CN108389935A - A kind of whole line of monocrystalline making herbs into wool is slotting to divide biplate to automate charging & discharging machine - Google Patents

A kind of whole line of monocrystalline making herbs into wool is slotting to divide biplate to automate charging & discharging machine Download PDF

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Publication number
CN108389935A
CN108389935A CN201810290640.9A CN201810290640A CN108389935A CN 108389935 A CN108389935 A CN 108389935A CN 201810290640 A CN201810290640 A CN 201810290640A CN 108389935 A CN108389935 A CN 108389935A
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China
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axis
silicon chip
component
biplate
axis driving
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CN201810290640.9A
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CN108389935B (en
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梁明刚
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Guangdong Qitian Automation Intelligent Equipment Ltd By Share Ltd
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Guangdong Qitian Automation Intelligent Equipment Ltd By Share Ltd
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Priority to CN201810290640.9A priority Critical patent/CN108389935B/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1876Particular processes or apparatus for batch treatment of the devices
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)

Abstract

The present invention, which discloses a kind of whole line of monocrystalline making herbs into wool and inserts, divides biplate to automate charging & discharging machine, the whole line of monocrystalline making herbs into wool, which is inserted, divides biplate automation charging & discharging machine to include that silicon chip divides biplate device, the silicon chip divides biplate device to include rack, the gaily decorated basket placement position for being used to place the gaily decorated basket is arranged in rack, is arranged and places the gaily decorated basket positioning component and monolithic fixation kit of position side in the gaily decorated basket, and the silicon chip separation assembly for being detached to double silicon chips in rack side is arranged.Silicon chip according to the present invention divides biplate device, completes the auto plate separation of biplate silicon chip by the cooperation of monolithic fixation kit and silicon chip separation assembly and blanking operates, more efficient, and rejection rate is lower, production capacity higher.

