CN108526175A - 一种湿式制程设备液流物理洗净装置 - Google Patents
一种湿式制程设备液流物理洗净装置 Download PDFInfo
- Publication number
- CN108526175A CN108526175A CN201810458577.5A CN201810458577A CN108526175A CN 108526175 A CN108526175 A CN 108526175A CN 201810458577 A CN201810458577 A CN 201810458577A CN 108526175 A CN108526175 A CN 108526175A
- Authority
- CN
- China
- Prior art keywords
- wet process
- teflon pipe
- process equipment
- liquid
- bristle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 40
- 230000008569 process Effects 0.000 title claims abstract description 37
- 239000007788 liquid Substances 0.000 title claims abstract description 34
- 239000004809 Teflon Substances 0.000 claims abstract description 34
- 229920006362 Teflon® Polymers 0.000 claims abstract description 34
- 230000005540 biological transmission Effects 0.000 claims abstract description 4
- 238000005253 cladding Methods 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 claims description 11
- 239000007921 spray Substances 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 abstract description 9
- 230000001680 brushing effect Effects 0.000 abstract description 4
- 239000003344 environmental pollutant Substances 0.000 abstract description 4
- 230000007246 mechanism Effects 0.000 abstract description 4
- 231100000719 pollutant Toxicity 0.000 abstract description 4
- 230000003749 cleanliness Effects 0.000 abstract description 3
- 238000005201 scrubbing Methods 0.000 abstract description 3
- 238000004140 cleaning Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000003814 drug Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000000686 essence Substances 0.000 description 1
- 239000007792 gaseous phase Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/12—Brushes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/20—Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
一种湿式制程设备液流物理洗净装置,横向安装在湿式制程设备中,包括本体,本体包括特氟龙管,所述特氟龙管为一端封口,另一端设有连接孔的圆柱形腔体,其连接孔端与湿式制程机台的药液进液管联通,且端部与湿式制程机台的传动装置轴套连接,特氟龙管的圆柱外壁设有均匀排列的通孔,特氟龙管外壁设有包覆的刷毛。本发明所述的一种湿式制程设备液流物理洗净装置,设计为整合型模刷清洗机构,特氟龙管一端通入药液,药液经特氟龙管上的通孔流出,可一边刷一边通入药液,药液从刷毛间流出,洗刷过程中的冲力可以使得脏污难以粘附在毛刷上,保持毛刷的洁净度,从而可保证对半导体晶圆刷洗过程中不带入污染物,提高良品率的同时,延长模刷的使用寿命。
Description
技术领域
本发明涉及湿式制程设备领域,尤其涉及一种湿式制程设备液流物理洗净装置。
背景技术
半导体制程是在超洁净无尘室进行的,仍然有些污染源的存在,至于污染源的来源,不外乎设备本身材料产生、现场作业员或制程工程师人体自身与动作的影响、化学材料或制程药剂残留或不纯度的发生,以及制程反应产生物的结果,尤其是制程反应产生物一项,更成为制程污染的主要来源,大多会造成良率和可靠度的下降;在半导体制程中,无论是在去光阻、化学气相沉淀、氧化扩散、晶圆研磨以后等各阶段制程都需要反复清洗步骤。
