CN108493329B - 电子器件及极化系统、电子器件模块制作方法及电子设备 - Google Patents
电子器件及极化系统、电子器件模块制作方法及电子设备 Download PDFInfo
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- CN108493329B CN108493329B CN201810105677.XA CN201810105677A CN108493329B CN 108493329 B CN108493329 B CN 108493329B CN 201810105677 A CN201810105677 A CN 201810105677A CN 108493329 B CN108493329 B CN 108493329B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/04—Treatments to modify a piezoelectric or electrostrictive property, e.g. polarisation characteristics, vibration characteristics or mode tuning
- H10N30/045—Treatments to modify a piezoelectric or electrostrictive property, e.g. polarisation characteristics, vibration characteristics or mode tuning by polarising
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/871—Single-layered electrodes of multilayer piezoelectric or electrostrictive devices, e.g. internal electrodes
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CN201810105677.XA CN108493329B (zh) | 2018-02-01 | 2018-02-01 | 电子器件及极化系统、电子器件模块制作方法及电子设备 |
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CN201810105677.XA CN108493329B (zh) | 2018-02-01 | 2018-02-01 | 电子器件及极化系统、电子器件模块制作方法及电子设备 |
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CN108493329B true CN108493329B (zh) | 2021-11-02 |
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CN110137340B (zh) * | 2019-04-08 | 2023-06-20 | 杭州士兰微电子股份有限公司 | 传感器组件的极化方法 |
CN110163085B (zh) * | 2019-04-08 | 2021-07-09 | 杭州士兰微电子股份有限公司 | 传感器组件的极化方法 |
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JP5442519B2 (ja) * | 2010-04-07 | 2014-03-12 | ダイキン工業株式会社 | 透明圧電シート、それをそれぞれ含有するフレーム付透明圧電シート、タッチ位置検出用タッチパネル、ディスプレイ装置、タッチパネルおよび電子機器 |
CN103674225B (zh) * | 2013-11-25 | 2016-03-02 | 北京航空航天大学 | 一种局部极化压电薄膜传感器 |
JP6332735B2 (ja) * | 2014-02-24 | 2018-05-30 | 株式会社リコー | 電気機械変換部材及びその製造方法、並びに、その電気機械変換部材を備える液滴吐出ヘッド及び画像形成装置 |
WO2016158743A1 (ja) * | 2015-03-30 | 2016-10-06 | 株式会社村田製作所 | マザーの圧電素子及び積層型圧電素子並びに積層型圧電素子の製造方法 |
CN106876579B (zh) * | 2016-12-27 | 2021-03-09 | 王开安 | 高分子薄膜极化方法及装置、极化膜、电子器件 |
CN106778691B (zh) * | 2017-01-16 | 2020-04-21 | 业成科技(成都)有限公司 | 声波式指纹识别装置及其制作方法以及应用其的电子装置 |
CN107451573A (zh) * | 2017-08-07 | 2017-12-08 | 吴露 | 复合式指纹识别模组、复合式指纹识别器件及电子设备 |
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Effective date of registration: 20190710 Address after: 611600 Bajiao Village Group 5, Shou'an Town, Pujiang County, Chengdu City, Sichuan Province Applicant after: Fang Rong Address before: 610000 South Tianfu Avenue, Tianfu New District, Chengdu City, Sichuan Province, 2039 Tianfu Jingrong Building, 16th Floor, 1609 Applicant before: Chengdu Rui core technology Co., Ltd. |
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Effective date of registration: 20200630 Address after: No.88, Yingbin Avenue, Shouan Town, Pujiang County, Chengdu City, Sichuan Province Applicant after: Chengdu Dachao Technology Co.,Ltd. Address before: 611600 Bajiao Village Group 5, Shou'an Town, Pujiang County, Chengdu City, Sichuan Province Applicant before: Fang Rong |
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