CN108410132B - 一种低介电无卤树脂组合物及其低流动度半固化片 - Google Patents

一种低介电无卤树脂组合物及其低流动度半固化片 Download PDF

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CN108410132B
CN108410132B CN201810145035.2A CN201810145035A CN108410132B CN 108410132 B CN108410132 B CN 108410132B CN 201810145035 A CN201810145035 A CN 201810145035A CN 108410132 B CN108410132 B CN 108410132B
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竺孟晓
潘锦平
彭康
陈忠红
梁希亭
盛佳炯
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Hangzhou Wazam New Materials Co ltd
Zhejiang Huazheng New Material Group Co ltd
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Abstract

本发明公开了一种低介电无卤树脂组合物及其低流动度半固化片。该无卤低介电树脂组合物的组分及重量份如下：环氧树脂10‑80份，酚氧树脂5‑30份，阻燃剂10‑50份，固化剂5‑50份，固化促进剂0‑5份，填料10‑80份，增韧剂5‑30份，添加剂0‑80份。本发明的无卤低介电树脂组合物具有更好的浸润性以及充分低的介电常数和介电损耗正切，其制备得到的半固化片固化后耐热性能好，介电常数低，介电损耗因子低，阻燃性能优异，耐吸水性好，粘结性好。

Description

一种低介电无卤树脂组合物及其低流动度半固化片
技术领域
本发明属于印刷线路板用树脂材料领域，特别是涉及一种无卤低介电树脂组合物，以及使用该树脂组合物制备的低流动半固化片。
背景技术
近年来，挠性覆铜板迅速发展，推动电子产品向“轻、薄、短、小”方向发展，与此同时刚挠性印刷板发展越来越快，性能要求也越来越高。以前刚挠结合板多采用的纯胶片由于材料本身的尺寸稳定性差，以及耐热性难以满足刚挠结合板的高耐热性能要求。因此，PCB厂家寻求用于刚性板与挠性板之间联结用的其它替代材料，目前表现较好的替代材料为不流动半固化片(No-Flow prepreg)。
目前的现有的不流胶半固化产品多采用以橡胶改性的环氧树脂为主要组分的树脂体系，如，中国专利公开CN 102775734 A以核壳橡胶改性主题树脂，虽然能够起到增韧的作用，但是会引起玻璃化转变温度的降低，与聚酰亚胺薄膜的结合力较差，耐热性较差，且橡胶组分容易析出耐候性较差。
中国专利公告CN 102311614 B采用大量的高分子量的双酚A型酚氧树脂，玻璃化转变温度不会降低，且与聚酰亚胺、金属箔的结合力较好。但是，大量的双酚A型酚氧树脂的使用使树脂胶液整体黏度度变大，造成树脂组合物对增强材料的浸润性不好。
此外，随着信息处理和信息传输高速高频化技术的不断推进，印制电路基板材料需要具备较低的介电常数和介电损耗正切，以减少高速传输时信号的延迟、失真和损耗，以及信号之间的干扰。
因此，为了解决上述现有技术中存在的问题，本发明提供一种无卤低介电树脂组合物，其具有更好的浸润性以及充分低的介电常数和介电损耗正切来满足高频高速电路的传输需求；其制备得到的半固化片粘结力优异，韧性好，加工粉尘低，具有良好的耐热性能、优异的阻燃性能和电学性能。
发明内容
本发明的目的在于提供一种无卤低介电树脂组合物，以及使用该树脂组合物制备的低流动半固化片。本发明的无卤低介电树脂组合物具有更好的浸润性以及充分低的介电常数和介电损耗正切，其制备得到的半固化片固化后耐热性能好，介电常数低，介电损耗因子低，阻燃性能优异，耐吸水性好，粘结性好。
为了达到上述的目的，本发明采取以下技术方案：
一种低介电无卤树脂组合物，其组分及重量份如下：环氧树脂10-80份，酚氧树脂5-30份，阻燃剂10-50份，固化剂5-50份，固化促进剂0-5份，填料10-80份，增韧剂5-30份，添加剂0-80份。
进一步地，优选以下组分及重量份：环氧树脂20-60份，酚氧树脂10-40份，阻燃剂10-35份，固化剂10-30份，固化促进剂0.1-1份，填料20-60份，增韧剂5-30份，添加剂0-80。
进一步地，所述的环氧树脂优选无卤低介电环氧树脂，选自双酚A型环氧树脂、双酚F型环氧树脂、含氮环氧树脂、含磷环氧树脂、酚醛改性环氧树脂、芳烷基线性酚醛环氧树脂、苯基烷烃类环氧树脂、脂环族类环氧树脂、联苯型环氧树脂、双环戊二烯型环氧树脂、萘环型环氧树脂、含双键的改性环氧树脂、异氰酸酯改性环氧树脂中的一种或几种。
优选的，所述环氧树脂选自含磷环氧树脂、芳烷基线性酚醛环氧树脂、联苯型环氧树脂、双环戊二烯型环氧树脂、萘环型环氧树脂、含双键的改性环氧树脂、酚醛改性环氧树脂中的一种或几种。