Description

A kind of whole line of monocrystalline making herbs into wool is slotting to divide biplate to automate charging & discharging machine
Technical field
It inserts biplate is divided to automate loading and unloading the present invention relates to solar energy manufacturing field more particularly to a kind of whole line of monocrystalline making herbs into wool Machine.
Background technology
Wool-weaving machine front end feeding is artificial the moving on feeding loader one by one by lamination magazine in solar energy industry, The silicon chip of pile of spool boxes is imported in the gaily decorated basket through feeder, then is filled the gaily decorated basket of silicon chip by manually moving and is put into wool-weaving machine front end, is passed through Wool-weaving machine making herbs into wool is later again by manually by treated, the full gaily decorated basket moves blanking machine to by inner silicon chip export Lai artificial separation silicon chip Classification, it is good with it is bad, either with or without aberration etc..However this flow is quite tired of lock not only waste of manpower labour, and production capacity is not Height, occupied space are huge.
Invention content
It is operated the object of the present invention is to provide a kind of auto plate separation that can be automatically performed biplate silicon chip and blanking The whole line of monocrystalline making herbs into wool, which is inserted, divides biplate to automate charging & discharging machine.
The present invention is achieved through the following technical solutions:There is provided a kind of whole line of monocrystalline making herbs into wool and inserting divides biplate to automate loading and unloading Machine, the whole line of monocrystalline making herbs into wool, which is inserted, divides biplate automation charging & discharging machine to include that silicon chip divides biplate device, the silicon chip that biplate is divided to fill It sets and determines including rack, the gaily decorated basket that the gaily decorated basket for being used to place gaily decorated basket placement position is arranged in rack, is arranged in gaily decorated basket placement position side Hyte part and monolithic fixation kit, and the silicon chip separation assembly for being detached to double silicon chips in rack side is set.
As a further improvement of the above technical scheme, the gaily decorated basket positioning component includes that setting is placed in the gaily decorated basket on the left of position Located lateral component and be arranged the gaily decorated basket place position on front side of longitudinal register component.
As a further improvement of the above technical scheme, the located lateral component includes located lateral cylinder and laterally determines Position push plate, the located lateral cylinder are fixed on the rack, and the located lateral push plate connects with located lateral cylinders;It is described Longitudinal register component includes longitudinal register cylinder and longitudinal register push plate, and the longitudinal register cylinder is fixed on the rack, described Longitudinal register push plate connects with longitudinal register cylinders.
As a further improvement of the above technical scheme, the monolithic fixation kit includes being inhaled for fixing the fixed of silicon chip Disk component and for driving X-axis drive component that fixing sucking disk component moves along the x-axis and driving fixing sucking disk component to be moved along Y-axis Y-axis drive component, the X-axis drive component be mounted on rack on, the Y-axis drive component be mounted on X-axis drive component on, The fixing sucking disk component is mounted on Y-axis drive component.
As a further improvement of the above technical scheme, the X-axis drive component includes X-axis driving motor, X-axis driving silk Bar, X-axis driving sliding rail, X-axis driving sliding block and X-axis mounting bracket, the X-axis driving motor and X-axis driving sliding rail are mounted on rack On, the X-axis driving sliding block is set on X-axis driving sliding rail, and the X-axis mounting bracket is connected with X-axis driving sliding block, the X Axis driving lead screw is connected with X-axis driving motor and is threaded through in X-axis mounting bracket;The Y-axis drive component includes Y-axis driving electricity Machine, Y-axis driving lead screw, Y-axis driving sliding rail, Y-axis driving sliding block and Y-axis mounting bracket, the Y-axis driving motor and Y-axis driving are slided Rail is mounted in rack, and the Y-axis driving sliding block is set on Y-axis driving sliding rail, and the Y-axis mounting bracket drives sliding block with Y-axis It is connected, the Y-axis driving lead screw is connected with Y-axis driving motor and is threaded through in Y-axis mounting bracket.
As a further improvement of the above technical scheme, the fixing sucking disk component is mounted on Y-axis mounting bracket, described solid It includes the fixing sucking disk mounting bracket being connected with Y-axis mounting bracket to determine Suction cup assembly, for pacifying on fixing sucking disk mounting bracket The sucker connecting rod of fixing sucking disk is filled, and the multiple fixing sucking disks for being provided with constant spacing being set in sucker connecting rod.
As a further improvement of the above technical scheme, the silicon chip divides biplate device to further include that setting places position in the gaily decorated basket Impurity above side rejects component, and the impurity rejects component setting between monolithic fixation kit and the gaily decorated basket place position, described It includes gas blow pipe and the driving cylinder for driving gas blow pipe to move up and down that impurity, which rejects component,.
As a further improvement of the above technical scheme, the silicon chip separation assembly includes being inhaled for detaching the separation of silicon chip Disk component, the push component for pushing silicon chip and carry out mobile machinery for driving separation Suction cup assembly and pushing component Hand, the push component are mounted on the both sides of separation Suction cup assembly.
On the other hand, the present invention also provides a kind of silicon chips to divide biplate method, including:
S1:The gaily decorated basket for filling biplate silicon chip is placed into the gaily decorated basket and places position, the gaily decorated basket is determined by gaily decorated basket positioning component Position and the fixed gaily decorated basket;
S2:After adsorbing by monolithic fixation kit and fix a piece of in biplate silicon chip, adsorbed by silicon chip separation assembly And it takes out another in biplate silicon chip and send into the tool needed for next process;
S3:After the fixed silicon chip of the fixed monolithic fixation kit of silicon chip separation assembly absorption, monolithic fixation kit stops absorption And it will be in the tool needed for silicon chip to next process by silicon chip separation assembly.
As a further improvement of the above technical scheme, in step s 2, the fixing sucking disk component is in X-axis drive component Under driving with Y-axis drive component, the fixing sucking disk of the fixing sucking disk component is inserted by the gap between silicon chip in the gaily decorated basket;