湿式制程机台在半导体产业已是成熟发展,但有些机构设计,使用上有维修困难、耗液量大、均匀性不佳、漏液,背面脏污等等问题。其中,模刷机构最常被使用到,主要用来刷除基板上半导体晶圆表面残留的污染物等,但刷毛使用一段时间后,其表面经常会粘附脏污,容易将脏污带入到半导体晶圆上,影响产品的良率,另外,刷毛因容易粘附脏污,导致刷毛的使用寿命降低,需要经常更换,费时费力的同时,增加了设备成本降低了生产效率。
发明内容
本发明正是针对现有技术存在的不足,提供了一种湿式制程设备液流物理洗净装置。
为解决上述问题,本发明所采取的技术方案如下:
一种湿式制程设备液流物理洗净装置,横向安装在湿式制程设备中,包括本体,所述本体包括特氟龙管,所述特氟龙管为一端封口,另一端设有连接孔的圆柱形腔体,其连接孔端与湿式制程机台的药液进液管联通,且端部与湿式制程机台的传动装置轴套连接,特氟龙管的圆柱外壁设有均匀排列的通孔,特氟龙管外壁设有包覆的刷毛。
进一步的,所述湿式制程设备包括传动辊和喷淋管,所述传动辊为圆柱形,其上承载有基板,喷淋管位于载具上方,特氟龙管位于基板与喷淋管之间,且特氟龙管的刷毛与基板上表面紧贴。
进一步的,所述特氟龙管上通孔呈螺旋状均匀排列。
进一步的,所述刷毛外表面整体为海绵体型的波点。
本发明与现有技术相比较,本发明的有益效果如下:
本发明所述的一种湿式制程设备液流物理洗净装置,设计为整合型模刷清洗机构,特氟龙管一端可通入药液,药液经特氟龙管上的通孔流出,可一边刷一边通入药液,药液从刷毛间流出,洗刷过程中的冲力可以使得脏污难以粘附在毛刷上,保持毛刷的洁净度,从而可保证对半导体晶圆刷洗过程中不带入污染物,提高良品率的同时,延长模刷的使用寿命。
附图说明
图1为本发明所述的一种湿式制程设备液流物理洗净装置结构示意图。
具体实施方式
下面将结合具体的实施例来说明本发明的内容。
如图1所示为本发明所述的一种湿式制程设备液流物理洗净装置结构示意图,所述的一种湿式制程设备液流物理洗净装置,横向安装在湿式制程设备中,包括本体1,所述本体1包括特氟龙管2,所述特氟龙管2为一端封口,另一端设有连接孔的圆柱形腔体,其连接孔端与湿式制程机台的药液进液管3联通,且端部与湿式制程机台的传动装置轴套连接,特氟龙管2的圆柱外壁设有均匀排列的通孔4,特氟龙管2外壁设有包覆的刷毛5。
所述的一种湿式制程设备液流物理洗净装置,设计为整合型模刷清洗机构,特氟龙管2一端可通入药液,药液经特氟龙管2上的通孔4流出,可一边刷一边通入药液,药液从刷毛5间流出,洗刷过程中的冲力可以使得脏污难以粘附在刷毛5上,保持刷毛5的洁净度,从而可保证对半导体晶圆刷洗过程中不带入污染物,提高良品率的同时,延长模刷的使用寿命。
所述湿式制程设备包括传动辊6和喷淋管7,所述传动辊6为圆柱形,其上承载有基板8,喷淋管7位于载具上方,特氟龙管2位于基板8与喷淋管7之间,且特氟龙管2的刷毛5与基板8上表面紧贴,传动辊6带入基板8横向移动,喷淋管7对基板8上半导体晶圆冲淋的同时,也会对特氟龙管2上端刷毛5冲淋,配合特氟龙管2的转动,进一步提高对刷毛5清洗,确保刷毛5上不会粘附脏污。
所述特氟龙管2上通孔4呈螺旋状均匀排列,特氟龙管2转动时,螺旋状排列的通孔4药液输出更加全面均匀,对刷毛5的清洗效果更佳,进一步保证了刷毛5不会粘附脏污,提高了模刷的使用寿命。
所述刷毛5外表面整体为海绵体型的波点,增大了刷魔5与基板8之间的摩擦力,冲击力好,也能有效去除刷毛5上粘附的脏污,保证模刷洗刷效果,提高产品的良率。
以上所述仅为本发明的较佳实施例而已,并不用以限制本发明,凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等,均应包含在本发明的保护范围之内。
Claims (4)
1.一种湿式制程设备液流物理洗净装置,横向安装在湿式制程设备中,其特征是,包括本体(1),所述本体(1)包括特氟龙管(2),所述特氟龙管(2)为一端封口,另一端设有连接孔的圆柱形腔体,其连接孔端与湿式制程机台的药液进液管(3)联通,且端部与湿式制程机台的传动装置轴套连接,特氟龙管(2)的圆柱外壁设有均匀排列的通孔(4),特氟龙管(2)外壁设有包覆的刷毛(5)。
2.根据权利要求1所述的一种湿式制程设备液流物理洗净装置,其特征是,所述湿式制程设备包括传动辊(6)和喷淋管(7),所述传动辊(6)为圆柱形,其上承载有基板(8),喷淋管(7)位于载具上方,特氟龙管(2)位于基板(8)与喷淋管(7)之间,且特氟龙管(2)的刷毛(5)与基板(8)上表面紧贴。
3.根据权利要求1所述的一种湿式制程设备液流物理洗净装置,其特征是,所述特氟龙管(2)上通孔(4)呈螺旋状均匀排列。
4.根据权利要求1所述的一种湿式制程设备液流物理洗净装置,其特征是,所述刷毛(5)外表面整体为海绵体型的波点。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810458577.5A CN108526175A (zh) | 2018-05-14 | 2018-05-14 | 一种湿式制程设备液流物理洗净装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810458577.5A CN108526175A (zh) | 2018-05-14 | 2018-05-14 | 一种湿式制程设备液流物理洗净装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN108526175A true CN108526175A (zh) | 2018-09-14 |
Family
ID=63477050
