CN108470725A - A kind of high performance control chip-packaging structure - Google Patents
A kind of high performance control chip-packaging structure Download PDFInfo
- Publication number
- CN108470725A CN108470725A CN201810411156.7A CN201810411156A CN108470725A CN 108470725 A CN108470725 A CN 108470725A CN 201810411156 A CN201810411156 A CN 201810411156A CN 108470725 A CN108470725 A CN 108470725A
- Authority
- CN
- China
- Prior art keywords
- upper cover
- pin
- fixed
- high performance
- control chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
Abstract
The invention discloses a kind of high performance control chip-packaging structures, including upper cover and lower housing, the upper cover and lower housing are mutually butted sealing, form package casing, the package casing is internally provided with substrate, it is installed with integrated circuit die on the substrate, the both sides of the package casing are fixedly installed several short pins along its length, it is welded by metal lead wire between hard contact and short pin on the integrated circuit die, the inner cavity of the package casing is embedded to resin, and resin is reserved with gap at the top of upper cover, the upper cover is located at gap location and is provided with radiator structure.It is of the invention novel in design, it is simple in structure, easy to use, the design seperated with chip of external pin both can guarantee that pin will not fracture in transportational process, it again can be so that pin be replaceable, the utilization rate for improving chip reduces scrappage, while while ensureing leakproofness, the radiating efficiency of chip is improved, suitable for promoting the use of.
Description
Technical field
The present invention relates to chip encapsulation technology field more particularly to a kind of high performance control chip-packaging structures.
Background technology
Encapsulation, refers to just that the circuit pin on silicon chip is connect with conducting wire and guided at external lug, in order to which other devices connect
It connects.Packing forms refer to the shell for installing semiconductor integrated circuit chip.It not only plays installation, fixation, sealing, protection core
The effect of piece and enhancing electric heating property etc., but also it is wired to by the contact on chip the pin of package casing
On, these pins are connected further through the conducting wire on printed circuit board with other devices, to realize inside chip and external electrical
The connection on road.Because chip must be isolated from the outside, to prevent the impurity in air from being caused to the corrosion of chip circuit electrically
Performance declines.On the other hand, the chip after encapsulation is also more convenient for installing and be transported.Since the quality of encapsulation technology also directly affects
To the design and manufacture of the performance and the PCB (printed circuit board) being attached thereto of chip self performance, therefore it is most important
's.
After the completion of traditional chip package, pin is fixedly connected with package casing, is held very much during transport and use
It easily leads to pipeline to fracture, leads to entire chip rejection, and chip cost is high, this results in largely losing, and in order to ensure
Chip interior bare board not by impurity and moisture and ray influenced, general package casing is sealing structure, this is resulted in
Chip cooling effect is poor, influences chip in work so that efficiency, traditional chip-packaging structure cannot be satisfied making for user
With demand, we design a kind of high performance control chip-packaging structure thus, to solve the above problems.
Invention content
The purpose of the present invention is to solve conventional package pin frangibility in the prior art, heat dissipation effect difference lack
Point, and a kind of high performance control chip-packaging structure proposed.
To achieve the goals above, present invention employs following technical solutions：
A kind of high performance control chip-packaging structure, including upper cover and lower housing, the upper cover and lower housing are mutually butted sealing,
Package casing is formed, the package casing is internally provided with substrate, integrated circuit die, institute are installed on the substrate
The both sides for stating package casing are fixedly installed several short pins, the hard contact on the integrated circuit die along its length
It is welded by metal lead wire between short pin, the inner cavity of the package casing is embedded to resin, and resin is apart from the top of upper cover
It is reserved with gap, the upper cover is located at gap location and is provided with radiator structure, and the both ends of the lower housing two sides are both provided with admittedly
Determine structure, the fixed structure includes supporting rod, and one end of the supporting rod is fixedly connected on lower housing, separately has one end to fix
It is provided with L-shaped fixed link, forms buckling groove between the L-shaped fixed link and supporting rod, and be provided through in L-shaped fixed link
Screw, two are located between the fixed structure of the same side of the lower housing and are installed with external pin, and external pin with
Short pin is connected.
Preferably, the radiator structure includes two positive stop strips, and two positive stop strips are fixedly installed on upper cover internal clearance
Both sides inner wall on, and adjustable plate is movably set between the upside of two positive stop strips, it is equidistant on the adjustable plate to be provided with
First radiating groove, and the first radiating groove is arranged along the width direction of adjustable plate, is fixedly connected in the middle part of one end of the adjustable plate
Support plate, the one end of the support plate far from adjustable plate are fixedly installed perpendicular push plate, equidistant in the upper cover to be provided with
Perforative second radiating groove, and the second radiating groove is arranged along its width direction, the side wall that the upper cover is located at support plate is provided with
Notch, and support plate extends to the outside of upper cover by notch.