When the silicon chip separation assembly send silicon chip into the tool needed for next process, passing through mechanical hand-motion point Silicon chip is pushed in place completely by push component after putting silicon chip into the tool needed for next process from Suction cup assembly;
In step S3, after the monolithic fixation kit stops absorption silicon chip, drive of the fixing sucking disk component in X-axis drive component The gaily decorated basket is exited under dynamic.
Beneficial effects of the present invention include at least:The silicon chip of the present invention divides in biplate device, by monolithic fixation kit and Auto plate separation and the blanking operation of biplate silicon chip are completed in the cooperation of silicon chip separation assembly, more efficient, and rejection rate is lower, production It can higher.
Description of the drawings
Fig. 1 is the schematic side view that silicon chip according to an embodiment of the invention divides biplate device;
Fig. 2 is that silicon chip according to an embodiment of the invention divides the solid after the removal silicon chip separation assembly of biplate device to show It is intended to;
Fig. 3 is that silicon chip according to an embodiment of the invention divides the decomposition after the removal silicon chip separation assembly of biplate device to show It is intended to;
Fig. 4 is the stereoscopic schematic diagram for the monolithic fixation kit that silicon chip according to an embodiment of the invention divides biplate device;
Fig. 5 is the stereoscopic schematic diagram for the sucker that silicon chip according to an embodiment of the invention divides biplate device;
Fig. 6 is the decomposition diagram for the silicon chip separation assembly that silicon chip according to an embodiment of the invention divides biplate device;
Fig. 7 is the schematic diagram that silicon chip according to an embodiment of the invention divides biplate method.
Specific implementation mode
Below in conjunction with attached drawing in the embodiment of the present invention, technical solution in the embodiment of the present invention carries out clear, complete Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Usually The component for the embodiment of the present invention being described and illustrated herein in the accompanying drawings can be arranged and be designed with a variety of different configurations.Cause This, the detailed description of the embodiment of the present invention to providing in the accompanying drawings is not intended to limit claimed invention below Range, but it is merely representative of the selected embodiment of the present invention.Based on the embodiment of the present invention, those skilled in the art are not doing The every other embodiment obtained under the premise of going out creative work, shall fall within the protection scope of the present invention.
Being inserted the invention discloses a kind of whole line of monocrystalline making herbs into wool divides biplate to automate charging & discharging machine, and the whole line of monocrystalline making herbs into wool is inserted Point biplate automation charging & discharging machine, which includes making herbs into wool feeding device, lifting device, inserts biplate device, fluff making device, silicon chip divides biplate Device 1000, making herbs into wool blanking device and reflux transmission line body.
The gaily decorated basket equipped with silicon chip is transported to by making herbs into wool feeding device in lifting device, is inserted by inserting biplate device silicon chip Biplate completes to insert to enter after biplate that making herbs into wool processing is carried out in fluff making device, then divides biplate device 1000 to carry out point pair by silicon chip Piece completes to divide the silicon chip of biplate to carry out blanking by making herbs into wool blanking device, while the gaily decorated basket is back to slotting biplate by reflux transmission line body At device.
As shown in Figure 1 to Figure 2, the silicon chip divides biplate device 1000 to be used in rack 100 including rack 100, setting The gaily decorated basket for placing the gaily decorated basket places position 200, the gaily decorated basket positioning component 300 and monolithic fixation group for placing 200 side of position in the gaily decorated basket is arranged Part 400, be arranged the impurity for placing above 200 side of position in the gaily decorated basket reject component 600 and be arranged rack 100 side for pair The silicon chip separation assembly 500 that double silicon chips are detached.Specifically, the gaily decorated basket places the left side that position 200 is located at rack, it is described The side that the gaily decorated basket places position 200 is provided with postive stop baffle 210.
As shown in Figure 2 to Figure 3, the gaily decorated basket positioning component 300 includes that the transverse direction placed on the left of position 200 in the gaily decorated basket is arranged to determine Hyte part 310 and the longitudinal register component 320 being arranged on front side of gaily decorated basket placement position 200.
The located lateral component 310 includes located lateral cylinder 311 and located lateral push plate 312, the located lateral Cylinder 311 is fixed in rack 100, and the located lateral push plate 312 is connected with located lateral cylinder 311.
The longitudinal register component 320 includes longitudinal register cylinder 321 and longitudinal register push plate 322, the longitudinal register Cylinder 321 is fixed in rack 100, and the longitudinal register push plate 322 is connected with longitudinal register cylinder 321.
It will be spent by located lateral component 310 and longitudinal register component 320 after the gaily decorated basket to be placed into the gaily decorated basket and places position 200 Basket pushes and the gaily decorated basket is in contact with postive stop baffle 210, thus completes the positioning to the gaily decorated basket, horizontal after the completion of to gaily decorated basket positioning Can the gaily decorated basket be fixed on to the gaily decorated basket to positioning component 310 and longitudinal register component 320 to place in position 200, prevent from carrying out to silicon chip Gaily decorated basket movement causes silicon chip damaged when fragment.
Referring to Fig.2, the monolithic fixation kit 400 includes fixing sucking disk component 430 for fixing silicon chip and for driving The Y-axis that the X-axis drive component 410 and driving fixing sucking disk component 430 that dynamic fixing sucking disk component 430 moves along the x-axis are moved along Y-axis Drive component 420, the X-axis drive component 410 are mounted in rack 100, and the Y-axis drive component 420 drives mounted on X-axis On component 410, the fixing sucking disk component 430 is mounted on Y-axis drive component 420.
As shown in Fig. 4 to Fig. 5, the X-axis drive component 410 includes X-axis driving motor, X-axis driving lead screw 411, X-axis drive Dynamic sliding rail 412, X-axis driving sliding block 413 and X-axis mounting bracket 414, the X-axis driving motor and X-axis driving sliding rail 412 are mounted on In rack 100, the X-axis driving sliding block 413 is set on X-axis driving sliding rail 412, and the X-axis mounting bracket 414 drives with X-axis Sliding block 413 is connected, and the X-axis driving lead screw 411 is connected with X-axis driving motor and is threaded through in X-axis mounting bracket 414.Institute Stating X-axis driving motor drives the rotation of X-axis lead screw to drive X-axis mounting bracket 414 to be moved in X-axis slide rail along X-axis.