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810458577.5A Pending CN108526175A (zh) | 2018-05-14 | 2018-05-14 | 一种湿式制程设备液流物理洗净装置 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN108526175A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110665366A (zh) * | 2019-10-25 | 2020-01-10 | 杭州博思特装饰材料有限公司 | 一种有机废气净化装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0774132A (ja) * | 1993-09-06 | 1995-03-17 | Fujitsu Ltd | ブラシスクラバとブラシスクラブ方法 |
TW572352U (en) * | 2003-06-03 | 2004-01-11 | Chunghwa Picture Tubes Ltd | Substrate cleaning device |
CN205789893U (zh) * | 2016-06-22 | 2016-12-07 | 昆山国显光电有限公司 | 用于洗刷基板的滚刷和基板传送装置 |
TW201733692A (zh) * | 2016-03-24 | 2017-10-01 | 盟立自動化股份有限公司 | 清洗機構 |
CN208427504U (zh) * | 2018-05-14 | 2019-01-25 | 安徽宏实自动化装备有限公司 | 一种湿式制程设备液流物理洗净装置 |
-
2018
- 2018-05-14 CN CN201810458577.5A patent/CN108526175A/zh active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0774132A (ja) * | 1993-09-06 | 1995-03-17 | Fujitsu Ltd | ブラシスクラバとブラシスクラブ方法 |
TW572352U (en) * | 2003-06-03 | 2004-01-11 | Chunghwa Picture Tubes Ltd | Substrate cleaning device |
TW201733692A (zh) * | 2016-03-24 | 2017-10-01 | 盟立自動化股份有限公司 | 清洗機構 |
CN205789893U (zh) * | 2016-06-22 | 2016-12-07 | 昆山国显光电有限公司 | 用于洗刷基板的滚刷和基板传送装置 |
CN208427504U (zh) * | 2018-05-14 | 2019-01-25 | 安徽宏实自动化装备有限公司 | 一种湿式制程设备液流物理洗净装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110665366A (zh) * | 2019-10-25 | 2020-01-10 | 杭州博思特装饰材料有限公司 | 一种有机废气净化装置 |
CN110665366B (zh) * | 2019-10-25 | 2022-02-01 | 杭州博思特装饰材料有限公司 | 一种有机废气净化装置 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW411522B (en) | A semiconductor device washing apparatus and a method of washing a semiconducotr device | |
WO2012163154A1 (zh) | 化学机械平坦化后清洗晶圆的方法 | |
CN207103358U (zh) | 一种自动洗瓶机 | |
CN202962975U (zh) | 烧结炉带的清洁装置及具有其的烧结炉 | |
CN104167351A (zh) | 一种SiC外延片的化学机械清洗方法及专用工具 | |
CN208427504U (zh) | 一种湿式制程设备液流物理洗净装置 | |
CN105983546A (zh) | 晶圆清洗方法 | |
CN108526175A (zh) | 一种湿式制程设备液流物理洗净装置 | |
CN202290654U (zh) | 兆声波清洗头及具有该清洗头的兆声波清洗系统 | |
CN206315567U (zh) | 滤芯清洗机 | |
CN116099785A (zh) | 晶圆清洗装置和晶圆加工设备 | |
TW449816B (en) | Wet processing apparatus | |
CN209020892U (zh) | 一种旋转螺杆式水利机械清管器 | |
CN206292479U (zh) | 一种超声干式清洗装置 | |
CN215613584U (zh) | 一种晶圆清洗台及晶圆清洗装置 | |
CN103962345B (zh) | 晶圆的碎屑的清除方法 | |
TWI695741B (zh) | 研磨後清潔裝置 | |
CN205270194U (zh) | 一种玻璃清洗装置 | |
CN210159998U (zh) | 一种砷化镓晶片表面清洁装置 | |
CN208189541U (zh) | 一种湿式制程设备动态蚀刻药液喷洒装置 | |
CN215466612U (zh) | 一种sic衬底的清洗装置 | |
CN202134514U (zh) | 一种单晶硅片的超声波清洗装置 | |
CN110524422A (zh) | 研磨垫清洗方法及装置 | |
CN215911399U (zh) | 一种半导体晶片抛光后拆卸用冲水装置 | |
CN210607200U (zh) | 晶圆清洁装置及晶圆清洁系统 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination |