持刷毛5的洁净度,从而可保证对半导体晶圆刷洗过程中不带入污染物,提高良品率的同时,延长模刷的使用寿命。
所述湿式制程设备包括传动辊6和喷淋管7,所述传动辊6为圆柱形,其上承载有基板8,喷淋管7位于载具上方,特氟龙管2位于基板8与喷淋管7之间,且特氟龙管2的刷毛5与基板8上表面紧贴,传动辊6带入基板8横向移动,喷淋管7对基板8上半导体晶圆冲淋的同时,也会对特氟龙管2上端刷毛5冲淋,配合特氟龙管2的转动,进一步提高对刷毛5清洗,确保刷毛5上不会粘附脏污。
所述特氟龙管2上通孔4呈螺旋状均匀排列,特氟龙管2转动时,螺旋状排列的通孔4药液输出更加全面均匀,对刷毛5的清洗效果更佳,进一步保证了刷毛5不会粘附脏污,提高了模刷的使用寿命。
所述刷毛5外表面整体为海绵体型的波点,增大了刷魔5与基板8之间的摩擦力,冲击力好,也能有效去除刷毛5上粘附的脏污,保证模刷洗刷效果,提高产品的良率。
以上所述仅为本发明的较佳实施例而已,并不用以限制本发明,凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等,均应包含在本发明的保护范围之内。

Claims (4)

1.一种湿式制程设备液流物理洗净装置,横向安装在湿式制程设备中,其特征是,包括本体(1),所述本体(1)包括特氟龙管(2),所述特氟龙管(2)为一端封口,另一端设有连接孔的圆柱形腔体,其连接孔端与湿式制程机台的药液进液管(3)联通,且端部与湿式制程机台的传动装置轴套连接,特氟龙管(2)的圆柱外壁设有均匀排列的通孔(4),特氟龙管(2)外壁设有包覆的刷毛(5)。
2.根据权利要求1所述的一种湿式制程设备液流物理洗净装置,其特征是,所述湿式制程设备包括传动辊(6)和喷淋管(7),所述传动辊(6)为圆柱形,其上承载有基板(8),喷淋管(7)位于载具上方,特氟龙管(2)位于基板(8)与喷淋管(7)之间,且特氟龙管(2)的刷毛(5)与基板(8)上表面紧贴。
3.根据权利要求1所述的一种湿式制程设备液流物理洗净装置,其特征是,所述特氟龙管(2)上通孔(4)呈螺旋状均匀排列。
4.根据权利要求1所述的一种湿式制程设备液流物理洗净装置,其特征是,所述刷毛(5)外表面整体为海绵体型的波点。
CN201810458577.5A 2018-05-14 2018-05-14 一种湿式制程设备液流物理洗净装置 Pending CN108526175A (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110665366A (zh) * 2019-10-25 2020-01-10 杭州博思特装饰材料有限公司 一种有机废气净化装置

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JPH0774132A (ja) * 1993-09-06 1995-03-17 Fujitsu Ltd ブラシスクラバとブラシスクラブ方法
TW572352U (en) * 2003-06-03 2004-01-11 Chunghwa Picture Tubes Ltd Substrate cleaning device
CN205789893U (zh) * 2016-06-22 2016-12-07 昆山国显光电有限公司 用于洗刷基板的滚刷和基板传送装置
TW201733692A (zh) * 2016-03-24 2017-10-01 盟立自動化股份有限公司 清洗機構
CN208427504U (zh) * 2018-05-14 2019-01-25 安徽宏实自动化装备有限公司 一种湿式制程设备液流物理洗净装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0774132A (ja) * 1993-09-06 1995-03-17 Fujitsu Ltd ブラシスクラバとブラシスクラブ方法
TW572352U (en) * 2003-06-03 2004-01-11 Chunghwa Picture Tubes Ltd Substrate cleaning device
TW201733692A (zh) * 2016-03-24 2017-10-01 盟立自動化股份有限公司 清洗機構
CN205789893U (zh) * 2016-06-22 2016-12-07 昆山国显光电有限公司 用于洗刷基板的滚刷和基板传送装置
CN208427504U (zh) * 2018-05-14 2019-01-25 安徽宏实自动化装备有限公司 一种湿式制程设备液流物理洗净装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110665366A (zh) * 2019-10-25 2020-01-10 杭州博思特装饰材料有限公司 一种有机废气净化装置
CN110665366B (zh) * 2019-10-25 2022-02-01 杭州博思特装饰材料有限公司 一种有机废气净化装置

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