The Y-axis drive component 420 includes Y-axis driving motor 421, Y-axis driving lead screw, Y-axis driving sliding rail 422, Y-axis drive Movable slider 423 and Y-axis mounting bracket 424, the Y-axis driving motor 421 and Y-axis driving sliding rail 422 are mounted in rack 100, institute It states Y-axis driving sliding block 423 to be set on Y-axis driving sliding rail 422, the Y-axis mounting bracket 424 is connected with Y-axis driving sliding block 423 It connects, the Y-axis driving lead screw is connected with Y-axis driving motor 421 and is threaded through in Y-axis mounting bracket 424.The Y-axis driving electricity Machine 421 drives the rotation of Y-axis lead screw to drive Y-axis mounting bracket 424 to be moved on Y-axis sliding rail along Y-axis.
The fixing sucking disk component 430 is mounted on Y-axis mounting bracket 424, and the fixing sucking disk component 430 includes and Y-axis The fixing sucking disk mounting bracket 431 that mounting bracket 424 is connected, for installing fixing sucking disk on fixing sucking disk mounting bracket 431 433 sucker connecting rod 432, and the multiple fixing sucking disks for being provided with constant spacing that are set in sucker connecting rod 432 433.Specifically, the fixing sucking disk 433 is provided with 50, the spacing between the fixing sucking disk 433 is according to silicon chip in the gaily decorated basket Spacing setting.The side of the fixing sucking disk 433 is provided with the sucker 4331 for adsorbing silicon chip.In the rack 100 also It is provided with sucker limited block 434, the setting of sucker limited block 434 is between X-axis drives sliding rail 412.
Referring to Fig.2, the impurity rejects the setting of component 600 between monolithic fixation kit 400 and the gaily decorated basket place position 200, It includes gas blow pipe 610 and the driving cylinder 620 for driving gas blow pipe 610 to move up and down that the impurity, which rejects component 600,.Specifically , the gas blow pipe 610 is one section of gassing pipe for being provided with multiple inflatable mouths, by driving cylinder 620 to drive gas blow pipe 610 It is moved downward to 433 top of fixing sucking disk, nitrogen is sprayed to fixing sucking disk 433 by multiple inflatable mouths, to remove fixed suction Impurity on disk 433.The impurity rejects component 600 and is used to remove the impurity on fixing sucking disk 433, dries up fixing sucking disk 433 The droplet of upper absorption prevents the impurity on fixing sucking disk 433 and droplet pollution silicon chip, reduces fraction defective.
As shown in fig. 6, the silicon chip separation assembly 500 includes for detaching the separation Suction cup assembly 510 of silicon chip, for pushing away Send the push component 520 of silicon chip and for driving separation Suction cup assembly 510 and push component 520 to carry out mobile manipulator, institute State the both sides that push component 520 is mounted on separation Suction cup assembly 510.
The separation Suction cup assembly 510 includes separation sucker mounting plate 511, separation sucker connecting rod 512 and is set in point From the multiple separation suckers 513 for being provided with constant spacing in sucker connecting rod 512.The separation sucker mounting plate 511 passes through Connecting flange 530 is connected with manipulator, and the separation sucker mounting plate 511 is provided with the limit for installing separation sucker 513 Position slot 514.
The push component 520 includes push cylinder 521 and pushing plate 522, and the push cylinder 521 passes through connecting plate 523 are connected with sucker mounting plate 511 is detached.The push component 520 is provided with two groups, is separately mounted to separation Suction cup assembly 510 both sides.It is pushed by pushing component 520 by the silicon chip that Suction cup assembly 510 adsorbs is detached with the silicon chip separation assembly 500 Into the tool needed for next process.The manipulator is six axis robot, since this is well known to those skilled in the art Common knowledge, details are not described herein.
As shown in fig. 7, the invention also discloses a kind of silicon chips to divide biplate method comprising:
S1:The gaily decorated basket for filling biplate silicon chip is placed into the gaily decorated basket and places position 200, by gaily decorated basket positioning component 300 to the gaily decorated basket It carries out positioning and fixing the gaily decorated basket.
S2:It is adsorbed by monolithic fixation kit 400 and after a piece of in fixed biplate silicon chip, passes through silicon chip separation assembly 500 adsorb and take out another in biplate silicon chip and send into the tool needed for next process.
S3:After the fixed 400 fixed silicon chip of monolithic fixation kit of the absorption of silicon chip separation assembly 500, monolithic fixation kit 400 Stopping absorption simultaneously will be in the tool needed for silicon chip to next process by silicon chip separation assembly 500.
Specifically, in step S2, the fixing sucking disk component 430 is in X-axis drive component 410 and Y-axis drive component 420 Under driving, the fixing sucking disk 433 of the fixing sucking disk component 430 is inserted by the gap between silicon chip in the gaily decorated basket.
When the silicon chip separation assembly 500 send silicon chip into the tool needed for next process, passing through manipulator band Dynamic separation Suction cup assembly 510 is pushed away silicon chip by push component 520 after putting silicon chip into the tool needed for next process completely It is sent to position.
In step S3, after the monolithic fixation kit 400 stops absorption silicon chip, fixing sucking disk component 430 is in X-axis driving group The gaily decorated basket is exited under the driving of part 410, prevents fixing sucking disk component 430 from interfering the work of silicon chip separation assembly 500.
The silicon chip for implementing the present invention divides biplate device 1000, at least has the advantages that:The silicon chip point of the present invention is double Sheet devices 1000, by the cooperation of monolithic fixation kit 400 and silicon chip separation assembly 500 complete the auto plate separation of biplate silicon chip with And blanking operation, it is convenient and efficient, compared to the more inefficient higher of manual operation rejection rate.
In the description of the present invention, it is to be understood that, term " first ", " second " etc. are used for description purposes only, without It can be interpreted as indicating or implying relative importance.For the ordinary skill in the art, on being understood with concrete condition State the concrete meaning of term in the present invention.In addition, in the description of the present invention, unless otherwise indicated, the meaning of " plurality " is Two or more.
Although an embodiment of the present invention has been shown and described, it will be understood by those skilled in the art that:Not In the case of being detached from the principle of the present invention and objective a variety of change, modification, replacement and modification can be carried out to these embodiments, this The range of invention is limited by claim and its equivalent.