进一步地，所述酚氧树脂为具有如下结构的高分子量热塑性聚合物，
Figure BDA0001578592160000021
其中R1可以为H、卤素，经或未经取代的C1～C15烷基及烷氧基，经或未经取代的C6～C15芳烷基及芳烷氧基，经或未经取代的C3～C15环烷基，经或未经取代的C2-C15不饱和烃基，共轭烃基或双环戊二烯基基团，R2基团可以为经或未经取代的C1～C15烷基及烷氧基，经或未经取代的C6～C15芳烷基及芳烷氧基，经或未经取代的C3～C15环烷基，经或未经取代的C2-C15不饱和烃基，共轭烃基或双环戊二烯基，其中n＝1-10。优选的，所述酚氧树脂为双酚F型酚氧树脂。
所述固化剂选自一种或多种苯乙烯-马来酸酐共聚物，所述苯乙烯-马来酸酐共聚物结构通式为：
Figure BDA0001578592160000031
其中m＝3，4，6或8；n＝7～10。
进一步地，所述填料选自结晶型二氧化硅、熔融二氧化硅、球形二氧化硅、硅酸钙、碳化硅、碳酸钙、氧化铝、氢氧化铝、氮化铝、氮化硼、二氧化钛、钛酸钡、硫酸钡、滑石粉、聚四氟乙烯中的一种或几种。
进一步地，所述增韧剂选自液态环氧、长链脂肪族环氧树脂、橡胶、橡胶改性环氧树脂中的一种或几种。
进一步地，所述添加剂为偶联剂和/或溶剂，偶联剂选自硅烷偶联剂、钛酸酯偶联剂、铝酸酯偶联剂、双金属偶联剂、磷酸酯偶联剂、硼酸酯偶联剂、铬络合物及其他高级脂肪酸、醇、酯的偶联剂的一种或几种，优选硅烷偶联剂和钛酸酯偶联剂。
本发明还提供一种低流动度半固化片，其包括增强材料及通过含浸干燥后附着在其上的低介电无卤树脂组合物。
制作时，将上述低介电无卤树脂组合物混合搅拌均匀，制成分散均匀的胶液；由玻纤布浸渍前述的胶液，然后在120～230℃下烘烤2～30分钟，即可制得所述的半固化片。
本发明具有以下技术特点：
(1)本发明使用一种改性酸酐固化剂及低介电树脂以获得充分低的介电常数和介电损耗正切。
(2)本发明树脂组合物选择浸润性更好的双酚F型酚氧树脂改善了体系的浸润性，引入液态环氧及长链脂肪族环氧树脂作为增韧剂，进一步提高了树脂组合物对增强材料的浸润性。同时，增韧剂的引入提高了半固化片的柔韧性，加工时无粉尘，具有良好的加工性。
(3)本发明半固化片固化后耐热性能好，介电常数低，介电损耗因子低，阻燃性能优异，耐吸水性好，粘结性好。
具体实施方式
以下具体实施例是对本发明提供的方法与技术方案的进一步说明，但不应理解成对本发明的限制。本发明中所用到的仪器、设备、方法等如未特别指明，均为本领域常用的仪器、设备及方法。
本发明实施例中用于制备无卤低介电树脂组合物的原料的型号及来源如下：
双酚A型环氧树脂，厂家：南亚环氧，NPEL-128
含磷酚醛树脂，厂家：Dow，XZ92741
DCPD环氧，厂家：台湾长春，DNE260
联苯型环氧，厂家：SHIN-A，SE-70H
固化剂EF-30，厂家：Cray Valley，苯乙烯-马来酸酐共聚物(St:MA＝3:1)
固化剂EF-40，厂家：Cray Valley，苯乙烯-马来酸酐共聚物(St:MA＝4:1)
酚醛固化剂，厂家：圣泉，PF-8020
胺类固化剂，厂家：大荣，DCD
固化促进剂，厂家：四国化成，2E4MI
填料，厂家：矽比科，硅微粉525
偶联剂，厂家：新蓝天，硅烷偶联剂
溶剂1，厂家：三和，丁酮
溶剂2，厂家：巨联，DMF。
本发明实施例1-8按照表1中的组分和重量份配比，具体制备方法如下：
(一)制备树脂胶液
按照实施例1-8组分配比将所有组分用有机溶剂溶解，搅拌均匀，调节树脂组合物的固含量为45-70wt％，配制树脂胶液。
(二)制备半固化片
将树脂胶液浸渍或充分均匀涂覆于E型玻璃布(1080)上，并在120-230℃烘箱中烘烤2～30分钟后制得半固化片。
(三)制备覆铜箔层压板
取制得的半固化片6片叠合在一起，上下各放一张铜箔(1OZ)，置于真空热压机中压制得到覆铜箔层压板。具体压合工艺为在1-3MPa压力下，160-210℃温度下压合0.5-3小时。所得双面覆铜箔层压板的性能见表1，所采用的测试方法如下：
(1)Flow-in流动度，IPC-6502.3.17.2的两孔测试法
(2)剥离强度，测试方法按照IPC-TM-650 2.4.9测量
(3)玻璃化转变温度(Tg)，测试方法差示扫描量热法(DSC)
(4)热分层时间(T288)，测试方法采用热机械分析法(TMA)
(5)燃烧性，依据美国UL94垂直燃烧法测定
(6)介电常数(Dk)和介质损耗(Df)，测试方法按照ASTM-D150及IPC-TM-6502.5.5.9测量。
表1
Figure BDA0001578592160000051
Figure BDA0001578592160000061
从表1可以看出，本发明制得半固化片具有较低的流动度(几乎不流动)，制得的覆铜箔层压板综合性能优异，其覆铜箔层压板Dk、Df低，阻燃性能优异，剥离强度高、Tg高，优异的韧性并且PCB加工性能优异，非常适用于流动度低且要求介电性能优异的多层印制电路。
以上实施例的说明只是用于帮助理解本发明方法及其核心思想。应当指出，对于本技术领域的普通技术人员来说，在不脱离本发明原理的前提下，还可以对本发明进行若干改进和修饰，这些改进和修饰也落入本发明权利要求保护范围内。