Preferably, the spacing of first radiating groove between any two and the second radiating groove are equal at a distance between any two, adjust
Section plate is located at upper cover in the state of initial position, and the first radiating groove is staggered with the second radiating groove, and support plate is located at upper cover
Outer length is equal with the spacing of the first radiating groove between any two.
Preferably, the external pin includes fixed strut, and the fixed strut is strip structure, and both ends are respectively provided with
There are docking block, the side of the fixed strut to be equidistantly positioned copper cap along its length, the side of the copper cap is provided with
Docking groove, the side of the fixed strut far from copper cap have been equidistantly positioned long pin along its length, the long pin with
Copper cap corresponds, and long pin is connected positioned at interior one end of fixed strut with copper cap.
Preferably, the equal length of the length and package casing of the fixed strut, and the docking block at fixed strut both ends
It is docked in the buckling groove of two fixed structures of encapsulating housing the same side.
Preferably, the setting quantity of the copper cap is equal with the setting quantity of short pin, and corresponds.
Preferably, the side that the substrate is in contact with integrated circuit die is equipped with one layer of heat sink material.
Preferably, it is provided with screw hole on the upside of the docking block, and the screw on fixed structure is fixedly connected with screw hole.
Compared with prior art, the beneficial effects of the invention are as follows：
1, short pin is arranged in package casing both sides, and connects external pin by fixed structure, the extension tube attached foot in transportational process
It is separable with package casing, in use, the short pin of external pin and encapsulating housing can be fixedly connected, avoid chip pipe
Foot fractures during transport and use, and external pin fracture after be conveniently replaceable, can ensure that chip will not be because of pin
It fractures and scraps, improve the service life and utilization rate of chip；
2, under radiator structure original state, adjustable plate blocks the second radiating groove, ensures under transportational process and unused state, envelope
The leakproofness of casing, chip can push push plate after installation is complete so that the first radiating groove is overlapped with the second radiating groove, is improved
The radiating efficiency of chip, improves the efficiency during chip use.
Of the invention novel in design, simple in structure, easy to use, the design seperated with chip of external pin both can guarantee transport
Pin will not fracture in the process, and can improve the utilization rate of chip, reduce scrappage so that pin is replaceable, while
While ensureing leakproofness, the radiating efficiency of chip is improved, suitable for promoting the use of.
Description of the drawings
Fig. 1 is a kind of structural schematic diagram of high performance control chip-packaging structure proposed by the present invention；
Fig. 2 is a kind of overlook explosive view of high performance control chip-packaging structure proposed by the present invention；
Fig. 3 is a kind of side sectional view of the upper cover of high performance control chip-packaging structure proposed by the present invention；
Fig. 4 is a kind of structural schematic diagram of the adjustable plate of high performance control chip-packaging structure proposed by the present invention；
Fig. 5 is a kind of side view of the external pin of high performance control chip-packaging structure proposed by the present invention.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.
Referring to Fig.1 with 2, a kind of high performance control chip-packaging structure, including upper cover 1 and lower housing 2, upper cover 1 and lower casing
Body 2 is mutually butted sealing, forms package casing, and package casing is internally provided with substrate 3, is installed on substrate 3 integrated
Circuit die 4, the side that substrate 3 is in contact with integrated circuit die 4 are equipped with one layer of heat sink material 18, the both sides of package casing
It is fixedly installed several short pins 5 along its length, passes through between the hard contact on integrated circuit die 4 and short pin 5
Metal lead wire 6 welds, and the inner cavity of package casing is embedded to resin 7, and resin 7 is reserved with gap, upper cover 1 apart from the top of upper cover 1
Gap location is provided with radiator structure, the both ends of 2 two sides of lower housing are both provided with fixed structure, and fixed structure includes support
One end of bar 14, supporting rod 14 is fixedly connected on lower housing 2, separately has one end to be fixedly installed L-shaped fixed link 15, L-shaped is fixed
The screw 16 for forming buckling groove between bar 15 and supporting rod 14, and being provided through in L-shaped fixed link 15, two are located at lower housing
External pin 17 is installed between the fixed structure of 2 same sides, and external pin 17 is connected with short pin 5.
The design seperated with package casing of external pin 17, not only can guarantee that pin will not fracture in transportational process, but also can make
Pin is replaceable, improves the utilization rate of chip, reduces scrappage, while while ensureing leakproofness, improving chip
Radiating efficiency, suitable for promoting the use of.