Claims (8)

  1. Biplate is divided to automate charging & discharging machine 1. a kind of whole line of monocrystalline making herbs into wool is inserted, which is characterized in that the whole line of monocrystalline making herbs into wool, which is inserted, to be divided Biplate automation charging & discharging machine includes that silicon chip divides biplate device, the silicon chip that biplate device is divided to include rack, be arranged in rack The gaily decorated basket for placing the gaily decorated basket places position, the gaily decorated basket positioning component and monolithic fixation kit for placing position side in the gaily decorated basket is arranged, with And the silicon chip separation assembly for being detached to double silicon chips in rack side is set.
  2. 2. silicon chip according to claim 1 divides biplate device, which is characterized in that the gaily decorated basket positioning component includes that setting exists The gaily decorated basket is placed the located lateral component on the left of position and is arranged places the longitudinal register component on front side of position in the gaily decorated basket.
  3. 3. silicon chip according to claim 2 divides biplate device, which is characterized in that the located lateral component includes laterally fixed Position cylinder and located lateral push plate, the located lateral cylinder are fixed on the rack, the located lateral push plate and located lateral Cylinders connect;The longitudinal register component includes longitudinal register cylinder and longitudinal register push plate, and the longitudinal register cylinder is solid It is scheduled in rack, the longitudinal register push plate connects with longitudinal register cylinders.
  4. 4. silicon chip according to claim 1 divides biplate device, which is characterized in that the monolithic fixation kit includes for solid Determine the fixing sucking disk component of silicon chip and the X-axis drive component for driving fixing sucking disk component to move along the x-axis and the fixed suction of driving The Y-axis drive component that disk component is moved along Y-axis, the X-axis drive component are mounted in rack, the Y-axis drive component installation On X-axis drive component, the fixing sucking disk component is mounted on Y-axis drive component.
  5. 5. silicon chip according to claim 4 divides biplate device, which is characterized in that the X-axis drive component includes X-axis driving Motor, X-axis driving lead screw, X-axis driving sliding rail, X-axis driving sliding block and X-axis mounting bracket, the X-axis driving motor and X-axis driving Sliding rail is mounted in rack, and the X-axis driving sliding block is set on X-axis driving sliding rail, and the X-axis mounting bracket is slided with X-axis driving Block is connected, and the X-axis driving lead screw is connected with X-axis driving motor and is threaded through in X-axis mounting bracket;The Y-axis driving group Part includes Y-axis driving motor, Y-axis driving lead screw, Y-axis driving sliding rail, Y-axis driving sliding block and Y-axis mounting bracket, the Y-axis driving Motor and Y-axis driving sliding rail are mounted in rack, and the Y-axis driving sliding block is set on Y-axis driving sliding rail, the Y-axis installation Frame is connected with Y-axis driving sliding block, and the Y-axis driving lead screw is connected with Y-axis driving motor and is threaded through in Y-axis mounting bracket.
  6. 6. silicon chip according to claim 5 divides biplate device, which is characterized in that the fixing sucking disk component is mounted on Y-axis On mounting bracket, the fixing sucking disk component includes the fixing sucking disk mounting bracket being connected with Y-axis mounting bracket, is mounted on fixing sucking disk On mounting bracket for installing the sucker connecting rod of fixing sucking disk, and the constant spacing that is provided with that is set in sucker connecting rod Multiple fixing sucking disks.
  7. 7. silicon chip according to claim 1 divides biplate device, which is characterized in that the silicon chip divides biplate device to further include setting It sets the impurity placed above the side of position in the gaily decorated basket and rejects component, the impurity rejecting component setting is put in monolithic fixation kit and the gaily decorated basket Between set, it includes gas blow pipe and the driving cylinder for driving gas blow pipe to move up and down that the impurity, which rejects component,.
  8. 8. silicon chip according to claim 1 divides biplate device, which is characterized in that the silicon chip separation assembly includes for dividing Separation Suction cup assembly from silicon chip, the push component for pushing silicon chip and for drive separation Suction cup assembly and push component into The mobile manipulator of row, the push component are mounted on the both sides of separation Suction cup assembly.
CN201810290640.9A 2018-03-30 2018-03-30 A kind of whole line of monocrystalline making herbs into wool is slotting to divide biplate to automate charging & discharging machine Expired - Fee Related CN108389935B (en)

