CN108396344A - 具有扭曲带状无序缠绕微观结构的电解铜箔及其制备方法 - Google Patents
具有扭曲带状无序缠绕微观结构的电解铜箔及其制备方法 Download PDFInfo
- Publication number
- CN108396344A CN108396344A CN201810226778.2A CN201810226778A CN108396344A CN 108396344 A CN108396344 A CN 108396344A CN 201810226778 A CN201810226778 A CN 201810226778A CN 108396344 A CN108396344 A CN 108396344A
- Authority
- CN
- China
- Prior art keywords
- copper
- axis direction
- copper foil
- electrolytic copper
- band
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 85
- 239000011889 copper foil Substances 0.000 title claims abstract description 29
- 238000004804 winding Methods 0.000 title claims abstract description 29
- 238000002360 preparation method Methods 0.000 title claims abstract description 15
- 229910052802 copper Inorganic materials 0.000 claims abstract description 55
- 239000010949 copper Substances 0.000 claims abstract description 55
- 238000009713 electroplating Methods 0.000 claims abstract description 30
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims abstract description 24
- 239000013078 crystal Substances 0.000 claims abstract description 24
- 239000000654 additive Substances 0.000 claims abstract description 16
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 14
- 230000000996 additive effect Effects 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims abstract description 10
- 239000000975 dye Substances 0.000 claims abstract description 7
- 238000004070 electrodeposition Methods 0.000 claims abstract description 6
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims abstract description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 12
- 238000007747 plating Methods 0.000 claims description 12
- 239000002253 acid Substances 0.000 claims description 5
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 4
- 239000002202 Polyethylene glycol Substances 0.000 claims description 4
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims description 4
- 125000001741 organic sulfur group Chemical group 0.000 claims description 4
- 229920001223 polyethylene glycol Polymers 0.000 claims description 4
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 claims description 4
- BQJTUDIVKSVBDU-UHFFFAOYSA-L copper;sulfuric acid;sulfate Chemical compound [Cu+2].OS(O)(=O)=O.[O-]S([O-])(=O)=O BQJTUDIVKSVBDU-UHFFFAOYSA-L 0.000 claims description 3
- 150000003242 quaternary ammonium salts Chemical class 0.000 claims description 3
- 150000002500 ions Chemical class 0.000 claims description 2
- 238000002156 mixing Methods 0.000 claims description 2
- 239000011780 sodium chloride Substances 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 239000004615 ingredient Substances 0.000 claims 2
- 229910001431 copper ion Inorganic materials 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 abstract 1
- 229910052801 chlorine Inorganic materials 0.000 abstract 1
- 239000000460 chlorine Substances 0.000 abstract 1
- MPTQRFCYZCXJFQ-UHFFFAOYSA-L copper(II) chloride dihydrate Chemical compound O.O.[Cl-].[Cl-].[Cu+2] MPTQRFCYZCXJFQ-UHFFFAOYSA-L 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 description 14
- 238000000576 coating method Methods 0.000 description 14
- 238000005728 strengthening Methods 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 3
- 241000370738 Chlorion Species 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 241000784732 Lycaena phlaeas Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 125000001453 quaternary ammonium group Chemical group 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810226778.2A CN108396344B (zh) | 2018-03-19 | 2018-03-19 | 具有扭曲带状无序缠绕微观结构的电解铜箔及其制备方法 |
Applications Claiming Priority (1)
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CN201810226778.2A CN108396344B (zh) | 2018-03-19 | 2018-03-19 | 具有扭曲带状无序缠绕微观结构的电解铜箔及其制备方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108396344A true CN108396344A (zh) | 2018-08-14 |
CN108396344B CN108396344B (zh) | 2021-02-12 |
Family
ID=63092915
Family Applications (1)
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CN201810226778.2A Active CN108396344B (zh) | 2018-03-19 | 2018-03-19 | 具有扭曲带状无序缠绕微观结构的电解铜箔及其制备方法 |
Country Status (1)
Country | Link |
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CN (1) | CN108396344B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109112580A (zh) * | 2018-09-18 | 2019-01-01 | 苏州昕皓新材料科技有限公司 | 一种具有热力学各向异性的金属材料及其制备方法 |
WO2023151029A1 (en) * | 2022-02-11 | 2023-08-17 | Suzhou Shinhao Materials Llc | Method for electroplating nanograined copper |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103924269A (zh) * | 2013-12-26 | 2014-07-16 | 苏州昕皓新材料科技有限公司 | 一种非染料系整平剂的应用 |
CN103924268A (zh) * | 2013-12-26 | 2014-07-16 | 苏州昕皓新材料科技有限公司 | 一种酸铜整平剂的应用 |
CN106521573A (zh) * | 2016-11-23 | 2017-03-22 | 苏州昕皓新材料科技有限公司 | 制备具有择优取向生长结构的电镀铜层的方法及其应用 |
CN106757191A (zh) * | 2016-11-23 | 2017-05-31 | 苏州昕皓新材料科技有限公司 | 一种具有高择优取向的铜晶体颗粒及其制备方法 |
-
2018
- 2018-03-19 CN CN201810226778.2A patent/CN108396344B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103924269A (zh) * | 2013-12-26 | 2014-07-16 | 苏州昕皓新材料科技有限公司 | 一种非染料系整平剂的应用 |
CN103924268A (zh) * | 2013-12-26 | 2014-07-16 | 苏州昕皓新材料科技有限公司 | 一种酸铜整平剂的应用 |
CN106521573A (zh) * | 2016-11-23 | 2017-03-22 | 苏州昕皓新材料科技有限公司 | 制备具有择优取向生长结构的电镀铜层的方法及其应用 |
CN106757191A (zh) * | 2016-11-23 | 2017-05-31 | 苏州昕皓新材料科技有限公司 | 一种具有高择优取向的铜晶体颗粒及其制备方法 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109112580A (zh) * | 2018-09-18 | 2019-01-01 | 苏州昕皓新材料科技有限公司 | 一种具有热力学各向异性的金属材料及其制备方法 |
WO2020057060A1 (en) * | 2018-09-18 | 2020-03-26 | Suzhou Shinhao Materials Llc | A metal material with thermodynamic anisotropy and a method of preparing the same |
US11242607B2 (en) | 2018-09-18 | 2022-02-08 | Suzhou Shinhao Materials Llc | Metal material with thermodynamic anisotropy and a method of preparing the same |
US11802345B2 (en) | 2018-09-18 | 2023-10-31 | Suzhou Shinhao Materials Llc | Metal material with thermodynamic anisotropy and a method of preparing the same |
WO2023151029A1 (en) * | 2022-02-11 | 2023-08-17 | Suzhou Shinhao Materials Llc | Method for electroplating nanograined copper |
Also Published As
Publication number | Publication date |
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CN108396344B (zh) | 2021-02-12 |
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Address after: 215000 East Side of Chang'an Road, Wujiang Economic and Technological Development Zone, Suzhou City, Jiangsu Province (Science and Technology Pioneering Park) Patentee after: Meiyouke (Suzhou) Semiconductor Materials Co.,Ltd. Country or region after: China Address before: 215000 East Side of Chang'an Road, Wujiang Economic and Technological Development Zone, Suzhou City, Jiangsu Province (Science and Technology Pioneering Park) Patentee before: SUZHOU SHINHAO MATERIALS LLC Country or region before: China |
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