With reference to Fig. 2-4, radiator structure includes two positive stop strips 9, and two positive stop strips 9 are fixedly installed between 1 inside of upper cover
On the both sides inner wall of gap, and it is movably set with adjustable plate 10 between the upside of two positive stop strips 9, is equidistantly positioned on adjustable plate 10
There is the first radiating groove 11, and the first radiating groove 11 is arranged along the width direction of adjustable plate 10, it is fixed in the middle part of one end of adjustable plate 10
It is connected with support plate 12, the one end of support plate 12 far from adjustable plate 10 is fixedly installed perpendicular push plate 13, equidistant in upper cover 1
The second radiating groove 8 being provided through, and the second radiating groove 8 is arranged along its width direction, upper cover 1 is located at the side wall at support plate 12
It is provided with notch, and support plate 12 extends to the outside of upper cover 1, the spacing and second of the first radiating groove 11 between any two by notch
The distance of radiating groove 8 between any two is equal, and adjustable plate 10 and upper cover 1 are located in the state of initial position, the first radiating groove 11 and
Second radiating groove 8 is staggered, and support plate 12 is located at spacing phase of the length with the first radiating groove 11 between any two outside upper cover 1
Deng.
Under radiator structure original state, adjustable plate 10 blocks the second radiating groove 8, ensures transportational process and unused state
Under, the leakproofness of package casing, chip can push push plate 13 so that the first radiating groove 11 and after installation is complete into upper cover 1
Two radiating grooves 8 overlap, and improve the radiating efficiency of chip, improve the efficiency during chip use.
Referring to Fig.1,2 and 5, external pin 17 includes fixed strut 171, fixes strut 171 as strip structure, and both ends
It is both provided with docking block 175, the side of fixed strut 171 has been equidistantly positioned copper cap 172 along its length, copper cap 172
Side is provided with docking groove 173, and 171 side far from copper cap 172 of fixed strut has been equidistantly positioned long tube along its length
Foot 174, long pin 174 are corresponded with copper cap 172, and long pin 174 is located at interior one end and the copper cap of fixed strut 171
172 are connected, the equal length of the length and package casing of fixed strut 171, and the docking block 175 at 171 both ends of fixed strut
It is docked in the buckling groove of two fixed structures of encapsulating housing the same side, setting quantity and the short pin 5 of copper cap 172
It is equal that quantity is set, and corresponds, the upside of docking block 175 is provided with screw hole, and the screw 16 on fixed structure and screw hole
It is fixedly connected.
Short pin 5 is arranged in package casing both sides, and connects external pin 17 by fixed structure, external in transportational process
Pin 17 is separable with package casing, in use, external pin 17 and the short pin 5 of encapsulating housing can be fixedly connected, phase
When docking, short pin 5 is inserted into the docking groove 173 of copper cap 172 on external pin 17 so that short pin 5 is connected with long pin 174
It is logical, and long pin 174 can be the shape needed in the actual productions such as strip, zigzag shape, avoid chip pin transport with
And use during fracture, and external pin 17 fracture after be conveniently replaceable, can ensure that chip will not be reported because pin fractures
It is useless, improve the service life and utilization rate of chip.
The foregoing is only a preferred embodiment of the present invention, but scope of protection of the present invention is not limited thereto,
Any one skilled in the art in the technical scope disclosed by the present invention, according to the technique and scheme of the present invention and its
Inventive concept is subject to equivalent substitution or change, should be covered by the protection scope of the present invention.
Claims (8)
1. a kind of high performance control chip-packaging structure, including upper cover（1）And lower housing（2）, the upper cover（1）And lower housing
（2）It is mutually butted sealing, forms package casing, which is characterized in that the package casing is internally provided with substrate（3）, described
Substrate（3）On be installed with integrated circuit die（4）If the both sides of the package casing are fixedly installed along its length
Dry short pin（5）, the integrated circuit die（4）On hard contact and short pin（5）Between pass through metal lead wire（6）Weldering
It connects, the inner cavity of the package casing is embedded to resin（7）, and resin（7）Apart from upper cover（1）Top be reserved with gap, it is described on
Lid（1）Gap location is provided with radiator structure, the lower housing（2）The both ends of two sides are both provided with fixed structure, described
Fixed structure includes supporting rod（14）, the supporting rod（14）One end be fixedly connected on lower housing（2）On, separately there is one end to fix
It is provided with L-shaped fixed link（15）, the L-shaped fixed link（15）With supporting rod（14）Between form buckling groove, and L-shaped fixed link
（15）On the screw that is provided through（16）, two are located at the lower housing（2）Fixed peace between the fixed structure of same side
Equipped with external pin（17）, and external pin（17）With short pin（5）It is connected.