Claims (4)

1.一种低介电无卤树脂组合物，其特征在于，其组分及重量份如下：环氧树脂20-60份，双酚F型酚氧树脂10-40份，阻燃剂10-35份，固化剂10-30份，固化促进剂0.1-1份，填料20-60份，增韧剂5-30份，添加剂0-80份；
所述环氧树脂为双酚A型环氧树脂与联苯型环氧树脂或DCPD型环氧树脂的两种环氧树脂的混合物；
所述固化剂选自一种或多种苯乙烯-马来酸酐共聚物，所述苯乙烯-马来酸酐共聚物结构通式为：
Figure 232464DEST_PATH_IMAGE002
其中，m＝3,4,6或8；n＝7～10。
2.根据权利要求1所述的所述低介电无卤树脂组合物，其特征在于，所述填料选自结晶型二氧化硅、熔融二氧化硅、球形二氧化硅、硅酸钙、碳化硅、碳酸钙、氧化铝、氢氧化铝、氮化铝、氮化硼、二氧化钛、钛酸钡、硫酸钡、滑石粉、聚四氟乙烯中的一种或几种。
3.根据权利要求1所述的所述低介电无卤树脂组合物，其特征在于，所述增韧剂选自液态环氧、长链脂肪族环氧树脂、橡胶、橡胶改性环氧树脂中的一种或几种。
4.根据权利要求1所述的所述低介电无卤树脂组合物，其特征在于，所述添加剂为偶联剂和/或溶剂，偶联剂选自硅烷偶联剂、钛酸酯偶联剂、铝酸酯偶联剂、双金属偶联剂、磷酸酯偶联剂、硼酸酯偶联剂、铬络合物及其他高级脂肪酸、醇、酯的偶联剂的一种或几种。
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103724944A (zh) * 2013-12-31 2014-04-16 广东生益科技股份有限公司 一种无卤环氧树脂组合物及其用途
CN105348742A (zh) * 2015-12-07 2016-02-24 浙江华正新材料股份有限公司 含三聚氰胺型苯并噁嗪树脂的热固性树脂组合物、半固化片及层压板
CN107286583A (zh) * 2017-06-20 2017-10-24 苏州生益科技有限公司 一种树脂组合物及使用其制作的低流胶半固化片

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US20110224332A1 (en) * 2009-06-05 2011-09-15 He Yufang Thermosetting resin composition and use thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103724944A (zh) * 2013-12-31 2014-04-16 广东生益科技股份有限公司 一种无卤环氧树脂组合物及其用途
CN105348742A (zh) * 2015-12-07 2016-02-24 浙江华正新材料股份有限公司 含三聚氰胺型苯并噁嗪树脂的热固性树脂组合物、半固化片及层压板
CN107286583A (zh) * 2017-06-20 2017-10-24 苏州生益科技有限公司 一种树脂组合物及使用其制作的低流胶半固化片

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