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Cited By (1)

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Publication number Priority date Publication date Assignee Title
CN109638112A (en) * 2018-12-29 2019-04-16 无锡尚品高自动化设备有限公司 A kind of biplate making herbs into wool wafer separator

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CN201663151U (en) * 2009-03-06 2010-12-01 东莞市启天自动化设备有限公司 Full automatic silicon chip loading and unloading machine
CN201838565U (en) * 2010-09-21 2011-05-18 江西赛维Ldk太阳能高科技有限公司 Automatic wet silicon slice distributing device
CN202076306U (en) * 2011-05-16 2011-12-14 东莞市启天自动化设备有限公司 Automatic silicon overturn and folding double-sheet inserting machine
CN103921548A (en) * 2013-01-15 2014-07-16 神讯电脑(昆山)有限公司 Automatic detecting device for double slices
CN105845598A (en) * 2015-01-15 2016-08-10 南京华伯仪器科技有限公司 Silicon wafer separation device and silicon wafer loading and unloading system
CN106684212A (en) * 2017-03-06 2017-05-17 常州亿晶光电科技有限公司 Automatic detection dual-silicon-wafer apparatus

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Publication number Priority date Publication date Assignee Title
CN201663151U (en) * 2009-03-06 2010-12-01 东莞市启天自动化设备有限公司 Full automatic silicon chip loading and unloading machine
CN201838565U (en) * 2010-09-21 2011-05-18 江西赛维Ldk太阳能高科技有限公司 Automatic wet silicon slice distributing device
CN202076306U (en) * 2011-05-16 2011-12-14 东莞市启天自动化设备有限公司 Automatic silicon overturn and folding double-sheet inserting machine
CN103921548A (en) * 2013-01-15 2014-07-16 神讯电脑(昆山)有限公司 Automatic detecting device for double slices
CN105845598A (en) * 2015-01-15 2016-08-10 南京华伯仪器科技有限公司 Silicon wafer separation device and silicon wafer loading and unloading system
CN106684212A (en) * 2017-03-06 2017-05-17 常州亿晶光电科技有限公司 Automatic detection dual-silicon-wafer apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109638112A (en) * 2018-12-29 2019-04-16 无锡尚品高自动化设备有限公司 A kind of biplate making herbs into wool wafer separator

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