2. a kind of high performance control chip-packaging structure according to claim 1, which is characterized in that the radiator structure packet
Include two positive stop strips（9）, and two positive stop strips（9）It is fixedly installed on upper cover（1）On the both sides inner wall of internal clearance, and two limits
Position item（9）Upside between be movably set with adjustable plate（10）, the adjustable plate（10）It is above equidistant to be provided with the first radiating groove
（11）, and the first radiating groove（11）Along adjustable plate（10）Width direction setting, the adjustable plate（10）One end in the middle part of it is fixed
It is connected with support plate（12）, the support plate（12）Far from adjustable plate（10）One end be fixedly installed perpendicular push plate（13）,
The upper cover（1）Upper equidistant the second radiating groove being provided through（8）, and the second radiating groove（8）It is arranged along its width direction,
The upper cover（1）Positioned at support plate（12）The side wall at place is provided with notch, and support plate（12）Upper cover is extended to by notch（1）It is outer
Portion.
3. a kind of high performance control chip-packaging structure according to claim 2, which is characterized in that first radiating groove
（11）Spacing between any two and the second radiating groove（8）Distance between any two is equal, adjustable plate（10）With upper cover（1）Positioned at first
In the state of beginning position, the first radiating groove（11）With the second radiating groove（8）It is staggered, and support plate（12）Positioned at upper cover（1）Outside
Length and the first radiating groove（11）Spacing between any two is equal.
4. a kind of high performance control chip-packaging structure according to claim 1, which is characterized in that the external pin
（17）Including fixed strut（171）, the fixed strut（171）For strip structure, and both ends are both provided with docking block
（175）, the fixed strut（171）Side be equidistantly positioned copper cap along its length（172）, the copper cap（172）
Side be provided with docking groove（173）, the fixed strut（171）Far from copper cap（172）Side it is equidistant along its length
From being provided with long pin（174）, the long pin（174）With copper cap（172）It corresponds, and long pin（174）Positioned at fixation
Strut（171）Interior one end and copper cap（172）It is connected.
5. a kind of high performance control chip-packaging structure according to claim 4, which is characterized in that the fixed strut
（171）Length and package casing equal length, and fixed strut（171）The docking block at both ends（175）It is docked at positioned at envelope
In the buckling groove for filling two fixed structures of shell the same side.
6. a kind of high performance control chip-packaging structure according to claim 4, which is characterized in that the copper cap（172）
Setting quantity and short pin（5）Setting quantity it is equal, and correspond.
7. a kind of high performance control chip-packaging structure according to claim 1, which is characterized in that the substrate（3）With
Integrated circuit die（4）The side being in contact is equipped with one layer of heat sink material（18）.
8. a kind of high performance control chip-packaging structure according to claim 4, which is characterized in that the docking block
（175）Upside be provided with screw hole, and the screw on fixed structure（16）It is fixedly connected with screw hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810411156.7A CN108470725B (en) | 2018-05-02 | 2018-05-02 | A kind of high performance control chip-packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810411156.7A CN108470725B (en) | 2018-05-02 | 2018-05-02 | A kind of high performance control chip-packaging structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108470725A true CN108470725A (en) | 2018-08-31 |
| CN108470725B CN108470725B (en) | 2019-11-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810411156.7A Active CN108470725B (en) | 2018-05-02 | 2018-05-02 | A kind of high performance control chip-packaging structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115064511A (en) * | 2022-08-17 | 2022-09-16 | 广东长华科技有限公司 | Semiconductor packaging part with heat radiation structure |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007058074A1 (en) * | 2005-11-16 | 2007-05-24 | Oki Electric Industry Co., Ltd. | Double-faced electrode package, and its manufacturing method |
| CN202003988U (en) * | 2011-02-22 | 2011-10-05 | 苏州日月新半导体有限公司 | QFN (quad flat no-lead) package structure and lead frame strip thereof |
| US20160343755A1 (en) * | 2015-05-19 | 2016-11-24 | Renesas Electronics Corporation | Semiconductor device |
| CN206711899U (en) * | 2017-05-04 | 2017-12-05 | 萨锐微电子（上海）有限公司 | There is one kind power to increase powerful Transient Suppression Diode encapsulating structure |
-
2018
- 2018-05-02 CN CN201810411156.7A patent/CN108470725B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007058074A1 (en) * | 2005-11-16 | 2007-05-24 | Oki Electric Industry Co., Ltd. | Double-faced electrode package, and its manufacturing method |
| CN202003988U (en) * | 2011-02-22 | 2011-10-05 | 苏州日月新半导体有限公司 | QFN (quad flat no-lead) package structure and lead frame strip thereof |
| US20160343755A1 (en) * | 2015-05-19 | 2016-11-24 | Renesas Electronics Corporation | Semiconductor device |
| CN206711899U (en) * | 2017-05-04 | 2017-12-05 | 萨锐微电子（上海）有限公司 | There is one kind power to increase powerful Transient Suppression Diode encapsulating structure |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115064511A (en) * | 2022-08-17 | 2022-09-16 | 广东长华科技有限公司 | Semiconductor packaging part with heat radiation structure |
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| Publication number | Publication date |
|---|---|
| CN108470725B (en) | 2019-11-15 |
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